Display module and terminal equipment

Abstract

The utility model relates to a display module and terminal equipment. The display module comprises a display panel, a first flexible circuit board, a chip on film, a first cushion layer and a driving chip. The first flexible circuit board is arranged on the backlight side of the display panel, and the first flexible circuit board and the display panel are stacked in the thickness direction; the chip on film comprises a first bending area and a connecting area, the two opposite sides of the connecting area are connected with the first bending area and the first flexible circuit board respectively, and the first bending area is connected with the display panel; the first cushion layer is arranged between the display panel and the connecting area and is provided with a groove, and an opening of the groove faces the connecting area; the driving chip is arranged on the surface, facing the display panel, of the connecting area and located in the groove. According to the display module, the driving chip is arranged in the groove, so that the space occupation in the thickness direction of the chip on film can be reduced, the offset of a bending area can be reduced, and glue overflow can be effectively avoided in the glue pouring process of mounting the display module.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic devices, and in particular to a display module and a terminal device. Background Art

[0002] Current terminal devices tend to have narrow bezels. However, when installing terminal devices with narrow bezels, glue overflow is prone to occur, resulting in damage to the terminal devices, making it difficult to achieve efficient production of terminal devices with narrow bezels. Utility Model Content

[0003] In order to overcome the problems existing in the related art, the present disclosure provides a display module and a terminal device.

[0004] According to a first aspect of an embodiment of the present disclosure, there is provided a display module, comprising:

[0005] Display panel;

[0006] a first flexible circuit board, disposed on the backlight side of the display panel and stacked with the display panel in a thickness direction;

[0007] A chip-on-film comprising a first bending region and a connecting region, wherein opposite sides of the connecting region are respectively connected to the first bending region and the first flexible circuit board, and the first bending region is connected to the display panel;

[0008] a first cushion layer, disposed between the display panel and the connection area, and having a groove, the notch of the groove facing the connection area;

[0009] The driving chip is arranged on a side of the connection area facing the display panel and is located in the groove.

[0010] In some embodiments, the groove is open toward the groove wall of the first flexible circuit board, and is closed toward the groove wall of the first bending region.

[0011] In some embodiments, the first cushion layer includes at least a support layer formed of a hard material.

[0012] In some embodiments, the thickness of the first pad layer is less than or equal to the thickness threshold, and the thickness threshold is such that the height difference of the chip-on-film at the first pad layer is less than or equal to 0.4 mm.

[0013] In some embodiments, the first bending region is connected to a first edge of the display panel, the first pad layer at least partially extends along the first edge, and the first pad layer protrudes from the COF in an extension direction of the first edge.

[0014] In some embodiments, the first bending region is connected to a first edge of the display panel, the first pad layer extends from one side of the display panel to one side of the first bending region, and the display panel protrudes from the first pad layer in this extending direction.

[0015] In some embodiments, the display module also includes a second pad, which is arranged between the display panel and the connection area. The first bending area is connected to the first edge of the display panel. The second pad is at least partially provided with a first notch on one side of the first edge. The first notch extends at least to the projection range of the chip-on-film on the display panel.

[0016] In some embodiments, the driving chip has a first side facing the first flexible circuit board and a second side facing the first bending area, the display module includes a first connecting portion extending along the first side and a second connecting portion extending along the second side, the first connecting portion connects the first side and the connecting area, the second connecting portion connects the second side and the connecting area, and the width of the first connecting portion is greater than the width of the second connecting portion.

[0017] In some embodiments, the display module further includes:

[0018] a touch panel, the touch panel being arranged on the light-emitting side of the display panel and being stacked with the display panel in a thickness direction;

[0019] a second flexible circuit board, comprising a second bending area connected to the touch panel and a second circuit board body, wherein the second circuit board body is arranged on the backlight side of the display panel;

[0020] a third pad layer, the third pad layer being disposed between the display panel and the second circuit board body;

[0021] The second bending region is located on a side of a second edge of the display panel, and the second edge protrudes from the third cushion layer toward the second bending region.

[0022] In some embodiments, the display module further includes:

[0023] a touch panel, the touch panel being arranged on the light-emitting side of the display panel and being stacked with the display panel in a thickness direction;

[0024] a second flexible circuit board, comprising a second bending area connected to the touch panel and a second circuit board body, wherein the second circuit board body is arranged on the backlight side of the display panel;

[0025] A second pad layer, the second pad layer is arranged between the second circuit board body and the display panel, the second bending area is connected to the touch panel on the second edge side of the display panel, the second pad layer is at least partially provided with a second notch on the second edge side, and the second notch extends at least to the projection range of the second circuit board body on the display panel.

[0026] In some embodiments, the display module further includes:

[0027] a touch panel, the touch panel being arranged on the light-emitting side of the display panel and being stacked with the display panel in a thickness direction;

[0028] a second flexible circuit board, comprising a second bending area connected to the touch panel and a second circuit board body, wherein the second circuit board body is arranged on the backlight side of the display panel;

[0029] a third pad layer, the third pad layer being disposed between the display panel and the second circuit board body;

[0030] The second bending region is located on a side of a second edge of the display panel. The third pad layer at least partially extends along the second edge, and the third pad layer protrudes from the second flexible circuit board in an extending direction of the second edge.

[0031] In some embodiments, an edge of a connection between the second bending region and the second circuit board body is perpendicular to the second edge.

[0032] In some embodiments, the sidewall of the display panel and the first bending region form an open corner structure, and the open corner structure is left vacant.

[0033] In some embodiments, the display module further includes a cover plate, which is disposed on the light-emitting side of the display panel. An ink area for shading is disposed at an edge of the cover plate, and a silk-screen logo is at least partially disposed on the ink area.

[0034] In some embodiments, a vacant area is provided at least partially along an edge of the display panel, and a width of the vacant area perpendicular to the edge of the display panel is A, and the width A satisfies: 1.5 mm ≤ A ≤ 3 mm.

[0035] In some embodiments, the vacant area is at least provided in a corner region of the display panel, and a width of the vacant area in the corner region perpendicular to an edge of the display panel is B, and the width B satisfies: 5mm≤B≤6mm.

[0036] In some embodiments, the first flexible circuit board includes a first connector and a first circuit board body, and the second flexible circuit board also includes a second connector connected to the second circuit board body. The distance between the connection position of the first connector and the first circuit board body and the edge of the display panel is C, and the distance between the connection position of the second connector and the second circuit board body and the edge of the display panel is C, and the distance C satisfies: C ≥ 5 mm.

[0037] According to a second aspect of an embodiment of the present disclosure, a terminal device is provided, comprising the display module of an embodiment of the present disclosure.

[0038] The technical solution provided by the embodiments of the present disclosure may include the following beneficial effects: by setting a groove in the first pad layer and setting the driver chip on the chip-on-chip film in the groove, it is possible to avoid stacking the driver chip and the first pad layer and increasing the occupied space in the thickness direction of the chip-on-chip film, thereby facilitating reducing the height difference of the bending area of ​​the chip-on-chip film, thereby reducing the process difficulty of the dam in the glue pouring and reducing the risk of glue overflow from the dam.

[0039] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0041] Figure 1 The figure is a schematic structural diagram of a display module according to an exemplary embodiment.

[0042] Figure 2 FIG. 1 is a structural diagram of a display module from another perspective according to an exemplary embodiment.

[0043] Figure 3 FIG. 4 is a schematic structural diagram of a first cushion layer according to an exemplary embodiment.

[0044] Figure 4 FIG. 1 is a structural diagram of a display module from another perspective according to an exemplary embodiment.

[0045] Figure 5 FIG. 1 is a structural diagram of a display module from another perspective according to an exemplary embodiment.

[0046] Figure 6 FIG. 4 is a schematic structural diagram of a second cushion layer according to an exemplary embodiment.

[0047] Figure 7FIG. 1 is a structural diagram of a display module from another perspective according to an exemplary embodiment.

[0048] Figure 8 FIG. 4 is a schematic structural diagram of a first bending region according to an exemplary embodiment.

[0049] Figure 9 FIG. 1 is a structural diagram of a display module from another perspective according to an exemplary embodiment.

[0050] Figure 10 FIG. 1 is a structural diagram of a display module from another perspective according to an exemplary embodiment.

[0051] Figure 11 FIG. 1 is a structural diagram of a display module from another perspective according to an exemplary embodiment.

[0052] Figure 12 FIG. 1 is a structural diagram of a display module from another perspective according to an exemplary embodiment.

[0053] Figure 13 The figure is a block diagram of a terminal device according to an exemplary embodiment.

[0054] Reference numerals:

[0055] 1. Display panel; 11. First edge; 12. Second edge; 13. Light-emitting side; 14. Backlight side; 2. First flexible circuit board; 3. Chip-on-film; 31. First bending area; 32. Connection area; 33. Driver chip; 331. First connection part; 332. Second connection part; 4. First cushion layer; 41. First side wall; 42. Second side wall; 43. Third side wall; 44. Support layer; 45. Adhesive layer; 5. Second cushion layer; 51. First notch; 52. Second notch; 53. Foaming layer; 54. Fixing layer; 6. Touch panel; 7. Second flexible circuit board; 71. Second bending area; 72. Second circuit board body; 8. Third cushion layer; 9. Cover plate; 91. Silk-screen logo. DETAILED DESCRIPTION

[0056] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0057] The present disclosure provides a display module comprising a display panel, a first flexible circuit board, a chip-on-film (COF), a first cushion layer, and a driver chip. The first flexible circuit board is disposed on the backlight side of the display panel and is stacked with the display panel in the thickness direction. The COF includes a first bending region and a connection region, with the first bending region and the first flexible circuit board connected to opposite sides of the connection region, respectively. The first bending region is connected to the display panel. The first cushion layer is disposed between the display panel and the connection region and has a groove, with the groove opening facing the connection region. The driver chip is disposed on the side of the connection region facing the display panel and is located within the groove.

[0058] In the disclosed embodiments, a groove is provided in the first underlayer to accommodate the driver chip on the COF, preventing the driver chip from being stacked on the first underlayer. This reduces the space occupied by the COF along its thickness, thereby minimizing the step difference in the bend area and effectively preventing glue overflow during the glue pouring process for display module installation.

[0059] A display module is a device that displays information by emitting light.

[0060] Figure 1 is a schematic structural diagram of a display module according to an exemplary embodiment. Figure 1 As shown, the display module includes a display panel 1, a first flexible circuit board 2, a chip-on-film (COF) 3, a first cushion layer 4, and a driver chip 33. The first flexible circuit board 2 is disposed on the backlight side 14 of the display panel 1 and is stacked with the display panel 1 in the thickness direction. The COF 3 includes a first bending region 31 and a connection region 32. The connection region 32 connects the first bending region 31 and the first flexible circuit board 2 on opposite sides, and the first bending region 31 is connected to the display panel 1. The first cushion layer 4 is disposed between the display panel 1 and the connection region 32 and has a groove, with the groove opening facing the connection region 32. The driver chip 33 is disposed on the side of the connection region 32 facing the display panel 1 and is located within the groove.

[0061] In the embodiment of the present disclosure, by setting a groove in the first pad layer 4, the driving chip 33 on the chip-on-chip film 3 can be accommodated in the groove, thereby avoiding the stacking of the driving chip 33 and the first pad layer 4, reducing the space occupied in the thickness direction of the chip-on-chip film 3, and further reducing the step difference in the bending area of ​​the chip-on-chip film 3, thereby avoiding glue overflow during the glue injection process of installing the display module.

[0062] The display panel 1 is a direct-light emitting device (also known as a panel). The first flexible printed circuit board 2 is a type of printed circuit board (FPC), which in the embodiments of the present disclosure may be referred to as a main printed circuit board (MFPC). The chip-on-film (COF) 3 is a structure used to connect the display panel 1 and the FPC. The driver chip 33 may be at least a touch display driver chip 33 (DDIC).

[0063] Figure 2 is a schematic structural diagram of a display module from another perspective according to an exemplary embodiment. Figure 2 As shown, the groove is open toward the groove wall of the first flexible circuit board 2 , and is closed toward the groove wall of the first bending area 31 .

[0064] In the disclosed embodiment, the groove walls are open toward the first flexible circuit board 2, providing a certain amount of redundant space for the driver chip 33. Even if there are errors in the driver chip 33's installation position, it can still be accommodated in the groove without damage. Even if the driver chip 33 is displaced along with the chip-on-film 3 by an impact, the groove walls will not collide with the driver chip 33, effectively protecting the driver chip 33. Furthermore, the groove walls are closed toward the first bend region 31, providing sufficient support for the chip-on-film 3 and preventing the glue from entering the groove during glue filling.

[0065] In some embodiments, the first cushion layer 4 includes a second side wall 42 , a first side wall 41 , and a third side wall 43 connected in sequence, wherein the first side wall 41 faces the first bending region 31 .

[0066] In some embodiments, the first cushion layer 4 includes at least a support layer 44 formed of a hard material.

[0067] In the embodiment of the present disclosure, the support layer 44 in the first cushion layer 4 is set to be a hard material, which can provide sufficient strength to avoid glue overflow during glue pouring.

[0068] Figure 3 is a schematic structural diagram of a first cushion layer according to an exemplary embodiment. Figure 3 As shown, the first cushion layer 4 may have a three-layer structure, including two adhesive layers 45 and a support layer 44 disposed between the two adhesive layers 45. The adhesive layers 45 are used to fix the first cushion layer 4.

[0069] In some embodiments, the support layer 44 may be made of polyethylene terephthalate (PET), and the adhesive layer 45 may be made of pressure-sensitive adhesive (PSA).

[0070] In some embodiments, the thickness of the first pad layer 4 is less than or equal to a thickness threshold, and the thickness threshold is such that the step height of the chip-on-film 3 at the first pad layer 4 is less than or equal to 0.4 mm.

[0071] In the embodiment of the present disclosure, the thickness of the first pad layer 4 is set to be less than or equal to the thickness threshold, so that the step height of the chip-on-film 3 at the first pad layer 4 is less than or equal to 0.4 mm, which can effectively reduce the risk of glue overflow in the glue filling process.

[0072] In some embodiments, the thickness of the two adhesive layers 45 is 0.1 mm respectively, the thickness of the support layer 44 is 0.1 mm, and the total thickness of the first cushion layer 4 is 0.3 mm.

[0073] Figure 4 is a schematic structural diagram of a display module from another perspective according to an exemplary embodiment. Figure 4 As shown, the first bending region 31 is connected to the first edge 11 of the display panel 1 , the first pad layer 4 at least partially extends along the first edge 11 , and the first pad layer 4 protrudes from the COF 3 in the extending direction of the first edge 11 .

[0074] In the embodiment of the present disclosure, by setting the first cushion layer 4 to protrude from the COF 3 in the extension direction of the first edge 11 , the gap under the COF 3 can be reduced, the difficulty of dam dispensing can be reduced, and the product yield can be improved.

[0075] In some embodiments, the first pad layer 4 protrudes from the chip-on-film 3 by a dimension of 0.1 mm to 0.5 mm.

[0076] Figure 5 is a schematic structural diagram of a display module from another perspective according to an exemplary embodiment. Figure 5 As shown, the first bending region 31 is connected to the first edge 11 of the display panel 1 , and the first pad layer 4 extends from one side of the display panel 1 to the first bending region 31 . The display panel 1 protrudes from the first pad layer 4 in this extending direction.

[0077] In the embodiment of the present disclosure, the display panel 1 is protruded from the first cushion layer 4 in the extension direction of the first cushion layer 4. This prevents the first cushion layer 4 from covering the first edge 11, leaving a portion of the first edge 11 exposed. This prevents the first cushion layer 4 from protruding from the first edge 11 and obstructing the normal bending of the first bending region 31, even if there are errors during assembly.

[0078] In some embodiments, the display panel 1 protrudes from the first cushion layer by 0.2 mm to 0.3 mm.

[0079] In some embodiments, as Figure 5 As shown, the display module also includes a second pad 5, which is arranged between the display panel 1 and the connection area 32, and the first bending area 31 is connected to the first edge 11 of the display panel 1. The second pad 5 is at least partially provided with a first notch 51 on one side of the first edge 11, and the first notch 51 extends at least to the projection range of the chip-on-film 3 on the display panel 1.

[0080] In the embodiment of the present disclosure, a first notch 51 is provided in the second cushion layer 5 to prevent the second cushion layer 5 from protruding from the display panel 1 at the chip-on-chip film 3 after installation in the event of installation errors, thereby preventing the bending of the chip-on-chip film 3 from being hindered, thereby improving the overall yield of the product.

[0081] In some embodiments, the second cushion layer 5 is flush with the first edge 11. The first notch 51 of the second cushion layer 5 is located 0.2 mm to 0.3 mm away from the first edge 11.

[0082] Figure 6 is a schematic structural diagram of a second cushion layer according to an exemplary embodiment. Figure 6 As shown, the second cushion layer 5 includes a foaming layer 53 and a fixing layer 54. The foaming layer 53 can be made of a foaming material (FOAM), and the fixing layer 54 can be made of polyethylene terephthalate (PET). The second cushion layer 5 can be used to support the display panel 1 and dissipate heat.

[0083] In some embodiments, the second cushion layer 5 has a thickness of 0.23 mm to 0.25 mm.

[0084] Figure 7 is a schematic structural diagram of a display module from another perspective according to an exemplary embodiment. Figure 7 As shown, the driving chip 33 has a first side facing the first flexible circuit board 2 and a second side facing the first bending area 31. The display module includes a first connecting portion 331 extending along the first side and a second connecting portion 332 extending along the second side. The first connecting portion 331 connects the first side and the connecting area 32, and the second connecting portion 332 connects the second side and the connecting area 32. The width of the first connecting portion 331 is greater than the width of the second connecting portion 332.

[0085] In the embodiment of the present disclosure, the driver chip 33 needs to be fixed on the flip chip film 3 through a fixing structure, and the width of the second connection portion 332 facing the first bending area 31 is set to be smaller than the first connection portion 331. This can reduce the risk of the mold squeezing the driver chip 33 and can also reduce the impact of the connection structure on the first bending area 31.

[0086] In some embodiments, the width of the first connection portion 331 may be 1.2 mm, and the width of the second connection portion 332 may be 0.6 mm.

[0087] In some embodiments, a side connection portion connecting both ends of the first connection portion 331 and the second connection portion 332 is further included, and a width of the side connection portion may be 0.6 mm.

[0088] Figure 8is a schematic structural diagram of a first bending region according to an exemplary embodiment. Figure 8 As shown, the side wall of the display panel 1 and the first bending area 31 form an open corner structure, and the open corner structure is left vacant.

[0089] In the embodiment of the present disclosure, the open corner structure formed by the sidewall of the display panel 1 and the first bending region 31 is left empty, thereby avoiding obstruction to the bending of the first bending region 31 and facilitating a reduction in the bending radius. If other components (such as colloid) were provided in this open corner structure, the bending stress in the first bending region 31 would be increased, thereby increasing the bending radius.

[0090] Figure 9 is a schematic structural diagram of a display module from another perspective according to an exemplary embodiment. Figure 9 As shown, the display module further includes a cover plate 9 , which is disposed on the light-emitting side 13 of the display panel 1 . An ink area for shading is disposed on the edge of the cover plate 9 , and a silk-screen mark 91 is disposed at least partially on the ink area.

[0091] In the embodiment of the present disclosure, by providing a silk screen mark 91 in the ink area of ​​the cover plate 9, it can serve as a boundary mark when bending the chip-on-film 3 or the flexible circuit board, thereby preventing the first bending area 31 from exceeding the edge of the cover plate 9.

[0092] In some embodiments, the cover plate 9 may be made of glass.

[0093] Figure 10 is a structural diagram of a display module from another perspective according to an exemplary embodiment. Figure 11 is a schematic structural diagram of a display module from another perspective according to an exemplary embodiment. Figure 10 、 Figure 11 As shown, the display module also includes a touch panel 6, a second flexible circuit board 7, and a third cushion layer 8. The touch panel 6 is disposed on the light-emitting side 13 of the display panel 1, and is stacked with the display panel 1 in the thickness direction. The second flexible circuit board 7 includes a second bending region 71 connected to the touch panel 6 and a second circuit board body 72, which is disposed on the backlight side 14 of the display panel 1. The third cushion layer 8 is disposed between the display panel 1 and the second circuit board body 72. The second bending region 71 is located on the side of the second edge 12 of the display panel 1, and the second edge 12 protrudes from the third cushion layer 8 toward the second bending region 71.

[0094] In an embodiment of the present disclosure, by setting the second edge 12 to protrude from the third pad 8, the third pad 8 can be misaligned with the second edge 12. In this way, even if there is an error during the installation process, the third pad 8 will not protrude from the second edge 12, thereby avoiding the third pad 8 interfering with the bending of the second bending area 71.

[0095] In some embodiments, the difference between the third cushion layer 8 and the second edge 12 is 0.2 mm to 0.3 mm.

[0096] In some embodiments, as Figure 11 As shown, the display module also includes a touch panel 6, a second flexible circuit board 7, and a second cushion layer 5. The touch panel 6 is disposed on the light-emitting side 13 of the display panel 1, and is stacked with the display panel 1 in the thickness direction. The second flexible circuit board 7 includes a second bending region 71 connected to the touch panel 6 and a second circuit board body 72, which is disposed on the backlight side 14 of the display panel 1. The second cushion layer 5 is disposed between the second circuit board body 72 and the display panel 1, with the second bending region 71 connected to the touch panel 6 on the side of the second edge 12 of the display panel 1. The second cushion layer 5 is at least partially provided with a second notch 52 on the side of the second edge 12, and the second notch 52 extends at least to the projection range of the second circuit board body 72 on the display panel 1.

[0097] In the embodiment of the present disclosure, by providing the second notch 52 in the second pad layer 5 , it is possible to prevent the second pad layer 5 from protruding from the COF 3 when an installation error occurs, thereby preventing the integrity of the COF 3 from being adversely affected.

[0098] In some embodiments, the width of the second notch 52 is 0.2 mm to 0.3 mm.

[0099] In some embodiments, as Figure 11 As shown, the display module also includes a touch panel 6, a second flexible circuit board 7, and a third padding layer 8. The touch panel 6 is disposed on the light-emitting side 13 of the display panel 1, and is stacked with the display panel 1 in the thickness direction. The second flexible circuit board 7 includes a second bending region 71 connected to the touch panel 6 and a second circuit board body 72, which is disposed on the backlight side 14 of the display panel 1. The third padding layer 8 is disposed between the display panel 1 and the second circuit board body 72. The second bending region 71 is located on the side of the second edge 12 of the display panel 1. The third padding layer 8 extends at least partially along the second edge 12 and protrudes from the second flexible circuit board 7 in the direction in which the second edge 12 extends.

[0100] In the embodiment of the present disclosure, by making the third pad 8 protrude from the second flexible circuit board 7 in the extension direction of the second edge 12 , the gap in the second bending area 71 can be reduced, thereby reducing the difficulty of glue pouring and improving product yield.

[0101] Figure 12 is a schematic structural diagram of a display module from another perspective according to an exemplary embodiment. Figure 12 As shown, the edge of the connection between the second bending area 71 and the second circuit board body 72 is perpendicular to the second edge 12 .

[0102] In the embodiment of the present disclosure, the second flexible circuit board 7 can better cooperate with the mold, thereby reducing the difficulty of production.

[0103] In some embodiments, as Figure 10 As shown, the display panel 1 is provided with a vacant area at least partially along the edge, and the width of the vacant area perpendicular to the edge of the display panel 1 is A, and the width A satisfies: 1.5 mm ≤ A ≤ 3 mm.

[0104] In the embodiment of the present disclosure, a glue sealing area with a width of A is provided to effectively avoid glue overflow and improve the sealing effect.

[0105] In some embodiments, as Figure 10 As shown, the vacant area is at least provided in the corner area of ​​the display panel 1 , and the width of the vacant area in the corner area perpendicular to the edge of the display panel 1 is B, and the width B satisfies: 5mm≤B≤6mm.

[0106] In the embodiment of the present disclosure, the width of the vacant area at the corner of the display panel 1 is set to B, which can leave enough space for the glue inlet and outlet, thereby facilitating smooth glue injection.

[0107] In some embodiments, as Figure 10 As shown, the first flexible circuit board 2 includes a first connector and a first circuit board body, and the second flexible circuit board 7 also includes a second connector connected to the second circuit board body 72. The distance between the connection position of the first connector and the first circuit board body and the edge of the display panel 1 is C, and the distance between the connection position of the second connector and the second circuit board body 72 and the edge of the display panel 1 is C. The distance C satisfies: C ≥ 5 mm.

[0108] In the embodiment of the present disclosure, the lengths of the first connector and the second connector are relatively fixed. The farther the connection position between the first connector and the first circuit board body and the connection position between the second connector and the second circuit board body 72 are set from the edge of the display panel 1, the easier it is to fold back the first connector and the second connector.

[0109] The present disclosure also proposes a terminal setting, including the display module in the embodiment of the present disclosure.

[0110] The terminal device proposed in the present disclosure can effectively avoid glue overflow and improve product yield by applying the display module of the present disclosure.

[0111] The terminal device involved in the present disclosure may also be referred to as user equipment (UE), mobile station (MS), mobile terminal (MT), etc., and is a device that provides voice and / or data connectivity to users. For example, the terminal can be a handheld device with wireless connection function, a vehicle-mounted device, etc. At present, some examples of terminals are: smart phones (Mobile Phones), pocket personal computers (Pocket Personal Computers, PPCs), handheld computers, personal digital assistants (Personal Digital Assistants, PDAs), laptops, tablet computers, wearable devices, or vehicle-mounted devices, etc. In addition, when it is a vehicle-to-everything (V2X) communication system, the terminal device can also be a vehicle-mounted device. It should be understood that the embodiments of the present disclosure do not limit the specific technology and specific device form adopted by the terminal.

[0112] Figure 13 8 is a block diagram of a terminal device according to an exemplary embodiment. For example, the terminal device 800 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0113] Reference Figure 13 The terminal device 800 may include one or more of the following components: a processing component 802 , a memory 804 , a power component 806 , a multimedia component 808 , an audio component 810 , an input / output interface (I / O interface) 812 , a sensor component 814 , and a communication component 816 .

[0114] The processing component 802 generally controls the overall operation of the terminal device 800, such as operations associated with display, phone calls, data communications, camera operation, and recording operations. The processing component 802 may include one or more processors 820 to execute instructions to complete all or part of the steps of the above-described method. In addition, the processing component 802 may include one or more modules to facilitate interaction between the processing component 802 and other components. For example, the processing component 802 may include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.

[0115] The memory 804 is configured to store various types of data to support operations on the terminal device 800. Examples of such data include instructions for any application or method operating on the terminal device 800, contact data, phone book data, messages, pictures, videos, etc. The memory 804 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk, or optical disk.

[0116] The power component 806 provides power to the various components of the terminal device 800. The power component 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the terminal device 800.

[0117] The multimedia component 808 includes a screen that provides an output interface between the terminal device 800 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, slides, and gestures on the touch panel. The touch sensor can not only sense the boundaries of a touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front camera and / or a rear camera. When the terminal device 800 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera can receive external multimedia data. Each front camera and rear camera can be a fixed optical lens system or have a focal length and optical zoom capability.

[0118] The audio component 810 is configured to output and / or input audio signals. For example, the audio component 810 includes a microphone (MIC), which is configured to receive external audio signals when the terminal device 800 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signal can be further stored in the memory 804 or transmitted via the communication component 816. In some embodiments, the audio component 810 also includes a speaker for outputting audio signals.

[0119] The input / output interface (I / O interface) 812 provides an interface between the processing component 802 and peripheral interface modules, such as a keyboard, a click wheel, buttons, etc. These buttons may include, but are not limited to, a home button, a volume button, a start button, and a lock button.

[0120] The sensor assembly 814 includes one or more sensors for providing various aspects of status assessment for the terminal device 800. For example, the sensor assembly 814 can detect the open / closed state of the terminal device 800, the relative positioning of components, such as the display and keypad of the terminal device 800. The sensor assembly 814 can also detect changes in the position of the terminal device 800 or a component of the terminal device 800, the presence or absence of user contact with the terminal device 800, the orientation or acceleration / deceleration of the terminal device 800, and temperature changes of the terminal device 800. The sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 814 may also include an optical sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an accelerometer, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0121] The communication component 816 is configured to facilitate wired or wireless communication between the terminal device 800 and other devices. The terminal device 800 can access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 816 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0122] In an exemplary embodiment, the terminal device 800 can be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the above method.

[0123] It is understood that in this disclosure, "plurality" refers to two or more than two, and other quantifiers are similar. "And / or" describes the association relationship of related objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the related objects before and after are in an "or" relationship. The singular forms "a", "the" and "the" are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0124] It will be further understood that the terms "first", "second", etc. are used to describe various information but do not imply a particular order or importance of the information. In fact, the terms "first", "second", etc. are used merely as labels to distinguish between two conceptually different objects or entities. For example, a first information can be termed a second information, and similarly, a second information can also be termed a first information without departing from the scope of the present disclosure.

[0125] It will be further understood that the terms "center", "longitudinal", "lateral", "front", "back", "up", "down", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate relative or positional relationships based on the orientation or position shown in the drawings, and are merely used to facilitate the description of the embodiments and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation.

[0126] It will be further understood that, unless otherwise specified, "connected" includes both direct and indirect connections between two or more elements, and that various elements can be directly or indirectly connected to each other.

[0127] It will be further understood that, although the operations of the embodiments of the present disclosure are described in a particular, sequential order, this should not be understood as requiring that the operations be performed in the described order, or in sequential order, or that all operations be performed, to achieve desirable results. In certain circumstances, multitasking and parallel processing can be advantageous.

[0128] Other embodiments of the present disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. It is intended that the present disclosure cover any and all variations of the application that come within the scope of the following claims and their equivalents. It is intended that the specification and examples be considered exemplary only, with the true scope and spirit of the application indicated by the following claims.

[0129] It should be understood that the present disclosure is not limited to the precise structures as herein described and illustrated in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the claims appended hereto.

Claims

1. A display module, characterized in that: include Display panel; a first flexible circuit board, disposed on the backlight side of the display panel and stacked with the display panel in a thickness direction; A chip-on-film comprising a first bending region and a connecting region, wherein opposite sides of the connecting region are respectively connected to the first bending region and the first flexible circuit board, and the first bending region is connected to the display panel; a first cushion layer, disposed between the display panel and the connection area, and having a groove, the notch of the groove facing the connection area; The driving chip is arranged on a side of the connection area facing the display panel and is located in the groove.

2. The display module according to claim 1, wherein: The groove is open toward the groove wall of the first flexible circuit board, and is closed toward the groove wall of the first bending area.

3. The display module according to claim 1, wherein: The first cushion layer includes at least a support layer formed of a hard material.

4. The display module according to any one of claims 1 to 3, wherein: The thickness of the first pad layer is less than or equal to a thickness threshold, and the thickness threshold is sufficient to ensure that a step height of the chip-on-film at the first pad layer is less than or equal to 0.4 mm.

5. The display module according to any one of claims 1 to 3, wherein: The first bending region is connected to a first edge of the display panel. The first pad layer at least partially extends along the first edge. The first pad layer protrudes from the COF in an extending direction of the first edge.

6. The display module according to any one of claims 1 to 3, characterized in that: The first bending region is connected to a first edge of the display panel. The first pad layer extends from one side of the display panel to one side of the first bending region. The display panel protrudes from the first pad layer in this extending direction.

7. The display module according to any one of claims 1 to 3, characterized in that: The display module also includes a second pad, which is arranged between the display panel and the connection area. The first bending area is connected to the first edge of the display panel. The second pad is at least partially provided with a first notch on one side of the first edge. The first notch extends at least to the projection range of the chip-on-film on the display panel.

8. The display module according to any one of claims 1 to 3, wherein: The driving chip has a first side facing the first flexible circuit board and a second side facing the first bending area. The display module includes a first connecting portion extending along the first side and a second connecting portion extending along the second side. The first connecting portion connects the first side and the connecting area, and the second connecting portion connects the second side and the connecting area. The width of the first connecting portion is greater than the width of the second connecting portion.

9. The display module according to any one of claims 1 to 3, wherein: The display module also includes a touch panel, the touch panel being arranged on the light-emitting side of the display panel and being stacked with the display panel in a thickness direction; a second flexible circuit board, comprising a second bending area connected to the touch panel and a second circuit board body, wherein the second circuit board body is arranged on the backlight side of the display panel; a third pad layer, the third pad layer being disposed between the display panel and the second circuit board body; The second bending region is located on a side of a second edge of the display panel, and the second edge protrudes from the third cushion layer toward the second bending region.

10. The display module according to any one of claims 1 to 3, characterized in that: The display module further includes a touch panel, which is arranged on the light-emitting side of the display panel and is stacked with the display panel in the thickness direction; a second flexible circuit board, comprising a second bending area connected to the touch panel and a second circuit board body, wherein the second circuit board body is arranged on the backlight side of the display panel; A second pad layer, the second pad layer is arranged between the second circuit board body and the display panel, the second bending area is connected to the touch panel on the second edge side of the display panel, the second pad layer is at least partially provided with a second notch on the second edge side, and the second notch extends at least to the projection range of the second circuit board body on the display panel.

11. The display module according to any one of claims 1 to 3, characterized in that: The display module further includes a touch panel, which is arranged on the light-emitting side of the display panel and is stacked with the display panel in the thickness direction; a second flexible circuit board, comprising a second bending area connected to the touch panel and a second circuit board body, wherein the second circuit board body is arranged on the backlight side of the display panel; a third pad layer, the third pad layer being disposed between the display panel and the second circuit board body; The second bending region is located on a side of a second edge of the display panel. The third pad layer at least partially extends along the second edge, and the third pad layer protrudes from the second flexible circuit board in an extending direction of the second edge.

12. The display module according to claim 9, wherein: An edge of a connection between the second bending region and the second circuit board body is perpendicular to the second edge.

13. The display module according to any one of claims 1 to 3, characterized in that: The side wall of the display panel and the first bending area form an open corner structure, and the open corner structure is vacant.

14. The display module according to any one of claims 1 to 3, characterized in that: The display module further includes a cover plate, which is arranged on the light-emitting side of the display panel. An ink area for shading is provided at an edge of the cover plate, and a silk-screen mark is provided at least partially on the ink area.

15. The display module according to any one of claims 1 to 3, characterized in that: The display panel is provided with a vacant area at least partially along an edge thereof, and the vacant area has a width A perpendicular to the edge of the display panel, and the width A satisfies: 1.5 mm ≤ A ≤ 3 mm.

16. The display module according to claim 15, wherein: The vacant area is at least provided in a corner area of ​​the display panel. The width of the vacant area in the corner area perpendicular to the edge of the display panel is B, and the width B satisfies: 5mm≤B≤6mm.

17. The display module according to claim 9, wherein: The first flexible circuit board includes a first connector and a first circuit board body, and the second flexible circuit board also includes a second connector connected to the second circuit board body. The connection position between the first connector and the first circuit board body is at a distance C from the edge of the display panel, and the connection position between the second connector and the second circuit board body is at a distance C from the edge of the display panel. The distance C satisfies: C ≥ 5 mm.

18. A terminal device, characterized in that: A display module comprising any one of claims 1-17.

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