Bare mounting device for bare substrate
By using horizontal and vertical interwoven main rib supports and negative pressure adsorption technology in the bare substrate ball planting device, the problem of bare substrate warping at high temperatures is solved, and high-quality ball planting welding and product stability are achieved.
Patent Information
- Application Number
- CN202422573318.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-24
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-10-24
AI Technical Summary
Bare substrates are prone to warping during high-temperature solder ball implantation, resulting in poor soldering and affecting the product's electrical performance and mechanical stability.
The bare substrate is supported by main ribs interwoven horizontally and vertically. Combined with positioning columns and adsorption plates, negative pressure adsorption and ball planting cover design can reduce warping and ensure ball planting welding quality.
It effectively reduces the warping of bare substrates during high-temperature solder ball implantation, improves soldering quality, increases yield rate, and ensures the electrical performance and mechanical stability of the product.
Smart Images
Figure CN223427453U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a bare substrate ball implantation device. Background Art
[0002] In the field of semiconductor packaging, bare substrate solder balling is a key process step that involves the precise placement of tiny solder balls on the substrate pads for subsequent packaging. This technology is crucial to the miniaturization, high performance and high reliability of electronic devices.
[0003] Currently, the two most commonly used soldering methods in the industry are solder paste printing and ball placement. Solder paste printing involves printing an appropriate amount of solder paste onto a pre-set pad, followed by reflow soldering to form a bumped terminal. Ball placement involves first applying solder paste or flux to the pad, then placing a solder ball onto the pad using a ball placement machine or screen printing, and then passing the ball through a reflow oven to form a spherical terminal.
[0004] Soldering of bare substrate solder balls is typically performed at temperatures above 270°C to ensure a good bond between the solder balls and the substrate pads. However, due to the ultra-thin nature of bare substrates and the characteristics of their materials, they may experience varying degrees of warping during high-temperature thermal processes. This warping can lead to poor soldering, compromising the product's electrical performance and mechanical stability. This warping not only affects soldering quality but can also cause packaging failure, increasing production costs and reducing product reliability. Utility Model Content
[0005] The purpose of this application is to provide a bare substrate ball planting device. When the bare substrate is deformed due to heat during the solder ball planting process, the support effect of the main ribs interwoven horizontally and vertically effectively reduces the warping tendency of the bare substrate, improves the warping problem, and ensures the quality of the bare substrate ball planting welding.
[0006] The present application provides a bare substrate ball planting device, comprising a ball planting base. The upper surface of the ball planting base is provided with a hollowed-out supporting area for supporting the bare substrate. The supporting area is provided with main ribs intersecting horizontally, vertically and vertically, and hollow holes are formed between the intervals formed by the intersecting main ribs.
[0007] In an implementable solution, the bare substrate includes a plurality of ball planting areas distributed in a rectangular array; when the bare substrate is placed on a ball planting base of a bare substrate ball planting device, each ball planting area of the bare substrate is located on a corresponding hollow hole.
[0008] In an practicable solution, a plurality of positioning posts are provided on the upper surface of the ball planting base, distributed around the edge of the bearing area. When a bare substrate is placed on the ball planting base of the bare substrate ball planting device, the edge of the bare substrate is confined within the positioning posts.
[0009] In an embodiment, the intersecting main ribs are symmetrically arranged along the longitudinal and transverse center lines.
[0010] In an embodiment, triangular connecting ribs are arranged at the intersections of adjacent main ribs and at the intersections of main ribs and the ball mounting base, and the height of the triangular connecting ribs does not exceed the surface of the main ribs.
[0011] In an embodiment, the main ribs are in line contact with the bare substrate.
[0012] In an embodiment, the cross-sectional shape of the side of the main ribs in contact with the bare substrate is arc-shaped or conical.
[0013] In an embodiment, at least one diagonal of the hollow hole is provided with a secondary rib, which is flush with the surface of the main rib; the cross-sectional shape of the side of the secondary rib in contact with the bare substrate is the same as that of the side of the main rib in contact with the bare substrate.
[0014] In an embodiment, the bare substrate ball mounting device further comprises a suction plate, which comprises an upper plate and a lower plate, the upper plate and the lower plate being spliced to form a sealed cavity, the upper surface of the upper plate being provided with a plurality of suction holes communicating with the sealed cavity, and the lower plate being provided with a suction port communicating with the sealed cavity; in use, the upper surface of the upper plate is attached to the lower surface of the ball mounting base around the periphery, and the suction port is connected to a suction device.
[0015] In an embodiment, the bare substrate ball mounting device further comprises a ball mounting cover plate, which comprises a peripheral frame and a mesh plate between the peripheral frame; the shape of the peripheral frame is consistent with that of the bearing area of the ball mounting base, and the mesh plate comprises a mesh hole area corresponding to the ball mounting area of the bare substrate. After the bare substrate is placed on the ball mounting base of the bare substrate ball mounting device, the ball mounting cover plate is placed on the bare substrate, the peripheral frame of the ball mounting cover plate is pressed against the peripheral edge of the bare substrate, and the mesh hole area is pressed against the ball mounting area of the bare substrate.
[0016] Compared with the prior art, the bare substrate ball mounting device has at least the following advantages:
[0017] In use, the bare substrate is stably placed on the bearing area of the ball mounting base. At this time, the lower surface of the bare substrate benefits from the support of the intersecting main ribs, and can obtain a stable foundation during the high-temperature process of mounting the solder balls. When the bare substrate deforms due to heating during the process of mounting the solder balls, the bottom support of the main ribs effectively reduces the warping tendency of the bare substrate. This design ingeniously improves the warping phenomenon of the bare substrate during the solder ball mounting heat process, ensuring the high quality of the solder ball mounting. Through this improvement, not only the yield of the bare substrate ball mounting process is improved, but also the electrical performance and mechanical stability of the product are guaranteed. BRIEF DESCRIPTION OF DRAWINGS
[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.
[0019] Figure 1 Schematic diagram of the structure of a first bare substrate ball implantation device according to an embodiment of the present application;
[0020] Figure 2 Schematic diagram of the structure of a second bare substrate ball implantation device according to an embodiment of the present application;
[0021] Figure 3 Schematic diagram of the structure of a third bare substrate ball implantation device according to an embodiment of the present application;
[0022] Figure 4 Schematic diagram of the structure of a bare substrate according to an embodiment of the present application;
[0023] Figure 5 for Figure 1 A top view of the bare substrate ball implantation device in use;
[0024] Figure 6 for Figure 2 A top view of the bare substrate ball implantation device in use;
[0025] Figure 7 for Figure 3 A top view of the bare substrate ball implantation device in use;
[0026] Figure 8 Schematic diagram of the structure of a bare substrate ball planting device with a ball planting cover according to an embodiment of the present application;
[0027] Figure 9 for Figure 8 Schematic diagram of structural explosion;
[0028] Figure 10 Schematic diagram of the structure of a bare substrate ball planting device with an adsorption plate according to an embodiment of the present application;
[0029] Figure 11 for Figure 10 Schematic diagram of the local structure explosion;
[0030] Figure 12 and Figure 13 This is a schematic diagram of the cross-sectional structure of the main ribs of the ball planting base supporting the bare substrate.
[0031] In the figure: 01, bare substrate; 011, ball planting area; 1, ball planting base; 11, bearing area; 101, main rib; 102, hollow hole; 103, triangular connecting rib plate; 104, secondary rib; 12, positioning column; 2, ball planting cover; 21, surrounding frame; 22, mesh plate; 221, mesh area; 3, adsorption plate; 31, upper plate; 311, adsorption hole; 32, lower plate; 33, suction port. DETAILED DESCRIPTION
[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.
[0033] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.
[0034] like Figure 1 As shown, an embodiment of the present application provides a bare substrate ball planting device, including a ball planting base 1. The upper surface of the ball planting base 1 is provided with a hollow supporting area 11 for supporting a bare substrate 01. The supporting area 11 is provided with main ribs 101 that intersect horizontally, vertically, and vertically. Hollow holes 102 are formed between the intervals formed by the main ribs 101 that intersect horizontally and vertically.
[0035] like Figure 4 As shown, when the bare substrate bumping device is in use, bare substrate 01 is placed on support area 11 of bumping base 1. The lower surface of bare substrate 01 is supported by main ribs 101 that intersect horizontally and vertically. When bare substrate 01 is heated and deformed during solder bumping, the support provided by the bottom side of main ribs 101 reduces the tendency of bare substrate 01 to warp, thereby improving the warping of bare substrate 01 during the solder bumping thermal process, ensuring soldering quality, improving the yield rate of the bare substrate bumping process, and guaranteeing the electrical performance and mechanical stability of the product.
[0036] In this embodiment, if Figure 4 As shown, the bare substrate 01 includes a plurality of ball planting areas 011 distributed in a rectangular array. Figure 5-Figure 7As shown, when the bare substrate 01 is placed on the ball planting base 1 of the bare substrate ball planting device, each ball planting area 011 of the bare substrate 01 can be located on the corresponding hollow holes 102, so as to avoid heat concentration on the back of the ball planting area 011, facilitate heat dissipation, and reduce deformation tendency.
[0037] In this embodiment, if Figure 1 As shown, the upper surface of the ball planting base 1 can be provided with a plurality of positioning posts 12, distributed around the edge of the supporting area 11. When the bare substrate 01 is placed on the ball planting base 1 of the bare substrate ball planting device, the edge of the bare substrate 2 is confined within the positioning posts 12, which plays a role in positioning the bare substrate.
[0038] In this embodiment, if Figure 1 As shown, the main ribs 101 that cross each other in the horizontal and vertical directions can be symmetrical along the longitudinal center line and the transverse center line, forming a balanced support for all parts of the bare substrate 01.
[0039] In this embodiment, if Figure 2 and Figure 6 As shown, triangular connecting ribs 103 can be provided at the intersections of adjacent main ribs 101, and triangular connecting ribs 103 can also be provided at the junctions between the main ribs 101 and the ball planting base 1. The height of the triangular connecting ribs 103 does not exceed the surface of the main ribs 101. The triangular connecting ribs 103 can improve the stability of the main ribs 101 that intersect horizontally and vertically, and reduce deformation of the main ribs 101 that may occur due to heat and pressure.
[0040] In this embodiment, if Figure 12 and Figure 13 As shown, the contact form between the main ribs 101 and the bare substrate 01 can preferably be a line contact support form. In this way, it can ensure that the main ribs 101 effectively support the bare substrate 01, and also prevent the contact area between the main ribs 101 and the bare substrate 01 from being too large, thereby alleviating the problem of heat concentration.
[0041] For example, Figure 12 As shown, the cross-sectional shape of the side where the main rib 101 contacts the bare substrate 01 can be an arc. Figure 13 As shown, the cross-sectional shape of the side of the main rib 101 that contacts the bare substrate 01 may be conical.
[0042] In this embodiment, if Figure 3 and Figure 7As shown, at least one diagonal corner of the hollow hole 102 is provided with a secondary rib 104, which is flush with the surface of the main rib 101. The secondary rib 104 provides additional support, further improving the effect of reducing warpage. The cross-sectional shape of the side of the secondary rib 104 in contact with the bare substrate 01 can be the same as the cross-sectional shape of the side of the main rib 101 in contact with the bare substrate 01. In addition, the width of the secondary rib 104 can be smaller than that of the main rib 101, maintaining the smallest possible contact area while providing additional support for the bare substrate.
[0043] In this embodiment, after the bare substrate 01 is placed on the support area 11 of the ball implant base 1, a pressing device can be used to press the bare substrate 01. This ensures that the bare substrate 01 adheres well to the surface of the main rib 101 throughout the entire ball implant process, thereby minimizing warping and deformation. The pressing device can include a lifting device (such as a cylinder, electric push rod, etc.) and a pressing bar. The pressing bar can be in the form of a strip or a cross. The lifting device drives the pressing bar to press the non-ball implant area of the bare substrate to achieve a tight fit between the bare substrate and the main rib 101.
[0044] In this embodiment, in order to make the bare substrate 01 adhere to the surface of the main rib 101 better, the embodiment of the present application also provides the following solution. Figure 10 and Figure 11 As shown, the bare substrate ball planting device can also include an adsorption plate 3, which includes an upper plate 31 and a lower plate 32. The upper plate 31 and the lower plate 32 are assembled to form a sealed cavity (not shown in the figure). The upper plate 31 has a plurality of adsorption holes 311 connected to the sealed cavity, and the lower plate 32 has a suction port 33 connected to the sealed cavity. When in use, the upper surface of the upper plate 31 is fitted around the lower surface of the ball planting base 1, and the suction port 33 is connected to the suction device.
[0045] During operation, the bare substrate is placed on the support area 11 of the ball implant base 1. During the implant process, a suction device can be used to apply suction through the suction port 33, thereby creating a negative pressure in the sealed cavity formed by the upper plate 31 and the lower plate 32. Adsorption through the adsorption holes 311 also forms a negative pressure area between the bare substrate and the upper plate 31, thereby exerting an adsorption force on the bare substrate, allowing it to adhere tightly to the surface of the main rib 101, thereby better suppressing any warping of the bare substrate. Furthermore, the use of negative pressure suction also helps to remove heat through the flowing airflow, which also helps to alleviate warping caused by local overheating.
[0046] It should be noted that the suction can be started during the ball implantation process in the ball implantation area of the bare substrate, or just after the ball implantation is completed. In addition, the magnitude of the suction force can be changed by controlling the suction device.
[0047] In this embodiment, if Figure 8 and Figure 9 As shown, the bare substrate ball mounting device can further comprise a ball mounting cover plate 2, the ball mounting cover plate 2 comprising a four-side frame 21 and a mesh plate 22 between the four-side frame 21; the shape of the four-side frame 21 is consistent with the shape of the bearing area 11 of the ball mounting base 1, and the mesh plate 22 comprises a mesh hole area 221 corresponding to the ball mounting area 011 of the bare substrate 01. After the bare substrate 01 is placed on the ball mounting base 1 of the bare substrate ball mounting device, the ball mounting cover plate 2 is covered on the bare substrate 01, the four-side frame 21 of the ball mounting cover plate 2 is pressed on the four-side edge of the bare substrate 01, and the mesh hole area 221 is pressed on the ball mounting area 011 of the bare substrate 01. The ball mounting cover plate 2 can facilitate the application of solder paste on the ball mounting area 011 of the bare substrate 01 or facilitate the mounting of solder balls.
[0048] The above only describes some embodiments of the present application and is not intended to limit the present application. Those skilled in the art can make various modifications and changes to the present application. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A bare substrate ball implantation device, characterized in that: It includes a ball planting base (1); The upper surface of the ball planting base (1) is provided with a hollowed-out carrying area (11) for carrying a bare substrate (01), the carrying area (11) is provided with main ribs (101) that cross each other horizontally and vertically, and hollow holes (102) are formed between the intervals formed by the main ribs (101) that cross each other horizontally and vertically.
2. The bare substrate ball implantation device according to claim 1, wherein: The bare substrate (01) comprises a plurality of ball planting areas (011) distributed in a rectangular array; when the bare substrate (01) is placed on the ball planting base (1) of the bare substrate ball planting device, each ball planting area (011) of the bare substrate (01) is located on each corresponding hollow hole (102).
3. The bare substrate ball implantation device according to claim 1, wherein: The upper surface of the ball planting base (1) is provided with a plurality of positioning columns (12), which are distributed around the edge of the bearing area (11); When a bare substrate (01) is placed on the ball planting base (1) of the bare substrate ball planting device, the edge of the bare substrate (01) is restricted within the positioning pillars (12).
4. The bare substrate ball implantation device according to claim 1, wherein: The main ribs (101) that cross each other longitudinally and transversely are symmetrical structures along the longitudinal center line and the transverse center line.
5. The bare substrate ball implantation device according to claim 1, wherein: A triangular connecting rib plate (103) is provided at the intersection of adjacent main ribs (101), and a triangular connecting rib plate (103) is provided at the junction of the main rib (101) and the ball planting base (1). The height of the triangular connecting rib plate (103) does not exceed the surface of the main rib (101).
6. The bare substrate ball implantation device according to claim 1, wherein: The contact form between the main rib (101) and the bare substrate (01) is line contact.
7. The bare substrate ball implantation device according to claim 6, wherein: The cross-sectional shape of the side of the main rib (101) in contact with the bare substrate (01) is arc-shaped or conical.
8. The bare substrate ball implantation device according to any one of claims 1 to 7, characterized in that: A secondary rib (104) is provided at at least one diagonal corner of the hollow hole (102), and the secondary rib (104) is flush with the surface of the primary rib (101); the cross-sectional shape of the side of the secondary rib (104) in contact with the bare substrate (01) is the same as the cross-sectional shape of the side of the primary rib (101) in contact with the bare substrate (01).
9. The bare substrate ball implantation device according to any one of claims 1 to 7, characterized in that: The bare substrate ball planting device also includes an adsorption plate (3), and the adsorption plate (3) includes an upper plate (31) and a lower plate (32). The upper plate (31) and the lower plate (32) are assembled to form a sealed cavity. The surface of the upper plate (31) is provided with a plurality of adsorption holes (311) connected to the sealed cavity, and the lower plate (32) is provided with a suction port (33) connected to the sealed cavity. When in use, the upper surface of the upper plate (31) is in contact with the lower surface of the ball planting base (1), and the suction port (33) is connected to a suction device.
10. The bare substrate ball implantation device according to claim 2, wherein: The bare substrate ball planting device further comprises a ball planting cover plate (2), the ball planting cover plate (2) comprising four peripheral frames (21) and a mesh plate (22) located between the four peripheral frames (21); the shape of the four peripheral frames (21) is consistent with the shape of the bearing area (11) of the ball planting base (1), and the mesh plate (22) comprises a mesh area (221) corresponding to the ball planting area (011) of the bare substrate (01); After the bare substrate (01) is placed on the ball planting base (1) of the bare substrate ball planting device, the ball planting cover (2) is placed on the bare substrate (01), the four peripheral frames (21) of the ball planting cover (2) are pressed against the four peripheral edges of the bare substrate (01), and the mesh area (221) is pressed against the ball planting area (011) of the bare substrate (01).