Heat dissipation memory bank

Abstract

The utility model discloses a heat dissipation memory bank which comprises a first heat dissipation assembly and a second heat dissipation assembly which are arranged on the two sides of the memory bank. The first heat dissipation assembly and the second heat dissipation assembly each comprise a shell, inner plates are fixedly installed in the shells, a plurality of fins are fixedly installed on the inner plates and right face the shells, the fins abut against the shells, and heat dissipation channels are formed between the adjacent fins. A shell of the first heat dissipation assembly and a shell of the second heat dissipation assembly are fixedly connected to form a heat dissipation shell, a through groove communicating with the heat dissipation channel is formed in the upper end of the heat dissipation shell, and a plurality of miniature fans arranged at intervals are fixedly installed at the upper end of the outer side of the first heat dissipation assembly. And an air hole is formed in the shell of the first heat dissipation assembly and is over against the micro fan, and the air hole is communicated with the through groove. The heat dissipation memory bank has the advantages of being capable of actively accelerating heat dissipation and convenient to install and use.

Description

Technical Field

[0001] The utility model relates to the technical field of memory bars, in particular to a heat dissipation memory bar. Background Art

[0002] With the rapid development of computer technology, the demand for memory has increased, the storage capacity and frequency of memory sticks have continued to increase, and the heat generated during the working process has also increased accordingly. If the heat is not dissipated in time, it will affect its storage speed, shorten its lifespan, and directly affect the stability of the system.

[0003] In order to speed up the heat dissipation of the memory stick, heat sinks are currently installed around the memory stick to accelerate the heat dissipation. However, the heat is only radiated outward through the heat sink, and the heat dissipation efficiency is low, which also cannot meet the needs. Summary of the Invention

[0004] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by this patent application is how to provide a heat dissipation memory stick that can actively accelerate heat dissipation and is easy to install and use.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] A heat dissipation memory bar comprises a first heat dissipation component and a second heat dissipation component arranged on both sides of the memory bar;

[0007] The first heat dissipation assembly and the second heat dissipation assembly each include a shell, an inner plate is fixedly installed in the shell, a plurality of fins are fixedly installed on the inner plate facing the shell, the fins abut against the shell, and heat dissipation channels are formed between adjacent fins;

[0008] The outer shell of the first heat dissipation component and the outer shell of the second heat dissipation component are fixedly connected to form a heat dissipation shell. The upper end of the heat dissipation shell is provided with a through groove connected to the heat dissipation channel. A plurality of spaced micro fans are fixedly installed on the upper outer end of the first heat dissipation component. The outer shell of the first heat dissipation component is provided with air holes facing the micro fans, and the air holes are connected to the through groove.

[0009] In this way, during assembly, the fins are welded to the inner plate, and then the inner plate is welded to the outer shell. The first heat dissipation component and the second heat dissipation component are arranged on both sides of the memory stick and fixedly connected to form a heat dissipation shell. During heat dissipation, the heat of the memory stick is transferred to the inner plate, and the heat is dissipated outwards through the inner plate and the fins, and the heat is dissipated outwards through the outer shell. At the same time, the micro fan is started, and the micro fan drives the air flow to take away the heat from the heat dissipation channel, accelerates the heat dissipation, and actively accelerates the heat dissipation through the micro fan, thereby better improving the heat dissipation efficiency.

[0010] The outer shell and the memory bar are provided with threaded holes facing each other, and the outer shell of the first heat dissipation component, the memory bar and the outer shell of the second heat dissipation component are fixedly connected by screws.

[0011] Wherein, a thermal conductive silicone grease layer is applied between the inner plate and the memory bar.

[0012] The inner plate, fins and outer shell are made of the same material.

[0013] Wherein, the inner plate is connected to the outer shell by welding.

[0014] The housing of the first heat dissipation component and the housing of the second heat dissipation component are fixedly connected by screws.

[0015] In summary, this heat dissipation memory stick has the advantages of being able to actively accelerate heat dissipation and being easy to install and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Fig. 1 The present invention is a schematic structural diagram of a heat dissipation memory bar.

[0017] Fig. 2 This is an exploded view of a heat dissipation memory module described in the present invention.

[0018] Fig. 3 This is a cross-sectional view of a heat dissipation memory bar according to the present invention. DETAILED DESCRIPTION

[0019] The present invention is further described in detail below with reference to the accompanying drawings. In the description of the present invention, it should be understood that the directions or positional relationships indicated by directional terms such as "upper, lower" and "top, bottom" are generally based on the directions or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present invention and simplify the description. Unless otherwise indicated, these directional terms do not indicate or imply that the devices or components referred to must have a specific direction or be constructed and operated in a specific direction, and therefore should not be understood as limiting the scope of protection of the present invention; the directional terms "inside" and "outside" refer to the inside and outside relative to the outline of each component itself.

[0020] like Figs. 1-3 As shown, a heat dissipation memory bar includes a first heat dissipation component 2 and a second heat dissipation component 3 arranged on both sides of a memory bar 1;

[0021] The first heat dissipation assembly and the second heat dissipation assembly each include a housing 4, an inner plate 5 fixedly mounted in the housing, a plurality of fins 6 fixedly mounted on the inner plate facing the housing, the fins abutting against the housing, and heat dissipation channels 7 formed between adjacent fins;

[0022] The outer shell of the first heat dissipation assembly and the outer shell of the second heat dissipation assembly are fixedly connected to form a heat dissipation shell, an upper end of the heat dissipation shell is provided with a through slot 8 in communication with the heat dissipation channel, and the outer side upper end of the first heat dissipation assembly is fixedly provided with a plurality of micro fans 9 arranged at intervals.

[0023] In this way, when assembled, the fins are welded to the inner plate, and the inner plate is welded to the outer shell, the first heat dissipation assembly and the second heat dissipation assembly are arranged on both sides of the memory bank and fixedly connected to form a heat dissipation shell, when dissipating heat, the heat of the memory bank is transmitted to the inner plate, and the heat is dissipated outward through the inner plate and the fins, and the heat is dissipated outward through the outer shell, at the same time, the micro fan is started, the micro fan drives the airflow to flow, and the heat of the heat dissipation channel is taken away, so as to accelerate heat dissipation, and the heat dissipation is actively accelerated by the micro fan, so as to better improve the heat dissipation efficiency.

[0024] In implementation, the outer shell and the memory bank are provided with threaded holes opposite to each other, and the outer shell of the first heat dissipation assembly, the memory bank and the outer shell of the second heat dissipation assembly are fixedly connected by screws, so that the first heat dissipation assembly and the second heat dissipation assembly are stably connected to the memory bank, and heat dissipation is facilitated.

[0025] In implementation, a layer of heat-conducting silicone grease 10 is applied between the inner plate and the memory bank, so as to accelerate heat transmission and improve heat dissipation efficiency.

[0026] In implementation, the inner plate, the fins and the outer shell are made of the same material, and all are made of aluminum material, so as to realize rapid heat transmission and dissipation.

[0027] In implementation, the inner plate and the outer shell are welded, so as to facilitate manufacturing.

[0028] In implementation, the outer shell of the first heat dissipation assembly and the outer shell of the second heat dissipation assembly are fixedly connected by screws, so as to facilitate assembly.

[0029] Finally, it should be noted that those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and the statistical number thereof, the present application also intends to include these modifications and variations.

Claims

1. A heat dissipation memory module, characterized in that: It comprises a first heat dissipation component (2) and a second heat dissipation component (3) arranged on both sides of a memory bar (1); The first heat dissipation assembly and the second heat dissipation assembly both comprise a shell (4), an inner plate (5) fixedly mounted in the shell, a plurality of fins (6) fixedly mounted on the inner plate facing the shell, the fins abutting against the shell, and heat dissipation channels (7) formed between adjacent fins; The outer shell of the first heat dissipation component and the outer shell of the second heat dissipation component are fixedly connected to form a heat dissipation shell, the upper end of the heat dissipation shell is provided with a through slot (8) connected to the heat dissipation channel, a plurality of spaced micro fans (9) are fixedly mounted on the outer upper end of the first heat dissipation component, and the outer shell of the first heat dissipation component is provided with air holes facing the micro fans, and the air holes are connected to the through slot.

2. The heat dissipation memory module according to claim 1, characterized in that: The shell and the memory bar are oppositely provided with threaded holes, and the shell of the first heat dissipation component, the memory bar and the shell of the second heat dissipation component are fixedly connected by screws.

3. The heat dissipation memory module according to claim 2, characterized in that: A thermal conductive silicone grease layer (10) is applied between the inner plate and the memory bar.

4. The heat dissipation memory module according to claim 3, characterized in that: The inner plate, fins and outer shell are made of the same material.

5. The heat dissipation memory module according to claim 4, characterized in that: The inner plate is connected to the outer shell by welding.

6. The heat dissipation memory module according to claim 5, characterized in that: The housing of the first heat dissipation assembly and the housing of the second heat dissipation assembly are fixedly connected by screws.

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