Protection device for integrated circuit

Abstract

The utility model relates to the technical field of integrated circuits, and discloses an integrated circuit protection device, which comprises a shell, a fixing mechanism is arranged in the shell, a heat dissipation mechanism is arranged at the top of the shell, the fixing mechanism comprises a support plate, the support plate is arranged in the shell, and the heat dissipation mechanism is arranged in the shell. Supporting frames are fixedly connected to the two sides of the top of the supporting plate, sliding grooves are formed in the supporting frames, and mounting frames are slidably connected into the sliding grooves. According to the integrated circuit protection device, through the arranged fixing mechanism, an integrated circuit can be positioned, the phenomenon that the integrated circuit shakes in the shell is avoided, and the service life of the integrated circuit is prolonged. The integrated circuit is protected, heat in the shell can be quickly dissipated under the action of a heat dissipation fan through the arranged heat dissipation mechanism and by starting the heat dissipation fan, and therefore the purpose of heat dissipation of the integrated circuit is achieved, and damage caused by overheating of the integrated circuit is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, in particular to a protection device for integrated circuits. Background Art

[0002] An integrated circuit is a miniature electronic device or component. Using a specific process, the transistors, resistors, capacitors, inductors, and other components required for a circuit, along with interconnected wiring, are fabricated on one or several small semiconductor wafers or dielectric substrates. These components are then packaged in a housing, resulting in a miniature structure that performs the desired circuit function. The structural integration of all components has made this a significant step forward in miniaturization, low power consumption, intelligent design, and high reliability in electronic devices. The letters "IC" represent this design in circuits. The inventors of the integrated circuit were Jack Kilby (for germanium (Ge)-based integrated circuits) and Robert Noyce (for silicon (Si)-based integrated circuits). Silicon-based integrated circuits are predominantly used in today's semiconductor industry.

[0003] Currently, most of the existing integrated circuit protection devices only use a shell to store the integrated circuit, but there is rarely a structure inside the shell to fix the integrated circuit. This makes the integrated circuit inside very easy to shake, thereby causing damage to the integrated circuit, which is not conducive to protecting the integrated circuit and has defects. Utility Model Content

[0004] The purpose of the present utility model is to provide a protection device for integrated circuits to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a device for protecting an integrated circuit, comprising a housing, a fixing mechanism provided inside the housing, and a heat dissipation mechanism provided on the top of the housing.

[0006] The fixing mechanism includes a support plate, which is arranged in the shell, and support frames are fixedly connected on both sides of the top of the support plate. A slide groove is provided in the support frame, and a mounting frame is slidably connected in the slide groove. One side of the mounting frame is fixedly connected to a positioning plate, and the positioning plate is arranged on the top of the support plate. A fixing rod is slidably connected in the mounting frame, and support members are fixedly connected on both sides of the surface of the fixing rod, and the support members are fixedly connected to the top of the support plate.

[0007] Preferably, a first spring is sleeved on the surface of the fixing rod, and the first spring is arranged between the two supporting members. Under the elastic force of the first spring, the positioning plates on both sides can be driven to move towards each other.

[0008] Preferably, both sides of the bottom of the shell are fixedly connected with a mounting shell, a vertical rod is fixedly connected inside the mounting shell, and the support plate is slidably connected to the surface of the vertical rod. The support plate can be supported by the vertical rod.

[0009] Preferably, second springs are sleeved on both sides of the vertical rod surface, and the second springs are arranged at the top and bottom of the support. Under the elastic potential energy of the second spring itself, it can effectively buffer the bumpy force generated during transportation, which is beneficial to protecting the integrated circuit.

[0010] Preferably, the heat dissipation mechanism includes a limiting rod, which is fixedly connected to the bottom of the shell, a cover body is inserted into the surface of the limiting rod, and the cover body is arranged on the top of the shell, and a mounting plate is fixedly connected to the surface of the limiting rod, and the mounting plate is fixedly connected to the top of the mounting shell. The cover body can be preliminarily limited by the setting of the limiting rod.

[0011] Preferably, cooling fans are fixedly connected to both sides of the cover body, and the two cooling fans are symmetrically arranged. Under the action of the cooling fans, the heat inside the shell can be quickly dissipated, thereby achieving the purpose of heat dissipation for the integrated circuit and avoiding damage caused by overheating of the integrated circuit itself.

[0012] Preferably, the surface of the limiting rod is provided with a thread, and the surface of the limiting rod is threadedly connected with a locking nut, and the cover body can be positioned by threading the locking nut to the surface of the limiting rod.

[0013] Compared with the prior art, the present invention provides a protection device for integrated circuits, which has the following beneficial effects:

[0014] 1. The integrated circuit protection device can position the integrated circuit through the provided fixing mechanism, thereby preventing the integrated circuit from shaking inside the housing and protecting the integrated circuit.

[0015] 2. The integrated circuit protection device can quickly dissipate the heat inside the shell by setting up a heat dissipation mechanism and starting the heat dissipation fan, thereby achieving the purpose of heat dissipation for the integrated circuit and avoiding damage caused by overheating of the integrated circuit itself. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without inventive work.

[0017] Figure 1 This is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the fixing mechanism of the utility model;

[0019] Figure 3 This is a schematic diagram of the heat dissipation mechanism of the utility model;

[0020] Figure 4 It is a cross-sectional schematic diagram of the heat dissipation mechanism of the present utility model.

[0021] In the figure: 1. Shell; 2. Fixing mechanism; 21. Mounting shell; 22. First spring; 23. Second spring; 24. Support plate; 25. Support frame; 26. Fixing rod; 27. Positioning plate; 28. Support member; 29. ​​Mounting frame; 3. Heat dissipation mechanism; 31. Limiting rod; 32. Locking nut; 33. Mounting plate; 34. Cover; 35. Cooling fan. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] The utility model provides a technical solution:

[0024] Example 1:

[0025] Combine Figures 1 to 2 A protection device for an integrated circuit includes a housing 1, a fixing mechanism 2 is provided inside the housing 1, and a heat dissipation mechanism 3 is provided on the top of the housing 1.

[0026] The fixing mechanism 2 includes a support plate 24, which is arranged in the shell 1. Support frames 25 are fixedly connected on both sides of the top of the support plate 24. A slide groove is provided in the support frame 25, and a mounting frame 29 is slidably connected in the slide groove. A positioning plate 27 is fixedly connected to one side of the mounting frame 29. The positioning plate 27 is arranged at the top of the support plate 24. A fixing rod 26 is slidably connected in the mounting frame 29. Support members 28 are fixedly connected on both sides of the surface of the fixing rod 26. The support member 28 is fixedly connected to the top of the support plate 24.

[0027] Furthermore, a first spring 22 is sleeved on the surface of the fixing rod 26 , and the first spring 22 is arranged between the two supporting members 28 . Under the elastic force of the first spring 22 , the positioning plates 27 on both sides can be driven to move toward each other.

[0028] Furthermore, a mounting shell 21 is fixedly connected to both sides of the bottom of the shell 1, a vertical rod is fixedly connected inside the mounting shell 21, and a support plate 24 is slidably connected to the surface of the vertical rod. The support plate 24 can be supported by the provided vertical rod.

[0029] Furthermore, second springs 23 are sleeved on both sides of the vertical rod surface, and the second springs 23 are arranged at the top and bottom of the support. Under the elastic potential energy of the second spring 23 itself, it can effectively buffer the bumpy force generated during transportation, which is beneficial to protecting the integrated circuit.

[0030] Example 2:

[0031] See Figure 3-4 On the basis of Example 1, the heat dissipation mechanism 3 is further obtained to include a limiting rod 31, which is fixedly connected to the bottom of the shell 1, and a cover 34 is inserted on the surface of the limiting rod 31, and the cover 34 is arranged on the top of the shell 1. The surface of the limiting rod 31 is fixedly connected to a mounting plate 33, and the mounting plate 33 is fixedly connected to the top of the mounting shell 21. The limit rod 31 is set to preliminarily limit the cover 34.

[0032] Furthermore, cooling fans 35 are fixedly connected to both sides of the cover 34. The two cooling fans 35 are symmetrically arranged. Under the action of the cooling fans 35, the heat inside the shell 1 can be quickly dissipated, thereby achieving the purpose of heat dissipation for the integrated circuit and avoiding damage caused by overheating of the integrated circuit itself.

[0033] Furthermore, a thread is provided on the surface of the limiting rod 31 , and a locking nut 32 is threadedly connected to the surface of the limiting rod 31 . By threading the locking nut 32 to the surface of the limiting rod 31 , the cover 34 can be positioned.

[0034] In actual operation, when the device is used, first, the support members 28 on both sides are pulled in directions away from each other, at which time the positioning plates 27 on both sides move in directions away from each other, and then the integrated circuit is placed between the positioning plates 27 on both sides, and then the support members 28 are loosened. Under the elastic force of the first spring 22, the positioning plates 27 on both sides can be driven to move toward each other, so that the integrated circuit can be positioned, thereby avoiding the shaking of the integrated circuit inside the housing 1 and protecting the integrated circuit. After the integrated circuit is fixed, the cover 34 is placed on the top of the housing 1. At this time, the limit rod 31 can be inserted into the interior of the cover body 34, and the cover body 34 can be positioned by threading the locking nut 32 to the surface of the limit rod 31. When the heat inside the shell 1 is too high, the heat dissipation fan 35 can be started. Under the action of the heat dissipation fan 35, the heat inside the shell 1 can be quickly dissipated, thereby achieving the purpose of heat dissipation for the integrated circuit and avoiding damage caused by overheating of the integrated circuit itself. When the protective device is bumpy during transportation, the elastic potential energy of the second spring 23 itself can effectively buffer the bumpy force generated during transportation, which is beneficial to protecting the integrated circuit.

[0035] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a..." does not exclude the presence of additional identical elements in the process, method, article, or device comprising the element.

Claims

1. A protection device for an integrated circuit, comprising a housing (1), characterized in that: A fixing mechanism (2) is provided in the housing (1), and a heat dissipation mechanism (3) is provided on the top of the housing (1); The fixing mechanism (2) comprises a support plate (24), the support plate (24) is arranged in the shell (1), and both sides of the top of the support plate (24) are fixedly connected with a support frame (25), a slide groove is provided in the support frame (25), a mounting frame (29) is slidably connected in the slide groove, a positioning plate (27) is fixedly connected to one side of the mounting frame (29), the positioning plate (27) is arranged on the top of the support plate (24), a fixing rod (26) is slidably connected in the mounting frame (29), and both sides of the surface of the fixing rod (26) are fixedly connected with a support member (28), and the support member (28) is fixedly connected to the top of the support plate (24).

2. The integrated circuit protection device according to claim 1, characterized in that: A first spring (22) is sleeved on the surface of the fixing rod (26), and the first spring (22) is arranged between two supporting members (28).

3. The integrated circuit protection device according to claim 1, characterized in that: Both sides of the bottom of the housing (1) are fixedly connected to a mounting shell (21), a vertical rod is fixedly connected inside the mounting shell (21), and the support plate (24) is slidably connected to the surface of the vertical rod.

4. The integrated circuit protection device according to claim 3, characterized in that: Second springs (23) are sleeved on both sides of the vertical rod surface, and the second springs (23) are arranged at the support top and bottom.

5. The integrated circuit protection device according to claim 1, characterized in that: The heat dissipation mechanism (3) comprises a limiting rod (31), each of the limiting rods (31) is fixedly connected to the inner bottom of the housing (1), a cover (34) is inserted into the surface of the limiting rod (31), the cover (34) is arranged on the top of the housing (1), and a mounting plate (33) is fixedly connected to the surface of the limiting rod (31), and the mounting plate (33) is fixedly connected to the top of the mounting shell (21).

6. The integrated circuit protection device according to claim 5, characterized in that: Both sides of the cover (34) are fixedly connected with heat dissipation fans (35), and the two heat dissipation fans (35) are symmetrically arranged.

7. The integrated circuit protection device according to claim 5, characterized in that: The surface of the limiting rod (31) is provided with a thread, and the surface of the limiting rod (31) is threadedly connected with a locking nut (32).

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