Ceramic substrate electroplating device

Abstract

The utility model relates to the technical field of electroplating devices, in particular to a ceramic substrate electroplating device which comprises a main body, the top of the main body is fixedly connected with a conveying assembly, and the top of the conveying assembly is fixedly connected with an electroplating position adjusting assembly; according to the utility model, the threaded block is driven by the second motor to perform threaded movement on the screw rod, so that the sliding block can slide on the sliding rod, the telescopic rod at the bottom of the bearing plate and the electroplating gun are driven to stably move, and the movement mode has the advantages of self-locking performance, synchronism, precision positioning, speed control and thrust control, so that the stability of the electroplating gun is improved. The ceramic substrate is conveyed by utilizing a transmission mechanism consisting of the first motor, the roller and the conveying belt, so that the positioning accuracy of the electroplating gun can be improved, the electroplating efficiency of the ceramic substrate can be improved, and the transmission mode is accurate in average transmission ratio, reliable in work and high in practicability. The efficiency, the transmission power and the overload capacity are high.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating devices, in particular to a ceramic substrate electroplating device. Background Art

[0002] Ceramic substrates are specially crafted boards made by directly bonding copper foil to an alumina or aluminum nitride ceramic substrate at high temperatures. The resulting ultra-thin composite substrates exhibit excellent electrical insulation, high thermal conductivity, superior solderability, and high adhesion strength. They can also be etched with various patterns, similar to PCBs, and possess a high current-carrying capacity. Consequently, ceramic substrates have become a fundamental material for high-power power electronics circuit structure and interconnect technologies.

[0003] Authorization announcement number CN208071829U discloses a ceramic substrate electroplating device. The patented technology is fixedly connected to a vibrator at the top of one side of the storage frame, and the top of the storage frame is fixedly connected to an electric socket through a conduit. The top of the electric socket passes through the outer frame and extends to the outside of the outer frame, which is convenient for electroplating. At the same time, it can increase the efficiency of electroplating and reduce time waste. A spring rod is fixedly connected to the bottom of the inner wall of the outer frame. The top of the spring rod is fixedly connected to the bottom of the inner frame. Sliders are fixedly connected to both sides of the inner frame, and In addition, both sides of the inner wall of the outer frame are provided with slide rails compatible with the slider, which improves the stability of the inner frame and prevents the electroplating liquid from spilling during movement. However, in this solution, when electroplating the ceramic substrate, a transmission method consisting of belts, pulleys, gears and other devices is used to sink the electroplating gun for electroplating. This method is not only troublesome to operate and has cumbersome steps, but also has too high an investment cost. Moreover, it can only sink and cannot move in multiple directions, thereby reducing the electroplating efficiency. Therefore, a ceramic substrate electroplating device is needed to improve the above problems. Utility Model Content

[0004] In order to solve the problem in the existing solution that when electroplating ceramic substrates, a transmission method composed of belts, pulleys, gears and other devices is used to sink the electroplating gun for electroplating, this method is not only cumbersome to operate and has complicated steps, but also has excessively high costs. In addition, it can only sink and cannot move in multiple directions, thereby reducing the electroplating efficiency. The purpose of the present utility model is to provide a ceramic substrate electroplating device to solve the problems raised in the above background technology.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A ceramic substrate electroplating device comprises a main body, a conveying assembly is fixedly connected to the top of the main body, and an electroplating position adjustment assembly is fixedly connected to the top of the conveying assembly;

[0007] The conveying assembly includes a support frame, a first motor is installed on the side of the support frame, an output end of the first motor is fixedly connected to a roller, and a conveyor belt is provided on the side of the roller;

[0008] The electroplating position adjustment assembly includes a mounting frame, the top of the mounting frame is fixedly connected to a top frame, the side of the top frame is fixedly connected to a loading plate, the side of the loading plate is installed with a second motor, the output end of the second motor is fixedly connected to a screw rod, and the side of the screw rod is threadedly connected to a threaded block.

[0009] As a preferred solution of the present invention, a slide rod is fixedly connected to the side of the loading plate, a slider is slidably connected to the side of the slide rod, and a supporting plate is fixedly connected to the bottom of the threaded block and the slider.

[0010] As a preferred solution of the present invention, the bottom of the supporting plate is fixedly connected to a telescopic rod, and the bottom of the telescopic rod is fixedly connected to an electroplating gun.

[0011] As a preferred solution of the present invention, two loading plates are provided, the side surfaces of the loading plates are fixedly connected to bearing seats, and the screw rod extends to the interior of the bearing seats.

[0012] As a preferred solution of the present invention, a connecting rod is fixedly connected to the side of the mounting frame, a control panel is fixedly connected to the inside of the control panel, and physical buttons are provided on the side of the control panel.

[0013] As a preferred solution of the present invention, a reinforcement rod is fixedly connected to the interior of the top frame, and two reinforcement rods are provided.

[0014] As a preferred solution of the present invention, the main body includes a supporting frame, and the bottom of the supporting frame is fixedly connected to an adjusting rod.

[0015] As a preferred solution of the present invention, the bottom of the adjusting rod is fixedly connected to a ground foot, and four adjusting rods and ground feet are provided.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] 1. In the utility model, the threaded block is driven by the second motor to move the thread on the screw rod, and then the slider can slide on the slide rod, thereby driving the telescopic rod and the electroplating gun at the bottom of the support plate to move smoothly. This movement method has self-locking performance, synchronization, precision positioning, speed control, and thrust control, and the extension and retraction of the telescopic rod can more conveniently contact the ceramic substrate.

[0018] 2. In the utility model, the ceramic substrate is transmitted by utilizing the transmission mechanism composed of the first motor, rollers and conveyor belt, which not only increases the positioning accuracy of the electroplating gun, but also improves the electroplating efficiency of the ceramic substrate. Moreover, this transmission method has an accurate average transmission ratio, reliable operation, high efficiency, large transmission power and strong overload capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the structure of the electroplating position adjustment component of the utility model;

[0021] Figure 3 This is a schematic diagram of the structure of the conveying component of the present utility model;

[0022] Figure 4 This is a schematic diagram of the structure of the position adjustment component of the utility model.

[0023] In the figure: 1. Main body; 101. Carrying frame; 102. Adjusting rod; 103. Foot; 2. Conveying assembly; 201. Support frame; 202. First motor; 203. Roller; 204. Conveyor belt; 3. Electroplating position adjustment assembly; 301. Mounting frame; 302. Top frame; 303. Connecting rod; 304. Control panel; 305. Touch screen; 306. Physical button; 307. Reinforcement rod; 308. Loading plate; 309. Second motor; 310. Screw; 311. Threaded block; 312. Sliding rod; 313. Sliding block; 314. Telescopic rod; 315. Electroplating gun; 316. Bearing seat; 317. Support plate. DETAILED DESCRIPTION

[0024] The following will combine the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0025] Example: See Figures 1-4 A ceramic substrate electroplating device shown includes a main body 1, a conveying assembly 2 is fixedly connected to the top of the main body 1, and an electroplating position adjustment assembly 3 is fixedly connected to the top of the conveying assembly 2;

[0026] In this embodiment, reference Figure 1 、 Figure 2 and Figure 4As shown, the conveying assembly 2 comprises a supporting frame 201, a first motor 202 is mounted on the side of the supporting frame 201, the output end of the first motor 202 is fixedly connected with a roller 203, the side of the roller 203 is provided with a conveying belt 204, the electroplating position adjusting assembly 3 comprises a mounting frame 301, the top of the mounting frame 301 is fixedly connected with a top frame 302, the side of the top frame 302 is fixedly connected with a loading plate 308, the side of the loading plate 308 is mounted with a second motor 309, the output end of the second motor 309 is fixedly connected with a lead screw 310, the side of the lead screw 310 is threadedly connected with a threaded block 311, the threaded block 311 is threadedly moved on the lead screw 310 by the driving of the second motor 309, and then the sliding block 313 can slide on the slide rod 312, so as to drive the telescopic rod 314 at the bottom of the supporting plate 317 and the electroplating gun 315 to move stably, and the moving mode has self-locking performance, synchronization, precision positioning, speed control and thrust control, and the telescopic rod 314 can be conveniently contacted to the ceramic substrate.

[0027] Wherein, the side of the loading plate 308 is fixedly connected with a slide rod 312, the side of the slide rod 312 is slidingly connected with a sliding block 313, the bottom of the threaded block 311 and the sliding block 313 is fixedly connected with a supporting plate 317, the bottom of the supporting plate 317 is fixedly connected with a telescopic rod 314, the bottom of the telescopic rod 314 is fixedly connected with an electroplating gun 315, the loading plate 308 is provided with two, the side of the loading plate 308 is fixedly connected with a bearing seat 316, the lead screw 310 extends to the inside of the bearing seat 316, the side of the mounting frame 301 is fixedly connected with a connecting rod 303, the side of the connecting rod 303 is fixedly connected with a control panel 304, the inside of the control panel 304 is fixedly connected with a touch display screen 305, the side of the control panel 304 is provided with a physical button 306, the inside of the top frame 302 is fixedly connected with a reinforcing rod 307, the reinforcing rod 307 is provided with two, a transmission mechanism composed of the first motor 202, the roller 203 and the conveying belt 204 is used for conveying the ceramic substrate, which can not only increase the positioning accuracy of the electroplating gun 315, but also improve the electroplating efficiency of the ceramic substrate, and the transmission mode has the advantages of accurate average transmission ratio, reliable work, high efficiency, large transmission power and strong overload capacity.

[0028] In this embodiment, referring to Figure 1 and Figure 3 As shown, the main body 1 comprises a supporting frame 101, the bottom of the supporting frame 101 is fixedly connected with an adjusting rod 102, the bottom of the adjusting rod 102 is fixedly connected with a footing 103, the adjusting rod 102 and the footing 103 are provided with four, the adjusting rod 102 can adjust the distance between the equipment and the ground, and increase the adaptability of the equipment in different environments.

[0029] When a ceramic substrate electroplating device in this solution is used, the ceramic substrate is placed on the conveyor belt 204. The transmission mechanism composed of the first motor 202, the roller 203 and the conveyor belt 204 can be used to transport the ceramic substrate. When it is transported to the bottom of the top frame 302, the second motor 309 can be used to drive the threaded block 311 to move threadedly on the screw rod 310, so that the slider 313 can slide on the slide rod 312, thereby driving the telescopic rod 314 and the electroplating gun 315 at the bottom of the supporting plate 317 to move smoothly, and then the position of the electroplating gun 315 can be automatically adjusted. After the electroplating gun 315 and the ceramic substrate are in the same vertical plane, the electroplating gun 315 is moved downward by the extension of the telescopic rod 314, and then the ceramic substrate can be electroplated.

[0030] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A ceramic substrate electroplating device, comprising a main body (1), characterized in that: The top of the main body (1) is fixedly connected to a conveying assembly (2), and the top of the conveying assembly (2) is fixedly connected to an electroplating position adjustment assembly (3); The conveying assembly (2) comprises a support frame (201), a first motor (202) is mounted on a side of the support frame (201), an output end of the first motor (202) is fixedly connected to a roller (203), and a conveyor belt (204) is provided on a side of the roller (203); The electroplating position adjustment component (3) comprises a mounting frame (301), the top of the mounting frame (301) is fixedly connected to a top frame (302), the side of the top frame (302) is fixedly connected to a loading plate (308), a second motor (309) is mounted on the side of the loading plate (308), an output end of the second motor (309) is fixedly connected to a lead screw (310), and the side of the lead screw (310) is threadedly connected to a threaded block (311).

2. The ceramic substrate electroplating device according to claim 1, characterized in that: The side of the loading plate (308) is fixedly connected to a slide bar (312), the side of the slide bar (312) is slidably connected to a slider (313), and the bottoms of the threaded block (311) and the slider (313) are fixedly connected to a supporting plate (317).

3. The ceramic substrate electroplating device according to claim 2, characterized in that: The bottom of the supporting plate (317) is fixedly connected to a telescopic rod (314), and the bottom of the telescopic rod (314) is fixedly connected to an electroplating gun (315).

4. The ceramic substrate electroplating device according to claim 1, characterized in that: Two loading plates (308) are provided, and a bearing seat (316) is fixedly connected to the side of the loading plate (308), and the screw rod (310) extends to the interior of the bearing seat (316).

5. The ceramic substrate electroplating device according to claim 1, characterized in that: A connecting rod (303) is fixedly connected to the side of the mounting frame (301), a control panel (304) is fixedly connected to the side of the connecting rod (303), a touch display screen (305) is fixedly connected inside the control panel (304), and a physical button (306) is provided on the side of the control panel (304).

6. The ceramic substrate electroplating device according to claim 1, characterized in that: A reinforcement rod (307) is fixedly connected to the interior of the top frame (302), and two reinforcement rods (307) are provided.

7. The ceramic substrate electroplating device according to claim 1, characterized in that: The main body (1) comprises a supporting frame (101), and an adjusting rod (102) is fixedly connected to the bottom of the supporting frame (101).

8. The ceramic substrate electroplating device according to claim 7, characterized in that: The bottom of the adjusting rod (102) is fixedly connected to a ground foot (103), and four adjusting rods (102) and four ground feet (103) are provided.

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