Interface board for semiconductor production

Abstract

The utility model provides an interface board for semiconductor production, which comprises a connecting plate, a Z-shaped supporting plate is vertically welded on one side of the top end of the connecting plate, a supporting plate is vertically welded on the connecting plate and on the same side as the Z-shaped supporting plate, a KF flange is mounted on the supporting plate, a first clamping sleeve joint is vertically mounted in the middle of two side edges of a lower supporting plate of the Z-shaped supporting plate, and a second clamping sleeve joint is mounted on the lower supporting plate of the Z-shaped supporting plate. A sealing pipe joint is installed at the top corner of the outer side of a lower supporting plate of the Z-shaped supporting plate, the top of the sealing pipe joint is connected with a pressure regulator, two second clamping sleeve pipe joints are installed at the positions, close to a vertical supporting plate of the Z-shaped supporting plate, of the lower supporting plate of the Z-shaped supporting plate, and rectangular square blocks are welded to the peripheries of the second clamping sleeve pipe joints. According to the utility model, various installation accessories are intensively designed on the interface board, the pipeline installation is rapid and convenient, the construction period is shortened, and the interface board and the accessories are connected in a bolting manner, so that the installation and the disassembly are convenient, the universality is strong, and the disassembly and the maintenance are convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit process devices, in particular to an interface board for semiconductor production. Background Art

[0002] The semiconductor industry is rapidly developing, and the upgrade and replacement of precision production equipment for semiconductor processes is accelerating. Consequently, the installation and modification of this equipment is increasing. For semiconductor factories, especially those in the chip manufacturing industry, the construction cycle is a crucial factor, often determining the market success of products. Currently, vacuum pumps, piping, and circuitry in semiconductor factories are all constructed on-site, making schedules difficult to control and installation and deployment cycles long. On-site construction consumes a significant portion of the project time and presents numerous safety and quality risks. Furthermore, when equipment layout changes are required, dismantling the equipment is time-consuming and labor-intensive. Utility Model Content

[0003] The purpose of the utility model is to provide an interface board for semiconductor production to solve the problems existing in the above-mentioned background technology.

[0004] The technical solution of the present utility model is achieved as follows:

[0005] An interface board for semiconductor production includes a connecting plate, a Z-shaped support plate vertically welded to one side of the top of the connecting plate, a support plate vertically welded to the upper side of the connecting plate and the same side as the Z-shaped support plate, a KF flange is installed on the support plate, a first compression sleeve joint is vertically installed in the middle position of both sides of the lower support plate of the Z-shaped support plate, a sealing pipe joint is installed at the outer top corner of the lower support plate of the Z-shaped support plate, a pressure regulator is connected to the top of the sealing pipe joint, two second compression sleeve joints are installed on the lower support plate of the Z-shaped support plate near the vertical support plate of the Z-shaped support plate, and a rectangular block is welded to the periphery of the second compression sleeve joint.

[0006] Furthermore, two mounting holes are provided on the top of the connecting plate.

[0007] Furthermore, the connecting plate and the base are fixed by means of mounting hole 1 and bolts.

[0008] Furthermore, five mounting holes are provided on the lower support plate of the Z-shaped support plate.

[0009] Furthermore, a semicircular mounting hole is provided on one side of the support plate that is parallel to the connecting plate, and the support plate is vertically connected to the KF flange through the semicircular mounting hole.

[0010] Furthermore, the first compression sleeve joint, the second compression sleeve joint, and the sealing pipe joint are respectively passed through the second mounting hole and vertically bolted to the Z-shaped support plate.

[0011] Furthermore, metal gaskets are installed between the first compression sleeve joint, the second compression sleeve joint, the sealing pipe joint and the Z-shaped support plate.

[0012] Furthermore, there are three rectangular blocks, which are welded with the vertical support plates of the Z-shaped support plates to form a rectangular structure.

[0013] The beneficial effects of the utility model are:

[0014] The utility model adopts a modular design for pipeline installation and concentrates various installation accessories on the interface board. The interface board is installed on the anti-micro-vibration base. When the pipeline is installed, it is directly connected through the accessory interface on the interface board. The installation is quick and convenient, and the construction period is shortened. The interface board and various accessories are connected by bolting, which is convenient for installation and disassembly, has strong versatility, and is easy to disassemble and repair. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the connection between the interface board and the base of the utility model.

[0016] Figure 2 This is a structural diagram of the connecting plate of the utility model.

[0017] Figure 3 It is a structural diagram of the present utility model.

[0018] Figure 4 It is a top view of the utility model.

[0019] In the figure, 1-interface plate, 11-connecting plate, 111-Z-type support plate, 112-support plate, 113-mounting hole 1, 114-mounting hole 2, 115-semicircular mounting hole, 12-KF flange, 13-tube connector 1, 14-pressure regulator, 15-sealing pipe connector, 16-tube connector 2, 17-rectangular block, 18-metal gasket, 19-bolt, 2-base. DETAILED DESCRIPTION

[0020] The following will clearly and completely describe the technical solutions of the present invention in conjunction with the embodiments. Obviously, the embodiments described are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] like Figure 1-4As shown, an interface board for semiconductor production includes a connecting plate 11, a Z-shaped support plate 111 is vertically welded to one side of the top of the connecting plate 11, a support plate 112 is vertically welded on the connecting plate 11 and on the same side as the Z-shaped support plate 111, a KF flange 12 is installed on the support plate 112, a compression sleeve joint 13 is vertically installed in the middle position of both sides of the lower support plate of the Z-shaped support plate 111, a sealing pipe joint 15 is installed at the outer top corner of the lower support plate of the Z-shaped support plate 111, a pressure regulator 14 is connected to the top of the sealing pipe joint 5, two compression sleeve joints 16 are installed on the lower support plate of the Z-shaped support plate 111 near the vertical support plate position of the Z-shaped support plate 111, and a rectangular block 17 is welded to the periphery of the compression sleeve joint 6.

[0022] The top of the connecting plate 11 is provided with two mounting holes 113 .

[0023] The connecting plate 11 is fixed to the base 2 via a mounting hole 113 and bolts 19 .

[0024] Five mounting holes 114 are formed on the lower support plate of the Z-shaped support plate 111 .

[0025] A semicircular mounting hole 115 is formed on one side of the support plate 112 that is parallel to the connecting plate 11 . The support plate 112 is vertically connected to the KF flange 12 through the semicircular mounting hole 115 .

[0026] The first ferrule joint 13, the second ferrule joint 16, and the sealing pipe joint 15 are respectively passed through the second mounting hole 114 and vertically bolted to the Z-shaped support plate 111.

[0027] A metal gasket 18 is installed between the first ferrule joint 13, the second ferrule joint 16, the sealing pipe joint 15 and the Z-shaped support plate.

[0028] The rectangular blocks 17 consist of three pieces and are welded with the vertical support plates of the Z-shaped support plate 111 to form a rectangular structure.

[0029] The connecting plate 11 has a rectangular structure.

[0030] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An interface board for semiconductor production, comprising a connection board, characterized in that: A Z-shaped support plate is vertically welded to one side of the top of the connecting plate, and a support plate is vertically welded on the connecting plate and on the same side as the Z-shaped support plate. A KF flange is installed on the support plate, and a compression sleeve joint 1 is vertically installed in the middle position of both sides of the lower support plate of the Z-shaped support plate. A sealing pipe joint is installed at the outer top corner of the lower support plate of the Z-shaped support plate, and a pressure regulator is connected to the top of the sealing pipe joint. Two compression sleeve joints 2 are installed on the lower support plate of the Z-shaped support plate near the vertical support plate of the Z-shaped support plate, and a rectangular block is welded on the periphery of the compression sleeve joint 2.

2. The semiconductor production interface board according to claim 1, characterized in that: Two mounting holes are provided on the top of the connecting plate.

3. The semiconductor production interface board according to claim 1, characterized in that: The connecting plate and the base are fixed by bolts through mounting holes one.

4. The interface board for semiconductor production according to claim 1, characterized in that: The lower support plate of the Z-shaped support plate is provided with five mounting holes 2.

5. The semiconductor production interface board according to claim 1, characterized in that: A semicircular mounting hole is provided on one side of the support plate that is parallel to the connecting plate, and the support plate is vertically connected to the KF flange through the semicircular mounting hole.

6. The semiconductor production interface board according to claim 1, characterized in that: The first compression sleeve joint, the second compression sleeve joint and the sealing pipe joint are respectively passed through the second mounting hole and are vertically bolted and fixed to the Z-shaped support plate.

7. The interface board for semiconductor production according to claim 1, characterized in that: Metal gaskets are installed between the first compression sleeve joint, the second compression sleeve joint, the sealing pipe joint and the Z-shaped support plate.

8. The interface board for semiconductor production according to claim 1, characterized in that: There are three rectangular blocks, which are welded with the vertical support plates of the Z-shaped support plates to form a rectangular structure.

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