Circulating electroplating water supply device special for integrated circuit (IC) lead frame

Abstract

The utility model relates to the technical field of IC (integrated circuit) lead frame processing, and discloses a circulating electroplating water supply device special for an IC lead frame, which comprises a bottom plate, the upper surface of the bottom plate is fixedly connected with a fixing frame, the inner wall of the fixing frame is fixedly connected with an electroplating bath, the lower surface of the electroplating bath is fixedly connected with a motor, and the motor is fixedly connected with a water tank. The output end of the motor is rotationally connected into the electroplating bath and fixedly connected with a disc, a limiting block is fixedly connected to the inner wall of the electroplating bath, a limiting groove is formed in the outer wall of the limiting block, and a round pin is fixedly connected to the top end of the disc. According to the utility model, the fixed column reciprocates to drive the spoiler to reciprocate to disturb the electrolyte in the electroplating bath in a reciprocating manner, so that the effect of continuously disturbing the electrolyte in the electroplating bath is achieved, and metal ions can be fully mixed and diffused in the electroplating bath; therefore, the uniformity of the surface coating of the IC lead frame is improved, and the quality and the performance of products are ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of IC lead frame processing, in particular to a circulating electroplating water supply device specially used for IC lead frames. Background Art

[0002] IC lead frame electroplating is a process that electroplates the surface of the integrated circuit (IC) lead frame. By plating a layer of metal with good conductive properties, such as copper, nickel, gold, etc., on the surface of the lead frame, the contact resistance is reduced and a good electrical connection between the integrated circuit and the external circuit is ensured. The electroplating layer can protect the lead frame from corrosion factors in the environment and extend its service life. During the electroplating process, a circulating electroplating water supply device dedicated to IC lead frames is required.

[0003] Existing technology is usually not convenient for disturbing the electrolyte inside the electroplating tank. In the absence of disturbance, the distribution of metal ions in the electrolyte may be uneven, resulting in inconsistent thickness of the plating deposited in different parts of the lead frame, which will affect the appearance quality of the product and may cause local over-thickness or over-thinness. Utility Model Content

[0004] In order to make up for the above shortcomings, the utility model provides a circulating electroplating water supply device dedicated to IC lead frames, aiming to improve the existing technology that is usually inconvenient to disturb the electrolyte inside the electroplating tank. When there is a lack of disturbance, this will affect the appearance quality of the product and may cause local over-thickness or over-thinness.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A circulating electroplating water supply device specially used for IC lead frames includes a base plate, the upper surface of the base plate is fixedly connected to a fixing frame, the inner wall of the fixing frame is fixedly connected to an electroplating tank, the lower surface of the electroplating tank is fixedly connected to a motor, the output end of the motor is rotatably connected to the inside of the electroplating tank and fixedly connected to a disc, the inner wall of the electroplating tank is fixedly connected to a limiting block, the outer wall of the limiting block is provided with a limiting groove, the top of the disc is fixedly connected to a round pin, the outer wall of the round pin is slidably connected to a rectangular frame, the outer wall of the rectangular frame is fixedly connected to a moving bar, the outer wall of the moving bar is slidably connected to the inner wall of the limiting groove, the upper surface of the moving bar is fixedly connected to a fixing column, the outer wall of the fixing column is fixedly connected to a spoiler, the outer wall of the spoiler is provided with a through hole, and a water supply component is provided on the upper surface of the base plate.

[0007] Preferably, the water supply assembly includes a water pump, the bottom end of the water pump is fixedly connected to the upper surface of the base plate, the outer wall of the water pump is fixedly connected to an external water pipe, the outer wall of the water pump is fixedly connected to one end of a barrel water pipe, and the other end of the barrel water pipe is fixedly connected to the lower surface of the electroplating tank.

[0008] Preferably, the lower surface of the electroplating tank is fixedly connected to one end of the circulating water pipe 2, the other end of the circulating water pipe 2 is fixedly connected to the filter box, the lower surface of the filter box is fixedly connected to the upper surface of the bottom plate, the outer wall of the filter box is fixedly connected to one end of the circulating water pipe 1, the other end of the circulating water pipe 1 is fixedly connected to the outer wall of the external water pipe, and the outer wall of the circulating water pipe 2 is provided with a solenoid valve.

[0009] Preferably, a mounting groove is provided on the upper surface of the filter box.

[0010] Preferably, the inner wall of the filter box is slidably connected to a filter plate, the outer wall of the filter plate is slidably connected to the inner wall of the mounting groove, and the outer wall of the filter plate is provided with a clamping groove.

[0011] Preferably, the outer wall of the filter box is fixedly connected to a fixed block, the interior of the fixed block is slidably connected to a short column, the outer wall of the fixed block is provided with a circular groove, the interior of the short column is fixedly connected to a sliding column 1, the inner wall of the short column is slidably connected to a rectangular block, the outer wall of the rectangular block is provided with an inclined groove, and the outer wall of the sliding column 1 is slidably connected to the inner wall of the inclined groove.

[0012] Preferably, the outer wall of the rectangular block is fixedly connected to one end of the sliding column 2, the outer wall of the sliding column 2 is slidably connected to the inside of the fixed block, the other end of the sliding column 2 is fixedly connected to one end of the clamping block, and the outer wall of the clamping block is slidably connected to the inner wall of the clamping slot.

[0013] Preferably, the outer wall of the second sliding column is slidably connected to a spring, one end of the spring is fixedly connected to the inner wall of the spring, and the other end of the spring is fixedly connected to an end of the block close to the second sliding column.

[0014] The utility model has the following beneficial effects:

[0015] 1. In the present invention, the reciprocating movement of the fixed column drives the reciprocating movement of the spoiler to disturb the electrolyte inside the electroplating tank, thereby achieving the effect of continuously disturbing the electrolyte inside the electroplating tank, thereby making the metal ions fully mixed and diffused in the electroplating solution, thereby improving the uniformity of the surface plating of the IC lead frame and ensuring the quality and performance of the product.

[0016] 2. In the present invention, when the rectangular block moves outward, it will prompt the sliding post 2 to slide inside the fixed block and drive the card block to slide out from the inner wall of the card slot opened on the outer wall of the filter plate. Then the filter plate can be slid out from the inner wall of the installation slot, thereby achieving the effect of quick disassembly of the filter plate, and then it can be easily taken out from the device for thorough cleaning. This can effectively remove impurities that clog the filter holes, restore the filtering performance of the filter plate, ensure that a good filtering effect is always maintained, and avoid affecting the electroplating quality due to clogging of the filter plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a three-dimensional diagram of a circulating electroplating water supply device specifically for IC lead frames proposed by the present invention;

[0018] Figure 2 This is a cross-sectional view of the internal structure of the electroplating tank of the circulating electroplating water supply device specifically used for IC lead frames proposed by the present invention;

[0019] Figure 3 This is a schematic diagram of the partial structure of the limit block of the circulating electroplating water supply device specifically for IC lead frames proposed by the present invention;

[0020] Figure 4 This is a partial structural diagram of a filter plate of a circulating electroplating water supply device specifically for IC lead frames proposed in the present invention;

[0021] Figure 5 This is a cross-sectional view of the internal structure of the fixed block of the circulating electroplating water supply device specially used for IC lead frames proposed by the present invention.

[0022] Legend:

[0023] 1. Bottom plate; 2. Fixing frame; 3. Plating tank; 4. Motor; 5. Limit block; 6. Limit slot; 7. Disc; 8. Round pin; 9. Rectangular frame; 10. Moving bar; 11. Fixing column; 12. Spoiler; 13. Through hole; 14. Water pump; 15. External water pipe; 16. Drum water pipe; 17. Filter box; 18. Circulating water pipe 1; 19. Circulating water pipe 2; 20. Solenoid valve; 21. Mounting slot; 22. Filter plate; 23. Clamping slot; 24. Fixing block; 25. Round slot; 26. Short column; 27. Sliding column 1; 28. Rectangular block; 29. ​​Inclined slot; 30. Sliding column 2; 31. Clamping block; 32. Spring. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the utility model will be apparently and completely described in the specification of the utility model with reference to the drawings, and obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all the other embodiments obtained by the ordinary skilled in the art without creative labor fall within the scope of the utility model.

[0025] With reference to Figure 1 - Figure 3 The utility model provides an embodiment: special circulating electroplating water supply device of IC lead frame, including bottom plate 1, the upper surface fixed connection of bottom plate 1 has fixed frame 2, the inner wall fixed connection of fixed frame 2 has electroplating groove 3, the lower surface fixed connection of electroplating groove 3 has motor 4, and the output end rotation connection of motor 4 is in the inside of electroplating groove 3 and fixed connection has disc 7, the inner wall fixed connection of electroplating groove 3 has limit block 5, and the outer wall of limit block 5 is equipped with limit slot 6, the top fixed connection of disc 7 has round pin 8, and the outer wall sliding connection of round pin 8 has rectangle frame 9, the outer wall fixed connection of rectangle frame 9 has moving strip 10, and the outer wall sliding connection of moving strip 10 is in the inner wall of limit slot 6, the upper surface fixed connection of moving strip 10 has fixed column 11, the outer wall fixed connection of fixed column 11 has spoiler 12, and the outer wall of spoiler 12 is equipped with through -hole 13, and the upper surface of bottom plate 1 is provided with water supply assembly;Water supply assembly includes water pump 14, and the bottom fixed connection of water pump 14 is on the upper surface of bottom plate 1, and the outer wall fixed connection of water pump 14 has external water pipe 15, and the outer wall fixed connection of water pump 14 has the one end of barrel water pipe 16, and the other end fixed connection of barrel water pipe 16 is on the lower surface of electroplating groove 3;

[0026] Specifically, through bottom plate 1 can play the role of fixed frame 2, through fixed frame 2 can play the role of supporting and fixed of electroplating groove 3, through limit block 5 can play the role of moving strip 10, in the process of starting motor 4 and promoting rectangle frame 9 drive round pin 8 rotation, due to the limiting effect of limit block 5, at this time round pin 8 sliding in the inner wall of rectangle frame 9 and promote rectangle frame 9 drive moving strip 10 reciprocating movement.

[0027] With reference to Figure 1 The lower surface fixed connection of electroplating groove 3 has the one end of circulating water pipe two 19, and the other end fixed connection of circulating water pipe two 19 has filter box 17, and the lower surface fixed connection of filter box 17 is on the upper surface of bottom plate 1, and the outer wall fixed connection of filter box 17 has the one end of circulating water pipe one 18, and the other end fixed connection of circulating water pipe one 18 is on the outer wall of external water pipe 15, and the outer wall of circulating water pipe two 19 is provided with electromagnetic valve 20;

[0028] Specifically, after a batch of electroplating is completed, the external water supply is suspended, and then the water pump 14 is started again. During the process of starting the water pump 14, the solenoid valve 20 is started. At this time, the electrolyte inside the electroplating tank 3 enters the interior of the filter box 17 through the circulating water pipe 2 19, and then after being filtered by the filter plate 22, it enters the interior of the water pump 14 again through the circulating water pipe 1 18, and then is transported to the interior of the electroplating tank 3 again through the barrel water pipe 16, thereby realizing the recycling of the coolant.

[0029] Reference Figure 1 、 Figure 4 and Figure 5 , the upper surface of the filter box 17 is provided with a mounting groove 21; the inner wall of the filter box 17 is slidably connected to a filter plate 22, the outer wall of the filter plate 22 is slidably connected to the inner wall of the mounting groove 21, and the outer wall of the filter plate 22 is provided with a slot 23; the outer wall of the filter box 17 is fixedly connected to a fixed block 24, the interior of the fixed block 24 is slidably connected to a short column 26, the outer wall of the fixed block 24 is provided with a circular groove 25, the interior of the short column 26 is fixedly connected to a sliding column 27, the inner wall of the short column 26 is slidably connected to a rectangular block 28, and the outer wall of the rectangular block 28 is provided with an oblique Slot 29, the outer wall of the sliding post 1 27 is slidably connected to the inner wall of the inclined slot 29; the outer wall of the rectangular block 28 is fixedly connected to one end of the sliding post 2 30, the outer wall of the sliding post 2 30 is slidably connected to the inside of the fixed block 24, the other end of the sliding post 2 30 is fixedly connected to one end of the clamping block 31, the outer wall of the clamping block 31 is slidably connected to the inner wall of the clamping slot 23; the outer wall of the sliding post 2 30 is slidably connected to the spring 32, one end of the spring 32 is fixedly connected to the inner wall of the spring 32, and the other end of the spring 32 is fixedly connected to the end of the clamping block 31 near the sliding post 2 30;

[0030] Specifically, the short column 26 is used to provide a force point. Pressing the short column 26 causes the short column 26 to move downward and slide inside the fixed block 24, and drives the sliding column 1 27 to move downward. When the sliding column 1 27 moves downward, it will slide on the inner wall of the inclined groove 29 opened on the outer wall of the rectangular block 28, and at the same time, it will also slide on the outer wall of the rectangular block 28, so that the rectangular block 28 moves outward. When the rectangular block 28 moves outward, it will cause the sliding column 2 30 to drive the card block 31 to slide out from the inner wall of the card groove 23 opened on the outer wall of the filter plate 22, and then the filter plate 22 can be slid out from the inner wall of the mounting groove 21.

[0031] Working principle: when using the device, start the water pump 14, water pump 14 start to make water through the water pump 14 after the cylinder pipe 16 to the inside of the electroplating tank 3, then put the workpiece into the electroplating tank 3 inside electroplating, at this time need to start the motor 4, the motor 4 start to make the disc 7 rotate, the disc 7 rotation will drive the round pin 8 rotation, round pin 8 rotation will slide in the inner wall of the rectangular frame 9 and drive the moving bar 10 reciprocating slide in the outer wall of the limiting groove 6 in the outer wall of the limiting block 5, in turn make the moving bar 10 through the fixed column 11 drive the spoiler 12 reciprocating movement to the electrolyte in the electroplating tank 3 reciprocating disturbance, so as to achieve the effect of continuously disturbing the electrolyte in the electroplating tank 3, so that the metal ions can be fully mixed and diffused in the electroplating solution, so as to improve the uniformity of the surface plating layer of IC lead frame, ensure the quality and performance of the product, in the process of long time use need to disassemble the filter plate 22 to replace or clean to ensure good filtering performance, when need to disassemble the filter plate 22, only need to press the short column 26, press the short column 26 make the short column 26 slide in the inside of the fixed block 24 and drive the slide column one 27 move downward, slide column one 27 move downward will slide in the inner wall of the inclined slot 29 in the outer wall of the rectangular block 28, and make the rectangular block 28 move outward, the rectangular block 28 move outward will make the slide column two 30 slide in the inside of the fixed block 24 and drive the clamping block 31 from the inner wall of the clamping groove 23 in the outer wall of the filter plate 22 slide out, then can slide the filter plate 22 from the inner wall of the installation groove 21 take out, so as to achieve the effect of quickly disassembling the filter plate 22, so that it can be easily taken out from the device, clean thoroughly, which can effectively remove the impurities blocking the filter hole, restore the filtering performance of the filter plate 22, ensure that the filtering effect is always good, avoid affecting the electroplating quality due to the blockage of the filter plate 22.

[0032] Finally, it should be pointed out that: the above only for preferred embodiments of the present application, and not for limiting the present application, although the present application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it still can modify the technical scheme recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features, any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application, should be included in the protection scope of the present application.

Claims

1. A circulating electroplating water supply device specifically for IC lead frames, comprising a base plate (1), characterized in that: The upper surface of the bottom plate (1) is fixedly connected to a fixing frame (2), the inner wall of the fixing frame (2) is fixedly connected to an electroplating tank (3), the lower surface of the electroplating tank (3) is fixedly connected to a motor (4), the output end of the motor (4) is rotatably connected to the inside of the electroplating tank (3) and is fixedly connected to a disc (7), the inner wall of the electroplating tank (3) is fixedly connected to a limiting block (5), the outer wall of the limiting block (5) is provided with a limiting groove (6), the top of the disc (7) is fixedly connected to a round pin ( 8), the outer wall of the round pin (8) is slidably connected to a rectangular frame (9), the outer wall of the rectangular frame (9) is fixedly connected to a moving bar (10), the outer wall of the moving bar (10) is slidably connected to the inner wall of the limiting groove (6), the upper surface of the moving bar (10) is fixedly connected to a fixing column (11), the outer wall of the fixing column (11) is fixedly connected to a spoiler (12), the outer wall of the spoiler (12) is provided with a through hole (13), and the upper surface of the bottom plate (1) is provided with a water supply component.

2. The circulating electroplating water supply device specifically for IC lead frames according to claim 1, characterized in that: The water supply assembly comprises a water pump (14), the bottom end of the water pump (14) is fixedly connected to the upper surface of the bottom plate (1), the outer wall of the water pump (14) is fixedly connected to an external water pipe (15), the outer wall of the water pump (14) is fixedly connected to one end of a barrel water pipe (16), and the other end of the barrel water pipe (16) is fixedly connected to the lower surface of the electroplating tank (3).

3. The circulating electroplating water supply device specifically for IC lead frames according to claim 1, characterized in that: The lower surface of the electroplating tank (3) is fixedly connected to one end of the second circulating water pipe (19), the other end of the second circulating water pipe (19) is fixedly connected to the filter box (17), the lower surface of the filter box (17) is fixedly connected to the upper surface of the bottom plate (1), the outer wall of the filter box (17) is fixedly connected to one end of the first circulating water pipe (18), the other end of the first circulating water pipe (18) is fixedly connected to the outer wall of the external water pipe (15), and the outer wall of the second circulating water pipe (19) is provided with a solenoid valve (20).

4. The circulating electroplating water supply device specifically for IC lead frames according to claim 3 is characterized in that: The upper surface of the filter box (17) is provided with a mounting groove (21).

5. The circulating electroplating water supply device specifically for IC lead frames according to claim 3 is characterized in that: The inner wall of the filter box (17) is slidably connected to a filter plate (22), the outer wall of the filter plate (22) is slidably connected to the inner wall of the mounting groove (21), and the outer wall of the filter plate (22) is provided with a clamping groove (23).

6. The circulating electroplating water supply device specifically for IC lead frames according to claim 3, characterized in that: The outer wall of the filter box (17) is fixedly connected to a fixed block (24), the interior of the fixed block (24) is slidably connected to a short column (26), the outer wall of the fixed block (24) is provided with a circular groove (25), the interior of the short column (26) is fixedly connected to a sliding column (27), the inner wall of the short column (26) is slidably connected to a rectangular block (28), the outer wall of the rectangular block (28) is provided with an inclined groove (29), and the outer wall of the sliding column (27) is slidably connected to the inner wall of the inclined groove (29).

7. The circulating electroplating water supply device specifically for IC lead frames according to claim 6, characterized in that: The outer wall of the rectangular block (28) is fixedly connected to one end of the second sliding column (30), the outer wall of the second sliding column (30) is slidably connected to the inside of the fixed block (24), and the other end of the second sliding column (30) is fixedly connected to one end of the clamping block (31), and the outer wall of the clamping block (31) is slidably connected to the inner wall of the clamping groove (23).

8. The circulating electroplating water supply device specifically for IC lead frames according to claim 7, characterized in that: The outer wall of the second sliding column (30) is slidably connected to a spring (32), one end of the spring (32) is fixedly connected to the inner wall of the spring (32), and the other end of the spring (32) is fixedly connected to an end of the block (31) close to the second sliding column (30).

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