Wafer vapor deposition device

Abstract

The utility model discloses a wafer vapor deposition device which comprises a wafer box lifting device used for lifting a wafer box; the load locking chamber is arranged between the reaction chamber and the wafer box lifting device, and a wafer cache structure is arranged in the load locking chamber; the wafer cache structure is used for storing wafers; the reaction chambers are used for performing thin film deposition on the wafer; the wafer carrying manipulator is used for transferring wafers among the wafer box, the wafer cache structure and the reaction chamber; the wafer carrying manipulator comprises a wafer taking fork and a wafer taking fork driving part, and the wafer taking fork driving part can drive the wafer taking fork to rotate and do reciprocating rectilinear motion; the wafer taking fork receives the wafer in the wafer cache structure through the clamping groove; the wafer taking fork is provided with a vacuum suction cup, a vacuum air channel connected with the vacuum suction cup is arranged in the wafer taking fork, and wafers in the wafer box are adsorbed through the vacuum suction cup. On the premise that the overall size of equipment is not greatly increased, the opening and closing frequency of the load locking cavity is remarkably reduced, and frequent conversion between atmospheric pressure and vacuum pressure is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer vapor deposition device. Background Art

[0002] The load lock chamber serves as a crucial transition zone between the wafer cassette and the reaction chamber. Thin film deposition operations on wafers in chemical vapor deposition (CVD) equipment require a wafer transport mechanism within the load lock chamber to transfer wafers between the reaction chamber and the wafer cassette on the cassette elevator.

[0003] When wafers that have not been deposited with thin films need to be transferred from the wafer box to the reaction chamber, or wafers that have completed thin film deposition need to be transferred back from the reaction chamber to the wafer box, the load lock chamber needs to be evacuated to atmospheric pressure and the vacuum gate valve of the load lock chamber needs to be opened so that the wafers can be transferred between the reaction chamber and the wafer box under atmospheric pressure. After the transfer is completed, the vacuum gate valve needs to be closed and the load lock chamber needs to be evacuated again to make the load lock chamber reach a vacuum state.

[0004] When thin film deposition is performed on wafers in batches, the load-lock chamber needs to frequently switch between atmospheric pressure and vacuum pressure. This switching process requires evacuation / exhaust, which not only consumes a lot of time and seriously affects overall production efficiency, but also places a heavy burden on the vacuum pumping system of the chemical vapor deposition equipment. This may shorten the equipment's service life, increase maintenance costs, and reduce the overall reliability of the equipment.

[0005] The increased size of CVD equipment hinders cleanroom control. Furthermore, due to the limited cleanroom space required to house CVD equipment, the larger the equipment, the fewer CVD equipment can be accommodated within a given unit of space. Therefore, avoiding the frequent switching of the load lock chamber between atmospheric and vacuum pressures while maintaining a significant increase in overall equipment size has become a pressing issue. Summary of the Invention

[0006] The utility model provides a wafer vapor deposition device, which can avoid frequent switching of the load-lock chamber between atmospheric pressure and vacuum pressure without significantly increasing the overall size of the equipment, thereby improving production efficiency and reducing the burden on the vacuum pumping system.

[0007] In order to achieve the above purpose, the technical solution of the utility model is:

[0008] A wafer vapor deposition device comprises: a wafer box lifting device, the wafer box lifting device is used to lift the wafer box; a load lock chamber, the load lock chamber is arranged between the reaction chamber and the wafer box lifting device, and a wafer buffer structure is provided in the load lock chamber; the wafer buffer structure is used to store wafers that have not been deposited with thin films transferred from the wafer box to the reaction chamber or to store wafers that have completed thin film deposition transferred from the reaction chamber to the wafer box; a plurality of reaction chambers, the reaction chambers are used to perform thin film deposition on wafers; a wafer handling robot The wafer handling robot is used to transfer wafers between a wafer box, a wafer buffer structure and a reaction chamber; the wafer handling robot includes: a wafer picking fork and a wafer picking fork driving unit, the wafer picking fork driving unit can drive the wafer picking fork to rotate and reciprocate linearly; the wafer picking fork is provided with a slot for placing the wafer, and the wafer picking fork can receive the wafer in the wafer buffer structure through the slot; a vacuum suction cup is provided at one end of the wafer picking fork, and a vacuum air duct connected to the vacuum suction cup is provided inside the wafer picking fork, and the wafer picking fork can absorb the wafer in the wafer box through the vacuum suction cup.

[0009] Beneficial effects: The wafer vapor deposition device provided by the present invention provides a wafer buffer structure in the load lock chamber, thereby adding an area in the load lock chamber for storing wafers in batches. The wafers to be transferred are concentrated in the wafer buffer structure for buffering, and then transferred in a centralized manner by a wafer handling robot. This significantly reduces the opening and closing frequency of the load lock chamber, avoids frequent switching between atmospheric pressure and vacuum pressure, improves production efficiency, and effectively alleviates the operating pressure of the vacuum pumping system.

[0010] After adding the wafer buffer structure, the distance between the wafer box and the wafer handling robot increases accordingly. In order to ensure that the wafer handling robot can smoothly carry out the wafer handling work, the travel range of the wafer handling robot is usually expanded or the length of the wafer picking fork is increased. Accordingly, more space is required to avoid mechanical interference, resulting in an increase in the overall size of the chemical vapor deposition equipment. The utility model provides a wafer vapor deposition device, which provides a vacuum suction cup at one end of the wafer picking fork to vacuum adsorb the wafer through the vacuum suction cup, so that the front end of the wafer picking fork only needs to contact a part of the wafer to drive the wafer transfer, so that it is transferred from the wafer box to the wafer buffer structure. The wafer picking fork is provided with a card slot for placing the wafer, so that the wafer can be transferred from the wafer buffer structure to the reaction chamber. Without expanding the travel range of the wafer handling robot and increasing the length of the wafer picking fork, the wafer transfer is achieved, thereby avoiding a significant increase in the overall size of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0012] Figure 1 This is a schematic diagram of the structure of a wafer vapor deposition device disclosed in this utility model Figure 1 ;

[0013] Figure 2 This is a schematic diagram of the structure of a wafer vapor deposition device disclosed in this utility model Figure 2 ;

[0014] Figure 3 This is a top view of a wafer vapor deposition device disclosed in the present utility model;

[0015] Figure 4 This is a schematic diagram of the structure of a wafer vapor deposition device disclosed in the utility model without part of the frame Figure 1 ;

[0016] Figure 5 This is a schematic diagram of the structure of a wafer vapor deposition device disclosed in the utility model without part of the frame Figure 2 ;

[0017] Figure 6 This is a schematic structural diagram of a wafer handling robot for a wafer vapor deposition device disclosed in the present utility model;

[0018] Figure 7 This is a side view of a wafer handling robot of a wafer vapor deposition device disclosed in the present utility model;

[0019] Figure 8 for Figure 7 V1-V1 cross-sectional view;

[0020] Figure 9 This is a top view of a wafer handling robot of a wafer vapor deposition device disclosed in the present utility model;

[0021] Figure 10 for Figure 9 V2-V2 cross-sectional view;

[0022] Figure 11 for Figure 10 Enlarged view of D1;

[0023] Figure 12 for Figure 9 V3-V3 cross-sectional view;

[0024] Figure 13 for Figure 12 Enlarged view of D2;

[0025] Figure 14 This is a structural schematic diagram of a hollow tensioning shaft of a wafer handling robot of a wafer vapor deposition device disclosed in the present utility model;

[0026] Figure 15 This is a structural schematic diagram of the lower first swing arm of a wafer handling robot of a wafer vapor deposition device disclosed in the present utility model;

[0027] Figure 16 This is a top view schematic diagram of an upper first swing arm of a wafer handling robot of a wafer vapor deposition device disclosed in the present utility model;

[0028] Figure 17 This is a schematic structural diagram of a pipe fixing bracket of a wafer handling robot of a wafer vapor deposition device disclosed in the present utility model;

[0029] Figure 18 This is a structural schematic diagram of a support body of a wafer handling robot of a wafer vapor deposition device disclosed in the present utility model;

[0030] Figure 19a This is a schematic diagram of the extension of a wafer handling robot of a wafer vapor deposition device disclosed in the present utility model;

[0031] Figure 19b This is a schematic diagram of the contraction of a wafer handling robot of a wafer vapor deposition device disclosed in the present invention;

[0032] Figure 20a This is a schematic diagram of a wafer handling fork of a wafer handling robot of a wafer vapor deposition device disclosed in the present invention handling a wafer through a card slot;

[0033] Figure 20b This is a schematic diagram of a wafer handling fork of a wafer handling robot of a wafer vapor deposition device disclosed in the present invention handling a wafer via a vacuum suction cup;

[0034] Figure 21a It is a top view schematic diagram of a wafer transport robot of a wafer vapor deposition device disclosed in the present invention, wherein a first wire rope pulley and a first transmission shaft are driven by a wire rope;

[0035] Figure 21b This is a schematic front view of a wafer transport robot of a wafer vapor deposition device disclosed in the present invention, in which a first wire rope pulley and a first transmission shaft are driven by a wire rope;

[0036] Figure 22This is a structural schematic diagram of a tensioning block of a wafer handling robot of a wafer vapor deposition device disclosed in the present utility model;

[0037] Figure 23 This is a schematic diagram of the positions of wafers and wafer retrieval forks stored in the wafer buffer structure disclosed in the present invention;

[0038] Figure 24 This is a schematic structural diagram of a wafer buffer structure of a wafer vapor deposition device disclosed in the present utility model;

[0039] Figure 25 This is a side view of a wafer buffer structure of a wafer vapor deposition device disclosed in the present utility model;

[0040] Figure 26 for Figure 25 V16-V16 cross-section view;

[0041] Figure 27 This is a schematic structural diagram of a wafer lifting mechanism and a wafer carrier of a wafer vapor deposition device disclosed in the present invention;

[0042] Figure 28 This is a front view of a wafer lifting mechanism and a wafer carrier of a wafer vapor deposition device disclosed in the present invention;

[0043] Figure 29 for Figure 28 V4-V4 cross-sectional view;

[0044] Figure 30 for Figure 28 V5-V5 cross-sectional view;

[0045] Figure 31 This is a side view of a wafer lifting mechanism and a wafer carrier of a wafer vapor deposition device disclosed in the present invention;

[0046] Figure 32a for Figure 31 V6-V6 cutaway view;

[0047] Figure 32b for Figure 31 V7-V7 cross-sectional view;

[0048] Figure 33 This is a structural schematic diagram of a lifting pin of a wafer vapor deposition device disclosed in the present utility model;

[0049] Figure 34 This is a top view of a wafer lifting mechanism and a wafer carrier of a wafer vapor deposition device disclosed in the present invention;

[0050] Figure 35 for Figure 34V8-V8 cutaway view;

[0051] Figure 36 This is a piping diagram of a gas cabinet of a wafer vapor deposition device disclosed in the present utility model;

[0052] Figure 37 This is a schematic diagram of the structure of a gas cabinet for a wafer vapor deposition device disclosed in this utility model. Figure 1 ;

[0053] Figure 38 This is a schematic diagram of the structure of a gas cabinet for a wafer vapor deposition device disclosed in this utility model. Figure 2 ;

[0054] Figure 39 This is a structural schematic diagram of a gas cabinet of a wafer vapor deposition device disclosed in the present utility model with the cabinet door removed;

[0055] Figure 40 This is a front view of a gas cabinet of a wafer vapor deposition device disclosed in the present utility model with the cabinet door removed;

[0056] Figure 41 for Figure 40 The enlarged view of D3;

[0057] Figure 42 This is a rear view of a gas cabinet of a wafer vapor deposition device disclosed in the present utility model;

[0058] Figure 43 for Figure 42 Enlarged view of D4;

[0059] Figure 44 A schematic diagram of a gas control module of an existing gas cabinet;

[0060] Figure 45 This is a structural schematic diagram of a wafer vapor deposition device disclosed in the present invention, in which a connecting device is installed on a chamber;

[0061] Figure 46 This is a structural schematic diagram of a hinge structure of a connecting device of a wafer vapor deposition device disclosed in the present utility model;

[0062] Figure 47 A side view of the hinge structure of a connection device for a wafer vapor deposition device disclosed in the utility model Figure 1 ;

[0063] Figure 48 for Figure 47 V9-V9 cross-sectional view;

[0064] Figure 49 A side view of the hinge structure of a connection device for a wafer vapor deposition device disclosed in the utility model Figure 2 ;

[0065] Figure 50 for Figure 49 V10-V10 cross-section view;

[0066] Figure 51 This is a front view of a hinge structure of a connecting device of a wafer vapor deposition device disclosed in the present utility model;

[0067] Figure 52 for Figure 51 V11-V11 cross-sectional view;

[0068] Figure 53 This is a structural schematic diagram of a limit slider of a connection device for a wafer vapor deposition device disclosed in the present utility model;

[0069] Figure 54 This is a side view of a limiting slider of a connection device of a wafer vapor deposition device disclosed in the present utility model;

[0070] Figure 55 This is a schematic structural diagram of a heating device for a wafer vapor deposition device disclosed in the present utility model;

[0071] Figure 56 This is a front view of a heating device for a wafer vapor deposition device disclosed in the present utility model;

[0072] Figure 57 This is a top view of a heating device for a wafer vapor deposition device disclosed in the present utility model;

[0073] Figure 58 This is a schematic structural diagram of a water-cooled lampshade of a heating device of a wafer vapor deposition device disclosed in the present utility model;

[0074] Figure 59 This is a structural schematic diagram of a lamp holder of a heating device for a wafer vapor deposition device disclosed in the present utility model;

[0075] Figure 60 for Figure 56 V12-V12 cutaway view;

[0076] Figure 61 for Figure 56 V13-V13 cross-sectional view;

[0077] Figure 62 This is a schematic diagram of the coordination between a vacuum gate valve and a chamber of a wafer vapor deposition device disclosed in the present utility model;

[0078] Figure 63 This is a schematic structural diagram of a chamber of a wafer vapor deposition device disclosed in the present utility model;

[0079] Figure 64 This is a schematic diagram of the structure of a vacuum gate valve for removing the cavity of a wafer vapor deposition device disclosed in the present invention. Figure 1 ;

[0080] Figure 65 This is a schematic diagram of the structure of a vacuum gate valve for removing the cavity of a wafer vapor deposition device disclosed in the present invention. Figure 2 ;

[0081] Figure 66 This is a schematic structural diagram of a vacuum gate valve of a wafer vapor deposition device disclosed in the present invention, with the chamber and cover removed;

[0082] Figure 67 This is a side view of a vacuum gate valve of a wafer vapor deposition device disclosed in the present invention, with the chamber and cover removed;

[0083] Figure 68 This is a structural schematic diagram of a valve plate of a vacuum gate valve of a wafer vapor deposition device disclosed in the present utility model;

[0084] Figure 69 This is a top view of a valve plate of a vacuum gate valve of a wafer vapor deposition device disclosed in the present utility model;

[0085] Figure 70 This is a schematic structural diagram of a transmission plate of a vacuum gate valve of a wafer vapor deposition device disclosed in the present utility model;

[0086] Figure 71 for Figure 69 V14-V14 cross-sectional view;

[0087] Figure 72 for Figure 69 V15-V15 cross-sectional view;

[0088] Figure 73 It is a structural diagram of an existing valve structure;

[0089] Figure 74 A schematic diagram of a structure in which an existing cavity is removed from an existing valve structure;

[0090] Figure 75 This is a structural schematic diagram of a wafer box lifting device of a wafer vapor deposition device disclosed in the utility model.

[0091] In the figure: 1. Slice removal fork; 101. First latching portion; 102. Second latching portion; 103. Main body; 104. Vacuum suction cup; 2. Swing arm portion; 201. Lower first swing arm; 202. Upper second swing arm; 203. Lower second swing arm; 204. Upper first swing arm; 205. Driving gear; 206. Driven gear; 207. First rotating shaft; 208. Second rotating shaft; 209. Gear upper cover; 210. Gear lower cover; 211. First opening ring; 212. Second opening ring; 213. Deformation groove; 3. Turntable; 301. Connecting sleeve; 4. Base flange; 5. Telescopic drive device; 501. Second motor; 502. Second mounting bracket; 503. Second transmission shaft; 504. Second wire rope pulley; 505 , second driven pulley; 6, rotary drive device; 601, first motor; 602, first mounting bracket; 603, first transmission shaft; 604, first wire rope pulley; 605, first driven pulley; 7, multi-axis magnetic fluid sealing transmission device; 701, hollow shaft; 702, intermediate shaft; 703, base shaft; 8, swing arm adjustment mechanism; 801, adjustment support; 802, hollow adjustment member; 803, hollow tensioning shaft; 804, locking bolt; 805, tensioning block; 806, tensioning part; 807, tensioning strip; 808, spring; 809, step surface; 810, milling plane; 811, internal threaded pipe; 9, pipeline fixing bracket; 901, bracket body; 902, pressure plate; 10, vacuum joint; 11, wire rope; 1 2. Waist-shaped hole; 13. Cavity connecting plate; 14. First adjustment plate; 1401. Y-axis slide rail; 15. Second adjustment plate; 1501. X-axis slide rail; 16. Lifting mechanism; 1601. Support; 1602. Motor; 1603. Screw; 1604. Z-axis slide rail; 1605. Z-axis slider; 1606. Fixed shaft clamping part; 1607. Screw nut; 1608. Screw nut seat; 1609. Clamping block; 1701. Connecting bolt; 1702. Leveling top screw; 1703. Leveling lock nut; 18. Y-axis adjustment mechanism; 1801. First connecting plate; 1802. First hollow bolt; 1803. First guide screw; 1804. First fixing nut; 19. X-axis adjustment structure; 190 1. Second connecting plate; 1902. Second hollow bolt; 1903. Second guide screw; 1904. Second fixing nut; 2001. Y-direction spring; 2002. Y-direction spring mounting pin; 2003. Y-direction spring mounting screw; 2101. X-direction spring; 2102. X-direction spring mounting pin; 2103. X-direction spring mounting screw; 22. Y-direction insert; 23. X-direction insert; 24. First bolt; 25. First nut; 26. Second bolt; 27. Second nut; 28. Third bolt; 29. ​​Wafer stage; 291. Fixed shaft; 30. Wafer; 31. First gas delivery unit; 32. Second gas delivery unit; 33a. First filter; 33b. Second filter; 33c. Third filter33d, fourth filter; 33e, fifth filter; 33f, sixth filter; 34a, first manual valve; 34b, second manual valve; 34c, third manual valve; 34d, fourth manual valve; 34e, fifth manual valve; 34f, sixth manual valve; 35a, first gas mass flow controller; 35b, second gas mass flow controller; 35c, third gas mass flow controller; 35d, fourth gas mass flow controller; 35e, fifth gas mass flow controller; 35f, sixth gas mass flow controller; 36a, first pneumatic valve; 36b, second pneumatic valve; 36c, third pneumatic valve; 36d, fourth pneumatic valve; 36e, fifth pneumatic valve; 36f, sixth pneumatic valve; 37a, first switch valve; 37b, second switch valve; 37c, third switch valve; 37d, fourth switch valve; 38, exhaust pipe; 39, cabinet door; 40, cabinet body; 41, first branch; 42, second branch; 43, third branch; 44, fourth branch; 4501, air supply interface; 4502, exhaust interface; 46, first leaf; 4601, locking hole; 4602, slide groove; 4603, unlocking groove; 47, second leaf; 48, locking plate; 4801, pin hole; 4802, arc-shaped portion; 49, latch spring; 50, latch; 51, limit slider; 5101, stop portion; 5102, sliding portion; 5103, blind hole; 52, spring; 53, handle; 54, gas spring; 55, Handle; 56. Blind plate; 57. Rotating shaft; 58. Light bulb; 5801. Plug; 59. Water-cooled lampshade; 60. Base plate; 6001. Wire hole; 61. Neutral copper busbar; 62. Live copper busbar; 63. Socket; 64. Cover; 6401. Main body; 6402. Inspection window cover; 65. Connector plug; 66. Water pipe; 67. Through hole; 68. Valve port; 69. Valve plate; 6901. Sealing ring groove; 6902. Valve plate body; 6903. Transmission plate; 6904. Positioning protrusion; 6905. Positioning groove; 70. Driving device; 7001. First cylinder; 7002. Second cylinder; 7003. Cylinder seat; 7004. Housing; 7005. Magnetic switch; 7006. Air pipe joint; 7007, electrical connector; 7008, housing; 7009, cover; 71, sealing ring; 72, positioning sinker; 73, sinker; 74, cylindrical pin; 75, base plate; 76, vertical guide rail; 77, vertical slider; 78, linear module; 79, rodless cylinder; 80, support frame; 81, rod cylinder; 82, pressing part; 83, wafer buffer box; 8401, mounting support; 8402, drive motor; 8403, buffer box lifting screw; 8404, buffer box Z-direction slide rail; 8405, buffer box Z-direction slider; 8406, connecting shaft clamping block; 8407, buffer box screw nut; 8408, buffer box screw nut seat; 85, lifting pin; 86, connecting shaft; 87, lifting pin fixing shaft;

[0092] A. Wafer box lifting device; B. Wafer box; C. Load lock chamber; C1. Load lock chamber body; D. Wafer buffer structure; E. Wafer handling robot; F. Reaction chamber; F1. Chamber body; F2. Upper cover; G1. First process gas source; G2. Second process gas source; G3. Third process gas source; G4. First purge gas source; G5. Second purge gas source; G6. Fourth process gas source; H. Vacuum pumping system; I. Interface; J. Existing chamber; K. Valve plate of existing valve structure; L. Connecting rod mechanism; M. Gas cabinet; N. Cabinet; O. Frame. DETAILED DESCRIPTION

[0093] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0094] Example 1

[0095] This embodiment provides a wafer vapor deposition device, such as Figures 1 to 5 Shown, including:

[0096] Wafer cassette lifting device A, which is used to lift wafer cassette B. Wafer cassette lifting device A can clamp wafer cassette B and drive wafer cassette B to rise and fall in the vertical direction to cooperate with the movement of wafer fork 1, so that wafer fork 1 can pick up and place wafers;

[0097] A load lock chamber C is provided between the reaction chamber F and the wafer cassette lifting device A. A wafer buffer structure D and a wafer handling robot E are provided in the load lock chamber C.

[0098] The wafer buffer structure D is used to store wafers that have not been deposited with thin films and are transferred from the wafer box B to the reaction chamber F, or to store wafers that have been deposited with thin films and are transferred from the reaction chamber F to the wafer box B;

[0099] The wafer handling robot E is used to transfer wafers between the wafer box B, the wafer buffer structure D and the reaction chamber F;

[0100] A plurality of reaction chambers F, wherein the reaction chambers F are used for performing thin film deposition on wafers;

[0101] A wafer handling robot E, which is used to transfer wafers between the wafer box B, the wafer buffer structure D and the reaction chamber F;

[0102] The wafer handling robot E comprises: a wafer picking fork 1 and a wafer picking fork driving unit, wherein the wafer picking fork driving unit can drive the wafer picking fork 1 to rotate and reciprocate linearly;

[0103] The wafer taking fork 1 is provided with a slot for placing the wafer, and the wafer taking fork 1 can receive the wafer in the wafer buffer structure D through the slot;

[0104] A vacuum suction cup 104 is provided at one end of the wafer taking fork 1, and a vacuum air passage connected to the vacuum suction cup 104 is provided inside the wafer taking fork 1. The wafer taking fork 1 can absorb the wafer in the wafer box B through the vacuum suction cup 104;

[0105] When it is necessary to transfer the wafers in the wafer box B that have not been thin film deposited to the reaction chamber F for thin film deposition:

[0106] The load lock chamber C is opened, and the wafer handling robot E transfers the wafers in the wafer box B to the wafer buffer structure D for storage. When the number of wafers stored in the wafer buffer structure D reaches the number required by the process (in this embodiment, the upper limit of the number of wafers stored in the wafer buffer structure D is 15, and the number required by the process is not greater than the upper limit of the storage number), the load lock chamber C is closed, the load lock chamber C is evacuated, and the reaction chamber F is opened (that is, the slit valve provided on the reaction chamber F is opened. The slit valve is a prior art and will not be described in detail here). The wafer handling robot E transfers the wafers in the wafer buffer structure D to the reaction chamber F, and the reaction chamber F is closed for thin film deposition.

[0107] When it is necessary to transfer the wafers in the reaction chamber F that have completed thin film deposition to the wafer box B:

[0108] The reaction chamber F is opened, and the wafer handling robot E transfers the wafers on which thin film deposition has been completed in the reaction chamber F to the wafer cache structure D. When the number of wafers stored in the wafer cache structure D reaches the number required by the process, the reaction chamber F is closed, and the load lock chamber C is opened. The wafer handling robot E transfers the wafers stored in the wafer cache structure D to the wafer box B. After the transfer is completed, the load lock chamber C is closed.

[0109] This embodiment provides a wafer vapor deposition apparatus. By disposing a wafer buffer structure D within a load lock chamber C, an area capable of storing wafers in batches is added to the load lock chamber C. Wafers to be transferred are cached in the wafer buffer structure D and then collectively transferred by a wafer handling robot E. This significantly reduces the frequency of opening and closing the load lock chamber C, avoids frequent switching between atmospheric pressure and vacuum pressure, improves production efficiency, and effectively alleviates the operating pressure of the vacuum pumping system.

[0110] After adding the wafer buffer structure D, the distance between the wafer cassette B and the wafer handling robot E increases accordingly. To ensure that the wafer handling robot E can smoothly carry out wafer handling operations, the travel range of the wafer handling robot is usually extended or the length of the wafer fork 1 is increased. Accordingly, more space is required to avoid mechanical interference, resulting in an increase in the overall size of the chemical vapor deposition equipment.

[0111] This embodiment provides a wafer vapor deposition device, by setting a vacuum suction cup 104 at one end of a wafer fork 1. Figure 20b As shown, the wafer 30 is transported by the fork 1 through the vacuum suction cup 104, so that the wafer 30 is vacuum-adsorbed by the vacuum suction cup 104, so that the front end of the fork 1 only needs to contact a part of the wafer to drive the wafer to be transferred from the wafer box B to the wafer buffer structure D. The fork 1 is provided with a slot for placing the wafer, as shown in FIG. Figure 20a As shown, the wafer retrieval fork 1 transports the wafer 30 through the card slot, so that the wafer can be transferred from the wafer buffer structure D to the reaction chamber F. Without expanding the travel range of the wafer transport robot E and increasing the length of the wafer retrieval fork 1, the wafer transfer is achieved, avoiding a significant increase in the overall size of the equipment.

[0112] In a specific embodiment, Figures 24 to 26 As shown, the wafer cache structure D includes: a wafer cache box 83 and a wafer cache box lifting device. The wafer cache box 83 is provided with a plurality of storage positions for storing wafers along the vertical direction. The wafer cache box lifting device is used to lift the wafer cache box 83;

[0113] The wafer cache box lifting device includes a mounting support 8401, a drive motor 8402, a cache box lifting screw 8403, a cache box Z-direction slide rail 8404, a cache box Z-direction slider 8405, a connecting shaft clamping block 8406 and a cache box screw nut seat 8408. The mounting support 8401 is fixed on the load lock chamber cavity C1, and the connecting shaft clamping block 8406 is fixed to the cache box screw nut seat 8408 by bolts. The connecting shaft clamping block 8406 is used to clamp and fix the connecting shaft 86 fixed on the wafer cache box 83 on the cache box screw nut seat 8408. In this embodiment, the mounting support 8401 is provided with an axial hole matching the connecting shaft 86, and the connecting shaft 86 can slide along the axial hole;

[0114] The cache box lifting screw 8403 is rotatably arranged on the mounting support 8401 through a bearing, and the drive motor 8402 is fixed on the mounting support 8401. The drive motor 8402 can drive the cache box lifting screw 8403 to rotate. In this embodiment, the drive motor 8402 drives the cache box lifting screw 8403 to rotate through a belt transmission. The cache box Z-direction slide rail 8404 is arranged on the mounting support 8401, and the cache box Z-direction slider 8405 is installed on the cache box Z-direction slide rail 8404. The cache box screw nut seat 8408 is fixedly connected to the cache box Z-direction slider 8405. A cache box screw nut 8407 is provided on the cache box screw nut seat 8408, and the cache box screw nut 8407 is installed on the cache box lifting screw 8403;

[0115] The wafer buffer structure D rises and falls in the vertical direction to lift the wafer on the retrieval fork 1 or put down the wafer on the storage position, so that the wafer can be placed from the retrieval fork 1 to the wafer buffer structure D or from the wafer buffer structure D to the retrieval fork 1.

[0116] In a specific embodiment, Figure 6 As shown, the slice fork driving unit includes: a slice fork 1, a swing arm 2, a turntable 3, a base flange 4, a telescopic driving device 5 and a rotating driving device 6;

[0117] The base flange 4 is fixed on the load lock chamber body C1 of the load lock chamber C, the turntable 3 is rotatably arranged on the base flange 4, the swing arm 2 is installed on the turntable 3, the rotation drive device 6 can drive the turntable 3 to rotate, and the telescopic drive device 5 can drive the swing arm 2 to move, so that the swing arm 2 drives the slice taking fork 1 to extend (such as Figure 19a as shown) or shrink (as shown) Figure 19b shown);

[0118] In this embodiment, if Figure 9 As shown, the wafer taking fork 1 includes a first clamping portion 101, a second clamping portion 102 and a main body 103. The first clamping portion 101 and the second clamping portion 102 are arranged on the top of the main body 103. The first clamping portion 101 and the second clamping portion 102 are arranged opposite to each other. The first clamping portion 101, the second clamping portion 102 and the main body 103 form a clamping slot for placing the wafer. The wafer taking fork 1 can receive the wafer in the wafer buffer structure D through the clamping slot;

[0119] A vacuum suction cup 104 is provided at one end of the wafer taking fork 1 away from the swing arm part 2 , and a vacuum air passage connected to the vacuum suction cup 104 is provided inside the wafer taking fork 1 , so that the wafer taking fork 1 can absorb the wafer in the wafer box B through the vacuum suction cup 104 .

[0120] The present embodiment provides a wafer vapor deposition device, which drives the turntable 3 to rotate through the rotation drive device 6 of the wafer handling robot E, and uses the telescopic drive device 5 to drive the swing arm part 2 to move, thereby driving the wafer picking fork 1 to extend and retract, thereby realizing the movement of the wafer picking fork 1.

[0121] When it is necessary to transfer the wafers in the wafer box B that have not been thin film deposited to the reaction chamber F for thin film deposition:

[0122] The load lock chamber C is opened, and the wafer cassette lifting device A lifts the wafer cassette B so that the wafer to be transferred is aligned with the wafer removal fork 1. The wafer removal fork 1 extends into the wafer cassette B and absorbs the wafer in the wafer cassette B through the vacuum suction cup 104;

[0123] The wafer removal fork 1 transfers the adsorbed wafer to the wafer buffer structure D. The wafer buffer structure D is raised and lowered so that the wafer to be transferred is aligned with the wafer removal fork 1. The wafer removal fork 1 extends into the wafer buffer structure D. The wafer buffer structure D is raised and lowered so that the wafer falls into the card slot of the wafer removal fork 1.

[0124] When the number of wafers stored in the wafer buffer structure D reaches the number required by the process, the load lock chamber C is closed and evacuated, and the reaction chamber F is opened. The wafer removal fork 1 transfers the wafer to the reaction chamber F. The lifting pins of the reaction chamber F rise to lift the wafer on the wafer removal fork 1, and then the wafer removal fork 1 leaves the reaction chamber F. The reaction chamber F is closed, and the lifting pins fall to place the wafer on the wafer stage. The wafer stage rises to a position where the wafer is to undergo thin film deposition, and process gas is introduced into the reaction chamber F to perform thin film deposition.

[0125] When it is necessary to transfer the wafers in the reaction chamber F that have completed thin film deposition to the wafer box B:

[0126] The wafer stage descends, the lifting pins ascend, and the wafer on which thin film deposition has been completed is lifted from the wafer stage. The reaction chamber F is opened, and the wafer removal fork 1 enters the reaction chamber F. The lifting pins descend, and the wafer falls into the slot of the wafer removal fork 1.

[0127] The wafer fork 1 transfers the wafer to the wafer buffer structure D, and the wafer buffer structure D is raised and lowered so that the wafer on the wafer fork 1 is aligned with the storage position in the wafer buffer structure D (such as Figure 23 As shown, the storage position is a groove on the wafer buffer box 83, the wafer fork 1 extends into the wafer buffer structure D, and the wafer buffer structure D descends, so that the wafer falls into the storage position in the wafer buffer structure D;

[0128] When the number of wafers stored in the wafer buffer structure D reaches the number required by the process, the reaction chamber F is closed and the load lock chamber C is opened. The wafer retrieval fork 1 is inserted into the wafer buffer structure D, and the wafer buffer structure D rises so that the wafer falls on the wafer retrieval fork 1. The wafer retrieval fork 1 absorbs the wafer in the wafer box B through the vacuum suction cup 104. The wafer box lifting device A lifts the wafer box B so that the wafer on the wafer retrieval fork 1 is aligned with the storage position in the wafer box B (the storage position is the groove on the wafer box B). The wafer retrieval fork 1 is inserted into the wafer box B to store the wafer in the storage position of the wafer box B. After the wafer transfer is completed, the load lock chamber C is closed.

[0129] In a specific embodiment, the system further includes a frame O, a vacuum gate valve, and a gas cabinet M. The wafer box lifting device A, the load lock chamber C, and the reaction chamber F are arranged within the frame O. A cabinet N is fixedly provided on the periphery of the frame O. The cabinet N is used to accommodate control components, including but not limited to components that require frequent maintenance, such as wire adapter boxes and sensor adapter boxes. By providing the cabinet N, components that require frequent maintenance are placed therein, which facilitates installation and maintenance, and also reserves installation space for subsequent addition of components.

[0130] The gas cabinet M is fixed on the frame O. The gas cabinet M is used to control the process gas input into the reaction chamber F. The vacuum gate valve is set on the load lock chamber C. The vacuum gate valve is located on the side of the load lock chamber C close to the wafer box lifting device A;

[0131] In actual use, the wafer box lifting device A lifts the wafer box B to cooperate with the retrieval fork 1 to pick up and place the wafer, open the vacuum gate valve on the load lock chamber C, and the retrieval fork 1 of the wafer handling robot E extends from the load lock chamber C, vacuum adsorbs the wafer in the wafer box B, and the retrieval fork 1 drives the wafer into the wafer buffer structure D for cache, and then the wafer in the wafer buffer structure D is transferred to the reaction chamber F by the retrieval fork 1. The wafer is supported by the wafer carrier 29 in the reaction chamber F, and process gas is introduced into the reaction chamber F. The heating equipment installed on the reaction chamber F provides the temperature required for coating (thin film deposition) to coat the wafer. The coated wafer is reversely transferred from the reaction chamber F to the wafer box B.

[0132] In a specific embodiment, the wafer handling robot further includes a multi-axis magnetic fluid sealing transmission device 7, such as Figure 7 and Figure 8As shown, the multi-axis magnetic fluid sealed transmission device 7 includes a hollow shaft 701, an intermediate shaft 702 and a base shaft 703 coaxially arranged from the inside to the outside. The multi-axis magnetic fluid sealed transmission device is a finished component, which is easy to install and has a simple structure, which is beneficial to the overall structural layout of the manipulator. The multi-axis magnetic fluid sealed transmission device uses magnetic fluid to achieve sealing, has better sealing performance during operation, longer service life, and is suitable for vacuum environments.

[0133] The hollow shaft 701 and the intermediate shaft 702 are rotatably connected via bearings. The intermediate shaft 702 and the base shaft 703 are rotatably connected via bearings. The base shaft 703 is fixed to the base flange 4 via bolts. The base flange 4 is fixed to the body of the load lock chamber C via bolts.

[0134] The two ends of the intermediate shaft 702 are connected to the turntable 3 and the rotation drive device 6 respectively. The rotation drive device 6 can rotate the turntable 3 by driving the intermediate shaft 702. The turntable 3 is fixedly connected to the intermediate shaft 702.

[0135] The two ends of the hollow shaft 701 are connected to the swing arm 2 and the telescopic drive device 5 respectively. The telescopic drive device 5 can drive the hollow shaft 701 to rotate, thereby moving the swing arm 2. The hollow shaft 701 is connected to the vacuum air passage in the slice taking fork 1 through a gas hose.

[0136] In this embodiment, a vacuum connector 10 is provided at one end of the hollow shaft 701 away from the wafer removal fork 1. The vacuum pumping system is connected to the hollow shaft 701 through the vacuum connector 10, and the hollow shaft 701 is connected to the vacuum air duct in the wafer removal fork 1 through a gas hose, so that the vacuum pumping system can act on the vacuum suction cup 104, so that the vacuum suction cup 104 can vacuum absorb the wafer.

[0137] In a specific embodiment, Figures 9 to 11 As shown, the swing arm portion 2 includes a lower first swing arm 201, an upper second swing arm 202, a lower second swing arm 203, an upper first swing arm 204 and a linkage portion, wherein the upper second swing arm 202 and the upper first swing arm 204 are located above the lower first swing arm 201 and the lower second swing arm 203;

[0138] One end of the lower first swing arm 201 is fixedly connected to the hollow shaft 701, and the other end of the lower first swing arm 201 is connected to the upper second swing arm 202 via a linkage portion. The lower first swing arm 201 drives the upper second swing arm 202 to swing via the linkage portion, and the end of the upper second swing arm 202 away from the linkage portion is hinged to the slice taking fork 1;

[0139] One end of the lower second swing arm 203 is rotatably connected to the turntable 3, and the other end of the lower second swing arm 203 is rotatably connected to the upper second swing arm 202 via a second rotating shaft 208 and a bearing sleeved on the second rotating shaft 208. The second rotating shaft 208 is fixed to the upper second swing arm 202.

[0140] One end of the upper first swing arm 204 is rotatably connected to the end of the lower first swing arm 201 away from the hollow shaft 701 via a first rotating shaft 207 and a bearing sleeved on the first rotating shaft 207. The first rotating shaft 207 is fixed to the upper first swing arm 204. The other end of the upper first swing arm 204 is hinged to the slice taking fork 1.

[0141] In this embodiment, the linkage portion includes a driving gear 205, a driven gear 206, a gear upper cover 209, and a gear lower cover 210. In this embodiment, the driving gear 205 and the driven gear 206 are both shift gears, which makes the transmission process smoother and more accurate, and does not cause the swing arm portion 2 to shake during the transmission process due to meshing clearance problems.

[0142] The gear upper cover 209 is rotatably connected to the first rotating shaft 207 and the second rotating shaft 208 via two bearings respectively. The gear lower cover 210 is connected to the gear upper cover 209 via bolts. The gear lower cover 210 and the gear upper cover 209 form a cavity to accommodate the driving gear 205 and the driven gear 206.

[0143] The driving gear 205 is fixed to the end of the lower first swing arm 201 away from the hollow shaft 701, and the driven gear 206 is fixed to the end of the upper second swing arm 202 away from the slice taking fork 1, and the driven gear 206 is meshed with the driving gear 205;

[0144] The gear lower cover 210 and the gear upper cover 209 can prevent the driving gear 205 and the driven gear 206 from being exposed, thereby playing a protective role. At the same time, the gear lower cover 210 and the gear upper cover 209 can ensure that the center distance between the first rotating shaft 207 and the second rotating shaft 208 remains unchanged, so that the driving gear 205 and the driven gear are always engaged, ensuring the normal operation of the swing arm part 2;

[0145] When the slice fork 1 needs to be extended or retracted, the hollow shaft 701 rotates, driving the lower first swing arm 201 to swing, and the upper second swing arm 202 is driven to swing by the driven gear 206 meshing with the driving gear 205, and the upper first swing arm 204 and the lower second swing arm 203 follow the lower first swing arm 201 and the upper second swing arm 202 to move. Figure 19a and Figure 19b As shown, the swing is converted into a telescopic movement of the slice taking fork 1, and the upper first swing arm 204 and the lower second swing arm 203 also play a role in ensuring that the slice taking fork 1 can move stably.

[0146] In a specific embodiment, Figure 7 and Figure 8 As shown, the rotation drive device 6 includes a first motor 601, a first mounting bracket 602, a first transmission shaft 603 and a first wire rope pulley 604. The first transmission shaft 603 and the first wire rope pulley 604 are connected by a wire rope transmission. In this embodiment, as shown in FIG. Figure 21a and Figure 21b As shown, two steel ropes 11 are wound around the first transmission shaft 603 and the first steel rope pulley 604 at the same time, and both ends of each steel rope 11 are fixed to the first transmission shaft 603 and the first steel rope pulley 604 respectively;

[0147] The first mounting frame 602 is fixedly connected to the base shaft 703 by bolts, the first transmission shaft 603 is rotatably set on the first mounting frame 602, the first wire rope pulley 604 is fixed to the intermediate shaft 702 by bolts, and the first motor 601 can drive the first transmission shaft 603 to rotate, and then drive the first wire rope pulley 604 to rotate through the wire rope wound around the first transmission shaft 603.

[0148] In a specific embodiment, Figure 7 and Figure 8 As shown, the telescopic drive device 5 includes a second motor 501, a second mounting frame 502, a second transmission shaft 503 and a second wire rope pulley 504. The second transmission shaft 503 and the second wire rope pulley 504 are connected by a wire rope 11. In this embodiment, the arrangement of the wire rope 11 on the telescopic drive device 5 is similar to that of the rotary drive device 6. The two wire ropes 11 are simultaneously wound around the second transmission shaft 503 and the second wire rope pulley 504, and the two ends of each wire rope 11 are respectively fixed to the second transmission shaft 503 and the second wire rope pulley 504.

[0149] The second mounting frame 502 is fixedly connected to the first wire rope pulley 604 and will rotate with the first wire rope pulley 604. Therefore, in actual production, it is necessary to ensure that the highest point of the telescopic drive device 5 is lower than the lowest point of the rotary drive device 6 to avoid interference. The second transmission shaft 503 is rotatably set on the second mounting frame 502, and the second wire rope pulley 504 is sleeved and fixed on the hollow shaft 701. The second motor 501 can drive the second transmission shaft 503 to rotate.

[0150] Traditional belt transmission has elasticity of the synchronous belt material, which leads to elastic slip during the transmission process, which makes it impossible to guarantee the accuracy of the transmission ratio and the transmission efficiency is relatively low. In contrast, the telescopic drive device 5 and the rotary drive device 6 use wire rope as the transmission medium, and the transmission structure is simpler. Compared with the belt transmission, the overall size is smaller, the transmission accuracy is high, the noise is low, the transmission is smooth, and the thermal deformation of the wire rope is much smaller than that of the synchronous belt, which is more suitable for the high temperature environment inside the chemical vapor deposition equipment.

[0151] In a specific embodiment, Figure 6 As shown, a waist-shaped hole 12 is provided on the first mounting bracket 602 of the rotary drive device 6. The first mounting bracket 602 is fixedly connected to the base shaft 703 by a bolt passing through the waist-shaped hole 12. The center distance between the first transmission shaft 603 and the first wire rope pulley 604 is adjusted through the waist-shaped hole 12 to ensure that the wire rope 11 of the rotary drive device 6 is tensioned.

[0152] The second mounting frame 502 of the telescopic drive device 5 is also provided with a waist-shaped hole 12. The second mounting frame 502 is fixedly connected to the first wire rope pulley 604 by bolts passing through the waist-shaped hole 12. The center distance between the second transmission shaft 503 and the second wire rope pulley 504 is adjusted through the waist-shaped hole 12 to ensure that the wire rope 11 of the telescopic drive device 5 is tensioned.

[0153] In a specific embodiment, a first driving pulley is provided on the output shaft of the first motor 601, such as Figure 8 As shown, the first transmission shaft 603 is provided with a first driven pulley 605, the first driving pulley and the first driven pulley 605 are connected through a synchronous belt transmission, and the output shaft of the second motor 501 is provided with a second driving pulley, as shown in FIG. Figure 7 and Figure 8 As shown, a second driven pulley 505 is provided on the second transmission shaft 503, and the second driving pulley and the second driven pulley 505 are connected through a synchronous belt transmission;

[0154] The diameter of the first driving pulley is smaller than that of the first driven pulley 605 , and the diameter of the second driving pulley is smaller than that of the second driven pulley 505 , so as to adjust the transmission ratio through belt transmission.

[0155] In practical applications, vapor deposition equipment also involves the following issues, such as Figure 23 As shown, when wafers 30 are stored in the wafer buffer structure D, the gaps between adjacent layers of wafers are relatively narrow. If the wafer fork has significant level deviations, it may scrape the wafers during wafer removal and placement operations, causing scratches on the wafer surface. This can render uncoated wafers unusable and coated wafers wasteful. Furthermore, significant level deviations can adversely affect the smoothness of the wafer transfer process.

[0156] The wafer handling robot of traditional chemical vapor deposition equipment does not have the function of adjusting the wafer fork in the vertical direction. Therefore, after assembly is completed, the position of the wafer fork in the vertical direction cannot be adjusted. The relative position of the wafer fork depends entirely on the previous processing accuracy and assembly accuracy. Once problems occur during the processing or assembly process, the wafer handling robot cannot meet the use requirements of the wafer fork through fine-tuning.

[0157] In order to overcome the above problems, the wafer handling robot E of the present application is provided with a horizontal adjustment mechanism to achieve horizontal adjustment of the wafer picking fork 1, so that the wafer handling robot E can meet the use requirements of the wafer picking fork 1 through fine adjustment.

[0158] In a specific embodiment, the level adjustment mechanism includes: Figure 9 The swing arm adjustment mechanism 8 shown in FIG. Figure 12 and Figure 13 As shown, the swing arm adjustment mechanism 8 includes an adjustment support 801, a hollow adjustment member 802, a hollow tensioning shaft 803, a locking bolt 804 and a tensioning block 805;

[0159] The adjustment support 801 is fixed to the top of the turntable 3 by bolts. The adjustment support 801 is provided with a threaded hole, and the hollow adjustment member 802 is provided with an external thread corresponding to the threaded hole;

[0160] By screwing the hollow adjusting member 802 , the hollow adjusting member 802 can be vertically displaced relative to the adjusting support 801 ;

[0161] The hollow tensioning shaft 803 is sleeved with a bearing fixed on the lower second swing arm 203, and one end of the hollow tensioning shaft 803 is detachably connected to the hollow adjustment piece 802 through a thread. After the bearing fixed on the lower second swing arm 203 is sleeved on the hollow tensioning shaft 803, the hollow tensioning shaft 803 and the hollow adjustment piece 802 are tightened and fixed for easy installation. Figure 14 As shown, a tensioning portion 806 is provided at the other end of the hollow tensioning shaft 803. The tensioning portion 806 has a stepped surface 809. The stepped surface 809 can limit the bearing mounted on the hollow tensioning shaft 803. The tensioning portion 806 is provided with a plurality of tensioning strips 807 evenly distributed around the circumference. The tensioning strips 807 can be inserted into the connecting sleeve 301 provided on the turntable 3. In actual application, a milled surface 810 is machined on the outer side of the tensioning strips 807 to facilitate the installer to tighten the hollow tensioning shaft 803 with a wrench.

[0162] In this embodiment, the thread between the hollow tensioning shaft 803 and the hollow adjusting member 802 is a reverse thread with a rotation direction opposite to that between the adjusting support 801 and the hollow adjusting member 802, so as to prevent the hollow tensioning shaft 803 and the hollow adjusting member 802 from separating from each other when the hollow adjusting member 802 is screwed.

[0163] The locking bolt 804 passes through the center holes of the hollow adjustment member 802 and the hollow tensioning shaft 803 and is threadedly connected to the tensioning block 805;

[0164] In this embodiment, if Figure 13 and Figure 22 As shown, the tensioning block 805 is in the shape of a truncated cone, the axial cross-section of which is an isosceles trapezoid. The angle range of the lower base angle of the isosceles trapezoid is 75-83 degrees. The truncated cone within this angle range can more smoothly expand the tensioning strip 807. The tensioning strip 807 is made of elastic metal material. The side of the tensioning strip 807 close to the tensioning block 805 is provided with a conical surface that cooperates with the side of the truncated cone.

[0165] In practical applications, an internal threaded tube 811 is further included. The internal threaded tube 811 is integrally formed with the tensioning block 805, thereby extending the contact length between the tensioning block 805 and the locking bolt 804. The internal threaded tube 811 provided on the tensioning block 805 improves the reliability of the connection between the locking bolt 804 and the tensioning block 805.

[0166] The locking bolt 804 is screwed, and the locking bolt 804 can drive the tensioning block 805 to vertically displace relative to the tensioning portion 806. When the tensioning block 805 moves toward the tensioning portion 806, the plurality of tensioning bars 807 are squeezed by the tensioning portion 806 and gradually expand, so that the tensioning bars 807 and the connecting sleeve 301 are locked. When the tensioning block 805 moves in a direction away from the tensioning portion 806, the plurality of tensioning bars 807 are no longer squeezed by the tensioning portion 806 and gradually return to their original position and close, so that the tensioning bars 807 and the connecting sleeve 301 are unlocked.

[0167] Also includes a first tensioning bolt, such as Figure 15 As shown, the first lower swing arm 201 is provided with a first open ring 211 at one end close to the hollow shaft 701. The hollow shaft 701 is located in the center hole of the first open ring 211. The two free ends of the first open ring 211 are respectively provided with a threaded hole and a countersunk hole. The first tensioning bolt passes through the countersunk hole and is threadedly connected to the threaded hole.

[0168] In this embodiment, Figure 15 The left free end of the first open ring 211 is provided with a countersunk hole, which accommodates the head of a first tightening bolt. The first tightening bolt is inserted through the countersunk hole on the left free end and exits through the threaded hole on the right free end. Tightening the first tightening bolt can bring the two free ends closer together, causing the first open ring 211 to deform and shrink to tightly embrace the hollow shaft 701.

[0169] Also includes a second tensioning bolt, such as Figure 16As shown, the upper first swing arm 204 is provided with a second open ring 212 at one end close to the first rotating shaft 207. The first rotating shaft 207 is located in the center hole of the second open ring 212. The two free ends of the second open ring 212 are respectively provided with a threaded hole and a countersunk hole. The second tensioning bolt passes through the countersunk hole and is threadedly connected to the threaded hole.

[0170] In this embodiment, Figure 16 The second open ring 212 is shown with a countersunk hole on the right free end, which accommodates the head of the second tightening bolt. The second tightening bolt is inserted through the countersunk hole on the right free end and exits from the threaded hole on the left free end. Tightening the second tightening bolt can bring the two free ends closer together, causing the second open ring 212 to deform and contract to tightly embrace the first rotating shaft 207.

[0171] In this embodiment, since the second open ring 212 is relatively thick and not easily deformed, the second open ring 212 is provided with the following Figure 16 The deformation groove 213 shown makes the second open ring 212 more easily deformed, and the pulling force required to bring the two free ends of the second open ring 212 closer to each other is smaller.

[0172] If the horizontality of the wafer picking fork 1 deviates greatly, the wafer picking fork 1 may scratch the wafer during wafer picking and placing operations. At the same time, during wafer transfer, the wafer picking fork 1 passes through the valve port of the vacuum gate valve of the load lock chamber C, and the position of the valve port remains fixed. If the vertical position of the wafer picking fork 1 deviates, it is easy to interfere with the valve port, causing the wafer picking fork 1 to collide. Therefore, to ensure the normal use of the wafer picking fork 1, after the swing arm 2 is installed on the turntable 3, the horizontality of the swing arm 2 and the height of the swing arm 2 relative to the turntable 3 need to be fine-tuned to ensure the horizontality and height of the wafer picking fork 1.

[0173] When fine-tuning is required, the locking bolt 804 can be loosened so that the tensioning block 805 no longer stretches the tensioning strip 807. At this time, the tensioning strip 807 no longer locks the connecting sleeve 301, and the two are separated from each other. The vertical displacement of the hollow tensioning shaft 803 is no longer constrained by the connecting sleeve 301. At this time, the hollow adjusting piece 802 is screwed, and the hollow adjusting piece 802 drives the hollow tensioning shaft 803 to move vertically, thereby driving the lower second swing arm 203 to move vertically relative to the turntable 3. After adjusting the rear position, the locking bolt 804 is tightened, and the tensioning block 805 stretches the tensioning strip 807, and the tensioning strip 807 is close to the connecting sleeve 301, so that the connecting sleeve 301 and the hollow tensioning shaft 803 are locked;

[0174] Loosen the first tightening bolt to separate the two free ends of the first open ring 211 from each other. The first open ring 211 no longer holds the hollow shaft 701 tightly. At this time, the position of the lower first swing arm 201 relative to the hollow shaft 701 can be adjusted vertically. After the position is adjusted, retighten the first tightening bolt to make the first open ring 211 hold the hollow shaft 701 tightly again.

[0175] Loosen the second tightening bolt to separate the two free ends of the second open ring 212 from each other, and the second open ring 212 no longer holds the first rotating shaft 207. At this time, the position of the upper first swing arm 204 relative to the first rotating shaft 207 can be adjusted vertically. After adjusting the position, re-tighten the second tightening bolt to make the second open ring 212 hold the first rotating shaft 207 again.

[0176] In a specific embodiment, Figure 13 As shown, a spring 808 is further included, one end of the spring 808 is connected to the tensioning portion 806, and the other end of the spring 808 is connected to the tensioning block 805;

[0177] By loosening the locking bolt 804, the spring 808 can release its elastic force, separating the tension block 805 from the tension strip 807, thereby preventing the tension block 805 and the tension strip 807 from being stuck together due to friction, making it impossible to separate the connecting sleeve 301 and the hollow tension shaft 803.

[0178] In a specific embodiment, Figure 6 and Figure 7 As shown, the apparatus further includes a pipe fixing bracket 9. In this embodiment, the pipe fixing bracket 9 is fixed to the linkage portion above the turntable 3 by bolts. The pipe fixing bracket 9 is used to fix the gas hose connecting the slice taking fork 1 and the hollow shaft 701. The pipe fixing bracket 9 constrains the position of the gas hose to prevent the gas hose from interfering with the movement of the swing arm 2.

[0179] In this embodiment, if Figure 17 As shown, the pipeline fixing bracket 9 includes a bracket body 901 and a pressing plate 902. Figure 18 As shown, the bracket body 901 is provided with a groove for placing the gas hose, and the pressing plate 902 is fixed to the bracket body 901 by bolts, and the gas hose is pressed into the groove by the pressing plate 902.

[0180] In a specific embodiment, a plurality of vacuum suction cups 104 are evenly distributed on one end of the wafer picking fork 1 away from the swing arm portion 2 , and the plurality of vacuum suction cups 104 can better absorb the wafer 30 .

[0181] Example 2

[0182] This embodiment provides a wafer vapor deposition device. The main structure of this embodiment is similar to that of Example 1. The differences between this embodiment and Example 1 are as follows:

[0183] To rationally utilize space, reduce the volume of the vapor deposition apparatus, and lower the difficulty of cleanliness control, in this embodiment, the wafer stage 29 within the reaction chamber F employs a cantilever design (one end of the wafer stage 29 is fixed to a fixed shaft 291). This design can easily cause the surface of the wafer stage 29 to become uneven, potentially causing the wafer to shift during loading, leading to loading failure. Furthermore, it can also cause adverse conditions such as wafer slippage, significantly negatively impacting the precision control of thin film deposition.

[0184] To ensure a high wafer yield, the wafer stage must be kept level. However, conventional lift mechanisms, primarily designed to adjust the wafer stage's displacement in the X, Y, and Z axes, struggle to meet the requirements for wafer stage leveling.

[0185] Therefore, in this embodiment, the cavity F1 of the reaction chamber F is provided with a wafer lifting mechanism, such as Figure 27 、 Figure 28 、 Figure 31 and Figure 34 As shown, the wafer lifting mechanism includes: a cavity connecting plate 13, a first adjustment plate 14, a second adjustment plate 15, a leveling mechanism and a lifting mechanism 16. In this embodiment, the cavity connecting plate 13 is fixed to the cavity of the reaction chamber by bolts;

[0186] The first adjustment plate 14 is slidably disposed on the cavity connecting plate 13 along the Y direction, and the second adjustment plate 15 is slidably disposed on the first adjustment plate 14 along the X direction;

[0187] The lifting mechanism 16 can drive the wafer stage 29 to move along the Z direction. The lifting mechanism 16 is installed on the second adjustment plate 15 through a leveling mechanism. The leveling mechanism can adjust the angle between the travel direction of the lifting mechanism 16 and the plane where the second adjustment plate 15 is located;

[0188] This embodiment provides a wafer vapor deposition apparatus, in which a Z-direction displacement of a wafer stage 29 is achieved by lifting and lowering a lifting mechanism 16. In this embodiment, the Z-direction is the vertical direction. By sliding a first adjustment plate 14 provided on a chamber connecting plate 13 and a second adjustment plate 15 provided on the first adjustment plate 14, the Y-direction and X-direction displacements of the lifting mechanism 16 are achieved, thereby achieving the Y-direction and X-direction displacements of the wafer stage 29.

[0189] The angle between the travel direction of the lifting mechanism 16 and the second adjustment plate 15 is adjusted through the leveling mechanism, thereby achieving adjustment of the horizontality of the wafer carrier 29. While ensuring the horizontal state of the wafer carrier 29, the displacement of the wafer carrier 29 in the three directions of XYZ is achieved. The leveling function and the displacement function are integrated together, with high space utilization, thereby reducing the volume of the vapor deposition device.

[0190] In a specific embodiment, the leveling mechanism includes three groups of leveling modules distributed in a triangle, such as Figure 28 and Figure 35 As shown, each set of the leveling modules includes a connecting bolt 1701, a leveling top screw 1702 and a leveling locking nut 1703;

[0191] The lifting mechanism 16 includes a support 1601, the leveling screw 1702 is threadedly connected to the support 1601, and the support 1601 is provided with a through hole allowing the connecting bolt 1701 to pass through. The connecting bolt 1701 passes through the through hole and is threadedly connected to the second adjustment plate 15.

[0192] The leveling screw 1702 abuts against the second adjustment plate 15 , and the leveling screw 1702 is screwed to adjust the length of the leveling screw 1702 protruding from the top surface of the support 1601 , so that the support 1601 moves away from or closer to the second adjustment plate 15 ;

[0193] The leveling locking nut 1703 is arranged on a side of the support 1601 away from the second adjustment plate 15 , and the leveling locking nut 1703 is arranged on the leveling top screw 1702 ;

[0194] By screwing three leveling screws 1702 that abut the bottom surface of the second adjustment plate 15, the plane is determined by three points, so that the angle between the bottom surface of the second adjustment plate 15 and the top surface of the support 1601 can be changed, so that the travel direction of the lifting mechanism 16 and the angle between the second adjustment plate 15 can be changed. The horizontality of the wafer stage 29 connected to the lifting mechanism 16 can be adjusted through the three sets of leveling modules distributed in a triangle.

[0195] In actual use, the connecting bolt 1701 can be loosened first to create a gap between the support 1601 and the second adjustment plate 15 for adjusting the horizontality, and then the leveling screw 1702 can be screwed for leveling. After leveling, the connecting bolt 1701 and the leveling locking nut 1703 can be tightened. The leveling locking nut 1703 can prevent the leveling screw 1702 from loosening. In this embodiment, a flat washer and a spring washer are provided on the connecting bolt 1701 to prevent the connecting bolt 1701 from loosening by providing a spring washer.

[0196] In a specific embodiment, the cavity connecting plate 13 is provided with a Y-direction slide groove, and the first adjustment plate 14 is provided with a Y-direction slide rail 1401, and the Y-direction slide rail 1401 is slidably connected to the Y-direction slide groove;

[0197] The first adjustment plate 14 is provided with an X-direction slide groove, and the second adjustment plate 15 is provided with an X-direction slide rail 1501, and the X-direction slide rail 1501 is slidably connected to the X-direction slide groove;

[0198] This embodiment does not adopt the form of matching the slider with the slide rail, but adopts the form of direct matching of the slide groove with the slide rail, which occupies less space and thus reduces the volume of the vapor deposition device.

[0199] In a specific embodiment, Figure 27 As shown, it also includes a Y-direction adjustment mechanism 18 and an X-direction adjustment structure 19; Figure 30 As shown, the Y-direction adjustment mechanism 18 includes a first connecting plate 1801, a first hollow bolt 1802, a Y-direction guide screw 1803 and a first fixing nut 1804. The first connecting plate 1801 is fixed to the cavity connecting plate 13 by bolts;

[0200] The first hollow bolt 1802 is provided with a first guide through-hole. The first connecting plate 1801 is threadedly connected to the first hollow bolt 1802. The Y-direction guide screw 1803 passes through the first guide through-hole and is threadedly connected to the first adjustment plate 14. The Y-direction guide screw 1803 is capable of sliding along the first guide through-hole. The first fixing nut 1804 is disposed on a side of the first hollow bolt 1802 away from the first adjustment plate 14 and is disposed on the Y-direction guide screw 1803.

[0201] By forwardly turning the first hollow bolt 1802 , the end of the first hollow bolt 1802 can abut against the side surface of the first adjustment plate 14 , so that the first hollow bolt 1802 can push the first adjustment plate 14 away from the first connecting plate 1801 , thereby achieving positive displacement of the wafer stage 29 in the Y direction.

[0202] The first hollow bolt 1802 is screwed in the reverse direction, so that the end of the first hollow bolt 1802 is separated from the side of the first adjustment plate 14. At this time, the Y-direction guide screw 1803 is pulled, and the Y-direction guide screw 1803 slides along the first guide hole, so that the first adjustment plate 14 can move closer to the first connecting plate 1801, thereby achieving reverse displacement of the wafer stage 29 in the Y direction.

[0203] After adjusting the displacement of the wafer stage 29 in the Y direction, tighten the first fixing nut 1804 so that the first fixing nut 1804 abuts against the end of the first hollow bolt 1802 away from the first adjustment plate 14, thereby locking the first adjustment plate 14 in the Y direction.

[0204] like Figure 32b As shown, the X-direction adjustment structure 19 includes a second connecting plate 1901, a second hollow bolt 1902, an X-direction guide screw 1903 and a second fixing nut 1904, and the second connecting plate 1901 is fixed to the first adjustment plate 14 by bolts;

[0205] The second hollow bolt 1902 is provided with a second guide through-hole. The second connecting plate 1901 is threadedly connected to the second hollow bolt 1902. The X-direction guide screw 1903 passes through the second guide through-hole and is threadedly connected to the second adjustment plate 15. The X-direction guide screw 1903 can slide along the second guide through-hole.

[0206] The second fixing nut 1904 is disposed on a side of the second hollow bolt 1902 away from the second adjustment plate 15 , and the second fixing nut 1904 is disposed on the X-direction guide screw 1903 ;

[0207] By forwardly turning the second hollow bolt 1902, the end of the second hollow bolt 1902 can abut against the side surface of the second adjustment plate 15, so that the second hollow bolt 1902 can push the second adjustment plate 15 away from the second connecting plate 1901, thereby achieving positive displacement of the wafer stage 29 in the X direction.

[0208] The second hollow bolt 1902 is screwed in the reverse direction to move the end of the second hollow bolt 1902 away from the side of the second adjustment plate 15. At this time, the X-direction guide screw 1903 is pulled, and the X-direction guide screw 1903 slides along the second guide through hole, so that the second adjustment plate 15 can move closer to the second connecting plate 1901, thereby achieving reverse displacement of the wafer stage 29 in the X direction.

[0209] After adjusting the displacement of the wafer stage 29 in the X direction, tighten the second fixing nut 1904 so that the second fixing nut 1904 abuts against the end of the second hollow bolt 1902 away from the second adjustment plate 15, thereby locking the second adjustment plate 15 in the X direction.

[0210] In a specific embodiment, it also includes a Y-direction resistance mechanism and an X-direction resistance mechanism;

[0211] like Figure 29 As shown, the Y-direction resistance mechanism includes a Y-direction spring 2001, one end of the Y-direction spring 2001 is connected to the first connecting plate 1801, and the other end of the Y-direction spring 2001 is connected to the first adjustment plate 14;

[0212] like Figure 32aAs shown, the X-direction resistance mechanism comprises an X-direction spring 2101, one end of which is connected to the second connecting plate 1901, and the other end of which is connected to the second adjusting plate 15;

[0213] When the first connecting plate 1801 and the first adjusting plate 14 move away from each other, the elastic force generated by the stretching of the Y-direction spring 2001 becomes the resistance for the movement of the first connecting plate 1801 and the first adjusting plate 14 away from each other, so that the first adjusting plate 14 cannot be easily moved, the displacement change is more controllable, and accurate adjustment is facilitated.

[0214] When the second connecting plate 1901 and the second adjusting plate 15 move away from each other, the elastic force generated by the stretching of the X-direction spring 2101 becomes the resistance for the movement of the second connecting plate 1901 and the second adjusting plate 15 away from each other, so that the second adjusting plate 15 cannot be easily moved, the displacement change is more controllable, and accurate adjustment is facilitated.

[0215] In the embodiment, as shown in the figure, Figure 29 As shown, the Y-direction resistance mechanism further comprises a Y-direction spring mounting pin 2002 and a Y-direction spring mounting screw 2003, the Y-direction spring mounting pin 2002 is threadedly connected with the first connecting plate 1801, the Y-direction spring mounting screw 2003 is threadedly connected with the first adjusting plate 14, and the hooks at both ends of the Y-direction spring 2001 are respectively sleeved on the Y-direction spring mounting pin 2002 and the Y-direction spring mounting screw 2003.

[0216] In the embodiment, as shown in the figure, Figure 32a As shown, the X-direction resistance mechanism further comprises an X-direction spring mounting pin 2102 and an X-direction spring mounting screw 2103, the X-direction spring mounting pin 2102 is threadedly connected with the second connecting plate 1901, the X-direction spring mounting screw 2103 is threadedly connected with the second adjusting plate 15, and the hooks at both ends of the X-direction spring 2101 are respectively sleeved on the X-direction spring mounting pin 2102 and the X-direction spring mounting screw 2103.

[0217] In specific embodiments, the X-direction sliding groove and the Y-direction sliding groove are both dovetail sliding grooves, and the X-direction sliding rail 1501 and the Y-direction sliding rail 1401 are both dovetail sliding rails, which have high precision and good rigidity and can bear large loads.

[0218] In specific embodiments, a Y-direction fillet 22 and an X-direction fillet 23 are further included, as shown in the figure, Figure 32b As shown, the Y-direction fillet 22 is arranged in the Y-direction sliding groove, and as shown in the figure, Figure 35 As shown, the X-direction fillet 23 is arranged in the X-direction sliding groove.

[0219] The Y-direction fillet 22 reduces the fitting gap between the Y-direction sliding rail 1401 and the Y-direction sliding groove, avoids the shaking of the lifting mechanism 16 during movement, and thus ensures the movement precision and position precision of the wafer table 29.

[0220] By reducing the matching gap of the X-direction slide rail 1501 and the X-direction slide groove through the X-direction insert strip 23, the shaking of the lifting mechanism 16 during movement is avoided, so as to ensure the movement accuracy and position accuracy of the wafer carrier 29;

[0221] In the embodiment, as shown in the figure, Figure 32b a first bolt 24 is arranged on the cavity connecting plate 13, and the size of the gap between the Y-direction insert strip 22 and the Y-direction slide rail 1401 can be adjusted by screwing the first bolt 24. A first nut 25 is arranged on the first bolt 24, and the first nut 25 is used to prevent the first bolt 24 from loosening;

[0222] In the embodiment, as shown in the figure, Figure 35 a third bolt 28 is arranged on the first adjusting plate 14, and the size of the gap between the X-direction insert strip 23 and the X-direction slide rail 1501 can be adjusted by screwing the third bolt 28. In order to avoid interference with the Y-direction resistance mechanism, the X-direction insert strip 23 in the embodiment is arranged on the right side of the figure, Figure 35 In actual use, the side is close to the cavity of the reaction chamber, and the operation space is small, which is not convenient for screwing. Therefore, a second bolt 26 is additionally arranged on the first adjusting plate 14, and the size of the gap between the X-direction insert strip 23 and the X-direction slide rail 1501 can be adjusted by screwing the second bolt 26. A second nut 27 is arranged on the second bolt 26, and the second nut 27 is used to prevent the second bolt 26 from loosening

[0223] In the embodiment, the first hollow bolt 1802 and the second bolt 26 are arranged on the side away from the cavity of the reaction chamber, and the second hollow bolt 1902 and the first bolt 24 are arranged on the side away from the fixed shaft 291, so as to ensure that the operator has sufficient operation space for screwing.

[0224] In the embodiment, as shown in the figure, Figure 28 the lifting mechanism 16 further comprises a motor 1602, a lead screw 1603, a Z-direction slide rail 1604, a Z-direction slide block 1605, a fixed shaft clamping portion 1606, and a lead screw nut seat 1608. The fixed shaft clamping portion 1606 is used to clamp the fixed shaft 291 of the wafer carrier 29, and the fixed shaft clamping portion 1606 is arranged on the lead screw nut seat 1608. In the embodiment, the lead screw 1603 is a trapezoidal lead screw;

[0225] In the embodiment, as shown in the figure, Figure 32a the fixed shaft clamping portion 1606 comprises two clamping blocks 1609, and the two clamping blocks 1609 clamp the fixed shaft 291 and are fixed on the lead screw nut seat 1608 through bolts;

[0226] The lead screw 1603 is rotatably arranged on the support 1601 through a bearing, and the motor 1602 is fixed on the support 1601. The motor 1602 can drive the lead screw 1603 to rotate. In this embodiment, the motor 1602 drives the lead screw 1603 to rotate through a belt transmission. The Z-direction slide rail 1604 is arranged on the support 1601, and the Z-direction slider 1605 is installed on the Z-direction slide rail 1604. The lead screw nut seat 1608 is fixedly connected to the Z-direction slider 1605. A lead screw nut 1607 is provided on the lead screw nut seat 1608, and the lead screw nut 1607 is installed on the lead screw 1603.

[0227] In actual use, such as Figure 33 As shown, the lifting pin 85 (lifting pin PI N ) can also adopt the same cantilever design as the wafer carrier 29, and adopt the same wafer lifting mechanism as the wafer carrier 29 for lifting and leveling. The lifting pin fixed shaft 87 of the lifting pin 85 is connected to the wafer lifting mechanism (the connection form of the lifting pin fixed shaft 87 and the wafer lifting mechanism is the same as the connection form of the fixed shaft 291 of the wafer carrier 29 and the wafer lifting mechanism), so that the lifting pin 85 can be driven by the wafer lifting mechanism. Figure 27 The four ejector pin holes provided on the wafer carrier 29 are shown to extend / retract to cooperate with the movement of the wafer removal fork 1 .

[0228] Example 3

[0229] This embodiment provides a wafer vapor deposition device. The main structure of this embodiment is similar to that of Example 1. The differences between this embodiment and Example 1 are as follows:

[0230] As a key component, the gas cabinet M is responsible for transporting a variety of reactive process gases into the reaction chamber F for chemical reactions to generate solid products and gaseous by-products. The solid products will be deposited on the wafer surface to form a solid film.

[0231] By changing the process gases introduced into the reaction chamber F from the gas cabinet M, different processes can be switched to accommodate diverse production needs. However, during process switching, residual gases from the previous process can affect the subsequent process, potentially altering the final process results. Therefore, to ensure process stability, effective measures must be taken to remove residual gases from the previous process.

[0232] Furthermore, when existing gas cabinets transport multiple process gases, the reactive reducing and oxidizing gases mix thoroughly within the pipelines before reaching the reaction chamber. This premature mixing not only leads to the premature formation of solid products and gaseous byproducts, disrupting the normal reaction flow within the reaction chamber and adversely affecting process performance, but also results in unnecessary consumption and waste of process gases, increasing production costs.

[0233] Therefore, in this embodiment, the gas cabinet M includes several gas control modules, such as Figure 40 As shown, it includes several gas control modules, and the number of gas control modules corresponds to the number of reaction chambers F in the CVD equipment. Figure 40 The part selected by D3 is a gas control module. The structure of the gas control module is as follows: Figure 41 As shown, Figure 40 The gas cabinet has four gas control modules, corresponding to the CVD equipment with four reaction chambers F, such as Figure 36 As shown, the gas control module includes a first gas delivery unit 31 and a second gas delivery unit 32;

[0234] The first gas delivery unit 31 includes a purge pipeline and several process gas delivery pipelines, such as Figure 36 As shown, one end of the purge pipeline of the first gas delivery unit 31 away from the purge gas source is connected to the other end of the process gas delivery pipeline away from the process gas source, and then branched into a first branch 41 and a third branch 43 provided with a switch valve;

[0235] The second gas delivery unit 32 includes a purge pipeline and several process gas delivery pipelines, such as Figure 36 As shown, one end of the purge pipeline of the second gas delivery unit 32 away from the purge gas source is connected to the other end of the process gas delivery pipeline away from the process gas source, and then a second branch 42 and a fourth branch 44 with a switch valve are separated;

[0236] The first gas delivery unit 31 is provided with at least one process gas delivery pipeline capable of delivering oxidizing gas, and the second gas delivery unit 32 is provided with at least one process gas delivery pipeline capable of delivering reducing gas. The first branch 41 and the second branch 42 are connected in parallel to the reaction chamber F, and the third branch 43 and the fourth branch 44 are connected in parallel to the vacuum pumping system H.

[0237] To better illustrate the beneficial effects of the gas cabinet M provided by this embodiment, the gas control module of the existing gas cabinet is introduced below. Figure 44The gas control module of the conventional gas cabinet shown is equipped with six process gas delivery pipelines. After the six process gas delivery pipelines are connected in parallel to the reaction chamber through the interface I, the reacting reducing gas and oxidizing gas will prematurely mix in the pipelines, resulting in the premature formation of solid products and gaseous by-products.

[0238] The gas cabinet M provided in this embodiment, by providing a first gas delivery unit 31 for delivering oxidizing gas and a second gas delivery unit 32 for delivering reducing gas, effectively isolates the reducing gas and the oxidizing gas that can react with each other. Before the first branch 41 and the second branch 42 merge, the reducing gas and the oxidizing gas do not come into contact with each other, greatly reducing the premature generation of solid products and gaseous by-products that may be caused by premature mixing of the gases, thereby ensuring the stability of the reaction in the reaction chamber F and reducing unnecessary consumption and waste of process gases.

[0239] The purge pipeline of the first gas delivery unit 31 is connected to the reaction chamber F and the vacuum pumping system H through the first branch 41 and the third branch 43 respectively. The purge pipeline of the second gas delivery unit 32 is connected to the reaction chamber F and the vacuum pumping system H through the second branch 42 and the fourth branch 44 respectively, so that residual gas and other impurities in the pipeline and the reaction chamber can be effectively removed to ensure the stability of the process.

[0240] In a specific embodiment, when the first gas delivery unit 31 includes multiple process gas delivery pipelines, the multiple process gas delivery pipelines of the first gas delivery unit 31 can deliver multiple process gases that do not react with each other, thereby preventing multiple process gases from mixing and reacting in the pipelines, causing premature generation of solid products and gaseous by-products, and affecting the normal reaction in the reaction chamber F;

[0241] When the second gas delivery unit 32 includes multiple process gas delivery pipelines, the multiple process gas delivery pipelines of the second gas delivery unit 32 can deliver multiple process gases that do not react with each other, thereby avoiding the reaction of multiple process gases in the pipeline after mixing, causing the premature generation of solid products and gaseous by-products, and affecting the normal reaction in the reaction chamber F.

[0242] In a specific embodiment, a gas cabinet body is further included, and the gas control module is arranged in the gas cabinet body, such as Figures 37 to 40 as well as Figure 42 As shown, the gas cabinet body includes a cabinet body 40 and a cabinet door 39 hinged on the cabinet body 40. The cabinet body 40 and the cabinet door 39 can form an airtight space. An exhaust pipe 38 is provided on the top of the cabinet body 40, and the exhaust pipe 38 is connected to the exhaust system.

[0243] When the gas control module is under maintenance, the cabinet door 39 needs to be opened, and the outside air will enter the gas cabinet body. As the pipeline is disassembled, the residual gas and impurities in the pipeline will overflow into the gas cabinet body, causing the gas cabinet body to be contaminated, seriously affecting the cleanliness of the working environment of the gas control module. Therefore, after the maintenance is completed, the exhaust pipe 38 connected to the exhaust system is used to suck out the residual gas and impurities in the gas cabinet body to eliminate the pollution in the airtight space and ensure the cleanliness of the gas cabinet body.

[0244] In a specific embodiment, a gas mass flow controller and a pneumatic valve are provided on the process gas delivery pipelines of the first gas delivery unit 31 and the second gas delivery unit 32, a filter is provided on one end of the process gas delivery pipelines of the first gas delivery unit 31 and the second gas delivery unit 32 close to the process gas source, and a manual valve is provided on the process gas delivery pipelines of the first gas delivery unit 31 and the second gas delivery unit 32;

[0245] A gas mass flow controller and a pneumatic valve are provided on the purge pipelines of the first gas delivery unit 31 and the second gas delivery unit 32. A filter is provided on one end of the purge pipelines of the first gas delivery unit 31 and the second gas delivery unit 32 close to the purge gas source. A manual valve is provided on the purge pipelines of the first gas delivery unit 31 and the second gas delivery unit 32.

[0246] The filter is used to ensure the purity of the transported gas, the gas mass flow controller is used to accurately control the flow of the transported gas, the pneumatic valve is used to control the on-off of the pipeline, and the manual valve is normally open. The manual valve only needs to be closed when the gas cabinet is repaired or there is a gas leak in the pipeline;

[0247] In this embodiment, the switch valve and the pneumatic valve are both pneumatic diaphragm valves, and the manual valves are both manual diaphragm valves. Each process gas delivery pipeline is independently provided with a manual diaphragm valve and a pneumatic diaphragm valve. The valves of the corresponding pipelines can be opened and closed individually according to different process requirements to meet different process requirements.

[0248] In this embodiment, if Figure 36 As shown, the first gas delivery unit 31 includes three process gas delivery pipelines and one purge pipeline. The three process gas delivery pipelines are respectively connected to the first process gas source G1, the second process gas source G2 and the third process gas source G3, and the purge pipeline is connected to the first purge gas source G4;

[0249] The second gas delivery unit 32 includes a process gas delivery pipeline and a purge pipeline, the process gas delivery pipeline is connected to the fourth process gas source G6, and the purge pipeline is connected to the second purge gas source G5;

[0250] In this embodiment, the gas corresponding to the first process gas source G1 is N2O (oxidizing gas), the gas corresponding to the second process gas source G2 is CF4, the gas corresponding to the third process gas source G3 is NH3, the gas corresponding to the fourth process gas source G6 is SiH4 (reducing gas), and the gases corresponding to the first purge gas source G4 and the second purge gas source G5 are both N2;

[0251] The process gas delivery pipelines and purge pipelines of the first gas delivery unit 31 and the second gas delivery unit 32 are both provided with filters (corresponding to Figure 36 The first filter 33a to the sixth filter 33f), manual valve (corresponding to Figure 36 The first manual valve 34a to the sixth manual valve 34f), the gas mass flow controller (corresponding to Figure 36 The first gas mass flow controller 35a to the sixth gas mass flow controller 35f) and the pneumatic valve (corresponding to Figure 36 The first pneumatic valve 36a to the sixth pneumatic valve 36f), the first branch 41 to the fourth branch 44 are respectively provided with a switch valve (corresponding to Figure 36 In the embodiment, the first switch valve 37a to the fourth switch valve 37d are Figure 43 As shown, the first branch 41 and the second branch 42 are connected in parallel and connected to the reaction chamber F through the gas supply interface 4501, and the third branch 43 and the fourth branch 44 are connected in parallel and connected to the vacuum pumping system H through the gas pumping interface 4502;

[0252] When the gas cabinet is operating normally, the manual valve is normally open, and the fourth pneumatic valve 36d, the fifth pneumatic valve 36e, the third on-off valve 37c, and the fourth on-off valve 37d are closed. According to different process requirements, different process gases are selected, and one or more of the first pneumatic valve 36a, the second pneumatic valve 36b, the third pneumatic valve 36c, and the sixth pneumatic valve 36f corresponding to the different process gases are opened. The first on-off valve 37a and the second on-off valve 37b are also opened to supply the process gases to the reaction chamber F.

[0253] When the cavity of the reaction chamber F needs to be opened, the flammable, explosive, toxic and harmful process gases remaining in the reaction chamber F need to be discharged. The third switch valve 37c and the fourth switch valve 37d are closed, and the first pneumatic valve 36a, the second pneumatic valve 36b, the third pneumatic valve 36c and the sixth pneumatic valve 36f are closed. The fourth pneumatic valve 36d, the fifth pneumatic valve 36e, the first switch valve 37a and the second switch valve 37b are opened, and N2 is introduced into the reaction chamber F for cleaning (in actual application, the reaction chamber F is also connected to the vacuum exhaust system H. At the same time as N2 is introduced, gas can be extracted through the vacuum exhaust system H to clean the interior of the reaction chamber F).

[0254] Since the process gas contains toxic, harmful, flammable and explosive gases, when the accessories of the gas cabinet (such as valves, pipelines, gas mass flow controllers and other accessories of the gas control module) need to be replaced or repaired, the residual process gas in the pipeline needs to be emptied, the first switch valve 37a and the second switch valve 37b are closed, the first pneumatic valve 36a, the second pneumatic valve 36b, the third pneumatic valve 36c and the sixth pneumatic valve 36f are closed, the third switch valve 37c and the fourth switch valve 37d are opened to vacuum the pipeline, the fourth pneumatic valve 36d and the fifth pneumatic valve 36e are opened to introduce N2 into the pipeline to evacuate the residual process gas in the pipeline, and then the third switch valve 37c and the fourth switch valve 37d are closed. After all manual valves are closed, the gas cabinet can be inspected and repaired.

[0255] When it is necessary to switch processes, the first pneumatic valve 36a, the second pneumatic valve 36b, the third pneumatic valve 36c and the sixth pneumatic valve 36f are closed, the first on-off valve 37a and the second on-off valve 37b are closed, the third on-off valve 37c and the fourth on-off valve 37d are opened to evacuate the pipeline, the fourth pneumatic valve 36d and the fifth pneumatic valve 36e are opened to introduce N2 into the pipeline to exhaust the residual process gas in the pipeline, ensuring that the newly introduced process gas after the process is switched will not be contaminated by the residual gas in the pipeline; after the residual process gas is exhausted, the fourth pneumatic valve 36d, the fifth pneumatic valve 36e, the third on-off valve 37c and the fourth on-off valve 37d are closed, and different process gases are selected according to different process requirements. One or more of the first pneumatic valve 36a, the second pneumatic valve 36b, the third pneumatic valve 36c and the sixth pneumatic valve 36f corresponding to the different process gases are opened, and the first on-off valve 37a and the second on-off valve 37b are opened to provide gas to the reaction chamber F.

[0256] Example 4

[0257] This embodiment provides a wafer vapor deposition device. The main structure of this embodiment is similar to that of Example 1. The differences between this embodiment and Example 1 are as follows:

[0258] During maintenance and commissioning, the reaction chamber F needs to be opened multiple times. Therefore, the hinge connecting the chamber body F1 and the upper cover F2 must have a self-locking function to ensure that the upper cover F2 is securely locked after opening. This effectively prevents the upper cover from accidentally falling and causing harm to workers, ensuring a safe and stable working environment.

[0259] Currently, self-locking hinges generally utilize a spring, gear, and toothed lever to achieve locking. This structure allows the hinge to be locked in any position through the meshing of the gear and the toothed lever. However, in practical applications, locking in any position is not essential; locking at a specific angle is sufficient.

[0260] The mechanism of meshing between the gears and the toothed joystick requires the operator to exert a relatively large force to press the joystick when performing the switching action, which makes the switching process very strenuous. In addition, during the cover opening process, unnecessary noise is generated due to the physical contact between the gears and the joystick, which also has a negative impact on the actual usage experience.

[0261] In this embodiment, the cavity F1 and the upper cover F2 of the reaction chamber F are connected by a connecting device, such as Figure 45 and Figure 46 As shown, the connecting device includes a hinge structure, such as Figure 50 As shown, the hinge structure includes a first leaf 46 and a second leaf 47 hingedly connected by a rotating shaft 57, and a limiting structure is provided on the first leaf 46;

[0262] like Figure 48 and Figure 52 As shown, the first leaf 46 has locking holes 4601 on both sides, and the locking holes 4601 are provided with latch springs 49 and latches 50. The latches 50 can move along the axial direction of the latch springs 49. The axial direction of the latch springs 49 is parallel to the axial direction of the rotating shaft 57. Figure 46 As shown, locking plates 48 are provided on both sides of the second leaf 47, and the locking plates 48 and the second leaf 47 are fixed by bolts. Figure 48 and Figure 49 As shown, the locking plate 48 is provided with a pin hole 4801 for allowing the latch 50 to be inserted;

[0263] When the second leaf 47 rotates until the latch 50 is aligned with the pin hole 4801, the latch 50 extends from the locking hole 4601 under the elastic force of the latch spring 49 and is inserted into the pin hole 4801, and the hinge structure is locked. The limiting structure can prevent the latch 50 from extending from the locking hole 4601 when the hinge structure is not locked.

[0264] Compared with the prior art, the connection device provided in this embodiment does not adopt the traditional mechanism of meshing gears with toothed operating levers to achieve the self-locking function. Instead, when the second leaf 47 is rotated to a specific position where the latch 50 is aligned with the pin hole 4801, the latch spring 49 provides elastic force to insert the latch 50 into the pin hole 4801, so that the hinge structure can be firmly and reliably locked, and the hinge structure can be opened and closed smoothly, which is labor-saving and noise-free. By setting a limit structure, the latch 50 is prevented from popping out when the latch 50 is not aligned with the pin hole 4801, thereby ensuring that the hinge structure can work normally.

[0265] In a specific embodiment, the limiting structure includes: Figure 46 The limiting slider 51 shown and Figure 48 The slide groove 4602 is provided on both sides of the first sheet 46. Figure 48 As shown, a spring 52 is provided in the slide groove 4602;

[0266] like Figure 53 and Figure 54 As shown, the limiting slider 51 includes a stopper 5101 and a sliding portion 5102 . The sliding portion 5102 is slidably disposed in the slide groove 4602 . Rotating the second page 47 enables the locking plate 48 to push the stopper 5101 .

[0267] Under the elastic force of the spring 52 , the sliding portion 5102 can slide along the sliding groove 4602 until the stop portion 5101 blocks the locking hole 4601 , thereby preventing the latch 50 from extending from the locking hole 4601 .

[0268] The second leaf piece 47 rotates, driving the locking plate 48 to rotate, so that the locking plate 48 pushes the stop portion 5101. Under the thrust of the locking plate 48, the sliding portion 5102 can slide in the opposite direction along the sliding groove 4602, and the stop portion 5101 moves away from the locking hole 4601 until the stop portion 5101 no longer blocks the locking hole 4601. When the second leaf piece 47 rotates until the latch 50 is aligned with the pin hole 4801, the latch 50 extends from the locking hole 4601 and is inserted into the pin hole 4801, thereby locking the hinge structure.

[0269] In a specific embodiment, Figure 51 and Figure 52 As shown, unlocking grooves 4603 communicating with the locking hole 4601 are further provided on both sides of the first leaf 46. The unlocking grooves 4603 extend along the axial direction of the latch spring 49. The latch 50 is provided with a handle 55. In this embodiment, the latch 50 is threadedly connected to the handle 55. The handle 55 extends from the unlocking grooves 4603. Pulling the handle 55 can retract the latch 50 into the locking hole 4601, thereby unlocking the hinge structure.

[0270] In a specific application, after the latch 50 extends from the locking hole 4601, the distance between the handles 55 on both sides should be smaller than the length of the thumb and index finger of a normal person, and can be designed to be 5-10 cm, so as to facilitate single-handed operation of the two handles 55 for unlocking.

[0271] In a specific embodiment, a damping device is also included, such as Figure 45As shown, the first page 46 is fixed on the cavity F1, the second page 47 is fixed on the upper cover F2, and the damping device can provide resistance during the folding of the upper cover F2 and the cavity F1, so that the operator needs to apply pressure to the upper cover F2 with one hand and operate the two handles 55 with the other hand to unlock, and both hands need to be operated at the same time to avoid the operator being accidentally injured by the upper cover F2.

[0272] In specific embodiments, as shown in Figure 45 The damping device is a gas spring 54, one end of the gas spring 54 is rotatably connected with the upper cover F2, and the other end of the gas spring 54 is rotatably connected with the cavity F1. The elasticity of the gas spring can be adjusted by filling gas with different pressures, so that the resistance during the folding of the upper cover F2 and the cavity F1 is controllable.

[0273] In specific embodiments, as shown in Figure 48 And Figure 49 The locking plate 48 is provided with an arc-shaped part 4802, and the locking plate 48 pushes the stop part 5101 through the arc-shaped part 4802.

[0274] By setting the arc-shaped part 4802, the top surface of the stop part 5101 is always tangent to the arc-shaped part 4802 during the pushing process of the locking plate 48 pushing the stop part 5101, so that the pushing process can be smoothly carried out.

[0275] In specific embodiments, as shown in Figure 47 And Figure 48 Further comprising a blind plate 56, one end of the sliding groove 4602 away from the locking hole 4601 is opened, the sliding part 5102 is inserted into the sliding groove 4602 from the opening for easy installation, and the blind plate 56 is connected with the first page 46 by bolts to block the opening.

[0276] As shown in Figure 53 The sliding part 5102 is provided with a blind hole 5103, one end of the spring 52 is inserted into the blind hole 5103, and the other end of the spring 52 abuts against the blind plate 56. The blind hole 5103 can make the spring 52 better force the sliding part 5102.

[0277] In specific embodiments, as shown in Figure 45 Further comprising a handle 53, the handle 53 is fixed on the upper cover F2, the handle 53 is convenient for the operator to hold to better force the upper cover F2, and the opening and closing of the upper cover F2 is facilitated.

[0278] Embodiment 5

[0279] The present embodiment provides a wafer vapor deposition device. The main structure of the present embodiment is similar to that of embodiment 1. The difference between the present embodiment and embodiment 1 is as follows.

[0280] In existing heating systems, the copper busbar and the socket for the bulb are tightly integrated with the water-cooled lampshade. When the water-cooled lampshade needs to be repaired or replaced, all associated wiring connections must be removed to ensure effective separation of the water-cooled lampshade from the copper busbar and socket.

[0281] This integrated design increases the complexity of maintenance operations. When problems occur with the water-cooled lampshade, it is difficult to repair it quickly and requires a long time to repair, which will have a certain impact on the overall production progress and production efficiency of wafer thin film deposition.

[0282] In this embodiment, the reaction chamber F is provided with a heating device, such as Figures 55 to 59 As shown, it includes: a bulb 58, a water-cooled lampshade 59 and a lamp holder, wherein the water-cooled lampshade 59 and the lamp holder are detachably connected by bolts;

[0283] The lamp holder includes a base plate 60, which is made of an insulating material. A copper busbar is provided on the base plate 60, and the copper busbar includes a neutral busbar 61 and a live busbar 62. The base plate 60 is also provided with a socket 63 that is compatible with the plug 5801 of the bulb 58. In this embodiment, the copper busbar and the socket 63 are mounted on the base plate 60 by bolts, and the socket 63 is connected to the neutral busbar 61 and the live busbar 62 by wires.

[0284] When the plug 5801 is inserted into the socket 63, the bulb 58 is located in the water-cooled lampshade 59. The water-cooled lampshade 59 uses water cooling to prevent the bulb 58 from overheating and causing burns to people who touch the lampshade. At the same time, the water-cooled lampshade 59 can prevent high temperatures from damaging the area around the bulb 58 and the cables of the bulb 58 itself.

[0285] The heating device provided in this embodiment effectively utilizes a modular design concept by integrating the copper busbar and the socket 63 on the base plate 60 of the lamp holder and making the water-cooled lampshade 59 detachably connected to the lamp holder, thereby significantly improving the installation and replacement efficiency of the device. This allows the user to quickly separate the water-cooled lampshade 59 from the copper busbar and the socket 63 when a malfunction of the water-cooled lampshade 59 occurs, thereby reducing the complexity of maintenance operations and shortening maintenance time.

[0286] When a fault occurs, the faulty water-cooling lampshade 59 can be completely disassembled and directly replaced with a normal water-cooling lampshade 59, thereby reducing the downtime of the heating equipment and ensuring the overall production progress and production efficiency of wafer thin film deposition;

[0287] like Figure 55As shown, one end of the water-cooled lampshade 59 away from the base plate 60 is open, and the bulb 58 is placed inside the water-cooled lampshade 59 through the opening and inserted into the socket 63. When the water-cooled lampshade 59 needs to be separated from the lamp holder, it can be separated after taking out the bulb 58 through the opening.

[0288] In a specific embodiment, Figure 60 and Figure 61 As shown, the socket 63 and the wiring copper bus are respectively located on both sides of the base plate 60. The base plate 60 is provided with a wire hole 6001. The socket 63 is connected to the wiring copper bus by the wire passing through the wire hole 6001. The wire hole 6001 can reduce the length of the wire connecting the socket 63 and the wiring copper bus. The wire hole 6001 corresponds to the socket 63 one by one, which is convenient for wire management and makes it easier to troubleshoot during maintenance.

[0289] In a specific embodiment, Figure 60 As shown, the plurality of sockets 63 are arranged in a circular array on the base plate 60, so that the plurality of bulbs 58 inserted in the sockets 63 can be arranged in a circular array, making the heating device heat more uniform.

[0290] In a specific embodiment, Figure 55 As shown, the lamp holder further includes an outer cover 64 detachably connected to the base plate 60 by bolts. The outer cover 64 is arranged on a side of the base plate 60 away from the water-cooled lampshade 59 , thereby providing protection for the base plate 60 .

[0291] In a specific embodiment, Figure 56 and Figure 59 As shown, the outer cover 64 includes a main body 6401 and an inspection window cover 6402, and the main body 6401 and the inspection window cover 6402 are made of insulating material. The main body 6401 is provided with a connector plug 65 connected to the wiring copper bus. The connector plug 65 on the main body 6401 can be connected to an external power supply, so that the power supply supplies power to the heating equipment through the wiring copper bus. The inspection window cover 6402 is detachably connected to the base plate 60 by bolts. When maintenance is required, there is no need to remove the main body 6401. Only the inspection window cover 6402 needs to be removed to inspect the wires and wiring copper bus on the base plate 60.

[0292] In a specific embodiment, Figure 55 As shown, it also includes a water pipe 66, such as Figure 59 As shown, a through hole 67 is provided in the middle of the lamp holder, one end of the water pipe 66 is connected to the water-cooled lampshade 59, and the other end of the water pipe 66 passes through the through hole 67 and is connected to an external cold water source. Figure 56 One of the two water pipes shown is a water inlet pipe and the other is a water return pipe. The cold water source is connected to the water channel of the water-cooled lampshade 59 through the water inlet pipe and the water return pipe, and the heat is taken away by circulating water.

[0293] In a specific embodiment, the socket 63 is a ceramic socket, which has high strength, long service life, and is flame retardant, and is suitable for heating equipment.

[0294] Example 6

[0295] This embodiment provides a wafer vapor deposition apparatus. The main structure of this embodiment is similar to that of Example 5. The differences between this embodiment and Example 5 are as follows:

[0296] In Example 1, the connection copper busbars include a neutral copper busbar 61 and a live copper busbar 62 .

[0297] In this embodiment, the wiring copper bar includes a neutral copper bar 61 and multiple live copper bars 62. The neutral copper bar 61 is annular and is arranged in the middle of the base plate 60. The multiple live copper bars 62 are evenly distributed around the neutral copper bar 61. The multiple live copper bars 62 can connect a corresponding number of live wires.

[0298] Each socket 63 needs to be connected to a neutral copper bar 61 and a live copper bar 62 through wires. To ensure that the distance between each socket 63 and the neutral copper bar 61 and the live copper bar 62 is kept moderate, in this embodiment, as shown in FIG. Figure 61 As shown, the three live copper bars 62 are evenly distributed around the neutral copper bar 61. This layout is intended to prevent the distance between a socket 63 and the neutral copper bar 61 or the live copper bar 62 from being too large, thereby avoiding the wires required for connection being too long. At the same time, it makes the wire arrangement more neat, facilitates wire management, and makes it easier to troubleshoot during maintenance.

[0299] The hardness of the wire is proportional to its cross-sectional size, that is, the thicker the wire, the greater its hardness, which makes the wiring process more complicated and difficult, indirectly increasing the cost of installation and subsequent maintenance. Compared with using a single live wire with a larger cross-sectional size for current transmission, the form of multiple live wires shared by the current in this embodiment can reduce the cross-sectional size of each live wire and reduce the difficulty and cost of wiring.

[0300] Example 7

[0301] This embodiment provides a wafer vapor deposition device. The main structure of this embodiment is similar to that of Example 1. The differences between this embodiment and Example 1 are as follows:

[0302] The load lock chamber is opened and closed by a valve structure. The existing valve structure is as follows Figure 73 and Figure 74As shown, the valve plate K of the existing valve structure is opened and closed by flipping the connecting rod mechanism L driven by the cylinder. When opening, the upper part of the sealing ring of the valve plate K of the existing valve structure first leaves the existing cavity J of the load locking chamber, which can easily lead to uneven force distribution on the entire sealing ring, causing significant deformation in the local area of ​​the sealing ring, directly affecting the sealing effect, and greatly shortening the service life of the sealing ring; at the same time, the surface where the existing cavity J of the load locking chamber cooperates with the valve plate K of the existing valve structure is an inclined surface, which makes the overall processing difficult and the processing cost high.

[0303] In this embodiment, the vacuum gate valve is as follows Figure 62 As shown, it includes a valve port 68, a valve plate 69 and a driving device 70. The valve port 68 is opened on the load lock chamber body C1 of the load lock chamber C. The valve plate 69 is arranged opposite to the valve port 68. Figure 68 As shown, a sealing ring 71 is provided on one side of the valve plate 69 close to the valve port 68 , and the driving device 70 is provided on the load lock chamber body C1 ;

[0304] The driving device 70 can drive the valve plate 69 to move closer to or away from the valve opening 68 along a first direction perpendicular to the valve opening 68 to close or open the valve opening 68. In actual use, the size of the sealing ring 71 must ensure that the orthographic projection of the valve opening 68 along the first direction can be completely located within the sealing ring 71.

[0305] When the valve plate 69 is away from the valve port 68 , the driving device 70 can drive the valve plate 69 to reciprocate along a second direction perpendicular to the first direction, so that the orthographic projection of the valve port 68 along the first direction does not overlap or overlaps with the valve plate 69 ;

[0306] like Figure 63 As shown, it also includes a sink 73 provided on the load lock chamber body C1. When the valve plate 69 is away from the valve port 68, the valve plate 69 is partially or completely located in the sink 73.

[0307] Given that the load lock chamber is located adjacent to related components such as wafer boxes in the chemical vapor deposition equipment, in order to reduce the impact of the valve structure on the internal layout of components such as wafer boxes in the chemical vapor deposition equipment, the vacuum gate valve provided in this embodiment significantly improves the space utilization efficiency by adding a sink 73 on the load lock chamber cavity C1, ensuring that the valve plate 69 can be partially or completely accommodated in the sink 73, thereby effectively avoiding potential interference between the valve structure and components such as wafer boxes.

[0308] In actual use, when the wafer cassette needs to transfer wafers to the load lock chamber, the drive device 70 drives the valve plate 69 in a first direction away from the valve port 68 to connect the load lock chamber to the atmosphere. Then, the drive device 70 drives the valve plate 69 downward in a second direction to avoid the robot that transfers the wafers.

[0309] When the load lock chamber needs to be isolated from the atmosphere, the driving device 70 drives the valve plate 69 to move upward in the second direction, and then the driving device 70 drives the valve plate 69 to move toward the valve port 68 in the first direction, so that the load lock chamber is isolated from the atmosphere.

[0310] Unlike existing valve structures that achieve opening and closing through a connecting rod mechanism L, the present invention provides a chamber valve structure in which a driving device 70 drives a valve plate 69 to reciprocate in a first direction to open and close a valve port 68, thereby enabling the load lock chamber to be connected to or isolated from the atmosphere. The driving device 70 drives the valve plate 69 to reciprocate in a second direction so that the orthographic projection of the valve port 68 along the first direction does not overlap with the valve plate 69, allowing the valve plate 69 to avoid the robot arm and not cause any obstruction to the robot arm, thereby enabling the robot arm to smoothly transfer wafers.

[0311] The valve plate 69 is moved vertically relative to the valve port 68 by the driving device 70, so that the sealing ring 71 on the valve plate 69 can be simultaneously moved away from the load lock chamber cavity C1, ensuring that the sealing ring 71 is evenly stressed and avoiding significant deformation in local areas. At the same time, the surface where the load lock chamber cavity C1 and the valve plate 1 cooperate with each other does not need to be processed into an inclined surface, but can be processed into a flat surface, thereby reducing the processing difficulty of the load lock chamber cavity C1 and saving processing costs.

[0312] In a specific embodiment, Figure 62 and Figure 64 As shown, the two driving devices 70 are symmetrically arranged on both sides of the load lock chamber body C1, and the two ends of the valve plate 69 are respectively connected to the two driving devices 70;

[0313] The two symmetrically arranged driving devices 70 drive the valve plate 69 simultaneously, so that the force on the valve plate 69 is more uniform and the sealing effect of the sealing ring 71 is better.

[0314] In a specific embodiment, Figure 68 and Figure 69 As shown, the valve plate 69 includes a valve plate body 6902 and a transmission plate 6903 detachably connected to the valve plate body 6902 , and both ends of the transmission plate 6903 are respectively connected to two driving devices 70 ;

[0315] The valve plate body 6902 is arranged opposite to the valve port 68. Figure 71As shown, a sealing ring groove 6901 is formed on the surface of the valve plate body 6902 opposite to the valve port 68, and a sealing ring 71 is installed in the sealing ring groove 6901;

[0316] To ensure the sealing effect, the sealing ring 71 needs to be replaced regularly. The operating space between the valve plate 69 and the valve port 68 is small. In order to facilitate the replacement of the sealing ring 71, the valve plate body 6902 and the transmission plate 6903 are detachably connected by bolts, so that the sealing ring 71 can be removed together with the valve plate body 6902.

[0317] In a specific embodiment, Figure 66 and Figure 67 As shown, the driving device 70 includes a first cylinder 7001, a second cylinder 7002, a cylinder base 7003 and a housing 7004. In this embodiment, as shown in FIG. Figure 65 As shown, the housing 7004 includes a shell 7008 and a cover plate 7009, and the shell 7008 and the cover plate 7009 are detachably connected by bolts. The first cylinder 7001 and the second cylinder 7002 arranged in the housing 7004 can be inspected by removing the cover plate 7009;

[0318] The housing 7004 is fixedly connected to the load lock chamber body C1 via threaded fasteners, the second cylinder 7002 is fixedly connected to the housing 7004 via threaded fasteners, the piston rod of the second cylinder 7002 is fixedly connected to the cylinder base 7003 via threaded fasteners, the first cylinder 7001 is fixedly connected to the cylinder base 7003 via threaded fasteners, and the piston rod of the first cylinder 7001 is fixedly connected to the transmission plate 6903 of the valve plate 69 via threaded fasteners.

[0319] The first cylinder 7001 can drive the valve plate 69 to reciprocate in a first direction, and the second cylinder 7002 can drive the cylinder base 7003 to reciprocate in a second direction. In this embodiment, the second direction is a vertical direction.

[0320] In actual use, corresponding pin holes are set on the housing 7004 and the load lock chamber C1, such as Figure 65 As shown, the position accuracy of the housing 7004 is ensured by inserting the two ends of a cylindrical pin 74 that is interference-fitted with the pin hole into two corresponding pin holes on the housing 7004 and the load lock chamber cavity C1.

[0321] Existing valve structure such as Figure 73 and Figure 74 As shown in the figure, the transmission route of the connecting rod mechanism L is long, and the dimensional errors of each component and the clearances in the kinematic pairs will produce large cumulative errors, which can easily lead to insufficient motion accuracy. The wear and fatigue of each component over a long period of use will greatly increase the cumulative error, resulting in the valve structure not closing tightly.

[0322] The vacuum gate valve provided in this embodiment replaces the connecting rod mechanism L by the first cylinder 7001 and the second cylinder 7002, so that the cumulative error is only affected by the stroke error of the first cylinder 7001 and the second cylinder 7002. The error source is single and controllable, the movement accuracy of the drive device 70 is higher, and the problem of loose closing of the valve structure is less likely to occur; when a fault occurs, the problem is easy to detect and maintenance is more convenient. The maintenance can be completed by directly replacing the first cylinder 7001 and / or the second cylinder 7002.

[0323] In a specific embodiment, Figure 63 As shown, two positioning sinks 72 are also included, and the two positioning sinks 72 are respectively arranged on both sides of the load lock chamber C1;

[0324] The shape of the positioning platform 72 is adapted to the housing 7004 , and the housing 7004 is disposed within the positioning platform 72 . By providing the positioning platform 72 , the housing 7004 can be quickly positioned on the load lock chamber body C1 , facilitating disassembly, assembly, and maintenance of the drive device 70 .

[0325] In a specific embodiment, Figure 66 and Figure 67 As shown, a magnetic switch 7005 is installed on the first cylinder 7001;

[0326] In actual application, an electrical connector 7007 is provided on the housing 7004, and the driving device 70 is connected to an external controller through wires and the electrical connector 7007. By setting a magnetic switch 7005, the position of the first cylinder 7001 can be accurately detected, so that the controller can accurately control the stroke of the first cylinder 7001.

[0327] In a specific embodiment, Figure 66 and Figure 67 As shown, a trachea connector 7006 is provided on the housing 7004, and the first cylinder 7001 and the second cylinder 7002 are connected to the air source through the trachea connector 7006 and the air pipe connected to the trachea connector 7006 to ensure that the first cylinder 7001 and the second cylinder 7002 can be used normally.

[0328] In a specific embodiment, Figure 69 As shown, the valve plate body 6902 is provided with a positioning protrusion 6904. Figure 70 As shown, the transmission plate 6903 is provided with a corresponding positioning groove 6905;

[0329] In actual use, such as Figure 71As shown, the valve plate body 6902 is provided with a pin hole, and a positioning pin in interference fit with the pin hole is arranged in the pin hole, and the part of the positioning pin exposed from the pin hole forms a positioning protrusion 6904;

[0330] The positioning protrusion 6904 of the valve plate body 6902 is inserted into the positioning groove 6905 of the transmission plate 6903 from above to realize the rapid positioning of the valve plate body 6902 and the transmission plate 6903.

[0331] In specific embodiments, as Figure 72 shown, the cross section of the sealing ring groove 6901 is inverted trapezoidal, which can ensure that the sealing ring 71 is stably installed on the valve plate 69.

[0332] Embodiment 8

[0333] The embodiment provides a wafer vapor deposition device, and the main structure of the embodiment is similar to that of embodiment 1. The embodiment differs from embodiment 1 in the following points:

[0334] To improve the wafer transmission efficiency, the wafer box lifting device A provided in the embodiment has a wafer box switching function; as Figure 75 shown, the wafer box lifting device A comprises a vertical lifting mechanism, a horizontal displacement mechanism arranged on the vertical lifting mechanism, a support frame 80 arranged on the horizontal displacement mechanism, and a plurality of clamping mechanisms for clamping wafer boxes B. The plurality of clamping mechanisms are horizontally arranged on the support frame 80. The vertical lifting mechanism can drive the horizontal displacement mechanism to vertically lift, and the horizontal displacement mechanism can drive the support frame 80 to horizontally displace;

[0335] By arranging a plurality of clamping mechanisms to simultaneously clamp a plurality of wafer boxes B, when it is necessary to switch the wafer boxes B, the horizontal displacement mechanism only needs to drive the support frame 80 to horizontally displace, so that the wafer box B on the clamping mechanism corresponds to the valve port position of the vacuum door valve, and the switching of the wafer box B can be completed;

[0336] In the embodiment, a base plate 75 is further included, which is fixed on the frame O by bolts, so that the wafer box lifting device A can be integrally disassembled. The vertical lifting mechanism comprises a vertical guide rail 76, a vertical sliding block 77 and a linear module 78. The horizontal displacement mechanism comprises a rodless cylinder 79. The clamping mechanism comprises a clamping cylinder 81 and a pressing part 82.

[0337] The vertical guide rail 76 and the linear module 78 are fixed on the base plate 75, the vertical slider 77 is installed on the vertical guide rail 76, the rodless cylinder 79 is fixed on the slider of the linear module 78 and the vertical slider 77, the support frame 80 is fixed on the slider of the rodless cylinder 79, the pressing portion 82 is hinged to the support frame 80, and the clamping cylinder 81 is tilted between the pressing portion 82 and the support frame 80, and the two ends of the clamping cylinder 81 are respectively hinged to the pressing portion 82 and the support frame 80;

[0338] The linear module 78 drives the rodless cylinder 79 to rise and fall, and the vertical guide rail 76 plays a guiding and fixing role to ensure that the rodless cylinder 79 rises and falls smoothly. The rodless cylinder 79 drives the support frame 80 to move horizontally. Through the extension and contraction of the clamping cylinder 81, the clamping part 82 can clamp the wafer box B on the support frame 80, thereby realizing the clamping of the wafer box B. The linear module 78 and the rodless cylinder 79 are small in size and occupy little space, which is conducive to the miniaturization of the overall size of the equipment.

[0339] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer vapor deposition device, characterized in that: include: a wafer cassette lifting device (A), wherein the wafer cassette lifting device (A) is used to lift the wafer cassette (B); a load lock chamber (C), the load lock chamber (C) being arranged between the reaction chamber (F) and the wafer cassette lifting device (A), and a wafer buffer structure (D) being provided in the load lock chamber (C); The wafer buffer structure (D) is used to store wafers that have not been deposited with thin films and are transferred from the wafer box (B) to the reaction chamber (F), or to store wafers that have been deposited with thin films and are transferred from the reaction chamber (F) to the wafer box (B); a plurality of reaction chambers (F), wherein the reaction chambers (F) are used for performing thin film deposition on wafers; a wafer handling robot (E), the wafer handling robot (E) being used to transfer wafers between the wafer box (B), the wafer buffer structure (D) and the reaction chamber (F); The wafer handling robot (E) comprises: a wafer picking fork (1) and a wafer picking fork driving unit, wherein the wafer picking fork driving unit is capable of driving the wafer picking fork (1) to rotate and reciprocate linearly; The wafer taking fork (1) is provided with a slot for placing wafers, and the wafer taking fork (1) can receive the wafer in the wafer buffer structure (D) through the slot; A vacuum suction cup (104) is provided at one end of the wafer taking fork (1), and a vacuum air passage connected to the vacuum suction cup (104) is provided inside the wafer taking fork (1). The wafer taking fork (1) can absorb the wafer in the wafer box (B) through the vacuum suction cup (104).

2. The wafer vapor deposition device according to claim 1, characterized in that: The wafer cache structure (D) comprises: a wafer cache box (83) and a wafer cache box lifting device, wherein the wafer cache box (83) is provided with a plurality of storage positions for storing wafers in a vertical direction, and the wafer cache box lifting device is used to lift the wafer cache box (83).

3. The wafer vapor deposition device according to claim 2, characterized in that: The wafer cache box lifting device comprises a mounting support (8401), a drive motor (8402), a cache box lifting screw (8403), a cache box Z-direction slide rail (8404), a cache box Z-direction slider (8405), a connecting shaft pressing block (8406) and a cache box screw nut seat (8408), wherein the connecting shaft pressing block (8406) is arranged on the cache box screw nut seat (8408), and the connecting shaft pressing block (8406) is used to press and fix the connecting shaft (86) on the wafer cache box (83) on the cache box screw nut seat (8408); The cache box lifting screw (8403) is rotatably arranged on the mounting support (8401), the drive motor (8402) is fixed on the mounting support (8401), and the drive motor (8402) can drive the cache box lifting screw (8403) to rotate, the cache box Z-direction slide rail (8404) is arranged on the mounting support (8401), the cache box Z-direction slider (8405) is installed on the cache box Z-direction slide rail (8404), the cache box screw nut seat (8408) is fixedly connected to the cache box Z-direction slider (8405), the cache box screw nut seat (8408) is provided with a cache box screw nut (8407), and the cache box screw nut (8407) is installed on the cache box lifting screw (8403).

4. The wafer vapor deposition device according to claim 2, characterized in that: The slice-taking fork drive unit comprises a swing arm unit (2), a turntable (3), a base flange (4), a telescopic drive device (5) and a rotary drive device (6); The base flange (4) is fixed on the load lock chamber body (C1) of the load lock chamber (C); the turntable (3) is rotatably arranged on the base flange (4); the swing arm portion (2) is mounted on the turntable (3); the rotation drive device (6) can drive the turntable (3) to rotate; the telescopic drive device (5) can drive the swing arm portion (2) to move, so that the swing arm portion (2) drives the slice picking fork (1) to extend or retract; The vacuum suction cup (104) is arranged at an end of the slice taking fork (1) away from the swing arm portion (2).

5. The wafer vapor deposition device according to claim 4, characterized in that: The wafer handling robot further comprises a multi-axis magnetic fluid sealing transmission device (7), wherein the multi-axis magnetic fluid sealing transmission device (7) comprises a hollow shaft (701), an intermediate shaft (702), and a base shaft (703) coaxially arranged in sequence from the inside to the outside; The hollow shaft (701) and the intermediate shaft (702) are rotatably connected, the intermediate shaft (702) and the base shaft (703) are rotatably connected, and the base shaft (703) is fixed on the base flange (4); The two ends of the intermediate shaft (702) are respectively connected to the turntable (3) and the rotation drive device (6), and the rotation drive device (6) can rotate the turntable (3) by driving the intermediate shaft (702); The two ends of the hollow shaft (701) are respectively connected to the swing arm portion (2) and the telescopic drive device (5); the telescopic drive device (5) can drive the hollow shaft (701) to rotate, thereby causing the swing arm portion (2) to move; the hollow shaft (701) is connected to the vacuum air duct via a gas hose.

6. The wafer vapor deposition device according to claim 5, characterized in that: The swing arm portion (2) comprises a lower first swing arm (201), an upper second swing arm (202), a lower second swing arm (203), an upper first swing arm (204) and a linkage portion; One end of the lower first swing arm (201) is fixedly connected to the hollow shaft (701), and the other end of the lower first swing arm (201) is connected to the upper second swing arm (202) via a linkage portion. The lower first swing arm (201) drives the upper second swing arm (202) to swing via the linkage portion, and the end of the upper second swing arm (202) away from the linkage portion is hinged to the slice taking fork (1); One end of the lower second swing arm (203) is rotatably connected to the turntable (3), and the other end of the lower second swing arm (203) is rotatably connected to the upper second swing arm (202) via a second rotating shaft (208); One end of the upper first swing arm (204) is rotatably connected to the end of the lower first swing arm (201) away from the hollow shaft (701) via a first rotating shaft (207), and the other end of the upper first swing arm (204) is hinged to the slice taking fork (1).

7. The wafer vapor deposition device according to claim 6, characterized in that: The linkage part comprises a driving gear (205), a driven gear (206), a gear upper cover (209) and a gear lower cover (210); The gear upper cover (209) is rotatably connected to the first rotating shaft (207) and the second rotating shaft (208) respectively through two bearings, and the gear lower cover (210) is connected to the gear upper cover (209) through bolts. The gear lower cover (210) and the gear upper cover (209) enclose a cavity for accommodating the driving gear (205) and the driven gear (206); The driving gear (205) is fixed to one end of the lower first swing arm (201) away from the hollow shaft (701), and the driven gear (206) is fixed to one end of the upper second swing arm (202) away from the slice taking fork (1), and the driven gear (206) is meshed with the driving gear (205).

8. The wafer vapor deposition device according to claim 6, characterized in that: It also includes a swing arm adjustment mechanism (8), the swing arm adjustment mechanism (8) including an adjustment support (801), a hollow adjustment member (802), a hollow tensioning shaft (803), a locking bolt (804) and a tensioning block (805); The adjustment support (801) is fixed on the top of the turntable (3), the adjustment support (801) is provided with a threaded hole, and the hollow adjustment member (802) is provided with an external thread corresponding to the threaded hole; The hollow adjustment member (802) is screwed to vertically displace the hollow adjustment member (802) relative to the adjustment support (801); The hollow tensioning shaft (803) is sleeved with a bearing fixed to the lower second swing arm (203); one end of the hollow tensioning shaft (803) is detachably connected to the hollow adjustment member (802); the other end of the hollow tensioning shaft (803) is provided with a tensioning portion (806); the tensioning portion (806) is provided with a plurality of tensioning strips (807) uniformly distributed around the circumference; the tensioning strips (807) can be inserted into a connecting sleeve (301) provided on the turntable (3); The locking bolt (804) passes through the center holes of the hollow adjustment member (802) and the hollow tensioning shaft (803) and is then threadedly connected to the tensioning block (805); By screwing the locking bolt (804), the locking bolt (804) can drive the tensioning block (805) to vertically displace relative to the tensioning portion (806), so as to cause the plurality of tensioning strips (807) to open or close, thereby achieving locking or unlocking of the tensioning strips (807) and the connecting sleeve (301).

9. The wafer vapor deposition device according to claim 8, characterized in that: It also includes a first tightening bolt, a first opening ring (211) is provided at one end of the lower first swing arm (201) close to the hollow shaft (701), the hollow shaft (701) is located in the center hole of the first opening ring (211), a threaded hole and a countersunk hole are respectively provided on the two free ends of the first opening ring (211), and the first tightening bolt passes through the countersunk hole and is threadedly connected to the threaded hole; Tightening the first tightening bolt can bring the two free ends closer to each other, causing the first open ring (211) to deform and shrink to hold the hollow shaft (701); It also includes a second tightening bolt, a second open ring (212) is provided at one end of the upper first swing arm (204) close to the first rotating shaft (207), the first rotating shaft (207) is located in the center hole of the second open ring (212), and two free ends of the second open ring (212) are respectively provided with a threaded hole and a countersunk hole, and the second tightening bolt passes through the countersunk hole and is threadedly connected to the threaded hole; Tightening the second tightening bolt can bring the two free ends closer to each other, causing the second open ring (212) to deform and shrink to hold the first rotating shaft (207).

10. The wafer vapor deposition device according to claim 1, characterized in that: The reaction chamber (F) is provided with a wafer lifting mechanism on the cavity, and the wafer lifting mechanism comprises: a cavity connecting plate (13), a first adjustment plate (14), a second adjustment plate (15), a leveling mechanism and a lifting mechanism (16); The first adjustment plate (14) is slidably arranged on the cavity connecting plate (13) along the Y direction, and the second adjustment plate (15) is slidably arranged on the first adjustment plate (14) along the X direction; The lifting mechanism (16) can drive the wafer carrier (29) to move along the Z direction. The lifting mechanism (16) is installed on the second adjustment plate (15) through a leveling mechanism. The leveling mechanism can adjust the angle between the travel direction of the lifting mechanism (16) and the plane where the second adjustment plate (15) is located.

11. The wafer vapor deposition device according to claim 10, characterized in that: The leveling mechanism comprises three groups of leveling modules distributed in a triangular shape, and each group of leveling modules comprises a connecting bolt (1701) and a leveling top screw (1702); The lifting mechanism (16) includes a support (1601), the leveling screw (1702) is threadedly connected to the support (1601), the support (1601) is provided with a through hole allowing the connecting bolt (1701) to pass through, and the connecting bolt (1701) is threadedly connected to the second adjustment plate (15) after passing through the through hole; By screwing the leveling screw (1702), the length of the leveling screw (1702) protruding from the top surface of the support (1601) can be adjusted.

12. The wafer vapor deposition device according to claim 1, characterized in that: It also includes a gas cabinet (M), the gas cabinet (M) includes a plurality of gas control modules, and the gas control modules include a first gas delivery unit (31) and a second gas delivery unit (32); The first gas delivery unit (31) comprises a purge pipeline and a plurality of process gas delivery pipelines, wherein an end of the purge pipeline of the first gas delivery unit (31) away from the purge gas source is connected to an end of the process gas delivery pipeline away from the process gas source, and then a first branch (41) and a third branch (43) provided with a switch valve are formed. The second gas delivery unit (32) comprises a purge pipeline and a plurality of process gas delivery pipelines, wherein an end of the purge pipeline of the second gas delivery unit (32) away from the purge gas source is connected to an end of the process gas delivery pipeline away from the process gas source, and then a second branch (42) and a fourth branch (44) provided with a switch valve are formed. The first gas delivery unit (31) is provided with at least one process gas delivery pipeline capable of delivering oxidizing gas, the second gas delivery unit (32) is provided with at least one process gas delivery pipeline capable of delivering reducing gas, the first branch (41) and the second branch (42) are connected in parallel to be connected to a reaction chamber (F), and the third branch (43) and the fourth branch (44) are connected in parallel to be connected to a vacuum pumping system (H).

13. The wafer vapor deposition device according to claim 1, characterized in that: The cavity (F1) and the upper cover (F2) of the reaction chamber (F) are connected via a connecting device, wherein the connecting device comprises a hinge structure, wherein the hinge structure comprises a first leaf (46) and a second leaf (47) hingedly connected via a rotating shaft (57), wherein a limiting structure is provided on the first leaf (46); The first leaf (46) is provided with locking holes (4601) on both sides, and a latch spring (49) and a latch (50) are provided in the locking hole (4601). The latch (50) can move along the axial direction of the latch spring (49), and the axial direction of the latch spring (49) is parallel to the axial direction of the rotating shaft (57). The second leaf (47) is provided with locking plates (48) on both sides, and the locking plates (48) are provided with a pin hole (4801) allowing the latch (50) to be inserted; When the second leaf (47) is rotated until the latch (50) is aligned with the pin hole (4801), the latch (50) extends from the locking hole (4601) and is inserted into the pin hole (4801) under the elastic force of the latch spring (49), and the hinge structure is locked. The limiting structure can prevent the latch (50) from extending from the locking hole (4601) when the hinge structure is not locked.

14. The wafer vapor deposition device according to claim 13, characterized in that: The limiting structure includes a limiting slider (51) and a slide groove (4602), wherein the slide groove (4602) is provided on both sides of the first leaf (46), and a spring (52) is provided in the slide groove (4602); The limiting slider (51) includes a stopper (5101) and a sliding portion (5102), wherein the sliding portion (5102) is slidably disposed in the slide groove (4602), and rotating the second page (47) enables the locking plate (48) to push the stopper (5101); Under the elastic force of the spring (52), the sliding portion (5102) can slide along the sliding groove (4602) to the stop portion (5101) to block the locking hole (4601); Under the thrust of the locking plate (48), the sliding portion (5102) can slide in the opposite direction along the sliding groove (4602) until the stop portion (5101) no longer blocks the locking hole (4601).

15. The wafer vapor deposition device according to claim 13, characterized in that: Unlocking grooves (4603) communicating with the locking hole (4601) are further provided on both sides of the first leaf (46). The unlocking grooves (4603) extend along the axial direction of the latch spring (49). A handle (55) is provided on the latch (50). The handle (55) extends from the unlocking groove (4603). Pulling the handle (55) can retract the latch (50) into the locking hole (4601).

16. The wafer vapor deposition device according to claim 1, characterized in that: The reaction chamber (F) is provided with a heating device on its cavity, comprising: a light bulb (58), a water-cooled lampshade (59) and a lamp holder, wherein the water-cooled lampshade (59) and the lamp holder are detachably connected; The lamp holder includes a base plate (60), the base plate (60) is provided with a wiring copper bar, the wiring copper bar includes a neutral copper bar (61) and at least one live copper bar (62), the base plate (60) is also provided with a socket (63) adapted to the plug (5801) of the light bulb (58), the socket (63) is electrically connected to the neutral copper bar (61) and the live copper bar (62); When the plug (5801) is inserted into the socket (63), the light bulb (58) is located in the water-cooled lampshade (59).

17. The wafer vapor deposition device according to claim 1, characterized in that: The system further comprises a vacuum gate valve provided on the load lock chamber (C), wherein the vacuum gate valve is located on a side of the load lock chamber (C) close to the wafer box lifting device (A); The vacuum gate valve comprises a valve port (68), a valve plate (69) and a driving device (70); the valve port (68) is opened on a load lock chamber body (C1) of a load lock chamber (C); the valve plate (69) is arranged opposite to the valve port (68); a sealing ring (71) is provided on a side of the valve plate (69) close to the valve port (68); and the driving device (70) is arranged on the load lock chamber body (C1); The driving device (70) is capable of driving the valve plate (69) to move closer to or away from the valve port (68) along a first direction perpendicular to the valve port (68), so as to close or open the valve port (68); When the valve plate (69) is away from the valve port (68), the driving device (70) is capable of driving the valve plate (69) to reciprocate along a second direction perpendicular to the first direction, so that the orthographic projection of the valve port (68) along the first direction does not overlap or overlaps with the valve plate (69); It also includes a sink (73) arranged on the load lock chamber body (C1); when the valve plate (69) is away from the valve port (68), the valve plate (69) is partially or completely located in the sink (73).

18. The wafer vapor deposition device according to claim 17, characterized in that: The two driving devices (70) are symmetrically arranged on both sides of the load lock chamber body (C1), and the two ends of the valve plate (69) are respectively connected to the two driving devices (70); The driving device (70) comprises a first cylinder (7001), a second cylinder (7002), a cylinder base (7003) and a housing (7004); The housing (7004) is fixedly connected to the load lock chamber body (C1), the second cylinder (7002) is fixedly connected to the housing (7004), the piston rod of the second cylinder (7002) is fixedly connected to the cylinder seat (7003), the first cylinder (7001) is fixedly connected to the cylinder seat (7003), and the piston rod of the first cylinder (7001) is fixedly connected to the valve plate (69); The first cylinder (7001) is capable of driving the valve plate (69) to reciprocate in a first direction, and the second cylinder (7002) is capable of driving the cylinder seat (7003) to reciprocate in a second direction.

19. The wafer vapor deposition device according to claim 1, characterized in that: It also includes a frame (O), the wafer box lifting device (A), the load lock chamber (C) and the reaction chamber (F) are arranged in the frame (O), and a cabinet (N) is provided on the periphery of the frame (O), and the cabinet (N) is used to accommodate control components.

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