Heat dissipation device

Abstract

The utility model discloses a heat dissipation device which comprises a water-cooling row assembly, a fan fixing structure and at least two fans, and the fan fixing structure is arranged on the water-cooling row assembly. The at least two fans are arranged side by side and are arranged on the fan fixing structure. According to the utility model, the fans arranged side by side are fixed through the fan fixing structure, so that the assembly of the heat dissipation device can be modularized; meanwhile, through cooperation of the spring needles and the golden fingers, the use of wires is greatly reduced while fan driving is achieved; and the work of the heat dissipation device can be monitored in real time through the display screen.

Description

Technical Field

[0001] The utility model relates to a heat dissipation device, in particular to a modular heat dissipation device. Background Art

[0002] Electronic devices and machinery typically generate high temperatures during operation, so manufacturers often install heat sinks to dissipate this heat. Existing heat sinks typically utilize fans. However, as component power consumption increases, heat sinks with independent fans are increasingly unable to meet cooling requirements. Therefore, integrating multiple fans into a single heat sink has become a growing trend.

[0003] In the prior art, structures in which multiple fans are configured in a heat dissipation device often have wires entangled with each other, causing clutter inside the chassis. In addition, each fan requires a corresponding power cord, which also causes wire redundancy and makes assembly and disassembly inconvenient.

[0004] Therefore, how to overcome the above-mentioned defects has become one of the problems that R&D personnel should solve. Utility Model Content

[0005] The utility model provides a heat dissipation device, which includes:

[0006] Water cooling radiator assembly;

[0007] A fan fixing structure is installed on the water cooling radiator assembly;

[0008] At least two fans are arranged side by side and mounted on the fan fixing structure.

[0009] The above-mentioned heat dissipation device, wherein the fan fixing structure includes:

[0010] A bottom frame, mounted on the water-cooling radiator assembly;

[0011] Two side guards are provided on the water cooling radiator assembly and are respectively located on both sides of the bottom frame;

[0012] A front guard is provided at the front side of the bottom frame and connected to the bottom frame;

[0013] The front guard and the two side guards are arranged to form a receiving area, and at least two fans are installed side by side in the receiving area.

[0014] The above-mentioned heat dissipation device, wherein the bottom frame includes four surrounding and connected frames, the inner side of the connection between each two frames has a protruding first fixing portion, and the first fixing portion is provided with a first fixing hole; the inner sides of the two opposite frames each have at least one protruding second fixing portion, and the second fixing portion is provided with a second fixing hole, and the heat dissipation device also includes a plurality of fixing parts, which are connected to the fan by the fixing parts passing through the first fixing holes and the second fixing holes to lock the fan on the bottom frame.

[0015] In the above-mentioned heat dissipation device, a power interface is provided on one of the side guards, and the power interface is used to connect to an external power source.

[0016] The above-mentioned heat dissipation device, wherein each of the fans has a spring pin, and at least one groove is formed on the outer side of the frame. The heat dissipation device also includes at least one gold finger, which is electrically connected to the power interface and is correspondingly installed in the groove. When the fan is locked on the bottom frame, the spring pin is correspondingly electrically connected to the gold finger, so that the power interface, the gold finger and the spring pin form a power supply path.

[0017] In the above-mentioned heat dissipation device, the water-cooling radiator assembly includes: a water-cooling radiator and a water-cooling pipeline. At least one through hole is opened on one of the side guards, and one end of the water-cooling pipeline passes through the through hole and is connected to the water-cooling radiator.

[0018] In the above-mentioned heat dissipation device, the side block provided with the through hole and the side block provided with the power interface are the same side block or different side blocks.

[0019] The above-mentioned heat dissipation device, wherein the front guard is connected to the side guard.

[0020] The above-mentioned heat dissipation device further includes: a display screen, which is installed on the front screen, and a temperature sensor is integrated inside each of the fans. The temperature sensor is electrically connected to the display screen, and the display screen is used to display the temperature information collected by the temperature sensor.

[0021] In the above-mentioned heat dissipation device, at least one of the grooves can be provided on the same frame or on different frames.

[0022] In the above-mentioned heat dissipation device, the bottom frame, the side guards and the front guard are an integrally formed structure.

[0023] According to the heat dissipation device of the above embodiment, the fans arranged side by side are fixed by a fan fixing structure so that the assembly of the heat dissipation device can be modularized; at the same time, the cooperation of spring pins and gold fingers can greatly reduce the use of wires while realizing fan driving; the operation of the heat dissipation device can be monitored in real time through the display screen.

[0024] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention and to provide further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a three-dimensional schematic diagram of the heat dissipation device of the present invention.

[0026] Figure 2 A three-dimensional schematic diagram of a fan.

[0027] Figure 3 The following is a schematic diagram of the fan installation.

[0028] Figure 4 This is a three-dimensional schematic diagram from one perspective of the fan fixing structure.

[0029] Figure 5 This is a three-dimensional schematic diagram from another perspective of the fan fixing structure.

[0030] Figure 6 It is a three-dimensional schematic diagram of the bottom frame.

[0031] Wherein, the reference numerals:

[0032] Water cooling radiator assembly 1

[0033] Water cooling radiator 11

[0034] Water cooling pipe 12

[0035] Fan fixing structure 2

[0036] Bottom frame 21

[0037] Borders 211, 212, 213, 214

[0038] Groove C1

[0039] First fixing portion 215

[0040] First fixing hole K1

[0041] Second fixing portion 216

[0042] Second fixing hole K2

[0043] Fixing 217

[0044] Side guards 22, 23

[0045] Power interface 221

[0046] Through hole K4

[0047] Front 24

[0048] Accommodation area S

[0049] Fan 3

[0050] Spring pin 31

[0051] The third fixing hole K3

[0052] Goldfinger 4

[0053] Display 5 DETAILED DESCRIPTION

[0054] See also Figure 1 , Figure 1 This is a three-dimensional schematic diagram of the heat dissipation device of the utility model. Figure 1 As shown, a heat dissipation device of the present invention comprises: a water-cooling radiator assembly 1, a fan fixing structure 2 and at least two fans 3, wherein the fan fixing structure 2 is mounted on the water-cooling radiator assembly 1; at least two of the fans 3 are arranged side by side and mounted on the fan fixing structure 2. The present invention fixes the side-by-side fans 3 through the fan fixing structure 2 so that the assembly of the heat dissipation device can be modularized.

[0055] See also Figure 2-Figure 6 , Figure 2 is a three-dimensional schematic diagram of a fan; Figure 3 This is a schematic diagram of the fan installation; Figure 4 A three-dimensional schematic diagram of a fan fixing structure from one perspective; Figure 5 A three-dimensional schematic diagram of the fan fixing structure from another perspective; Figure 6 is a three-dimensional schematic diagram of the bottom frame. Figure 2-Figure 6 Please combine with Figure 1 The fan fixing structure 2 includes: a bottom frame 21, two side blocks 22, 23 and a front block 24, the bottom frame 21 is installed on the water-cooling radiator assembly 1; the two side blocks 22, 23 are provided on the water-cooling radiator assembly 1 and are respectively located on both sides of the bottom frame 21; the front block 24 is provided on the front side of the bottom frame 21 and connected to the bottom frame 21; wherein the front block 24 and the two side blocks 22, 23 enclose a accommodating area S, and at least two fans 3 are installed side by side in the accommodating area S.

[0056] In one embodiment of the present invention, the front bumper 24 may also be connected to the side bumpers 22 and 23 .

[0057] It should be noted that, in this embodiment, the bottom frame 21, the side guards 22, 23 and the front guard 24 are separate structures, but in another embodiment of the present invention, the bottom frame 21, the side guards 22, 23 and the front guard 24 may also be an integrally formed structure.

[0058] Furthermore, the bottom frame 21 includes four surrounding frames 211, 212, 213, and 214. The inner side of the connection between each two frames 211, 212, 213, and 214 has a protruding first fixing portion 215, and the first fixing portion 215 has a first fixing hole K1. The inner sides of the two opposing frames 211 and 213 each have at least one protruding second fixing portion 216, and the second fixing portion 216 has a second fixing hole K2. The heat dissipation device also includes a plurality of fixing members 217. The fan has a third fixing hole K3. The plurality of fixing members 217 are respectively inserted into the first fixing hole K1 and the second fixing hole K2 and connected to the third fixing hole K3 to lock the fan 3 to the bottom frame 21.

[0059] In this embodiment, two second fixing portions 216 are provided on each of the frames 211 and 213 , and each second fixing portion 216 has two second fixing holes K2 to accommodate the installation of three fans 3 . However, the present invention does not limit the number of the second fixing portions 216 and the second fixing holes K2 .

[0060] Furthermore, each fan 3 has a spring pin 31. At least one groove C1 is formed on the outer side of the frame 211. The heat dissipation device also includes at least one gold finger 4, which is correspondingly installed in the groove C1. The side guard 22 is provided with a power interface 221, which is used to connect to an external power source. The gold finger 4 is electrically connected to the power interface 221. When the fan 3 is locked on the bottom frame 21, the spring pin 31 is correspondingly electrically connected to the gold finger 4, so that the power interface 221, the gold finger 4 and the spring pin 31 form a power supply path. At the same time, the cooperation between the spring pin 31 and the gold finger 4 can achieve fan drive while significantly reducing the use of wires.

[0061] It should be noted that, in this embodiment, the three grooves C1 are all opened on the outer side of the frame 211 for installing the gold fingers 4, but the present invention is not limited to this. In other embodiments, the designer can adjust the position of the groove C1 according to the fan type. For example, the three grooves C1 are all opened on the outer side of the frame 213, or the middle groove C1 is opened on the outer side of the frame 213 and the grooves C1 at both ends are opened on the outer side of the frame 211.

[0062] Furthermore, the water-cooling radiator assembly 1 includes: a water-cooling radiator 11 and a water-cooling pipe 12. The side guard 23 is provided with at least one through hole K4. One end of the water-cooling pipe 12 passes through the through hole 24 and is connected to the water-cooling radiator 11.

[0063] It should be noted that, in the present embodiment, the power interface 221 is provided on the side guard 22 and the through hole K4 is opened on the side guard 23, but the present invention is not limited to this. In other embodiments, designers can make adjustments according to the connection position of the water cooling radiator 11 and the water cooling pipe 12, for example, the power interface 221 is provided on the side guard 22 and the through hole K4 is opened, or the power interface 221 is provided on the side guard 23 and the through hole K4 is opened.

[0064] Furthermore, the heat dissipation device also includes: a display screen 5, which is installed on the front screen 24, and a temperature sensor (not shown) is integrated inside each of the fans 3, and the temperature sensor is electrically connected to the display screen 5, and the display screen 5 is used to display the temperature information collected by the temperature sensor.

[0065] In summary, the utility model fixes the fans arranged side by side through the fan fixing structure so that the assembly of the heat dissipation device can be modularized; at the same time, the cooperation of the spring pins and the gold fingers can greatly reduce the use of wires while realizing fan driving; the operation of the heat dissipation device can be monitored in real time through the display screen.

[0066] Although the present invention is disclosed above with reference to the aforementioned embodiments, they are not intended to limit the present invention. Any person skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of protection of the claims attached to this application.

Claims

1. A heat dissipation device, characterized in that: Include: Water cooling radiator assembly; A fan fixing structure is mounted on the water-cooling radiator assembly, and the fan fixing structure includes: a bottom frame, mounted on the water-cooling radiator assembly, the bottom frame including four surrounding and connected frames, and at least one groove is formed on the outer side of the frame; At least two fans, at least two of the fans are arranged side by side and mounted on the fan fixing structure, each of the fans having a spring pin; At least one gold finger is correspondingly installed in the groove. When the fan is locked on the bottom frame, the spring is correspondingly electrically connected to the gold finger.

2. The heat dissipation device according to claim 1, wherein: The fan fixing structure further includes: Two side guards are provided on the water cooling radiator assembly and are respectively located on both sides of the bottom frame; A front guard is provided at the front side of the bottom frame and connected to the bottom frame; The front guard and the two side guards are arranged to form a receiving area, and at least two fans are installed side by side in the receiving area.

3. The heat dissipation device according to claim 2, wherein: The inner side of the connection between each two frames has a protruding first fixing portion, and the first fixing portion is provided with a first fixing hole; the inner sides of the two opposite frames each have at least one protruding second fixing portion, and the second fixing portion is provided with a second fixing hole. The heat dissipation device also includes a plurality of fixing parts, which are connected to the fan by the fixing parts passing through the first fixing holes and the second fixing holes to lock the fan on the bottom frame.

4. The heat dissipation device according to claim 3, wherein: A power interface is provided on the side guard, and the power interface is used to connect to an external power source.

5. The heat dissipation device according to claim 4, wherein: The gold finger is electrically connected to the power interface. When the fan is locked on the bottom frame, the power interface, the gold finger and the spring pin form a power supply path.

6. The heat dissipation device according to claim 4, wherein: The water-cooling radiator assembly includes a water-cooling radiator and a water-cooling pipeline. At least one through hole is opened on one side block, and one end of the water-cooling pipeline passes through the through hole and is connected to the water-cooling radiator.

7. The heat dissipation device according to claim 6, wherein: The side block provided with the through hole and the side block provided with the power interface are the same side block or different side blocks.

8. The heat dissipation device according to claim 2, wherein: The front bumper is connected to the side bumper.

9. The heat dissipation device according to claim 2, wherein: Also includes: A display screen is installed on the front screen, a temperature sensor is integrated inside each of the fans, and the temperature sensor is electrically connected to the display screen, and the display screen is used to display the temperature information collected by the temperature sensor.

10. The heat dissipation device according to claim 5, wherein: At least one of the grooves is formed on the same frame or on different frames.

11. The heat dissipation device according to claim 2, wherein: The bottom frame, the side guard and the front guard are an integrally formed structure.

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