Piezoelectric ceramic controller case

Abstract

The utility model discloses a piezoelectric ceramic controller case, and relates to the technical field of piezoelectric ceramic controllers. In order to solve the technical problems that in the prior art, heat of a traditional piezoelectric controller case remains in the case and is harmful to electrical components, and disassembly and assembly are difficult, the technical scheme provided by the utility model is as follows: the piezoelectric ceramic controller case comprises an upper panel, a lower panel, an upper sub-case body and a lower sub-case body; the upper sub-box body is provided with an upper inter-plate connector which is used for being matched with the lower inter-plate connector to realize signal transmission; the upper branch box body and the lower branch box body are used for fixing a PCB, a heating element carried by the PCB in the upper branch box body makes contact with the first assembling heat dissipation plate and the second assembling heat dissipation plate, and the first assembling heat dissipation plate and the second assembling heat dissipation plate are used for guiding heat out of the case. The heating element in the lower branch box body is installed on the PCB in the lower branch box body through the processing heat dissipation plate, and the processing heat dissipation plate is used for guiding heat out of the case. The controller case can be applied to a controller case which needs to be used in a special environment.

Description

Technical Field

[0001] The present invention relates to the technical field of piezoelectric ceramic controllers, and in particular to a piezoelectric ceramic controller. Background Art

[0002] Piezoelectric controllers, as high-precision control devices, are widely used in various high-tech fields. Traditional piezoelectric controllers typically consist of stacked layers of printed circuit boards (PCBs), a design that enables complex functionality. These layers are connected by connectors to achieve coordinated control of the entire system. However, this design presents several technical challenges in practical application.

[0003] First, heat dissipation is a key challenge in multilayer piezoelectric ceramic controllers. Under normal circumstances, fans are typically used for cooling to effectively dissipate heat. However, in some special environments, such as a vacuum, fans are unable to circulate air, preventing the effective removal of heat. In these cases, heat is trapped inside the chassis, adversely affecting electrical components and, in severe cases, causing overheating or even damage to the device.

[0004] Secondly, maintenance issues significantly impact the practical application of multilayer piezoelectric ceramic controllers. For single-layer piezoelectric ceramic controllers, maintenance is relatively simple, requiring only opening the chassis. However, when controllers are designed with multilayer stacked structures, disassembly and assembly become significantly more difficult due to the entanglement of various leads and connectors. Repairs often require disassembly of the entire device, which is not only time-consuming and labor-intensive but can also lead to increased downtime, impacting its efficiency and reliability.

[0005] In summary, heat dissipation and maintenance issues are particularly prominent in the application of multilayer piezoelectric ceramic controllers. These technical challenges need to be addressed urgently to improve the performance of the equipment and facilitate maintenance. Summary of the Invention

[0006] To solve the technical problems in the prior art, the traditional piezoelectric controller chassis cannot use a fan in some special environments, heat will be retained in the chassis and harmful to the electrical components, and after multiple layers are stacked, various leads will be entangled, making disassembly and assembly difficult, and maintenance usually requires disassembly of the entire machine. The technical solution provided by the utility model is as follows:

[0007] Piezoelectric ceramic controller chassis, including:

[0008] An upper panel and a lower panel, and an upper sub-box and a lower sub-box disposed between the upper panel and the lower panel, wherein the upper sub-box is close to the upper panel;

[0009] The upper sub-box is provided with an upper inter-board connector for cooperating with the lower inter-board connector to realize signal transmission;

[0010] The lower inter-board connector is arranged on the lower sub-box body;

[0011] The upper and lower sub-boxes are used to fix the PCB board.

[0012] The heating element carried by the PCB board in the upper sub-box is in contact with the first and second heat sinks, and the first and second heat sinks are used to conduct heat from the heating element carried by the PCB board in the upper sub-box to the outside of the chassis;

[0013] The heating elements in the lower sub-box are mounted on a PCB in the lower sub-box via a processed heat sink. The processed heat sink is used to conduct heat from the heating elements in the lower sub-box to the outside of the chassis.

[0014] Furthermore, a preferred embodiment is provided, wherein the upper panel, the upper sub-box, the lower sub-box and the lower panel are detachably connected.

[0015] Furthermore, a preferred embodiment is provided in which the heating surface of the heating element in the lower sub-box contacts the processing heat dissipation plate.

[0016] Furthermore, a preferred embodiment is provided, wherein the processing heat dissipation plate and the PCB board in the lower sub-box are an integrated structure.

[0017] Furthermore, a preferred embodiment is provided, wherein the processed heat dissipation plate and the lower sub-box are an integrated structure.

[0018] Furthermore, a preferred embodiment is provided, wherein the upper panel is also provided with an upper heat sink 1 and an upper heat sink 2, which are used to contact the heating elements carried by the PCB board in the upper sub-box body, and to conduct the heat of the heating elements carried by the PCB board in the upper sub-box body to the outside of the chassis.

[0019] Furthermore, a preferred embodiment is provided in which the lower panel is further provided with a heat dissipation portion for contacting the heating element in the lower sub-box body and dissipating the heat of the heating element in the lower sub-box body to the outside of the chassis.

[0020] Furthermore, a preferred embodiment is provided, wherein the heat dissipation portion is a thickened panel.

[0021] Furthermore, a preferred embodiment is provided, wherein the upper inter-board connector and the lower inter-board connector cooperate to achieve signal transmission between the PCB board in the upper sub-box and the PCB board in the lower sub-box.

[0022] Furthermore, a preferred embodiment is provided, wherein the first heat sink plate and the second heat sink plate are respectively arranged on the PCB boards in the upper sub-box.

[0023] Compared with the prior art, the technical solution provided by the present invention is beneficial in that:

[0024] This piezoelectric ceramic controller chassis incorporates a heat sink on the heating surface of the electrical components, transferring heat to the chassis housing. This allows for both heat radiation and conduction, improving heat dissipation. Compared to traditional air cooling, this solution eliminates the need for fans and can achieve cooling within the chassis even in specialized environments.

[0025] The piezoelectric ceramic controller chassis provided by this utility model allows for flexible adjustment of the heat sink's position based on the structure and location of the PCB and its components, ensuring direct contact with the heating elements, thereby enhancing heat dissipation. Furthermore, the outer heat sink can directly contact the chassis, while the inner heat sink can be integrated with the chassis to accommodate the structural requirements of different controller types.

[0026] The piezoelectric ceramic controller chassis provided by this utility model has each PCB board installed in its own independent sub-chassis. The sub-chassis are connected by screws, and the boards are connected in series via inter-board connectors. This design allows each sub-chassis to be independently disassembled and repaired, improving maintenance convenience.

[0027] Compared with the existing research status, the piezoelectric ceramic controller chassis provided by the utility model improves the heat dissipation effect and the convenience of maintenance by improving the heat dissipation and maintenance methods of traditional piezoelectric controllers.

[0028] Compared with the traditional air cooling method, the piezoelectric ceramic controller chassis provided by the utility model does not need to rely on fans and can cool the inside of the chassis under special circumstances.

[0029] The piezoelectric ceramic controller chassis provided by the utility model can improve the efficiency and convenience of maintenance through the design of independent disassembly and maintenance.

[0030] The piezoelectric ceramic controller case provided by the utility model can be applied to a controller case that needs to be used in special environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is an exploded view of the piezoelectric ceramic controller chassis;

[0032] Figure 2 for Figure 1 Main view of the upper middle panel;

[0033] Figure 3 for Figure 1 Main view of the upper and middle sub-box;

[0034] Figure 4 for Figure 1Rear view of the upper and middle sub-box;

[0035] Figure 5 for Figure 1 Main view of the middle and lower sub-box;

[0036] Figure 6 for Figure 1 Rear view of the middle and lower sub-box;

[0037] Figure 7 for Figure 1 Schematic diagram of heating element;

[0038] Figure 8 for Figure 1 Main view of the lower middle panel.

[0039] Among them, 1-upper panel, 101-upper heat sink one, 102-upper heat sink two 102, 103-upper panel edge, 2-upper sub-box, 201-equipped heat sink one, 202-equipped heat sink two, 203-upper sub-box edge, 204-fixing bar, 205-upper panel connector, 3-lower sub-box, 301-processed heat sink, 302-heating element, 3021-non-heating surface of the element, 3022-heating surface of the element, 303-lower sub-box edge, 304-non-heating element, 305-lower board connector, 4-lower panel, 401-heating part, 402-non-heating part, 403-lower panel edge. DETAILED DESCRIPTION

[0040] In order to make the advantages and benefits of the technical solution provided by the present invention more clearly reflected, the technical solution provided by the present invention is now further described in detail with reference to the accompanying drawings, specifically:

[0041] Embodiment 1: This embodiment provides a piezoelectric ceramic controller chassis, including:

[0042] An upper panel and a lower panel, and an upper sub-box and a lower sub-box disposed between the upper panel and the lower panel, wherein the upper sub-box is close to the upper panel;

[0043] The upper sub-box is provided with an upper inter-board connector for cooperating with the lower inter-board connector to realize signal transmission;

[0044] The lower inter-board connector is arranged on the lower sub-box body;

[0045] The upper and lower sub-boxes are used to fix the PCB board.

[0046] The heating element carried by the PCB board in the upper sub-box is in contact with the first and second heat sinks, and the first and second heat sinks are used to conduct heat from the heating element carried by the PCB board in the upper sub-box to the outside of the chassis;

[0047] The heating elements in the lower sub-box are mounted on a PCB in the lower sub-box via a processed heat sink. The processed heat sink is used to conduct heat from the heating elements in the lower sub-box to the outside of the chassis.

[0048] Embodiment 2: This embodiment further limits the piezoelectric ceramic controller chassis provided in Embodiment 1, wherein the upper panel, the upper sub-box, the lower sub-box and the lower panel are detachably connected.

[0049] Implementation method 3: This implementation method further limits the piezoelectric ceramic controller chassis provided in implementation method 1, wherein the heating surface of the heating element in the lower sub-box contacts the processed heat dissipation plate.

[0050] Implementation 4: This implementation further limits the piezoelectric ceramic controller chassis provided in Implementation 3. The processed heat sink and the PCB board in the lower sub-box are an integrated structure.

[0051] Embodiment 5: This embodiment further limits the piezoelectric ceramic controller chassis provided in Embodiment 1, wherein the processed heat dissipation plate and the lower sub-box are an integrated structure.

[0052] Implementation method six. This implementation method further limits the piezoelectric ceramic controller chassis provided in implementation method one. The upper panel is also provided with an upper heat sink one and an upper heat sink two, which are used to contact the heating elements carried by the PCB board in the upper sub-box body, and export the heat of the heating elements carried by the PCB board in the upper sub-box body to the outside of the chassis.

[0053] Implementation 7. This implementation further limits the piezoelectric ceramic controller chassis provided in Implementation 1. The lower panel is further provided with a heat dissipation portion for contacting the heating element in the lower sub-box to conduct the heat of the heating element in the lower sub-box to the outside of the chassis.

[0054] Embodiment 8: This embodiment further limits the piezoelectric ceramic controller chassis provided in Embodiment 7, and the heat dissipation portion is a thickened panel.

[0055] Implementation 9: This implementation further limits the piezoelectric ceramic controller chassis provided in Implementation 1. The upper inter-board connector and the lower inter-board connector cooperate to achieve signal transmission between the PCB board in the upper sub-box and the PCB board in the lower sub-box.

[0056] Implementation 10: This implementation further limits the piezoelectric ceramic controller chassis provided in Implementation 1. The first heat sink and the second heat sink are respectively provided on the PCB board in the upper sub-chassis.

[0057] Implementation Method 11: Combination Figure 1-8 This embodiment further clearly and completely describes the technical solution provided above through specific examples, specifically:

[0058] The purpose of this embodiment is to provide a piezoelectric ceramic controller chassis that can be used in special environments. During use, the heating surfaces of all heat-generating electronic components are in direct contact with the chassis, and all heat is transferred from the chassis in the form of conduction and radiation. The multi-layer PCB boards are installed in their own independent sub-chassis, and each chassis can be removed separately. This utility model is achieved by the following methods:

[0059] Install a heat sink on the heating surface of the heating electrical component. The heat sink is in direct contact with or integrated with the chassis shell, so that the generated heat can be transferred out through the chassis shell.

[0060] The heating elements on the side can directly dissipate heat by contacting the heat dissipation surface with the panel, or heat dissipation plates of different specifications can be installed to conduct heat to the panel. The heating elements on the inside can be equipped with a heat dissipation plate integrated with the chassis between the heat dissipation surface and the PCB board for heat conduction.

[0061] Each layer of PCB is installed in its own independent sub-chassis, which are connected by screws, and the boards are connected in series using inter-board connectors.

[0062] like Figure 1 As shown, a schematic diagram of the overall piezoelectric ceramic controller chassis that can be used in special environments includes an upper panel 1, an upper sub-box 2, a lower sub-box 3 and a lower panel 4. The upper panel 1, the upper sub-box 2, the lower sub-box 3 and the lower panel 4 are connected in sequence from top to bottom by screws to form a closed box, and each box can be disassembled and installed separately.

[0063] like Figure 2-4 As shown, a schematic diagram of the connection between the upper panel and the upper sub-box includes an upper heat sink 101, an upper heat sink 202, an upper panel edge 103, a matching heat sink 201, a matching heat sink 202, an upper sub-box edge 203, a fixing bar 204, and an upper inter-board connector 205. The upper inter-board connector 205 is mounted on the PCB and can transmit signals to the lower layer.

[0064] A PCB is installed in the upper housing 2. When the main heat generating component of the installed PCB is a chip, a heat sink that meets the chip specifications can be processed and matched with the chip. The heat sink is installed to a position connected to the heat dissipation surface of the chip. The heat sink 1 201 and the heat sink 2 202 are respectively installed on the fixing bar 204 on the other side of the PCB by multiple screws. The heat sink can have various specifications and shapes. The heat sink 1 201 and the heat sink 2 202 are not the only types that can be installed.

[0065] The upper sub-box 2 is connected to the upper panel 1 with screws. The positioning screws pass through the through holes on the upper panel edge 103 and the upper sub-box edge 203 respectively to complete the positioning of the two. The upper sub-box 2 can be disassembled and installed separately.

[0066] like Figure 5-7 As shown, the lower sub-box 3 includes a processed heat dissipation plate 301, a heating element 302, a non-heating surface 3021 of the element, a heating surface 3022 of the element, a lower sub-box side 303, a non-heating element 304, and a lower inter-board connector 305. The lower board connector 305 is mounted on the PCB board and connected to the upper board connector 205. Signals can be transmitted between the two, and disassembly and assembly can be directly plugged in and out.

[0067] The lower sub-box 3 is installed with a PCB board. To maintain the normal function of the PCB board, a heating element 302 and a non-heating element 304 are provided. The non-heating element 304 is a conventional electrical component and can be directly installed on the PCB board. The heating element 302 can be divided into two sides: a non-heating surface 3021 and a heating surface 3022. During installation, the heating surface 3022 is installed on the PCB board through the processed heat sink 301, so that heat can be directly transferred to the processed heat sink 301.

[0068] The heat dissipation plate 301 is processed integrally with the box body, and the processing position is determined according to the position of the heating element 302 on the PCB board. The processing area and position can be determined according to the position of the heating element 302;

[0069] The lower sub-box body 3 is connected to the upper sub-box body side 203 by screws through the lower sub-box body side 303 to complete the positioning of the two, and the lower sub-box body 3 can be disassembled and installed separately;

[0070] like Figure 8 As shown, the lower panel 4 includes a heat dissipation portion 401, a non-heat dissipation portion 402, and a lower panel edge 403;

[0071] The heat dissipation portion 401 and the non-heat dissipation portion 402 together constitute the lower panel 4. The area and position of the two are determined according to the position of the electrical components on the PCB board. The non-heat dissipation portion 402 is a conventional panel, and the heat dissipation portion 401 is a thickened panel, which can be in direct contact with the components that need to be cooled, thereby achieving a heat dissipation effect. The lower panel edge 403 is used to fix the lower panel 4 on the lower sub-box body 3 by screws.

[0072] Working principle: In some environments where fan cooling is not possible, the piezoelectric ceramic controller can transfer the generated heat to the outer surface of the chassis through various heat dissipation plates and panels, through direct contact with the heating surface 3022 of the heating element 302, thereby cooling the inside of the chassis and ensuring the normal operation of the electrical components. At the same time, each sub-chassis and its internal PCB board are installed independently, and each sub-chassis is an independent entity. The sub-chassis are connected by plate connectors to achieve series control, ensuring normal use while having the function of convenient disassembly and maintenance.

[0073] The utility model works according to the above method and has the following beneficial effects:

[0074] The heating surfaces of the heating electrical components are in direct contact with the heat sink, which is either in direct contact with the chassis or is part of the chassis. The heat generated by the heating electrical components is transferred to the chassis through the heat sink and then radiated out, thus achieving cooling inside the chassis without the need for a fan.

[0075] The heat sink can be flexibly adjusted according to the structure and position of the PCB board and the electrical components on it. The outer heat sink can be in direct contact with the chassis, and the inner heat sink can be processed to be integrated with the chassis, meeting the structural requirements of all types of controllers.

[0076] Each layer of PCB board can be installed separately in the sub-chassis of each layer. The sub-chassis of each layer can be disassembled and assembled independently, and the boards are connected through board connectors to complete the series connection of signals.

[0077] The above further describes in detail the technical solution provided by the present invention through several specific implementation methods in order to highlight the advantages and benefits of the technical solution provided by the present invention. However, the several specific implementation methods described above are not intended to limit the present invention. Any reasonable modification and improvement of the present invention, combination of implementation methods and equivalent replacement based on the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. Piezoelectric ceramic controller chassis, characterized in that, include: An upper panel and a lower panel, and an upper sub-box and a lower sub-box disposed between the upper panel and the lower panel, wherein the upper sub-box is close to the upper panel; The upper sub-box is provided with an upper inter-board connector for cooperating with the lower inter-board connector to realize signal transmission; The lower inter-board connector is arranged on the lower sub-box body; The upper and lower sub-boxes are used to fix the PCB board. The heating element carried by the PCB board in the upper sub-box is in contact with the first and second heat sinks, and the first and second heat sinks are used to conduct heat from the heating element carried by the PCB board in the upper sub-box to the outside of the chassis; The heating elements in the lower sub-box are mounted on a PCB in the lower sub-box via a processed heat sink. The processed heat sink is used to conduct heat from the heating elements in the lower sub-box to the outside of the chassis.

2. The piezoelectric ceramic controller chassis according to claim 1, characterized in that: The upper panel, the upper sub-box, the lower sub-box and the lower panel are detachably connected.

3. The piezoelectric ceramic controller chassis according to claim 1, characterized in that: The heating surface of the heating element in the lower sub-box contacts the processing heat dissipation plate.

4. The piezoelectric ceramic controller chassis according to claim 3, characterized in that: The processed heat dissipation plate and the PCB board in the lower sub-box are an integrated structure.

5. The piezoelectric ceramic controller chassis according to claim 1, characterized in that: The processed heat dissipation plate and the lower sub-box are an integrated structure.

6. The piezoelectric ceramic controller chassis according to claim 1, characterized in that: The upper panel is further provided with an upper heat sink 1 and an upper heat sink 2, which are used to contact the heating elements carried by the PCB board in the upper sub-box body and conduct the heat of the heating elements carried by the PCB board in the upper sub-box body to the outside of the chassis.

7. The piezoelectric ceramic controller chassis according to claim 1, characterized in that: The lower panel is further provided with a heat dissipation portion for contacting the heating element in the lower sub-box body and dissipating the heat of the heating element in the lower sub-box body to the outside of the chassis.

8. The piezoelectric ceramic controller chassis according to claim 7, characterized in that: The heat dissipation portion is a thickened panel.

9. The piezoelectric ceramic controller chassis according to claim 1, characterized in that: The upper inter-board connector and the lower inter-board connector cooperate to realize signal transmission between the PCB board in the upper sub-box and the PCB board in the lower sub-box.

10. The piezoelectric ceramic controller chassis according to claim 1, characterized in that: The first heat sink and the second heat sink are respectively arranged on PCB boards in the upper sub-box.

Images