High-power LED filament packaging structure

Abstract

The utility model relates to the packaging structure technical field, and discloses a large power LED filament packaging structure comprising an internal assembly and packaging glue, the internal assembly comprises a pedestal, the pedestal is internally provided with a heat conduction cavity, two ends of the pedestal are provided with installation ports, the heat conduction cavity is internally provided with a heat conduction member, and the heat conduction member is provided with a heat conduction hole. Heat conducting strips are uniformly and fixedly connected to the heat conducting piece, the heat conducting strips are in contact with the inner wall of the base, the two ends of each heat conducting strip penetrate through the corresponding mounting through opening, and a notch is formed in the end of each heat conducting strip; lED chips are fixedly connected to the upper surface and the lower surface of the base, and metal terminals are fixedly connected to the two ends of the base. According to the high-power LED filament, through the arrangement of the heat conduction cavity, the heat conduction piece and the heat conduction strip, heat conducted to the base by the LED chip can be conducted out, so that the overall heat dissipation effect is improved, the service life of the high-power LED filament is prolonged, and the high-power LED filament is durable in use.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging structures, in particular to a high-power LED filament packaging structure. Background Art

[0002] In the existing technology, the LED filament packaging structure mainly includes a substrate, an LED chip, an insulating adhesive, a wire and a packaging adhesive.

[0003] However, when a high-power LED filament is working, the conventional packaging structure cannot transfer heat well, thereby affecting the service life of the high-power LED filament and causing inconvenience in use. Utility Model Content

[0004] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a high-power LED filament packaging structure. Through the provided heat-conducting cavity, heat-conducting parts and heat-conducting strips, the heat conducted from the LED chip to the base can be conducted away, thereby improving the overall heat dissipation effect, increasing the service life of the high-power LED filament and making it durable.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a high-power LED filament packaging structure, comprising internal components and packaging glue, wherein the internal components include a base, a heat-conducting cavity is provided inside the base, mounting openings are provided at both ends of the base, a heat-conducting member is provided in the heat-conducting cavity, heat-conducting strips are evenly fixedly connected to the heat-conducting member, the heat-conducting strips are in contact with the inner wall of the base, the two ends of the heat-conducting strips pass through the mounting openings, and the ends of the heat-conducting strips are provided with notches; LED chips are fixedly connected to the upper and lower surfaces of the base, metal terminals are fixedly connected at both ends of the base, and gold wires are provided between the metal terminals and the plurality of LED chips. The heat-conducting cavity, heat-conducting member, and heat-conducting strips can be conducted away from the base by the heat-conducting cavity, thereby improving the overall heat dissipation effect, increasing the service life of the high-power LED filament, and making it durable.

[0006] Furthermore, the middle portion of the metal terminal has an L-shaped external connection portion, and the L-shaped external connection portion is located in the notch and does not contact each other.

[0007] Furthermore, the surface of the metal terminal is flush with the surface of the LED chip.

[0008] Furthermore, the longitudinal cross-section of the packaging adhesive is elliptical.

[0009] Furthermore, the length of the heat conducting strip is the same as the width of the heat conducting element.

[0010] The utility model has the following beneficial effects:

[0011] The utility model provides a high -power LED filament packaging structure, through the heat conduction cavity, heat conduction part, heat conduction strip set up, can conduct the heat that LED chip conducted to the base to conduct out, thereby improving the overall heat dissipation effect, improve the service life of high -power LED filament, durable use. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is the structure schematic drawing of the utility model;

[0013] Figure 2 It is the structure schematic drawing of the utility model's split state;

[0014] Figure 3 It is the structure schematic drawing of the utility model's heat conduction part;

[0015] Figure 4 It is the structure schematic drawing of the utility model's base part.

[0016] LEGEND:

[0017] 1, packaging glue, 2, internal component, 201, heat conduction part, 202, metal terminal, 203, gold wire, 204, LED chip, 205, base, 2011, notch, 2012, heat conduction strip, 2051, heat conduction cavity, 2052, installation through -hole. DETAILED DESCRIPTION

[0018] The technical scheme in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model, obviously, the described embodiments are only a part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the range of protection of the utility model.

[0019] REFERENCE Figures 1-4The utility model provides a kind of embodiment: a high-power LED filament packaging structure, including internal component 2, encapsulation glue 1, the longitudinal section shape of encapsulation glue 1 is oval, internal component 2 includes base 205, the inside of base 205 is provided with heat conduction cavity 2051, the both ends of base 205 are provided with installation throughport 2052, heat conduction cavity 2051 is provided with heat conduction piece 201, heat conduction piece 201 is uniformly fixedly connected with heat conduction strip 2012, heat conduction strip 2012 length size and the width size of heat conduction piece 201 are identical, heat conduction strip 2012 and the inner wall of base 205 are mutually contacted, the both ends of heat conduction strip 2012 pass through installation throughport 2052, and the end of heat conduction strip 2012 is provided with notch 2011;The upper and lower surfaces of base 205 are fixedly connected with LED chip 204, and the both ends of base 205 are fixedly connected with metal terminal 202, and metal terminal 202 is used to provide energy for LED chip 204 and gold wire 203, and the middle part of metal terminal 202 has L-shaped external part, L-shaped external part is located in notch 2011, and mutually does not contact, and L-shaped external part and notch 2011 are not contacted with each other, and the stability and durability of L-shaped external part connection can be guaranteed, avoid the heat of transmission to influence the normal use of L-shaped external part.Metal terminal 202 and the surface of LED chip 204 are mutually flush, guarantee gold wire 203 connection state's stability, and gold wire 203 is arranged between metal terminal 202 and multiple LED chips 204.

[0020] When working, metal terminal 202 is electrified to provide power supply for LED chip 204 and gold wire 203, the heat generated by the working of LED chip 204 can be transmitted to base 205, and then transmitted to heat conduction piece 201 from heat conduction strip 2012, and then conducted out by heat conduction piece 201, so as to have good heat dissipation effect, improve the overall service life, and be durable in use.

[0021] Through the heat conduction cavity 2051, heat conduction piece 201 and heat conduction strip 2012, the heat conducted to base 205 by LED chip 204 can be conducted out, so as to improve the overall heat dissipation effect, improve the service life of high-power LED filament, and be durable in use.

[0022] Working principle: when working, metal terminal 202 is electrified to provide power supply for LED chip 204 and gold wire 203, the heat generated by the working of LED chip 204 can be transmitted to base 205, and then transmitted to heat conduction piece 201 from heat conduction strip 2012, and then conducted out by heat conduction piece 201, so as to have good heat dissipation effect, improve the overall service life, and be durable in use.

[0023] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high-power LED filament packaging structure, characterized by: The invention comprises an internal component (2) and a packaging glue (1), wherein the internal component (2) comprises a base (205), a heat conduction cavity (2051) is provided inside the base (205), installation openings (2052) are provided at both ends of the base (205), a heat conduction piece (201) is provided in the heat conduction cavity (2051), a heat conduction strip (2012) is evenly fixedly connected to the heat conduction piece (201), and the heat conduction strip (2012) is connected to the base (205). ) are in contact with each other, both ends of the heat-conducting strip (2012) pass through the installation opening (2052), and a notch (2011) is provided at the end of the heat-conducting strip (2012); the upper and lower surfaces of the base (205) are fixedly connected to LED chips (204), both ends of the base (205) are fixedly connected to metal terminals (202), and gold wires (203) are provided between the metal terminals (202) and the plurality of LED chips (204).

2. The high-power LED filament packaging structure according to claim 1, characterized in that: The middle portion of the metal terminal (202) has an L-shaped external connection portion, and the L-shaped external connection portion is located in the notch (2011) and does not contact each other.

3. The high-power LED filament packaging structure according to claim 1, characterized in that: The surface of the metal terminal (202) and the surface of the LED chip (204) are flush with each other.

4. The high-power LED filament packaging structure according to claim 1, characterized in that: The longitudinal cross-section of the packaging glue (1) is elliptical.

5. The high-power LED filament packaging structure according to claim 1, characterized in that: The length of the heat-conducting strip (2012) is the same as the width of the heat-conducting element (201).

Images