Flexible circuit board and electronic equipment

Abstract

The utility model provides a flexible circuit board and electronic equipment, and belongs to the technical field of flexible circuit boards. The shielding layer is arranged on one side of the covering film layer; the adhesive layer is arranged on the side, away from the covering film layer, of the shielding layer; and the base material is bonded with the adhesive layer.

Description

Technical Field

[0001] The present application belongs to the technical field of flexible circuit boards, and specifically relates to a flexible circuit board and an electronic device. Background Art

[0002] In related technologies, such as Figure 1 As shown, the flexible circuit board 100' generally includes a substrate insulating dielectric layer 110', a substrate copper layer 120', a cover film adhesive layer 130', a cover film 140', a conductive adhesive 150', a shielding metal layer 160' and a shielding film ink layer 170'. However, the above stacking method causes the conductive adhesive 150', the shielding metal layer 160' and the shielding film ink layer 170' to be located on the outer layer of the flexible circuit board 100', which is easily corroded by liquids, resulting in damage to the flexible circuit board 100'. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide a flexible circuit board and an electronic device, which can effectively solve the technical problem that the flexible circuit board is easily damaged by external corrosion.

[0004] In a first aspect, an embodiment of the present application provides a flexible circuit board, comprising:

[0005] Covering film layer;

[0006] A shielding layer is provided on one side of the covering film layer;

[0007] An adhesive layer is provided on a side of the shielding layer facing away from the covering film layer;

[0008] The substrate is bonded to the adhesive layer.

[0009] As a possible implementation, the shielding layer is plated or sprayed on the covering film layer.

[0010] As a possible implementation method, it also includes:

[0011] The heat dissipation layer is arranged on a side of the shielding layer away from the covering film layer.

[0012] As a possible implementation, the heat dissipation layer is plated or sprayed on the side of the shielding layer facing away from the covering film layer.

[0013] As a possible implementation, the heat dissipation layer includes:

[0014] At least two heat dissipating parts are arranged side by side on a side of the shielding layer away from the covering film layer, and at least two heat dissipating parts are arranged at intervals.

[0015] As a possible implementation, the heat dissipation layer is a graphite layer.

[0016] As a possible embodiment, the substrate includes:

[0017] Insulation layer;

[0018] The circuit layer is arranged on the side of the insulating layer facing the adhesive layer. The side of the circuit layer facing away from the insulating layer has a grounding portion that passes through the adhesive layer and is connected to the heat dissipation layer. The heat dissipation layer is conductive.

[0019] As a possible embodiment, the substrate includes:

[0020] Insulation layer;

[0021] The circuit layer is arranged on the side of the insulating layer facing the adhesive layer. The side of the circuit layer facing away from the insulating layer is provided with a grounding portion, which passes through the adhesive layer and is connected to the shielding layer.

[0022] As a possible implementation, the grounding portion is a copper tooth structure to pierce the adhesive layer.

[0023] In a second aspect, an embodiment of the present application provides an electronic device, including:

[0024] circuit boards;

[0025] As provided in the first embodiment of the flexible circuit board, the flexible circuit board and the circuit board are electrically connected.

[0026] In an embodiment of the present application, the flexible circuit board includes a covering film layer, a shielding layer, an adhesive layer and a substrate. The shielding layer is arranged between the covering layer and the adhesive layer, and the adhesive layer and the substrate are bonded to each other. That is, the shielding layer is located between the covering film layer and the substrate. The covering film layer is used to protect the shielding layer, thereby reducing the possibility of the flexible circuit board being damaged by liquid corrosion and improving the service life of the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0028] Figure 1 A schematic diagram of a stacked structure of a flexible circuit board in related art is shown;

[0029] Figure 2 FIG1 shows one of the stacking structure schematic diagrams of the flexible circuit board provided by one embodiment of the present application;

[0030] Figure 3 A schematic diagram of the stacking structure of a cover film layer, a shielding layer, a heat dissipation layer, and an adhesive layer in a flexible circuit board provided in one embodiment of the present application is shown;

[0031] Figure 4 A second schematic diagram of a stacking structure of a flexible circuit board provided in one embodiment of the present application is shown;

[0032] Figure 5 A schematic diagram showing a heat dissipation portion and an adhesive layer in a flexible circuit board provided in one embodiment of the present application is shown;

[0033] Figure 6 A schematic diagram of the stacking structure of substrates in a flexible circuit board provided in one embodiment of the present application is shown;

[0034] Figure 7 The third schematic diagram of the stacking structure of the flexible circuit board provided by one embodiment of the present application is shown;

[0035] Figure 8 A schematic diagram of an electronic device provided by an embodiment of the present application is shown.

[0036] Figure 1 Reference numerals:

[0037] 100' flexible circuit board, 110' base material insulating dielectric layer, 120' base material copper layer, 130' cover film adhesive layer, 140' cover film, 150' conductive adhesive, 160' shielding metal layer, 170' shielding film ink layer;

[0038] Figures 2 to 8 Reference numerals:

[0039] 100 flexible circuit board, 110 covering film layer, 120 shielding layer, 130 adhesive layer, 140 base material, 142 insulating layer, 144 circuit layer, 146 grounding portion, 150 heat dissipation layer, 152 heat dissipation portion, 200 electronic device, 210 circuit board, 212 first circuit board, 214 second circuit board, 220 first body, 230 second body, 240 hinge. DETAILED DESCRIPTION

[0040] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0041] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0042] In the description of this application, it should be understood that the terms "upper" and "inner" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on this application.

[0043] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0044] The following combination Figures 2 to 8 A flexible circuit board 100 and an electronic device 200 according to an embodiment of the present application are described.

[0045] First, as Figure 2 、 Figure 3 and Figure 7 As shown, an embodiment of the present application provides a flexible circuit board 100, including: a covering film layer 110; a shielding layer 120, arranged on one side of the covering film layer 110; an adhesive layer 130, arranged on the side of the shielding layer 120 away from the covering film layer 110; and a substrate 140, bonded to the adhesive layer 130.

[0046] In an embodiment of the present application, the flexible circuit board 100 includes a covering film layer 110, a shielding layer 120, an adhesive layer 130 and a substrate 140. The shielding layer 120 is arranged between the covering layer and the adhesive layer 130, and the adhesive layer 130 and the substrate 140 are bonded to each other. That is, the shielding layer 120 is located between the covering film layer 110 and the substrate 140. The covering film layer 110 is used to protect the shielding layer 120, thereby reducing the possibility of the flexible circuit board 100 being damaged by liquid corrosion and improving the service life of the flexible circuit board 100. The shielding layer 120 can reduce signal interference and ensure the integrity of signal transmission.

[0047] The substrate 140 may be used to arrange circuits, the adhesive layer 130 may be used for bonding, the shielding layer 120 may be used for signal shielding, and the cover film layer 110 may be used for insulation protection.

[0048] In addition, the conductive glue, shielding metal layer and shielding film ink layer in the related technology are eliminated, which reduces the thickness of the flexible circuit board 100, is conducive to the thinning of the electronic device 200, and at the same time avoids the corrosion of the shielding layer 120, which causes the accumulation of foreign matter at the bending position, bending breakage and short circuit, thereby improving the corrosion resistance of the flexible circuit board 100.

[0049] As a possible implementation, the shielding layer 120 may be made of metal, such as iron, iron alloy, aluminum, aluminum alloy, copper, copper alloy, silver, silver alloy, gold or gold alloy.

[0050] Specifically, the metal material has certain ductility and flexibility, so that the flexible circuit board 100 can be bent better.

[0051] As a possible implementation, the shielding layer 120 is plated or sprayed on the covering film layer 110 .

[0052] Specifically, the shielding layer 120 is plated or sprayed on the covering film layer 110, that is, no adhesive is required between the shielding layer 120 and the covering film layer 110, which is beneficial to reducing the overall thickness of the flexible circuit board 100. In addition, plating or spraying the shielding layer 120 on the covering film layer 110 can increase the connection strength between the covering film layer 110 and the shielding layer 120, and reduce the possibility of delamination between the covering film layer 110 and the shielding layer 120.

[0053] The shielding layer 120 can be disposed on the covering film layer 110 by sputtering coating, evaporation coating, ultrasonic spraying, or electrostatic spraying.

[0054] As a possible implementation manner, the thickness of the shielding layer 120 ranges from 1 μm to 3 μm.

[0055] like Figure 2 and Figure 3 As shown, as a possible implementation, the flexible circuit board 100 further includes: a heat dissipation layer 150 , which is disposed on a side of the shielding layer 120 away from the cover film layer 110 .

[0056] Specifically, the flexible circuit board 100 further includes a heat dissipation layer 150 , which is disposed on the side of the shielding layer 120 facing away from the cover film layer 110 , and the adhesive layer 130 is disposed on the heat dissipation layer 150 . The heat dissipation layer 150 can enhance the heat distribution and heat dissipation effects of the flexible circuit board 100 .

[0057] Among them, the combination of the covering film layer 110, the shielding layer 120 and the heat dissipation layer 150 can realize multiple functions of shielding, heat dissipation and insulation protection. Compared with the structure of the covering film, conductive glue, shielding metal layer and shielding film ink layer in the related technology, the structure of the present application reduces the overall thickness of the flexible circuit board 100.

[0058] As a possible implementation, the heat dissipation layer 150 can be an ultra-thin heat spreader, a heat pipe, a metal insulation plate or a non-metallic heat spreader, etc.; the heat dissipation layer 150 can be made of steel, copper, copper alloy, graphite or graphene, etc.

[0059] As a possible implementation, the heat dissipation layer 150 is plated or sprayed on a side of the shielding layer 120 facing away from the covering film layer 110 .

[0060] Specifically, the heat dissipation layer 150 is plated or sprayed on the side of the shielding layer 120 facing away from the covering film layer 110, that is, no adhesive is required between the heat dissipation layer 150 and the shielding layer 120, which is beneficial to reducing the overall thickness of the flexible circuit board 100. In addition, plating or spraying the heat dissipation layer 150 on the shielding layer 120 can increase the connection strength between the shielding layer 120 and the heat dissipation layer 150 and reduce the possibility of delamination between the shielding layer 120 and the heat dissipation layer 150.

[0061] The heat dissipation layer 150 can be disposed on the shielding layer 120 by sputtering coating, evaporation coating, ultrasonic spraying, or electrostatic spraying.

[0062] like Figure 4 and Figure 5 As shown, as a possible embodiment, the heat dissipation layer 150 includes: at least two heat dissipation parts 152, at least two heat dissipation parts 152 are arranged side by side on the side of the shielding layer 120 away from the covering film layer 110, and at least two heat dissipation parts 152 are arranged at intervals.

[0063] Specifically, the heat dissipation layer 150 includes at least two heat dissipation portions 152, and the at least two heat dissipation portions 152 are arranged side by side on the side of the shielding layer 120 away from the cover film layer 110, and the two adjacent heat dissipation portions 152 are arranged at intervals, thereby utilizing the at least two heat dissipation portions 152 arranged at intervals to improve the bending resistance of the flexible circuit board 100, reduce the possibility of a layer of the flexible circuit board 100 breaking, and improve the service life of the flexible circuit board 100.

[0064] The heat dissipation portion 152 may be a strip-shaped structure, and at least two heat dissipation portions 152 are arranged along a direction perpendicular to the heat dissipation portion 152 .

[0065] Optionally, the gaps between adjacent heat dissipation portions 152 are filled with the adhesive layer 130 .

[0066] As a possible implementation, the heat dissipation layer 150 is a graphite layer.

[0067] Specifically, the heat dissipation layer 150 is a graphite layer, which has good heat dissipation effect and small density, thereby reducing the weight of the flexible circuit board 100 and improving the heat dissipation effect of the flexible circuit board 100.

[0068] The graphite layer can be a combination of graphite material and glue, and the proportion of the graphite material is greater than that of the glue. In manufacturing, the graphite material and the glue can be mixed, and then sprayed or set on the shielding layer 120, thereby increasing the connection strength between the heat dissipation layer 150 and the shielding layer 120, and the heat dissipation layer 150 and the shielding layer 120 do not need to be set with an adhesive, thereby reducing the thickness of the flexible circuit board 100.

[0069] As shown in Figure 2 , Figure 4 and Figure 6 , as a possible implementation, the base material 140 includes an insulating layer 142 and a circuit layer 144 disposed on one side of the insulating layer 142 facing the glue layer 130. The circuit layer 144 has a grounding portion 146 on the side away from the insulating layer 142. The grounding portion 146 penetrates the glue layer 130 and is connected to the heat dissipation layer 150, which has electrical conductivity.

[0070] Specifically, the base material 140 includes the insulating layer 142, the circuit layer 144, and the grounding portion 146. The circuit layer 144 is disposed on one side of the insulating layer 142 facing the glue layer 130. The insulating layer 142 can protect the circuit layer 144. The grounding portion 146 is disposed on the side of the circuit layer 144 away from the insulating layer 142. After the flexible circuit board 100 is pressed, the grounding portion 146 penetrates the glue layer 130 and is connected to the heat dissipation layer 150, which has electrical conductivity, thereby achieving grounding of the circuit layer 144.

[0071] As described above, by setting the grounding portion 146 to penetrate the glue layer 130 and be connected to the heat dissipation portion 152, the grounding mode is achieved, which reduces the difficulty of grounding the circuit layer 144 and is conducive to simplifying the production process of the flexible circuit board 100.

[0072] The combination of the cover film layer 110, the shielding layer 120, and the heat dissipation layer 150 can achieve multiple functions of shielding, heat dissipation, grounding, and insulation protection. Compared with the structure of the cover film, the conductive glue, the shielding metal layer, and the shielding film ink layer in the related art, the structure of the present application reduces the overall thickness of the flexible circuit board 100.

[0073] As shown in Figure 7As shown, as a possible embodiment, the substrate 140 includes: an insulating layer 142; a circuit layer 144, which is arranged on the side of the insulating layer 142 facing the adhesive layer 130, and the circuit layer 144 has a grounding portion 146 on the side away from the insulating layer 142, and the grounding portion 146 passes through the adhesive layer 130, and the grounding portion 146 is connected to the shielding layer 120.

[0074] Specifically, the substrate 140 includes an insulating layer 142, a circuit layer 144 and a grounding portion 146. The circuit layer 144 is arranged on the side of the insulating layer 142 facing the adhesive layer 130. The insulating layer 142 can protect the circuit layer 144. The grounding portion 146 is provided on the side of the circuit layer 144 facing away from the insulating layer 142. After the flexible circuit board 100 is pressed together, the grounding portion 146 passes through the adhesive layer 130 and is connected to the shielding layer 120, thereby realizing the grounding of the circuit layer 144.

[0075] As described above, by providing the grounding portion 146 passing through the adhesive layer 130 and connecting to the shielding film, grounding is achieved, which reduces the difficulty of grounding the circuit layer 144 and helps to simplify the production process of the flexible circuit board 100.

[0076] Among them, the combination of the covering film layer 110 and the heat dissipation layer 150 can realize multiple functions of shielding, grounding and insulation protection. Compared with the structure of the covering film, conductive glue, shielding metal layer and shielding film ink layer in the related art, the structure of the present application reduces the overall thickness of the flexible circuit board 100.

[0077] like Figure 2 、 Figure 4 and Figure 6 As shown, as a possible implementation, the grounding portion 146 is a copper tooth structure to pierce the adhesive layer 130 .

[0078] Specifically, the grounding portion 146 is a copper tooth structure provided on the circuit layer 144. The copper tooth structure pierces the adhesive layer 130 to achieve grounding of the circuit layer 144, further simplifying the production process of the flexible circuit board 100. For example, after the adhesive layer 130 is coated on the shielding layer 120 or the heat dissipation layer 150, it can be directly pressed with the substrate 140 without the need for corresponding avoidance treatment of the adhesive layer 130, thereby improving the production efficiency of the flexible circuit board 100.

[0079] As a possible implementation, the grounding portion 146 is disposed at the grounding position of the circuit layer 144 by electroplating.

[0080] Specifically, a roughening process may be performed on the grounding position of the circuit layer 144 , and electroplating may be performed on the position, so that the grounding portion 146 grows at the grounding position.

[0081] As a possible implementation, the cover film layer 110 can be a polyimide film (PI).

[0082] As a possible implementation, the insulating layer 142 can be a polyimide film (PI).

[0083] As a possible implementation, the material of the glue layer 130 can be a thermosetting glue or a light-curing glue, etc.

[0084] The manufacturing process of the flexible circuit board 100 provided in the present application can be that a thin copper layer is first made on the cover film layer 110 as the shielding layer 120 by using a sputtering film plating process, and the thickness of the shielding layer 120 is about 1-3 μm; then the graphite liquid is sprayed on the shielding layer 120, and solidification is performed after the spraying is completed to form the heat dissipation layer 150, the graphite liquid is a mixed liquid of graphite material and glue, and the graphite material can use graphite powder or graphite sheet, etc.; then the glue layer 130 is arranged on the heat dissipation layer 150; when the insulating layer 142 and the circuit layer 144 are made, roughness is made at the grounding position of the circuit layer 144, and electroplating treatment is performed to obtain the grounding part 146; then the structure after the substrate 140 is arranged on the glue layer 130 is pressed, the grounding part 146 can pierce the glue layer 130 and contact the heat dissipation layer 150, so that the heat dissipation layer 150 and the circuit layer 144 are conducted, and the grounding of the circuit layer 144 is realized.

[0085] When the heat dissipation part 152 is manufactured, the graphite liquid can be uniformly sprayed in sections, so that at least two heat dissipation parts 152 form a grid structure, and the other layers remain unchanged. The sectional heat dissipation part 152 can improve the flexibility of the flexible circuit board 100, improve the bending life of the flexible circuit board, and also has the functions of shielding, heat dissipation and grounding, etc.

[0086] In a second aspect, as shown in Figure 8 The electronic device 200 provided in the present application includes the flexible circuit board 100 provided in the first aspect, and therefore has all the beneficial effects of the flexible circuit board 100 provided in the first aspect, which will not be repeated here.

[0087] The electronic device 200 provided in the present application includes the flexible circuit board 100 provided in the first aspect, and therefore has all the beneficial effects of the flexible circuit board 100 provided in the first aspect, which will not be repeated here.

[0088] The electronic device 200 includes the circuit board 210, one end of the flexible circuit board 100 is electrically connected to the circuit board 210, and the other end can be electrically connected to the camera, the loudspeaker, the screen, the battery or other components.

[0089] Alternatively, as shown in Figure 8As shown, the circuit board 210 includes a first circuit board 212 and a second circuit board 214 . One end of the flexible circuit board 100 is electrically connected to the first circuit board 212 , and the other end is electrically connected to the second circuit board 214 .

[0090] For example, the electronic device 200 is a foldable electronic device 200, which includes a first body 220, a hinge 240, and a second body 230. The hinge 240 connects the first body 220 and the second body 230. The first circuit board 212 is disposed in the first body 220, and the second circuit board 214 is disposed in the second body 230. The flexible circuit board 100 passes through the hinge, with one portion located in the first body 220 and the other portion located in the second body 230. One end of the flexible circuit board 100 is electrically connected to the first circuit board 212, and the other end is electrically connected to the second circuit board 214. The heat dissipation layer 150 in the flexible circuit board 100 can improve the heat distribution and heat dissipation effect between the first body 220 and the second body 230.

[0091] As mentioned above, since the foldable electronic device 200 needs to be bent frequently, the outer side of the flexible circuit board 100 in this application is a covering film layer 110 and an insulating layer 142. The covering film layer 110 can effectively prevent sweat, beverages, food soup or other items from corroding the shielding layer 120. Similarly, the insulating layer 142 can effectively prevent sweat, beverages, food soup or other items from corroding the circuit layer 144. That is, the insulating layer 142 and the covering film layer 110 protect the circuit layer 144, the heat dissipation layer 150 and the shielding layer 120, thereby improving the service life of the flexible circuit board 100 and reducing the occurrence of breakage or short circuits in the circuit layer 144 and the shielding layer 120.

[0092] Among them, the electronic device 200 can be a foldable screen mobile phone, a foldable screen tablet computer, a foldable screen laptop computer or a foldable screen wearable device, etc.

[0093] Throughout this specification, references to "one embodiment" or "a specific embodiment" mean that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0094] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and purpose of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A flexible circuit board, characterized in that: include: Covering film layer; a shielding layer, arranged on one side of the covering film layer; An adhesive layer is provided on a side of the shielding layer away from the covering film layer; The substrate is bonded to the adhesive layer.

2. The flexible circuit board according to claim 1, wherein: The shielding layer is plated or sprayed on the covering film layer.

3. The flexible circuit board according to claim 1, wherein: Also includes: The heat dissipation layer is arranged on a side of the shielding layer away from the covering film layer.

4. The flexible circuit board according to claim 3, characterized in that: The heat dissipation layer is plated or sprayed on a side of the shielding layer away from the covering film layer.

5. The flexible circuit board according to claim 3, wherein: The heat dissipation layer comprises: At least two heat dissipation parts are arranged side by side on a side of the shielding layer away from the covering film layer, and at least two heat dissipation parts are arranged at intervals.

6. The flexible circuit board according to claim 3, wherein: The heat dissipation layer is a graphite layer.

7. The flexible circuit board according to claim 3, wherein: The substrate comprises: Insulation layer; The circuit layer is arranged on the side of the insulating layer facing the adhesive layer. The side of the circuit layer facing away from the insulating layer has a grounding portion, which passes through the adhesive layer and is connected to the heat dissipation layer. The heat dissipation layer is conductive.

8. The flexible circuit board according to claim 1, wherein: The substrate comprises: Insulation layer; The circuit layer is arranged on a side of the insulating layer facing the adhesive layer. The side of the circuit layer facing away from the insulating layer has a grounding portion, which passes through the adhesive layer and is connected to the shielding layer.

9. The flexible circuit board according to claim 7 or 8, characterized in that: The grounding portion is a copper tooth structure to pierce the adhesive layer.

10. An electronic device, characterized in that: include: circuit boards; The flexible circuit board according to any one of claims 1 to 9, wherein the flexible circuit board is electrically connected to the circuit board.

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