Solid-state laser light source monitoring device of inner wafer surface particle detection equipment

Abstract

The utility model belongs to the technical field of solid-state laser light source monitoring, and particularly relates to a solid-state laser light source monitoring device of inner wafer surface particle detection equipment, which comprises a bottom plate, a master station and a slave station are sequentially and fixedly arranged on the left side of the top of the bottom plate from left to right, and the master station and the slave station are connected in series. A sensor of the master station is connected with the slave station, a laser controller, a parallel collector and a communication board are sequentially and fixedly installed on the right side of the top of the bottom plate from left to right, the parallel collector is connected between the laser controller and the communication board in series, and an interface of the parallel collector is used for connecting and collecting power and current signals; according to the utility model, data can be collected and stored in real time, whether a Laser Current state is stable or not can be traced, the data are uploaded to an FDC system, and management and control can be realized, so that the device can reduce customer complaint risks caused by abnormal measurement due to an unstable light source of a product.

Description

Technical Field

[0001] The utility model relates to the technical field of solid-state laser light source monitoring, in particular to a solid-state laser light source monitoring device for inner wafer surface particle detection equipment. Background Art

[0002] The wafer surface particle detection equipment (SP1-TBI) in Jingmeng's factory requires a solid-state laser light source. The function of LaserCurrent: It is mainly used to determine whether the driving current of the laser exceeds the limit value during use. At present, the status monitoring method of the light source Laser Current during use is that personnel manually check from the Lon Browser software operation interface in the machine, and the signal cannot be transmitted through SECS. At the same time, the laser will fail due to the use time during use. The laser controller will automatically adjust the Laser Current to ensure its normal operation. However, the abnormal Laser Current will affect the accuracy of particle detection. The laser failure cannot be discovered in the first time due to the error in the monitoring frequency. Therefore, a solid-state laser light source monitoring device for internal wafer surface particle detection equipment is proposed to address the above problems. Utility Model Content

[0003] In order to make up for the deficiencies of the prior art and solve the problems in the above-mentioned background technology, the present invention proposes a solid-state laser light source monitoring device for an inner wafer surface particle detection device.

[0004] The technical solution adopted by the utility model to solve the technical problem is as follows: the solid-state laser light source monitoring device of the inner wafer surface particle detection equipment of the utility model comprises a bottom plate;

[0005] The master station and the slave station are fixedly installed in sequence from left to right on the top left side of the base plate. The master station and the slave station are connected in series, and the sensor of the master station is connected to the slave station. The laser controller, the parallel collector and the communication board are fixedly installed in sequence from left to right on the top right side of the base plate. The parallel collector is connected in series between the laser controller and the communication board, and the interface of the parallel collector is used to connect and collect power and current signals.

[0006] Preferably, the slave station provides multiple data interfaces.

[0007] Preferably, it also includes a wire management component, which is located between the slave station and the laser controller. The wire management component includes a wire management plate, which is fixedly installed on the top of the base plate. A plurality of evenly distributed wire holes are opened inside the wire management plate. A plurality of evenly distributed wire management rods are fixedly connected to the right side of the wire management plate, and the wire management rods correspond to the wire holes.

[0008] Preferably, the wire management rod is provided with a through groove that passes through the upper and lower parts, a guide rod is fixedly connected between the left and right sides of the through groove, baffles are sliding through the left and right sides of the outer surface of the guide rod, a spring is fixedly connected between the two baffles, and a set of springs is arranged on the outer surface of the guide rod.

[0009] Preferably, a slide groove is provided inside the baffle, and a plurality of evenly distributed card grooves are provided on the front and rear surfaces of the slide groove. A connecting block is slidably connected to the slide groove, and a through groove is provided inside the connecting block. Card blocks are slidably connected to the front and rear of the through groove, and the outer surface of the card block is clamped in the card groove. A spring 2 is fixedly connected between the two card blocks, and one side of the connecting block passes through one side of the baffle and is fixedly connected to a handle plate.

[0010] Preferably, one side of the handle plate is in contact with one side of the baffle.

[0011] Preferably, the outer surface of the handle plate, the outer surface of the clamping block and the interior of the clamping slot are all arranged in an arc shape.

[0012] The utility model is beneficial in that:

[0013] 1. This utility model can collect and store data in real time and trace whether the laser current status is stable. At the same time, the data is uploaded to the FDC system for management and control, thereby enabling the device to reduce the risk of customer complaints caused by measurement anomalies due to unstable light sources.

[0014] 2. The utility model can organize and place the connected wires through the wire management component, which is convenient for subsequent search and avoids the confusion and entanglement of many connected wires placed together, thereby making the device easy to use and highly practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure in Example 1;

[0017] Figure 2 This is a schematic diagram of the principle flow structure in Example 1;

[0018] Figure 3 This is a schematic diagram of the three-dimensional structure of the cable management assembly in Example 1;

[0019] Figure 4 This is a partial cross-sectional structural diagram of the cable management assembly in Example 1;

[0020] Figure 5 For Example 2 Figure 4 Enlarged structural diagram at point A in the middle.

[0021] In the figure: 1. Base plate; 2. Master station; 3. Slave station; 4. Communication board; 5. Parallel collector; 6. Laser controller; 7. Wire management assembly; 701. Wire management board; 702. Wire hole; 703. Wire management rod; 704. Handle plate; 705. Baffle; 706. Through slot; 707. Spring 1; 708. Guide rod; 709. Connecting block; 710. Slot; 711. Slide; 712. Block; 713. Through slot; 714. Spring 2. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] Example 1

[0024] See also Figure 1-4 As shown, a solid-state laser light source monitoring device for an inner wafer surface particle detection device includes a base plate 1;

[0025] The master station 2 and the slave station 3 are fixedly installed on the left side of the top of the base plate 1 from left to right. The master station 2 and the slave station 3 are connected in series. The sensor of the master station 2 is connected to the slave station 3. The laser controller 6, the parallel collector 5 and the communication board 4 are fixedly installed on the right side of the top of the base plate 1 from left to right. The parallel collector 5 is connected in series between the laser controller 6 and the communication board 4. The interface of the parallel collector 5 is used to connect and collect power and current signals. When working, the parallel collector 5 connected between the laser controller 6 and the communication board 4 has a serial DB25 interface and can be used to collect power and current signals. Then the master station 2 is equipped with the slave station 3, and all the sensors of the master station 2 are only connected to the slave station 3, not to the master station 2, and the slave station 3 and the master station 2 are connected in series. Then the host computer interface runs on the industrial computer of the master station 2 to realize display alarm, and the host computer can upload data to the FDC system in real time to realize real-time monitoring, so that the device can collect and store data in real time, and the Laser Whether the current status is stable, the data is uploaded to the FDC system for management and control, thereby enabling the device to reduce the risk of customer complaints caused by measurement abnormalities due to unstable light sources.

[0026] The slave station 3 provides a variety of data interfaces, which facilitate wiring and data transmission during operation.

[0027] It also includes a wire management component 7, which is located between the slave station 3 and the laser controller 6. The wire management component 7 includes a wire management plate 701, which is fixedly installed on the top of the base plate 1. A plurality of evenly distributed wire holes 702 are opened inside the wire management plate 701, and a plurality of evenly distributed wire management rods 703 are fixedly connected to the right side of the wire management plate 701, and the wire management rods 703 correspond to the wire holes 702; when working, the wires that need to be organized pass through the wire management plate 701 through the wire holes 702 of the wire management plate 701, and then the excess wires can be wrapped around the outer surface of the wire management rods 703 to be organized.

[0028] The wire management rod 703 is provided with a through slot 706 which passes through the top and bottom. A guide rod 708 is fixedly connected between the left and right sides of the through slot 706. Baffles 705 are slidingly passed through the left and right sides of the outer surface of the guide rod 708. A spring 1 707 is fixedly connected between the two baffles 705, and the spring 1 707 is sleeved on the outer surface of the guide rod 708. When working, the baffle 705 is moved to open the baffle 705 to stretch the spring 1 707, and the spring 1 707 has a rebound force after being stretched, and then the excess wires can be wrapped around the outer surface of the wire management rod 703 and blocked by the baffle 705 to prevent it from falling from the outer surface of the wire management rod 703, thereby achieving a better wire management effect.

[0029] The baffle 705 is provided with a sliding groove 711, and a plurality of evenly distributed card slots 710 are provided on the front and rear surfaces of the sliding groove 711. A connecting block 709 is slidably connected to the sliding groove 711, and a through groove 713 is provided inside the connecting block 709. The front and rear surfaces of the through groove 713 are slidably connected to card blocks 712, and the outer surfaces of the card blocks 712 are clamped in the card slot 710. A spring 2 714 is fixedly connected between the two card blocks 712. One side of the connecting block 709 passes through one side of the baffle 705 and is fixedly connected to the handle plate 704. When working, the handle plate 704 is pulled to move the handle plate 704, and the movement of the handle plate 704 drives the connecting block 709 When the lock 714 is unlocked, the lock 714 will be unlocked, and the lock 714 will be unlocked after unlocking, and the lock 714 will be unlocked.

[0030] One side of the handle plate 704 is in contact with one side of the baffle 705 ; during operation, the handle plate 704 can be separated from the baffle 705 .

[0031] Example 2

[0032] See also Figure 5 As shown, compared with Example 1, as another implementation of the present invention, the outer surface of the handle plate 704, the outer surface of the clamping block 712, and the inside of the clamping slot 710 are all arranged to be arc-shaped; when working, it is convenient to engage and disengage the clamping block 712 and the clamping slot 710, and the arc shape of the outer surface of the handle plate 704 is relatively rounded, so it will not cause too much pain if it is accidentally touched when organizing the wires.

[0033] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0034] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and improvements fall within the scope of the present invention as claimed.

Claims

1. A solid-state laser light source monitoring device for an inner wafer surface particle detection device, comprising a base plate (1); Its characteristics are: A master station (2) and a slave station (3) are fixedly installed in sequence from left to right on the top left side of the base plate (1); the master station (2) and the slave station (3) are connected in series; a sensor of the master station (2) is connected to the slave station (3); a laser controller (6), a parallel collector (5) and a communication board (4) are fixedly installed in sequence from left to right on the top right side of the base plate (1); a parallel collector (5) is connected in series between the laser controller (6) and the communication board (4); an interface of the parallel collector (5) is used to connect and collect power and current signals.

2. The solid-state laser light source monitoring device for an inner wafer surface particle detection device according to claim 1, characterized in that: The slave station (3) provides multiple data interfaces.

3. The solid-state laser light source monitoring device for an inner wafer surface particle detection device according to claim 1, characterized in that: The invention also includes a wire management component (7), the wire management component (7) is located between the slave station (3) and the laser controller (6), the wire management component (7) includes a wire management plate (701), the wire management plate (701) is fixedly mounted on the top of the base plate (1), a plurality of evenly distributed wire through holes (702) are opened inside the wire management plate (701), and a plurality of evenly distributed wire management rods (703) are fixedly connected to the right side of the wire management plate (701), and the wire management rods (703) correspond to the wire through holes (702).

4. The solid-state laser light source monitoring device for an inner wafer surface particle detection device according to claim 3, characterized in that: A through slot (706) is provided inside the cable management rod (703) and is passed through from top to bottom. A guide rod (708) is fixedly connected between the left and right sides of the through slot (706). Baffles (705) are slidably passed through the left and right sides of the outer surface of the guide rod (708). A spring (707) is fixedly connected between the two baffles (705), and the spring (707) is sleeved on the outer surface of the guide rod (708).

5. The solid-state laser light source monitoring device for an inner wafer surface particle detection device according to claim 4, characterized in that: The baffle (705) is provided with a slide groove (711) inside, and a plurality of evenly distributed card grooves (710) are provided on both the front and rear surfaces of the slide groove (711). A connecting block (709) is slidably connected inside the slide groove (711), and a through groove (713) is provided inside the connecting block (709). Card blocks (712) are slidably connected at the front and rear of the through groove (713), and the outer surface of the card block (712) is engaged with the inside of the card groove (710). A spring 2 (714) is fixedly connected between the two card blocks (712). One side of the connecting block (709) passes through one side of the baffle (705) and is fixedly connected to the handle plate (704).

6. The solid-state laser light source monitoring device for inner wafer surface particle detection equipment according to claim 5, characterized in that: One side of the handle plate (704) is in contact with one side of the baffle (705).

7. The solid-state laser light source monitoring device for an inner wafer surface particle detection device according to claim 6, characterized in that: The outer surface of the handle plate (704), the outer surface of the clamping block (712), and the interior of the clamping slot (710) are all arranged in an arc shape.

Images