Shielding cover and PCB module

Abstract

The embodiment of the utility model provides a shielding case and a PCB module. The shield case includes: a shield case body having an opening; a semi-rolling structure; the semi-rolling structure is arranged on the shielding case main body and surrounds the circumferential edge of the opening; and the shielding case main body is in contact with the soldering tin at one end where the opening is located, so that the soldering tin covers at least part of the semi-rolling structure. According to the shielding case, the semi-rolled circle structure is adopted to replace a plane structure of a traditional shielding case, so that the welding surface of the shielding case is an arc surface, the shielding case can meet the shielding performance, and meanwhile, the contact area of the shielding case during welding can be effectively increased; therefore, the welding strength of the shielding case at the welding surface and the reliability of the shielding case at the welding surface are improved, the flatness of the shielding case after welding is improved, and the welding reject ratio of the shielding case is reduced. In addition, compared with a plane, the arc surface is more beneficial to tin climbing during SMT welding, so that the connectivity and the welding efficiency of the shielding case are enhanced.

Description

Technical Field

[0001] The utility model relates to the technical field of shielding covers, in particular to a shielding cover and a PCB module. Background Art

[0002] Shielding covers are mainly used in electronic products such as mobile phones and GPS (Global Positioning System) to prevent electromagnetic interference and shield electronic components on PCB (Printed Circuit Board).

[0003] Generally speaking, when performing SMT (Surface Mount Technology) patch mounting, it is usually necessary to use solder to solder the shielding cover to the PCB board to prevent at least one electronic component on the PCB board from being interfered by external signals.

[0004] However, the contact surface (or welding surface) for welding the existing shielding cover and the PCB board is usually flat (that is, the welding structure of the existing shielding cover is a flat structure), which results in a small effective contact area between the solder and the shielding cover when the two are welded (that is, the contact area of ​​the flat structure at the welding position is small), making it impossible for the two to grab enough solder during welding, thereby reducing the welding reliability and welding strength between the two.

[0005] In addition, it is difficult to achieve consistent planes between the existing shielding cover and the PCB board after welding, resulting in a defect of poor flatness, which leads to a high welding defect rate, further affecting product quality and wasting resources. Utility Model Content

[0006] The shielding cover and PCB module provided by the present invention are intended to solve at least some of the defects existing in the welding of the existing shielding cover and PCB board.

[0007] In a first aspect, the present invention provides a shielding cover. The shielding cover comprises:

[0008] A shielding cover body; the shielding cover body has an opening;

[0009] A semi-rolled structure; the semi-rolled structure is arranged on the shielding cover body and surrounds the circumferential edge of the opening;

[0010] The shielding cover body contacts the solder at one end where the opening is located, so that the solder covers at least a portion of the semi-rolled structure.

[0011] In some embodiments, the semi-rolled structure has a first arc surface, a second arc surface, and a connecting plane;

[0012] The two sides of the coupling plane are connected to the first arc surface and the second arc surface respectively.

[0013] In some embodiments, one side of the first arc surface is connected to the outer surface of the shield body, and the other side of the first arc surface is connected to one side of the coupling plane.

[0014] In some embodiments, one side of the second arc surface is connected to the inner surface of the shield body, and the other side of the second arc surface is connected to the other side of the coupling plane.

[0015] In some embodiments, the first arc surface has a first radius, the second arc surface has a second radius, and the first radius is smaller than the second radius.

[0016] In some embodiments, the first arc surface, the coupling plane, and the outer surface of the shield body enclose a rounded groove with a gap.

[0017] In some embodiments, at least a portion of the solder can climb along the second arc surface and fill into the rounded groove through the gap.

[0018] In some embodiments, the shield body comprises:

[0019] A cover plate and a plurality of side walls; the plurality of side walls protrude from the cover plate, and the ends of the plurality of side walls away from the cover plate enclose the opening.

[0020] In a second aspect, the utility model provides a PCB module. The PCB module comprises a PCB board and the shield mentioned above;

[0021] The half-rounded structure of the shield faces the PCB board, and at least a part of the half-rounded structure abuts against the surface of the PCB board, so that the shield is welded on the PCB board.

[0022] In some embodiments, the PCB board is provided with a plurality of electronic components, and the shield can cover at least one of the electronic components.

[0023] At least one beneficial effect of the shielding cover and PCB module provided by the embodiment of the present utility model is that the shielding cover adopts a semi-rolled circular structure to replace the flat structure of the traditional shielding cover, so that the welding surface of the shielding cover is a circular arc surface. While satisfying the shielding performance, the shielding cover can also effectively increase the contact area of ​​the shielding cover during welding, thereby increasing the welding strength of the shielding cover at the welding surface and improving the welding reliability of the shielding cover at the welding surface, further improving the flatness of the shielding cover after welding, and reducing the welding defect rate of the shielding cover. In addition, compared with a flat surface, the circular arc surface is more conducive to solder creep during SMT welding, thereby further enhancing the connectivity and welding efficiency of the shielding cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] One or more embodiments are exemplarily illustrated by corresponding drawings, which do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as the same elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0025] Figure 1 A schematic structural diagram of a PCB module provided in an embodiment of the present utility model;

[0026] Figure 2 A schematic cross-sectional view of a PCB module provided in an embodiment of the present invention;

[0027] Figure 3 The embodiment of the present invention provides Figure 2 A local enlarged view at point A;

[0028] Figure 4 A schematic structural diagram of a shielding cover provided in an embodiment of the present utility model;

[0029] Figure 5 This is a cross-sectional diagram of a conventional shielding cover welded on a conventional PCB board;

[0030] Figure 6 for Figure 5 A partial enlarged view at point B.

[0031] Reference numerals:

[0032] 1000, PCB module; 100, shielding cover; 200, PCB board; 1, shielding cover body; 11, cover plate; 12, sidewall; 101, opening; 102, outer surface of the shielding cover body; 103, inner surface of the shielding cover body; 2, semi-rolled structure; 201, first arc surface; 202, second arc surface; 203, connecting plane; 204, notch; 205, roll groove;

[0033] 300, traditional shielding cover; 301, planar structure; 400, traditional PCB board. DETAILED DESCRIPTION

[0034] The present invention is described in detail below with reference to specific embodiments. It should be emphasized that the following description is merely illustrative and is not intended to limit the scope and application of the present invention.

[0035] It should be noted that, unless otherwise expressly specified and limited, the terms "away from", "towards", "protruding from", "relative to", etc. used in this specification to indicate the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. Terms such as "installation", "fitting", "connection" and "fixation" should be understood in a broad sense. For example, "connection" can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; "fixation" can be bolt fixation, snap fixation, or glue fixation; the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated; thus, the features specified as "first" and "second" may explicitly or implicitly include one or more of such features; "multiple" or "several" means two or more; in addition, "and / or" includes any and all combinations of one or more related listed items; for ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to the specific circumstances.

[0036] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0037] In this embodiment, the specific implementation of the "shielding cover and PCB module" is not limited, and those skilled in the art can selectively use any appropriate implementation method according to actual needs.

[0038] Figure 1 A schematic structural diagram of a PCB module provided in an embodiment of the present utility model. Figure 2 A schematic cross-sectional view of a PCB module provided in an embodiment of the present invention. Figure 3 The embodiment of the present invention provides Figure 2 A partial enlarged view of point A. Figure 4 This is a schematic structural diagram of a shielding cover provided in an embodiment of the present utility model.

[0039] See also Figures 1-4The shielding cover 100 includes: a shielding cover body 1 and a semi-rolled structure 2.

[0040] The shielding cover body 1 has an opening 101 ; the semi-rolled structure 2 is disposed on the shielding cover body 1 and surrounds the circumferential edge of the opening 101 .

[0041] In addition, the end of the shielding cover body 1 where the opening 101 is located contacts the solder, so that the solder covers at least a portion of the semi-rolled structure 2 .

[0042] Figure 5 This is a cross-sectional diagram of a traditional shielding cover welded on a traditional PCB board. Figure 6 for Figure 5 A partial enlarged view at point B.

[0043] like Figures 1-6 As shown, the contact surface (or welding surface) for welding the traditional shielding cover 300 and the traditional PCB board 400 is a plane; that is, the welding structure of the traditional shielding cover 300 is a plane structure 301; specifically, the plane is used as the welding surface between the traditional shielding cover 300 and the traditional PCB board 400, which easily causes the effective contact area between the solder and the traditional shielding cover 300 to be small; therefore, the present shielding cover 100 adopts a semi-rolled structure 2 to replace the above-mentioned plane structure 301, that is, a circular arc surface is used instead of a plane as a welding surface, thereby effectively increasing the contact area during welding, which can not only enhance the welding strength and welding reliability of the entire welding surface, but also improve the flatness after welding, thereby reducing the welding defect rate of the entire welding surface.

[0044] In some embodiments, combined Figures 1-6 It can be seen that the semi-rolled circular structure 2 has a first arc surface 201 , a second arc surface 202 and a connecting plane 203 .

[0045] It can be understood that the two opposite sides of the connecting plane 203 are respectively connected to the first arc surface 201 and the second arc surface 202 .

[0046] It should be noted that the arc surface in the semi-rolled structure 2 (the arc surface is the second arc surface 202, which can abut the surface of the PCB board) is more conducive to tin creep during SMT soldering than the plane of the planar structure 301, thereby being more conducive to enhancing the connectivity and welding efficiency of the shielding cover 100.

[0047] Specifically, the term "tin creep" is usually associated with the "wick effect" or "tin creep effect" and is prone to occur in SMT soldering; "tin creep" describes the phenomenon of solder climbing upward during the soldering process; generally speaking, under appropriate conditions, solder climbing upward can form a tighter connection, which helps to enhance the connectivity and reliability of SMT soldering; in addition, in some cases, "tin creep" can assist in the uniform distribution of solder on the soldering surface, thereby improving soldering efficiency to a certain extent.

[0048] In some embodiments, according to Figures 1-4 It can be seen that one side of the first arc surface 201 is connected to the outer surface 102 of the shielding cover body, and the other side of the first arc surface 201 is connected to one side of the connecting plane 203 .

[0049] In some embodiments, Figures 1-4 It can be seen that one side of the second arc surface 202 is connected to the inner surface 103 of the shielding cover body, and the other side of the second arc surface 202 is connected to the other side of the connecting plane 203 .

[0050] In some embodiments, reference Figures 1-4 It can be seen that the first arc surface 201 has a first radius, the second arc surface 202 has a second radius, and the first radius is smaller than the second radius.

[0051] In some embodiments, please refer to Figures 1-4 The first arc surface 201 , the connecting plane 203 and the outer surface of the shielding cover 100 body are combined to form a rolled groove 205 with a notch 204 .

[0052] In some embodiments, as Figures 1-4 As shown, at least a portion of the solder can climb along the second arc surface 202 and pass through the gap 204 to fill into the curling groove 205 .

[0053] To further illustrate, the solder can be filled into the semi-rolled structure 2 (including the solder filled into the rolled groove 205 ), which can effectively increase the reliability of welding.

[0054] In some embodiments, the shielding cover body 1 includes a cover plate 11 and a plurality of side walls 12 .

[0055] In the embodiment of the present application, the plurality of side walls 12 protrude from the cover plate 11 , and the ends of the plurality of side walls 12 away from the cover plate 11 enclose an opening 101 .

[0056] Please refer to Figures 1-4 The PCB module 1000 includes: a PCB board 200 and the above-mentioned shielding cover 100.

[0057] It can be understood that the semi-circular structure 2 of the shielding cover 100 faces the PCB 200, and at least part of the semi-circular structure 2 abuts against the surface of the PCB 200, so that the shielding cover 100 is welded on the PCB 200.

[0058] In some embodiments, in combination with Figures 1-4 It can be understood that the PCB 200 is provided with a plurality of electronic components (not shown in the figure), and the shielding cover 100 can cover at least one electronic component.

[0059] In summary, the shielding cover and the PCB module provided by the embodiment of the present application replace the planar structure of the traditional shielding cover with the semi-circular structure, so that the welding surface of the shielding cover is a circular arc surface, which can effectively increase the contact area of the shielding cover during welding, thereby increasing the welding strength and improving the welding reliability of the shielding cover at the welding surface, further improving the flatness of the shielding cover after welding, and reducing the welding failure rate of the shielding cover. In addition, compared with the plane, the circular arc surface is more conducive to tin climbing during SMT welding, thereby being more conducive to enhancing the connectivity and welding efficiency of the shielding cover. Therefore, the shielding cover and the PCB module provided by the embodiment of the present application have certain novelty compared with the traditional shielding cover and the PCB module.

[0060] The above is a further detailed description of the present application in combination with specific / preferred embodiments, and cannot be regarded as limiting the specific implementation of the present application to these descriptions. For those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, and these all belong to the protection scope of the present application.

Claims

1. A shielding cover, characterized in that: include: Shielding cover body; The shielding cover body has an opening; Semi-rolled structure; The semi-rolled structure is provided on the shielding cover body and surrounds the circumferential edge of the opening; The shielding cover body contacts the solder at one end where the opening is located, so that the solder covers at least a portion of the semi-rolled structure.

2. The shielding cover according to claim 1, wherein: The semi-rolled circular structure has a first arc surface, a second arc surface and a connecting plane; Two opposite sides of the connecting plane are respectively connected to the first arc surface and the second arc surface.

3. The shielding cover according to claim 2, wherein: One side of the first arc surface is connected to the outer surface of the shielding cover body, and the other side of the first arc surface is connected to one side of the connecting plane.

4. The shielding cover according to claim 2, wherein: One side of the second arc surface is connected to the inner surface of the shielding cover body, and the other side of the second arc surface is connected to the other side of the connecting plane.

5. The shielding cover according to claim 2, wherein: The first arc surface has a first radius, the second arc surface has a second radius, and the first radius is smaller than the second radius.

6. The shielding cover according to claim 2, wherein: The first arc surface, the connecting plane and the outer surface of the shielding cover body are combined to form a rolled groove with a notch.

7. The shielding cover according to claim 6, wherein: At least a portion of the solder can climb along the second arc surface and pass through the gap to fill into the curling groove.

8. The shielding cover according to claim 1, wherein: The shielding cover body comprises: A cover plate and a plurality of side walls; the plurality of side walls protrude from the cover plate, and the ends of the plurality of side walls away from the cover plate enclose the opening.

9. A PCB module, characterized in that: include: A PCB board and a shielding cover according to any one of claims 1 to 8; The semi-rolled structure of the shielding cover faces the PCB board, and at least a portion of the semi-rolled structure abuts against the surface of the PCB board, so that the shielding cover is welded to the PCB board.

10. The PCB module according to claim 9, characterized in that: A plurality of electronic components are arranged on the PCB board, and the shielding cover can cover at least one of the electronic components.

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