Swing arm type wafer drying device

The swinging component of the swing-arm wafer drying device solves the problem of insufficient contact between the wafer and the drying gas when the wafer is in a static state, achieving a more efficient wafer drying effect.

CN223425625UActive Publication Date: 2025-10-10ZHICHENG SEMICON EQUIP TECH (KUNSHAN) CO LTD
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Patent Information

Application Number
CN202423159013.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-20
Publication Date
2025-10-10
Estimated Expiration
2034-12-20

AI Technical Summary

Technical Problem

In existing wafer drying devices, the wafers are in a static state and are difficult to fully contact with the drying gas, resulting in poor drying effect.

Method used

A swing-arm wafer drying device is used, which drives the wafer basket and wafer to swing synchronously through the swing component, so that the drying gas contacts the wafer surface evenly. It includes a swing seat, a swing arm component and a drive device to achieve uniform drying of the wafer.

Benefits of technology

The contact efficiency between the wafer and the drying gas is improved, and the drying effect of the wafer is enhanced.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a swing arm type wafer drying device which comprises a drying cavity, a swing assembly is assembled in the drying cavity, the swing assembly comprises a swing seat and a swing arm assembly, and the swing seat is rotatably connected with the drying cavity; the swing arm assembly comprises a driving device and a connecting assembly, the driving device is assembled on the inner wall of the drying cavity, drives the connecting assembly to ascend and descend and drives the swing base to swing with the rotary connecting point of the swing base and the drying cavity as the axis, and a wafer basket is detachably placed on the upper surface of the swing base. The wafer drying device is used for solving the problem that the drying effect is affected due to the fact that a wafer in a static state in an existing wafer drying device is difficult to make full contact with drying gas.
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Description

Technical Field

[0001] The utility model relates to the field of semiconductor production equipment, and more particularly to a swing-arm type wafer drying device. Background Art

[0002] A wafer is a silicon wafer used in the manufacture of silicon semiconductor integrated circuits. Various circuit structures can be fabricated on the wafer surface to create electronic components with specific electrical functions. During various processing steps, wafers come into contact with contaminants such as organic matter, particles, and metallic impurities, which can adhere to the wafer and necessitate cleaning. Wet cleaning is a common method in wafer cleaning. After cleaning, the wafer needs to be dried to prevent water marks on the surface.

[0003] Existing wafer drying devices use a wafer basket to hold several wafers evenly spaced within the chamber. Dry gas is introduced into the chamber through a ventilation duct, where it contacts the wafers to dry any residual liquid on their surfaces. In this prior art, because the wafers are held in the wafer basket and remain stationary within the chamber, the dry gas entering the chamber struggles to fully contact the stationary wafer surfaces, compromising the drying effect.

[0004] In view of this, it is necessary to improve the wafer drying device in the prior art to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to disclose a swing-arm type wafer drying device, which is used to solve the problem that wafers in a stationary state in the existing wafer drying device are difficult to fully contact with the drying gas, thereby affecting the drying effect.

[0006] To achieve the above-mentioned object, the utility model provides a swing-arm type wafer drying device, comprising: a drying chamber, wherein a swing assembly is assembled in the drying chamber, wherein the swing assembly comprises a swing seat and a swing arm assembly, wherein the swing seat is rotatably connected to the drying chamber;

[0007] The swing arm assembly includes a driving device and a connecting assembly. The driving device is assembled on the inner wall of the drying chamber and drives the connecting assembly to rise and fall and drives the swing seat to swing around the rotating connection point with the drying chamber. The upper surface of the swing seat is detachable for placing a wafer basket.

[0008] As a further improvement of the present invention, the connecting assembly includes a first connecting rod, a second connecting rod and a driving member, the bottom end of the first connecting rod is connected to the driving end of the driving device, the end of the first connecting rod away from the driving device extends upward and is equipped with a mounting block, and the end of the mounting block away from the first connecting rod is connected to the top end of the second connecting rod;

[0009] The bottom end of the second connecting rod extends downward in parallel with the length direction of the first connecting rod and is connected to the driving member. One end of the swing seat in the length direction is connected to the driving wheel. The driving member is provided with a receiving groove for the driving wheel to pass through. The first connecting rod and the second connecting rod drive the driving member to rise and fall so that the receiving groove applies force to the driving wheel and drives the swing seat to swing around the rotation connection point between the swing seat and the drying chamber as the axis.

[0010] As a further improvement of the present invention, the top end of the drying chamber is hingedly connected to a cover, and a sealing ring is provided around the opening of the top end of the drying chamber. When the cover is buckled onto the opening of the drying chamber, the bottom wall of the cover abuts against the sealing ring.

[0011] The outer wall of the drying chamber is fixedly connected to a sealing assembly, which includes a lifting cylinder and a sealing member. The driving end of the lifting cylinder drives the sealing member to move downward to resist the upper surface of the cover body buckled at the opening of the drying chamber.

[0012] As a further improvement of the present invention, the cover body is provided with an air hole, an air path connected to the air hole is formed in the cover body, the outer wall of the cover body is connected to an exhaust pipe connected to the air path, and when the sealing member is against the top surface of the cover body, the exhaust pipe discharges the gas in the drying chamber through the air hole and the air path.

[0013] As a further improvement of the present invention, it further comprises: a pipeline, which is U-shaped and surrounds the swing seat and is arranged in the drying chamber. The connecting pipe of the pipeline passes through the side wall of the drying chamber, and the pipeline is evenly distributed with a plurality of through holes.

[0014] As a further improvement of the present invention, a mounting bracket for supporting the pipeline is provided in the drying chamber, and two pipelines are arranged side by side from top to bottom in the drying chamber. Both pipelines are fixed by a clamp and connected to the mounting bracket.

[0015] As a further improvement of the present invention, the swing seat arranges two wafer flower baskets in parallel along the length direction, a connecting column is provided at the midpoint of the length direction of the swing seat, the connecting column rotates with the drying chamber, and the driving wheel is connected to the side wall of the swing seat in the length direction away from the connecting column.

[0016] As a further improvement of the utility model, the upper surface of the swing seat is uniformly distributed with four first positioning seats for positioning the length direction of the two wafer baskets, and four second positioning seats for positioning the width direction of the two wafer baskets.

[0017] As a further improvement of the utility model, the sealing assembly is provided in two groups, the two groups of lifting cylinders are symmetrically assembled on the outer wall of the drying cavity in the width direction, the cover body is connected to the stress end away from the hinge point of the drying cavity, and the two lifting cylinders synchronously drive the two sealing members to move downward and abut against the upper surface of the stress end.

[0018] As a further improvement of the utility model, the driving device is selected as a driving cylinder vertically upward.

[0019] Compared with the prior art, the utility model has the beneficial effects that: the swing assembly in the drying cavity is composed of a swing seat and a swing arm assembly, the wafer baskets uniformly arranging a plurality of wafers are placed on the swing seat, the swing assembly drives the swing seat and the wafer baskets placed in the swing seat and the plurality of wafers uniformly arranged in the wafer baskets to synchronously rotate around the rotation connection point of the swing seat and the drying cavity, and dry gas is introduced into the drying cavity, so that the dry gas introduced into the drying cavity can more uniformly contact the wafers arranged in the wafer baskets during the wafer swinging process, so that the wafer drying effect is effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a specific structure diagram for embodying the wafer drying device in the utility model;

[0021] Figure 2 It is a specific structure diagram for embodying each part in the drying cavity in the utility model;

[0022] Figure 3 It is a specific structure diagram for embodying the swing assembly in the utility model;

[0023] Figure 4 It is a structure diagram for embodying the cooperation relationship between the swing seat and the swing arm assembly in the embodiment;

[0024] Figure 5 It is Figure 1 A enlarged view of A part in the embodiment;

[0025] Figure 6 It is Figure 1 A enlarged view of B part in the embodiment;

[0026] Figure 7 It is Figure 4 A enlarged view of C part in the embodiment. DETAILED DESCRIPTION

[0027] The present invention is described in detail below with reference to the various embodiments shown in the accompanying drawings. However, it should be noted that these embodiments are not limitations of the present invention, and any equivalent transformations or substitutions in functions, methods, or structures made by ordinary technicians in this field based on these embodiments are all within the scope of protection of the present invention.

[0028] Ginseng Figures 1 to 7 This is a specific embodiment of a swing-arm type wafer drying device disclosed by the present invention. Compared with the prior art, the swing assembly 2 in the drying chamber 1 in this embodiment is composed of a swing seat 21 and a swing arm assembly 22. A wafer basket 6 with several wafers 7 evenly arranged is placed on the swing seat 21. The swing arm assembly 22 drives the swing seat 21 and the wafer basket 6 placed in the swing seat 21 and the several wafers 7 evenly distributed therein to rotate synchronously with the rotation connection point between the swing seat 21 and the drying chamber 1 as the axis, and dry gas is introduced into the drying chamber 1. In the process of the swing seat 21 driving the wafers 7 to swing, the dry gas introduced into the drying chamber 1 can more evenly contact the wafers 7 arranged in the wafer basket 6. Compared with the prior art in which the wafers in a stationary state in the wafer drying device are difficult to fully contact with the dry gas, the drying effect of the wafers is effectively improved.

[0029] Ginseng Figures 1 to 7 As shown, in this embodiment, a swing-arm type wafer drying device (hereinafter referred to as a drying device) includes a drying chamber 1, in which a swing assembly 2 is assembled. The swing assembly 2 includes a swing seat 21 and a swing arm assembly 22. The swing seat 21 is rotatably connected to the drying chamber 1; the swing arm assembly 22 includes a driving device 221 and a connecting assembly 222. The driving device 221 is assembled on the inner wall of the drying chamber 1 and drives the connecting assembly 222 to rise and fall and drives the swing seat 22 to swing around the rotation connection point with the drying chamber 1. The upper surface of the swing seat 21 is detachable to place the wafer basket 6. It should be noted that in this embodiment, a liquid collecting chamber 15 is also provided in the drying chamber 1, and the swing seat 21 is arranged in the liquid collecting chamber 15. Furthermore, the swing seat 21 is rotatably connected to the drying chamber 1 through a connecting column 213. The connecting column 213 passes through the side wall of the liquid collecting chamber 15 and is connected to the drying chamber 1.

[0030] Ginseng Figures 2 to 6As shown, the connecting assembly 222 includes a first connecting rod 2221, a second connecting rod 2222 and a driving member 2223, the bottom end of the first connecting rod 2221 is connected to the driving end of the driving device 221, the first connecting rod extends upward away from one end of the driving device 221 and is equipped with a mounting block 2224, and the mounting block 2224 is connected to the top of the second connecting rod 2222 at one end away from the first connecting rod 2221; the bottom end of the second connecting rod 2222 extends downward parallel to the length direction of the first connecting rod 2221 and is connected to the driving member 2223, one end in the length direction of the swing seat 21 is connected to the driving wheel 221, and the driving member 2223 is provided with a receiving groove 2225 for the driving wheel 221 to pass through, the first connecting rod 2221 and the second connecting rod 2222 drive the driving member 2223 to rise and fall so that the receiving groove 2225 applies force to the driving wheel and drives the swing seat 21 to swing around the rotating connection point between the drying chamber, that is, the connecting column 213 as the axis. It should be noted that the first connecting rod 2221 and the second connecting rod 2222 are designed to bypass the side wall of the liquid collecting chamber 15 and are connected above the liquid collecting chamber 15 through the mounting block 2124. It should be noted that the driving device 221 is selected as a driving cylinder with a driving end vertically upward, and the driving end of the driving device 221 is connected to the bottom end of the first connecting rod 2221.

[0031] Ginseng Figure 1 、 Figure 5 and Figure 6 As shown, the top of the drying chamber 1 is hinged to the cover body 4, and a sealing ring 11 is provided around the opening 14 at the top of the drying chamber 1. When the cover body 4 is fastened to the opening 14 of the drying chamber 1, the bottom wall of the cover body 4 presses against the sealing ring 11; the outer wall of the drying chamber 1 is fixed with a sealing assembly 12, and the sealing assembly 12 includes a lifting cylinder 121 and a sealing member 122. The driving end of the lifting cylinder 121 drives the sealing member 122 to move downward to press against the upper surface of the cover body 4 that is fastened to the opening 14 of the drying chamber 1. The cover body 4 is provided with an air hole 41, and an air path (not shown) connected to the air hole 41 is formed in the cover body 41. The outer wall of the cover body 4 is connected to an exhaust pipe 42 connected to the air path (not shown). When the sealing member 122 presses against the top surface of the cover body 4, the exhaust pipe 42 discharges the gas in the drying chamber 1 through the air hole 41 and the air path (not shown). Combined Figure 2 As shown, the drying device further includes: a pipeline 5, which is U-shaped and surrounds the swing seat 21 and is arranged in the drying chamber 1. Specifically, Figure 1As shown, the pipeline 5 is assembled on the top of the liquid collecting chamber 15 through the mounting bracket 13. The connecting pipe 51 of the pipeline 5 passes through the side wall of the drying chamber 1, and the pipeline 5 is evenly distributed with a number of through holes 52. Furthermore, the sealing assembly 12 is provided in two groups, and the lifting cylinders 121 of the two groups of sealing assemblies 12 are symmetrically assembled on the outer wall of the drying chamber 1 in the width direction. The cover body 1 is connected to the force-bearing end 43 away from the hinge point with the drying chamber 1, and the two lifting cylinders 121 synchronously drive the two sealing members 122 to move downward and abut against the upper surface of the force-bearing end 43. It should be noted that the sealing member 122 is provided in an inverted L shape (see FIG. 1 ). Figure 6 As shown), so as to achieve the effect of clamping the force-bearing end 43.

[0032] Ginseng Figure 1 、 Figure 2 as well as Figure 6 As shown, two pipelines 5 are arranged side by side from top to bottom within the drying chamber 1. Both pipelines 5 are secured by clamps 131 and connected to the mounting bracket 13. A swing base 21 arranges two wafer baskets 6 side by side along its length. A connecting post 213 is located at the midpoint of the swing base 21's length and rotates with the drying chamber 1. A drive wheel 221 is connected to a longitudinal sidewall of the swing base 21, away from the connecting post 213. The upper surface of the swing base 21 is evenly distributed with four first positioning seats 214 for positioning the two wafer baskets 6 along their length, as well as four second positioning seats 215 for positioning the two wafer baskets 6 along their width.

[0033] When the wafers 7 placed in the wafer basket 6 need to be dried, the wafer basket 6 is placed on the swing seat 21 through the opening 14 of the drying chamber 1 by a robot (not shown) or manually. The four first positioning seats 214 and the four second positioning seats 215 formed on the swing seat 21 respectively limit the length direction and the width direction of the two wafer baskets 6 at the same time, so as to achieve the following effect: Figure 2 The state shown is for the purpose of simultaneously positioning two wafer baskets 6. The cover 4 is then fastened to the opening 14 of the drying chamber 1 with the hinge point with the drying chamber 1 as the axis. The lower surface of the cover 4 is in contact with the sealing ring 11 formed on the top surface of the drying chamber 1 and arranged around the opening 14. The driving end of the lifting cylinder 121 is then lowered to drive the sealing member 122 downward and against the upper edge of the force-bearing end 43 of the cover 4, so that the drying chamber 1 is in a sealed state. An air pump or other exhaust device (not shown) is then connected to the exhaust channel 42, and the gas in the drying chamber 1 is extracted through the air holes 41 and the exhaust channel 42 to maintain a vacuum state within the drying chamber.

[0034] It should be noted that in this embodiment, a liquid collecting chamber 15 is provided in the drying chamber 1, and two U-shaped pipes 5 are arranged in parallel on the upper edge of the liquid collecting chamber 15 through the mounting bracket 13, and a number of evenly distributed through-holes 52 of the U-shaped pipes 5 are all opened on the side of the pipes 5 facing the swing seat 21. The connecting pipes 51 of the two pipes 5 are all passed through the drying chamber 1, and a fluid can be injected into each of the two connecting pipes 51. For example, if the wafers 7 need to be rinsed before drying, the rinsing liquid is first injected into the connecting pipe 51 of one pipe 5. The rinsing liquid is sprayed from the through-holes 52 opened in the pipe 5 to the surface of the wafers 7 in the two wafer baskets 6 placed on the swing seat 21 to rinse the wafers 7. The rinsing liquid falls into the liquid collecting chamber 15 to collect the rinsing liquid. The liquid collecting chamber 15 can discharge the cleaning liquid inside it through a drain pipe passing through the drying chamber 1, which will not be described in detail here. After the rinsing of the wafer 7 is completed, a dry gas (such as nitrogen) is injected into the connecting pipe 51 of another pipeline 5, and the nitrogen is sprayed from the through hole 52 opened in the pipeline 5 to the surface of the wafer 7 in the two wafers 6 placed on the swing seat 21 to dry the surface of the wafer 7. During the above-mentioned rinsing and drying process of the wafer 7, the swing seat 21 is in an up and down swinging state with the connecting column 213 as the axis under the drive of the swing arm assembly 22, so as to achieve a better rinsing and drying effect on the surface of the wafer 7. It should be noted that whether the rinsing step is performed is determined according to the production requirements of the wafer 7.

[0035] After the wafer basket 6 containing a plurality of wafers 7 is placed on the swing seat 21, the driving device 21 configured as a driving cylinder is made to cyclically extend and retract the driving end. When the driving end of the driving device 21 is extended, the first connecting rod 2221 of the driving end connecting rod and the second connecting rod 2222 connected thereto are synchronously raised to drive the driving member 2223 and the receiving groove 2225 opened by the driving member 2223 to apply an upward lifting force to the driving wheel 221 passing through the interior thereof, so as to drive the swing seat 21 to rotate relative to the connecting seat 213 with the connecting seat as the axis. The drying chamber 1 is lifted upward, and the wafers 7 placed in the wafer basket 6 move in unison with the rise of the swing seat 21. After the driving end of the driving device 21 is extended to its maximum length, it is retracted to drive the first connecting rod 2221 and the second connecting rod 2222 to descend together, thereby driving the driving member 2223 and the receiving groove 2225 defined by the driving member 2223 to apply downward pressure to the driving wheel 221 passing therethrough, causing the wafers placed in the wafer basket 6 to move in unison with the descent of the swing seat 21. By driving the swing seat 221 to swing upward and downward, when the rinsing solution or drying gas is introduced into the drying chamber 1 through the through hole of the pipeline 5, the swing seat 21 drives the wafers 7 to swing within a certain range, thereby improving the contact efficiency between the wafers 7 and the rinsing solution or drying gas, compared to the conventional method of keeping the wafers stationary, thereby effectively improving the rinsing and drying effects on the surface of the wafers 7.

[0036] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

[0037] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A swing-arm wafer drying device, characterized in that: include: A drying chamber, wherein a swing assembly is assembled in the drying chamber, the swing assembly comprising a swing seat and a swing arm assembly, the swing seat being rotatably connected to the drying chamber; The swing arm assembly includes a driving device and a connecting assembly. The driving device is assembled on the inner wall of the drying chamber and drives the connecting assembly to rise and fall and drives the swing seat to swing around the rotating connection point with the drying chamber. The upper surface of the swing seat is detachable for placing a wafer basket.

2. The swing-arm wafer drying device according to claim 1, characterized in that: The connecting assembly includes a first connecting rod, a second connecting rod and a driving member, wherein the bottom end of the first connecting rod is connected to the driving end of the driving device, the end of the first connecting rod away from the driving device extends upward and is equipped with a mounting block, and the end of the mounting block away from the first connecting rod is connected to the top end of the second connecting rod; The bottom end of the second connecting rod extends downward in parallel with the length direction of the first connecting rod and is connected to the driving member. One end of the swing seat in the length direction is connected to the driving wheel. The driving member is provided with a receiving groove for the driving wheel to pass through. The first connecting rod and the second connecting rod drive the driving member to rise and fall so that the receiving groove applies force to the driving wheel and drives the swing seat to swing around the rotation connection point between the swing seat and the drying chamber as the axis.

3. The swing-arm type wafer drying device according to claim 2, characterized in that: The top of the drying chamber is hingedly connected to a cover, and a sealing ring is provided around the opening at the top of the drying chamber. When the cover is buckled onto the opening of the drying chamber, the bottom wall of the cover abuts against the sealing ring. The outer wall of the drying chamber is fixedly connected to a sealing assembly, which includes a lifting cylinder and a sealing member. The driving end of the lifting cylinder drives the sealing member to move downward to resist the upper surface of the cover body buckled at the opening of the drying chamber.

4. The swing-arm type wafer drying device according to claim 3, characterized in that: The cover body is provided with an air hole, an air path connected to the air hole is formed in the cover body, the outer wall of the cover body is connected to an exhaust pipe connected to the air path, and when the sealing member abuts against the top surface of the cover body, the exhaust pipe discharges the gas in the drying chamber through the air hole and the air path.

5. The swing-arm type wafer drying device according to claim 2, characterized in that: Also includes: The pipeline is U-shaped and surrounds the swing seat and is arranged in the drying chamber. The connecting pipe of the pipeline passes through the side wall of the drying chamber, and the pipeline is evenly distributed with a plurality of through holes.

6. The swing-arm type wafer drying device according to claim 3, characterized in that: A mounting bracket for supporting pipelines is provided in the drying chamber. Two pipelines are arranged side by side from top to bottom in the drying chamber. Both pipelines are fixed by a clamping member and then connected to the mounting bracket.

7. The swing-arm wafer drying device according to claim 2, characterized in that: The swing seat arranges two wafer flower baskets in parallel along the length direction, a connecting column is set at the midpoint of the length direction of the swing seat, the connecting column rotates with the drying chamber, and the driving wheel is connected to the side wall of the swing seat in the length direction away from the connecting column.

8. The swing-arm wafer drying device according to claim 3, characterized in that: The upper surface of the swing seat is evenly distributed with four first positioning seats for positioning the two wafer flower baskets in the length direction and four second positioning seats for positioning the two wafer flower baskets in the width direction.

9. The swing-arm wafer drying device according to claim 3, characterized in that: The sealing components are provided in two groups. The lifting cylinders of the two groups of sealing components are symmetrically assembled on the outer wall of the drying chamber in the width direction. The cover body is connected to the force-bearing end away from the hinge point with the drying chamber. The two lifting cylinders synchronously drive the two sealing members to move downward and abut against the upper surface of the force-bearing end.

10. The swing-arm type wafer drying device according to claim 2, characterized in that: The driving device is optionally a driving cylinder with a driving end arranged vertically upward.