Power module PCB
By setting through heat dissipation holes on the PCB board and installing heat dissipation filling blocks, the problem of space occupied by the heat dissipation components of the power module is solved, higher power density and compact structure are achieved, and heat dissipation and flow capacity are improved.
Patent Information
- Application Number
- CN202422893673.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-26
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-11-26
AI Technical Summary
Existing power modules have a contradiction in improving power density and heat dissipation performance. The heat dissipation components occupy internal space, resulting in a non-compact structure and an inability to further improve power density.
A through-hole heat dissipation hole is set on the PCB board, and a heat dissipation filler block is installed in the hole. The metal edging and solder paste layer are used to improve the electrical conductivity and thermal conductivity, and heat is transferred through the heat dissipation hole, while achieving electrical connection in the multi-layer PCB board.
Without taking up additional space, the heat dissipation performance and flow capacity are improved, achieving higher power density and compact structural design.
Smart Images
Figure CN223428622U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of PCB board especially relates to the technical field of power module PCB board and provides a kind of power module PCB board. BACKGROUND
[0002] With the rapid development of new generation information technology and new energy field, standard size power module is higher and higher in power and greater and greater in power density under the condition of unchanged volume, while improving product efficiency, higher requirements are put forward to product heat dissipation.
[0003] The existing power module usually separately sets the heat dissipation component, but occupies the internal space of the module, and the overall structure is not compact enough, which is not conducive to miniaturization and cannot further improve the power density. SUMMARY
[0004] The utility model aims at providing a kind of power module PCB board, on the basis that heat dissipation component does not occupy PCB surface patch device space, guarantee that main power device can be well heat dissipated.
[0005] The utility model provides a kind of power module PCB board, including PCB board body, PCB board body includes PCB first plane and PCB second plane, at least one MOS tube patch area is provided in the PCB first plane, the MOS tube patch area can be attached and installed heat dissipation element;The MOS tube patch area is opposite the bottom position of the heat dissipation element and is provided with the heat dissipation hole of penetrating PCB board body;The heat dissipation hole is the heat dissipation area in the MOS tube patch area corresponding the PCB second plane.
[0006] At least one MOS tube patch area is provided in the PCB first plane, and heat dissipation element can be attached and installed in the MOS tube patch area.In the MOS tube patch area, the bottom position of the heat dissipation element is opposite, and the heat dissipation hole of penetrating PCB board body is provided, and the heat dissipation element is discharged heat through the heat dissipation hole during work.The heat dissipation hole is the heat dissipation area in the MOS tube patch area corresponding the PCB second plane.
[0007] Further, heat dissipation filling block is provided in the heat dissipation hole, and as preferred, the heat dissipation filling block is copper.The thermal conductivity coefficient of copper is greater than that of PCB medium layer, and the heat of power heating device can be better absorbed and transmitted by setting the heat dissipation hole and the heat dissipation filling block of metal copper.
[0008] Further, the inner wall of the heat dissipation hole is provided with metal edge, and as preferred, the metal edge is copper-plated metal edge.Copper-plated metal edge can reduce contact resistance, has good conductivity, and has good heat conduction performance, so that the conductivity and heat dissipation capacity can be improved.
[0009] The heat dissipation filling block comprises a heat conduction surface facing the MOS tube patch area, a heat dissipation surface facing the heat dissipation area, and a connecting surface facing the inner wall of the heat dissipation hole; the heat conduction surface is provided with tin paste connected with the heat dissipation element, forming a tin paste layer.
[0010] The heat dissipation filling block and the heat dissipation hole adopt two connection modes, but are not limited to the two connection modes.
[0011] The outer contour of the heat dissipation filling block is slightly smaller than the cavity contour of the heat dissipation hole after the metal edge cover is arranged, and the heat dissipation filling block can be welded and connected with the metal edge cover through the connecting surface.
[0012] Alternatively, the outer contour of the heat dissipation filling block is slightly larger than the cavity contour of the heat dissipation hole after the metal edge cover is arranged, and the heat dissipation filling block can be connected with the metal edge cover in an interference fit through the connecting surface.
[0013] The skilled in the art can also adopt other connection modes, which need to be easy to operate, stable in connection and ensure that the metal edge cover is in full contact with the heat dissipation filling block. After connection, the copper block and the PCB are flush, and the surface is subjected to tin spraying treatment.
[0014] Further, when the PCB body is a double-sided PCB board or a multi-layer PCB board, the power supply layers of the multiple layer structures are connected through the metal edge cover. In the embodiment, the metal edge cover is selected to be a metal copper-plated edge cover with high current passing capacity and high thermal conductivity. In actual use, other materials with the characteristics can be selected according to actual conditions.
[0015] Further, when the PCB body is a double-sided PCB board or a multi-layer PCB board, the power supply layers of the multiple layer structures are connected through the heat dissipation filling block. In the embodiment, the heat dissipation filling block is made of copper material, and the current passing capacity of the copper block with the same area is much larger than that of the through-hole mode.
[0016] The technical scheme provided by the utility model provides that the heat dissipation hole is arranged, the heat dissipation filling block is arranged in the heat dissipation hole, the circuit board is provided with strong heat dissipation performance without occupying extra space, the heat dissipation filling block is used to replace the power supply mode of the through-hole, and the current passing capacity is greatly improved. Compared with the prior art, the technical scheme of the utility model saves the board space, realizes high thermal conductivity and high current passing capacity, and has beneficial effects. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 The utility model provides a power module PCB board structure schematic view;
[0018] Figure 2 The utility model provides a power module PCB board first embodiment heat dissipation hole section view;
[0019] Figure 3The utility model provides a power module PCB board first embodiment heat dissipation hole section view is provided.
[0020] Figure 4 The utility model provides a power module PCB board second embodiment heat dissipation filling block section view is provided.
[0021] Label explanation:
[0022] 1. PCB board body;2. PCB first plane;3. PCB second plane;4. Heat dissipation hole;5. Heat dissipation filling block;51. Heat conduction surface;52. Heat dissipation surface;53. Connecting surface;54. Main part;55. Extension part;6. MOS tube patch area;7. Solder paste layer;8. Heat dissipation element;9. Metal edge;10. Power supply layer. Specific embodiment
[0023] The technical scheme in the embodiments of the utility model will be apparently and completely described below in combination with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without making creative labor belong to the range of protection of the utility model.
[0024] Figure 1 、 Figure 2 and Figure 3 The first embodiment of the utility model is shown.
[0025] As Figure 1 shown, the power module PCB board of the first embodiment includes: PCB board body 1.
[0026] As Figure 1 and Figure 2 shown, the PCB board body 1 includes the PCB first plane 2 and the PCB second plane 3 opposite to the PCB first plane 2.
[0027] As Figure 1 shown, a plurality of MOS tube patch areas 6 are arranged in the PCB first plane 2, and the number of the MOS tube patch areas 6 can be set according to the actual power consumption of the power supply. Figure 1 Only schematic in the middle. The heat dissipation element 8 is attached on the MOS tube patch area 6, and the heat dissipation element 8 can be a MOS tube or other elements. The heat dissipation hole 4 penetrating through the PCB board body 1 is arranged at the position opposite to the bottom of the heat dissipation element 8 in the MOS tube patch area 6;When in use, the heat generated by the heat dissipation element 8 can be discharged through the heat dissipation hole 4.
[0028] The heat dissipation hole 4 is the heat dissipation area in the PCB second plane 3 corresponding to the MOS tube patch area 6.
[0029] In this embodiment, the thickness of the PCB body 1 is 4 mm, and the heat dissipation hole 4 is a rectangular slot hole of 4.5 mm×6 mm. When in use, the shape and size of the heat dissipation hole can be adjusted according to actual conditions.
[0030] Further, if Figure 2 As shown, a heat dissipation filling block 5 is installed in the heat dissipation hole 4.
[0031] In this embodiment, the heat dissipation filling block 5 is preferably copper. The thermal conductivity of copper is originally greater than that of the PCB dielectric layer. By opening the heat dissipation holes 4 and setting the heat dissipation filling block 5, the heat of the power heating device can be better absorbed and transferred. When in use, other metal materials with high thermal conductivity, such as aluminum, gold, etc., can be selected according to actual conditions.
[0032] The side of the heat dissipation filler block 5 facing the MOS tube patch area 6 is a heat conduction surface 51, which is flush with the first plane 2 of the PCB. Solder paste for connecting to the heat dissipation element 8 is applied on the heat conduction surface 51, forming a solder paste layer 7. The side of the heat dissipation filler block 5 facing the heat dissipation area is a heat dissipation surface 52. The closed-loop side of the heat dissipation filler block 5 facing the inner wall of the heat dissipation hole 4 is a connection surface 53. The inner wall of the heat dissipation hole 4 is provided with a metal edging 9, and the heat dissipation filler block 5 is fixedly connected to the metal edging 9 via the connection surface 53.
[0033] In this embodiment, the heat dissipation filler block 5 has a size of 4.3mm x 5.8mm x 4mm, and the heat dissipation hole 4 is surrounded by a metal copper rim. Because the heat dissipation filler block 5 is slightly smaller than the heat dissipation hole 4, the heat dissipation hole 4 and the heat dissipation filler block 5 can be connected in the following two ways, but are not limited to:
[0034] The outer contour of the heat dissipation filling block 5 is slightly smaller than the cavity contour of the heat dissipation hole 4 after the metal edging 9 is provided, and the heat dissipation filling block 5 is welded to the metal edging 9;
[0035] The outer contour of the heat dissipation filling block 5 is slightly larger than the cavity contour of the heat dissipation hole 4 after the metal edging 9 is provided. The heat dissipation filling block 5 and the metal edging 9 can be connected by interference fit.
[0036] The excellent thermal conductivity of the solder paste helps conduct heat from the MOS tube pins to the heat sink filler 5. At the same time, the close contact between the solder paste, the PCB, and the MOS tube pins reduces the contact thermal resistance, allowing heat to be transferred more efficiently, thereby assisting the MOS tube in dissipating heat to a certain extent.
[0037] Further, if Figure 3As shown, when the PCB body 1 is a double-sided or multi-layer PCB, the power supply layers 10 of the multiple layers are electrically connected via heat dissipation fillers 5. In this embodiment, the heat dissipation fillers 5 are made of copper. The current carrying capacity of a copper block of the same area is much greater than that of a via. Other metal materials with high current carrying capacity, such as aluminum or gold, can be selected based on actual needs.
[0038] Furthermore, when metal edging 9 is provided on the inner wall of heat dissipation hole 4, heat dissipation filler block 5 is fixedly connected to metal edging 9 via connection surface 53, and metal edging 9 is electrically connected to power layer 10 of the layer structure. In this embodiment, the metal edging is made of copper-plated metal with high current capacity and high thermal conductivity. In actual use, other materials with similar properties can be selected according to actual conditions.
[0039] The present invention also has a second embodiment. The second embodiment is substantially the same as the first embodiment, with the only difference being:
[0040] like Figure 4 As shown, when there is available space on the second plane 3 of the PCB body 1, the heat dissipation filling block 5 includes a main body 54 arranged in the heat dissipation hole 4, and also includes an extension portion 55 arranged on one side of the heat dissipation area. The cross-sectional area of the extension portion 55 is larger than the cross-sectional area of the main body, further expanding the heat dissipation area.
[0041] Furthermore, the extension portion 55 may be connected using, but not limited to, heat dissipation fins or heat dissipation fans;
[0042] Furthermore, the extension parts 55 of the multiple heat dissipation filling blocks 5 in the multiple MOS tube patch areas 6 are integrally formed, and the main bodies 54 of the multiple heat dissipation filling blocks 5 share the extension part 55, thereby improving heat dissipation efficiency.
[0043] The present invention has two embodiments, which reduce the extra space required for a traditional heat dissipation structure by opening a heat dissipation hole 4 and arranging a heat dissipation filling block 5 in the heat dissipation hole 4, saving board space, making the PCB design more compact, and easily achieving a higher power density.
[0044] It should be noted that, in this article, the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "inside", "outside", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, relational terms such as "first" and "second" are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations, nor can they be understood as indicating or implying relative importance. Moreover, the term "include" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or terminal device that includes a series of elements includes not only those elements, but also includes other elements that are not explicitly listed, or also includes elements that are inherent to such process, method, article or terminal device.
[0045] The above describes in detail a power module PCB board provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The descriptions of the above embodiments are intended only to facilitate understanding of the present application, and the contents of this specification should not be construed as limiting the present application. Furthermore, those skilled in the art will appreciate that various modifications may be made to the specific implementation methods and scope of application based on the present application. While it is not necessary and impossible to exhaustively enumerate all implementation methods, any obvious variations or modifications arising therefrom remain within the scope of protection of the present application.
Claims
1. A power module PCB board, characterized by: The PCB body (1) includes a PCB first plane (2) and a PCB second plane (3). At least one MOS tube patch area (6) is provided in the first plane (2) of the PCB, and a heat dissipation element (8) can be mounted on the MOS tube patch area (6); A heat dissipation hole (4) penetrating the PCB board (1) is provided at a position of the MOS tube patch area (6) facing the bottom of the heat dissipation element (8); The heat dissipation hole (4) is located on the second plane (3) of the PCB corresponding to the MOS tube patch area (6) as a heat dissipation area.
2. The power module PCB board according to claim 1, characterized in that: A heat dissipation filling block (5) is provided in the heat dissipation hole (4).
3. The power module PCB board according to claim 2, characterized in that: The heat dissipation filling block (5) comprises a heat conducting surface (51) facing the MOS tube patch area (6), a heat dissipation surface (52) facing the heat dissipation area, and a connection surface (53) facing the inner wall of the heat dissipation hole (4); A solder paste connected to the heat dissipation element (8) is provided on the heat conducting surface (51) to form a solder paste layer (7); The heat conducting surface (51) is flush with the first plane (2) of the PCB.
4. The power module PCB board according to claim 3, characterized in that: The inner wall of the heat dissipation hole (4) is provided with a metal edging (9), and the heat dissipation filling block (5) is fixedly connected to the metal edging (9) via a connecting surface (53).
5. The power module PCB board according to claim 4, characterized in that: The outer contour of the heat dissipation filling block (5) is slightly smaller than the cavity contour of the heat dissipation hole (4) after the metal edging (9) is provided, and the heat dissipation filling block (5) is welded to the metal edging (9); Alternatively, the outer contour of the heat dissipation filling block (5) is slightly larger than the cavity contour of the heat dissipation hole (4) after the metal edging (9) is provided, and the heat dissipation filling block (5) is connected to the metal edging (9) by interference fit.
6. The power module PCB board according to claim 2, characterized in that: The PCB body (1) comprises at least two layer structures, and the power supply layers (10) of the multiple layer structures are electrically connected via the heat dissipation filling blocks (5).
7. The power module PCB board according to claim 6, characterized in that: The inner wall of the heat dissipation hole (4) is provided with a metal edging (9), and the heat dissipation filling block (5) includes a connection surface (53) facing the inner wall of the heat dissipation hole (4); The heat dissipation filling block (5) is fixedly connected to the metal edging (9) via a connection surface (53), and the metal edging (9) is electrically connected to the power supply layer (10) of the layer structure.
8. The power module PCB board according to claim 2, characterized in that: The heat dissipation filling block (5) comprises a main body (54) arranged in the heat dissipation hole (4), and also comprises an extension portion (55) arranged on one side of the heat dissipation area, wherein the cross-sectional area of the extension portion (55) is larger than the cross-sectional area of the main body.
9. The power module PCB board according to claim 8, characterized in that: The extension portion (55) is connected to a heat dissipation fin or a heat dissipation fan.
10. The power module PCB board according to claim 8, characterized in that: The extension portion (55) of the plurality of heat dissipation filling blocks (5) of the plurality of MOS tube patch areas (6) is integrally formed.