Semiconductor etching machine integrated with robot and visual identification

Abstract

The utility model discloses a semiconductor etching machine table integrating a robot and visual identification, and relates to the technical field of semiconductor etching, and the semiconductor etching machine table comprises a machine table body and a visual identification device; the machine table body is provided with an etching chamber; a robot body is mounted in the etching chamber; at least one etching groove and at least one drying groove are formed in the etching chamber; the visual recognition device is installed on the machine table body and used for collecting surface image information of a machined workpiece or a workpiece carrier. The robot body can convey the machined workpiece or the workpiece carrier to the collection view of the visual recognition device or can drive the visual recognition device to move so that the collection end of the visual recognition device can face the machined workpiece or the workpiece carrier. Through the design, in-situ detection can be realized, and the process efficiency and reliability are improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor etching technology, and in particular to a semiconductor etching machine integrating a robot and visual recognition. Background Art

[0002] Wet etching technology, which removes material from specific areas of a wafer's surface through a chemical reaction, is widely used in semiconductor manufacturing. Currently, automated wet etching machines typically use a robot to grasp a wafer or a basket containing wafers and place it in an etching tank filled with an etching solution to complete the etching and cleaning process. For example, Chinese patent application publication number CN118053795A discloses a fully automated system and machine for scientific research wet etching, demonstrating technological advancements in this field.

[0003] However, existing etching machines have significant shortcomings: they are typically designed without in-situ wafer inspection capabilities, such as to determine if there are impurities or contamination on the surface of the wafer or workpiece carrier. Therefore, in order to obtain a preliminary understanding of the wafer etching effect, the existing technology can only rely on operators to visually inspect the wafer or use tools to inspect the wafer. However, this method requires pausing the machine and removing the wafer or workpiece carrier for inspection. This cumbersome operation affects process efficiency and easily exposes the wafer or workpiece carrier to the risk of secondary contamination, affecting product quality and process stability.

[0004] Therefore, there is an urgent need to provide a new solution to achieve in-situ detection during the wet etching process to improve process efficiency and reliability. Utility Model Content

[0005] In view of this, the purpose of this application is to provide a semiconductor etching machine that integrates robots and visual recognition, which can realize in-situ detection and improve process efficiency and reliability.

[0006] To achieve the above technical objectives, the present application provides a semiconductor etching machine integrating a robot and visual recognition, comprising a machine body and a visual recognition device;

[0007] The machine body is provided with an etching chamber;

[0008] A robot body is installed in the etching chamber;

[0009] The etching chamber is provided with at least one etching tank and at least one drying tank;

[0010] The visual recognition device is installed on the machine body and is used to collect surface image information of the workpiece or workpiece carrier;

[0011] The robot body is capable of transporting the workpiece or the workpiece carrier to the collection field of view of the visual recognition device, or is capable of driving the visual recognition device to move so that its collection end faces the workpiece or the workpiece carrier;

[0012] At least the collecting end of the visual recognition device is covered with a transparent protective cover.

[0013] Furthermore, an internal fixing frame is provided in the etching chamber;

[0014] The visual recognition device is detachably arranged on the internal fixation frame;

[0015] The robot body can be detachably connected to the visual recognition device.

[0016] Furthermore, an electromagnetic suction mechanism or a suction cup mechanism is installed at the end of the robot body;

[0017] The visual recognition device is provided with a magnetic attraction member that cooperates with the electromagnetic attraction mechanism or an adsorption surface that cooperates with the suction cup mechanism.

[0018] Furthermore, the visual recognition device has a built-in power supply and a wireless power receiving module connected to the built-in power supply;

[0019] A wireless charging module is installed on the electromagnetic suction mechanism;

[0020] When the electromagnetic attraction mechanism is magnetically engaged with the magnetic attraction component of the visual recognition device, the wireless charging module can transmit electric energy to the wireless power receiving module.

[0021] Furthermore, the visual recognition device is installed on the robot body.

[0022] Furthermore, an inspection port communicating with the etching chamber is provided on one side wall of the machine body;

[0023] The inspection port is provided with an openable and closable shielding mechanism;

[0024] An external fixing bracket is installed on one side wall of the machine body at a position on one side of the inspection port;

[0025] The visual recognition device is fixedly mounted on the external fixing frame, and its collecting end is arranged toward the inspection port.

[0026] Furthermore, it also includes a position adjustment mechanism;

[0027] The position adjustment mechanism is installed on the external fixing frame and is connected to the visual recognition device to drive the visual recognition device to move.

[0028] Furthermore, the position adjustment mechanism is a micrometer displacement stage.

[0029] Furthermore, the visual recognition device is an electron microscope.

[0030] Furthermore, a manual blowing mechanism is included for blowing the workpiece or the workpiece carrier.

[0031] Furthermore, the manual purge mechanism includes a purge head, a connecting air pipe and an air supply source;

[0032] The purge head is connected to the air supply source via the connecting air pipe;

[0033] A hanging bracket is installed on one side wall of the machine body at a position on the other side of the inspection port for hanging the purge head.

[0034] From the above technical solutions, it can be seen that the semiconductor etching machine designed in this application has the following beneficial effects:

[0035] By integrating a visual recognition device into the machine body, and then using the robot body to move the workpiece or workpiece carrier so that it is exposed to the visual recognition device's field of view, or using the robot body to directly move the visual recognition device so that its collection end is directed towards the workpiece or workpiece carrier, it is possible to collect image information of the surface of the workpiece or workpiece carrier, and use the image information to determine the condition of surface dirt or water stains. Through the above design, the semiconductor etching machine has an integrated in-situ detection function, which solves the traditional method of pausing the machine operation and removing the wafer or flower basket for inspection. This is not only cumbersome and affects process efficiency, but also easily exposes the wafer or flower basket to the risk of secondary contamination, affecting product quality and process stability. Technical problems, thereby effectively improving process efficiency and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0037] Figure 1 A three-dimensional diagram of a semiconductor etching machine integrating a robot and visual recognition provided in this application;

[0038] Figure 2 for Figure 1 A magnified schematic diagram of position A in FIG;

[0039] Figure 3A three-dimensional diagram of a robot body grabbing a workpiece carrier of a semiconductor etching machine integrating a robot and visual recognition provided in this application;

[0040] Figure 4 A three-dimensional diagram of a semiconductor etching machine integrating robot and visual recognition provided in this application, wherein the robot body directly grasps a wafer;

[0041] Figure 5 A three-dimensional diagram of a visual recognition device of a semiconductor etching machine integrating a robot and visual recognition provided in this application installed on an external fixing frame;

[0042] In the figure: 1. Machine body; 11. Etching chamber; 12. Etching tank; 13. Drying tank; 14. Visual window; 15. Inspection port; 16. Shielding mechanism; 17. Hanging rack; 2. Robot body; 3. Visual recognition device; 4. External fixing frame; 5. Position adjustment mechanism; 6. Purge head; 7. Workpiece to be processed; 8. Workpiece carrier. DETAILED DESCRIPTION

[0043] The following will clearly and completely describe the technical solutions of the embodiments of the present application in conjunction with the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present application, not all of them. Based on the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the embodiments of the present application.

[0044] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, they should not be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0045] In the description of the embodiments of the present application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, replaceable connections, or integral connections. They can also refer to mechanical connections or electrical connections. They can also refer to direct connections or indirect connections through an intermediate medium. They can also refer to internal connections between two components. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0046] The embodiments of the present application disclose a semiconductor etching machine that integrates a robot and visual recognition.

[0047] See also Figure 1 An embodiment of a semiconductor etching machine integrating a robot and visual recognition provided in the embodiments of the present application includes:

[0048] The machine body 1 and the visual recognition device 3.

[0049] The machine body 1 is an existing machine structure design, which is provided with an etching chamber 11, and the robot body 2 is installed in the etching chamber 11; the etching chamber 11 is provided with at least one etching tank 12 and at least one drying tank 13; the etching tank 12 contains etching liquid, which etches the workpiece 7 (wafer) or the workpiece carrier 8 (basket, a carrier for carrying wafers), and the drying tank 13 is used to dry the workpiece 7 after etching. Other specific structures of the machine body 1 are not described in detail.

[0050] The visual recognition device 3 is installed on the machine body 1 and is used to collect surface image information of the processed workpiece 7 or the workpiece carrier 8; the robot body 2 (such as a multi-axis manipulator) can transport the processed workpiece 7 or the workpiece carrier 8 to the collection field of view of the visual recognition device 3, or can drive the visual recognition device 3 to move so that its collection end is facing the processed workpiece 7 or the workpiece carrier 8.

[0051] The visual recognition device 3 can provide important basis for subsequent surface defect determination by collecting surface image information of the workpiece 7 or the workpiece carrier 8. For example, it can detect whether there are dirt, water stains, etc. on the surface of the workpiece 7.

[0052] One way: when the robot body 2 transports the workpiece 7 or workpiece carrier 8 to the collection field of view of the visual recognition device 3, the visual recognition device 3 can accurately capture the image of the surface of the workpiece 7 or workpiece carrier 8 and record it clearly, and transmit the image data to the background terminal (computer, tablet, mobile phone, operation screen outside the machine body 1, etc.) through wired or wireless transmission. The background terminal then uses advanced image recognition algorithms (such as AI visual recognition software) to analyze and process these images (manual identification and judgment can also be performed); detect whether there is contamination or etching defects on the surface of the workpiece 7 or workpiece carrier 8. When it is determined that there is contamination or defects, it sends instructions to the control system in the machine body 1, and the control system controls the robot body 2 to perform corresponding actions (for example, readjusting the angular position of the workpiece 7 to avoid misidentification due to incorrect angular position; for example, triggering intervention instructions such as marking and process pause to remind the operator to conduct on-site inspection; for example, increasing the etching time and number of times to ensure the etching effect, etc.). Figure 3 as well as Figure 4As shown, the robot body 2 can directly grab the wafer and move it, or can grab the workpiece carrier 8 to drive the wafer to move, and there is no specific limitation.

[0053] Another way: the robot body 2 drives the visual recognition device 3 to move so that its acquisition end is directed towards the workpiece 7 or the workpiece carrier 8. The visual recognition device 3 then accurately captures the image of the surface of the workpiece 7 or the workpiece carrier 8 and records it clearly. The image data is transmitted to the background terminal (computer, tablet, mobile phone, operation screen outside the machine body 1, etc.) through wired or wireless transmission. The background terminal then uses the corresponding image recognition algorithm (such as AI visual recognition software) to analyze and process these images (manual identification and judgment can also be performed); detect whether there is contamination or etching defects on the surface of the workpiece 7 or the workpiece carrier 8. When it is determined that there is contamination or defects, an instruction is sent to the control system in the machine body 1. The control system controls the robot body 2 to perform corresponding actions (for example, adjusting the shooting angle position of the visual recognition device again to avoid misidentification due to incorrect angle position; for example, triggering intervention instructions such as marking and process pause to remind the operator to conduct on-site inspection; for example, increasing the etching time and number of times to ensure the etching effect, etc.).

[0054] If quality problems are detected in the workpiece 7 or workpiece carrier 8, the operator can quickly take corresponding treatment measures, such as direct replacement, or adjusting etching parameters, performing secondary processing on the workpiece 7, etc., thereby improving processing efficiency and product quality.

[0055] The visual recognition device 3 can be connected to the system of the machine body 1 and transmit data to the control system, which makes a judgment through the image recognition algorithm. When it is determined that there is a defect in the processed workpiece 7 or the workpiece carrier 8, the control system adaptively adjusts the entire etching parameters of the current processed workpiece 7 or performs secondary processing, thereby realizing full-process automation (full-process automation of detection-identification-response), avoiding defective samples from flowing into the next link, and at the same time reducing the lag and error of manual inspection, and reducing the risk of damage to the processed workpiece 7 or the workpiece carrier 8 due to manual operation.

[0056] To ensure the proper operation and longevity of the visual recognition device 3, at least the acquisition end thereof is covered with a transparent protective cover (not shown). This transparent protective cover prevents contamination and damage to the acquisition end of the visual recognition device 3 by impurities such as the etching solution and dust within the etching chamber 11, while also ensuring that the visual recognition device 3 does not affect the acquisition of the surface image of the workpiece 7.

[0057] Preferably, the entire collection end of the visual recognition device 3 may also be covered with another protective cover to enhance the overall corrosion resistance.

[0058] The visual recognition device 3 designed in this application is different from the visual sensor already carried by the robot body 2. The visual sensor of the robot body 2 is used for visual positioning to assist the robot body in accurate grasping; while the visual recognition device 3 designed in this application is designed to add the function of detecting wafers or flower baskets to the machine integration. The two are completely different. In the design scheme of this application, the visual sensor of the robot body 2 and the visual recognition device 3 are independent of each other and coexist.

[0059] The semiconductor etching machine designed in this application has the following beneficial effects:

[0060] By integrating a visual recognition device 3 onto the machine body 1 and then using the robot body 2 to move the workpiece 7 or workpiece carrier 8 so that it is exposed to the collection field of view of the visual recognition device 3, or using the robot body 2 to directly move the visual recognition device 3 so that its collection end is directed toward the workpiece 7 or workpiece carrier 8, image information of the surface of the workpiece 7 or workpiece carrier 8 can be collected, and the image information can be used to determine the condition of surface dirt or water stains. Through the above design, the semiconductor etching machine has an integrated in-situ detection function, which solves the traditional method of pausing the machine operation and removing the wafer or flower basket for inspection. This not only requires cumbersome operation and affects process efficiency, but also easily exposes the wafer or flower basket to the risk of secondary contamination, affecting product quality and process stability. The technical problem is that it effectively improves process efficiency and reliability.

[0061] The above is an embodiment of a semiconductor etching machine integrating a robot and visual recognition provided by the embodiment of the present application. The following is an embodiment of a semiconductor etching machine integrating a robot and visual recognition provided by the embodiment of the present application. For details, please refer to Figures 1 to 5 .

[0062] Based on the solution of the above embodiment 1:

[0063] Furthermore, in order to enable the robot body 2 to better drive the visual recognition device 3, an internal fixing frame (not shown in the figure) is provided in the etching chamber 11; the visual recognition device 3 is detachably arranged on the internal fixing frame; the robot body 2 can be detachably connected to the visual recognition device 3.

[0064] This design allows the robot body 2 to easily remove the visual recognition device 3 from the internal mount when it needs to be used, and return it to the internal mount after completing the image acquisition task. This not only improves operational flexibility but also ensures the storage stability of the visual recognition device 3 when not in use.

[0065] Furthermore, to achieve a detachable connection between the robot body 2 and the visual recognition device 3, an electromagnetic suction mechanism or a suction cup mechanism can be installed at the end of the robot body 2, and the visual recognition device 3 can be provided with a magnetic member that cooperates with the electromagnetic suction mechanism or a suction surface that cooperates with the suction cup mechanism. When the robot body 2 approaches the visual recognition device 3, the magnetic attraction of the electromagnetic suction mechanism or the suction of the suction cup mechanism can securely connect the visual recognition device 3 to the robot body 2, facilitating its movement driven by the robot body 2.

[0066] Of course, the robot body 2 can also grasp the visual recognition device 3 by grasping to drive its movement. The end clamp for grasping the visual recognition device 3 is distinguished from the end clamp for grasping the workpiece 7 or the workpiece carrier 8. That is, if the robot body 2 wants to grasp the visual recognition device 3, it can first replace the end clamp and then grasp it. The rapid replacement of the end clamp of the robot body 2 belongs to the existing technology and will not be elaborated in detail.

[0067] Furthermore, the visual recognition device 3 has a built-in power supply and a wireless power receiving module connected to the built-in power supply, and a wireless charging module is installed on the electromagnetic suction mechanism. When the electromagnetic suction mechanism is magnetically coupled with the magnetic suction part of the visual recognition device 3, the wireless charging module can transmit electrical energy to the wireless power receiving module. This design ensures that the visual recognition device 3 has sufficient power during operation, avoids the situation where the image acquisition work is affected by insufficient power, and further improves the reliability and stability of the entire semiconductor etching machine. Moreover, the wireless charging design can remain relatively closed, avoiding corrosion from the gas evaporated from the etching solution inside the etching chamber 11, thereby extending its service life.

[0068] Furthermore, the visual recognition device 3 can also be directly installed on the robot body 2.

[0069] In the above design, the robot body 2 can flexibly drive the visual recognition device 3 to target locations such as above each tank, workpiece carrier 8, and in front of the workpiece 7 being processed. This method, relying on the robot body 2, can achieve shooting from any angle and multiple positions, adapting to the inspection needs of complex tanks or workpiece carriers 8.

[0070] The above describes a method in which the visual recognition device 3 is built-in. The following describes a method in which the visual recognition device 3 is external:

[0071] like Figure 1 as well as Figure 2As shown, an inspection port 15 connected to the etching chamber 11 is provided on one side wall of the machine body 1 (which may be the wall of the visual window 14), and an openable and closable shielding mechanism 16 is installed on the inspection port 15; the shielding mechanism 16 may be an automatic door mechanism or a manual door mechanism. Taking the manual door mechanism as an example, the opening and closing control of the inspection port 15 can be achieved by manually pushing and pulling.

[0072] like Figure 2 As shown, an external fixing frame 4 is installed on one side wall of the machine body 1 at a position on one side of the inspection port 15 ; the visual recognition device 3 is fixedly installed on the external fixing frame 4 , and its collection end is arranged toward the inspection port 15 .

[0073] When it is necessary to capture an image of the workpiece 7, the shielding mechanism 16 can be opened, and the robot body 2 can grasp the workpiece 7 and extend it through the inspection port 15, allowing the visual recognition device 3 to capture surface image information of the workpiece 7 through the inspection port 15. During the inspection process, the robot body 2 can adjust the position and angle of the workpiece 7 so that the visual recognition device 3 can capture more comprehensive image information.

[0074] The external visual recognition device 3 is easier to maintain and replace than the internal one, and also avoids the direct impact of the harsh environment in the etching chamber 11 on the visual recognition device 3.

[0075] The external placement of the visual recognition device 3 is suitable for situations where the space of the etching chamber 11 is limited and the interference with the internal environment is reduced.

[0076] Furthermore, if Figure 2 as well as Figure 5 As shown, a position adjustment mechanism 5 is provided to more accurately capture images of the workpiece 7. This mechanism 5 is mounted on the external fixation frame 4 and connected to the visual recognition device 3, driving the movement of the visual recognition device 3. This mechanism 5 allows the position of the visual recognition device 3 to be flexibly adjusted based on the specific position of the workpiece 7 and the image area to be captured, ensuring the capture of clear and accurate surface images.

[0077] Position adjustment mechanism 5 can be manual or electric. For example, in the manual mode, a micrometer stage can be used. A micrometer stage offers high-precision displacement adjustment capabilities, enabling precise adjustment of minute distances. This ensures that visual recognition device 3 can accurately align with a specific portion of workpiece 7, improving the quality and accuracy of image acquisition.

[0078] Furthermore, visual recognition device 3 is an electron microscope. Electron microscopes are compact, highly integrated, and powerful, enabling efficient acquisition of image information from the surface of workpiece 7. Their high-resolution imaging capabilities clearly capture subtle features on the surface of workpiece 7, providing more accurate data for subsequent quality (defect) inspection and assessment. Furthermore, the electron microscope's low power consumption helps reduce the energy consumption of the entire semiconductor etching machine, aligning with energy conservation and environmental protection trends.

[0079] Furthermore, if Figure 2 As shown, a manual purge mechanism is also provided. The manual purge mechanism includes a purge head 6, a connecting air pipe (not shown in the figure) and an air supply source (not shown in the figure), and the purge head 6 is connected to the air supply source via a connecting air pipe. If there is still residual liquid on the surface of the wafer for image acquisition, the operator can hold the purge head 6 and purge the surface of the processed workpiece 7 or the workpiece carrier 8 to remove the surface residue and avoid affecting the accuracy of image acquisition. In another way, when the image information collected by the visual recognition device 3 determines that there are residual impurities and tiny particles on the surface, the handheld purge head 6 can be used to purge the surface of the processed workpiece 7 or the workpiece carrier 8 to solve the problem. If the problem cannot be solved by blowing, secondary etching or manual cleaning can be performed.

[0080] In general, during actual operation, operators can flexibly utilize the visual recognition device 3 and manual purge mechanism based on the specific conditions of the workpiece 7 or workpiece carrier 8 being processed. For example, before image acquisition, the manual purge mechanism can be used to purge the workpiece 7 or workpiece carrier 8 to ensure a clearer and more accurate captured image. After image acquisition, the image information can be used to determine whether there are any residual impurities (dirt / water stains) on the surface of the workpiece 7 or workpiece carrier 8. If so, the manual purge mechanism can be used again to remove them. This method further improves the processing quality and reliability of semiconductor etching tools, providing the semiconductor manufacturing industry with more efficient and stable processing equipment.

[0081] like Figure 2 As shown, a hanger 17 is installed on one side wall of the machine body 1 at the position on the other side of the inspection port 15 for hanging the purge head 6, which is convenient for the operator to store the purge head 6 after use and keep the environment around the machine clean and tidy.

[0082] The above is a detailed introduction to a semiconductor etching machine that integrates robots and visual recognition provided by the present application. For those skilled in the art, based on the ideas of the embodiments of the present application, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present application.

Claims

1. A semiconductor etching machine integrating a robot and visual recognition, characterized in that: It includes a machine body (1) and a visual recognition device (3); The machine body (1) is provided with an etching chamber (11); A robot body (2) is installed in the etching chamber (11); The etching chamber (11) is provided with at least one etching tank (12) and at least one drying tank (13); The visual recognition device (3) is installed on the machine body (1) and is used to collect surface image information of the processed workpiece (7) or the workpiece carrier (8); The robot body (2) is capable of transporting the workpiece (7) or the workpiece carrier (8) into the collection field of view of the visual recognition device (3), or is capable of driving the visual recognition device (3) to move so that its collection end faces the workpiece (7) or the workpiece carrier (8); At least the collection end of the visual recognition device (3) is covered with a transparent protective cover.

2. The semiconductor etching machine integrating robot and visual recognition according to claim 1, characterized in that: An internal fixing frame is provided in the etching chamber (11); The visual recognition device (3) is detachably arranged on the internal fixing frame; The robot body (2) can be detachably connected to the visual recognition device (3).

3. The semiconductor etching machine integrating robot and visual recognition according to claim 1, characterized in that: An electromagnetic suction mechanism or a suction cup mechanism is installed at the end of the robot body (2); The visual recognition device (3) is provided with a magnetic attraction member that cooperates with the electromagnetic attraction mechanism or a suction surface that cooperates with the suction cup mechanism.

4. The semiconductor etching machine integrating robot and visual recognition according to claim 3, characterized in that: The visual recognition device (3) has a built-in power supply and a wireless power receiving module connected to the built-in power supply; A wireless charging module is installed on the electromagnetic suction mechanism; When the electromagnetic attraction mechanism is magnetically engaged with the magnetic attraction component of the visual recognition device (3), the wireless charging module can transmit electric energy to the wireless power receiving module.

5. The semiconductor etching machine integrating robot and visual recognition according to claim 1, characterized in that: The visual recognition device (3) is installed on the robot body (2).

6. The semiconductor etching machine integrating robot and visual recognition according to claim 1, characterized in that: An inspection port (15) communicating with the etching chamber (11) is provided on one side wall of the machine body (1); The inspection port (15) is provided with an openable and closable shielding mechanism (16); An external fixing frame (4) is installed on a side wall of the machine body (1) at a position on one side of the inspection port (15); The visual recognition device (3) is fixedly mounted on the external fixing frame (4), and its collecting end is arranged toward the inspection port (15).

7. The semiconductor etching machine integrating robot and visual recognition according to claim 6, characterized in that: Also includes a position adjustment mechanism (5); The position adjustment mechanism (5) is mounted on the external fixing frame (4) and is connected to the visual recognition device (3) to drive the visual recognition device (3) to move.

8. The semiconductor etching machine integrating robot and visual recognition according to claim 7, characterized in that: The position adjustment mechanism (5) is a micrometer displacement stage.

9. The semiconductor etching machine integrating robot and visual recognition according to claim 1, characterized in that: The visual recognition device (3) is an electron microscope.

10. The semiconductor etching machine integrating robot and visual recognition according to claim 6, characterized in that: It also includes a manual blowing mechanism for blowing the processed workpiece (7) or the workpiece carrier (8).

11. The semiconductor etching machine integrating robot and visual recognition according to claim 10, characterized in that: The manual purge mechanism comprises a purge head (6), a connecting air pipe and an air supply source; The purge head (6) is connected to the air supply source via the connecting air pipe; A hanging bracket (17) is installed on one side wall of the machine body (1) at a position on the other side of the inspection port (15) for hanging the purge head (6).

Images