Circuit board ultraviolet curing system

Abstract

The utility model relates to a curing system, in particular to a circuit board ultraviolet curing system. The circuit board ultraviolet curing system comprises an equipment shell, a partition plate I, a partition plate II, a partition plate III and the like, a first partition plate and a second partition plate are fixedly welded in the equipment shell, a curing area is divided in the equipment shell through the first partition plate and the second partition plate, a third partition plate is fixedly welded to the right portion in the equipment shell, and a preheating area is divided between the first partition plate and the third partition plate. Before the coating is cured, the circuit board is preheated through the preheating area, so that the phenomenon that the curing effect of the coating is affected by bubbles generated in the coating due to the fact that solvent components are directly irradiated and gasified by the high-temperature curing lamp when passing through the liquid level and the solvent components are volatilized too fast is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to a curing system especially relates to a circuit board ultraviolet curing system. BACKGROUND

[0002] The three-proof paint coated on the circuit board is a special formula paint, which is used to protect the circuit board and its related equipment from environmental erosion. The three-proof paint has good high and low temperature resistance; after curing, it forms a layer of transparent protective film, which has excellent insulation, moisture-proof, anti-creeping, shock-proof, dust-proof, corrosion-proof, anti-aging, corona-resistant and other properties, protects the circuit surface from the erosion of various solvents and chemicals, and has strong heat resistance.

[0003] A patent application number CN202321113124.1 discloses a circuit board coating curing oven, which comprises a machine body, a circulating assembly and a high-temperature channel. The circulating assembly comprises a wind conveying assembly fixed to the outside of the machine body and a gas collecting assembly arranged around the conveying opening to recover heat. The circuit board is sent into the machine body by a conveyor belt, and the electric heating assembly generates high temperature. The heat is circulated through the high-temperature channel to cure the surface of the electric heating plate. At the same time, the high temperature is discharged into the gas collecting groove through the conveying opening, and then sent into the machine body again from the first fan under the conveying of the air guide channel to improve the recycling of heat and reduce heat loss. The gas collecting groove is provided with a heat collecting mechanism. The cold air at the conveying opening is directly sucked into the gas collecting groove by the first fan and heated by the heat absorbing sheet to avoid the cold air entering the machine body, affecting the stability of the heat and reducing the loss. However, the device does not set a preheating station to preheat the coating before the curing work, which may cause the coating layer of the circuit board to volatilize too fast in the high-temperature curing oven, resulting in bubbles in the film surface during curing, affecting the quality of the coating. SUMMARY

[0004] In order to overcome the shortcomings of the prior art that the device does not set a preheating station to preheat the coating before the curing work, which may cause the coating layer of the circuit board to volatilize too fast in the high-temperature curing oven, resulting in bubbles in the film surface during curing, affecting the quality of the coating, the purpose is to provide a circuit board ultraviolet curing system which is provided with a preheating area to preheat the paint coating of the circuit board, reducing the occurrence of coating quality hazards.

[0005] The technical scheme is as follows: a circuit board ultraviolet curing system comprises a device shell, a transmission assembly, a partition plate one, a partition plate two, a curing lamp and a partition plate three, the partition plate one and the partition plate two are fixedly welded in the device shell, the partition plate one and the partition plate two divide a curing area in the device shell, the partition plate three is fixedly welded on the right part in the device shell, a preheating area is divided between the partition plate one and the partition plate three, the transmission assembly is installed in the device shell, the transmission assembly passes through the partition plate one, the partition plate two and the partition plate three, material grooves are formed in the partition plate one, the partition plate two and the partition plate three, two curing lamps are symmetrically installed between the partition plate one and the partition plate two, and the distance between the curing lamps on the upper side and the transmission assembly is equal to the distance between the curing lamps on the lower side and the transmission assembly.

[0006] Optionally, the system further comprises a purification device, a smoke exhaust pipe and a filter, the purification device is fixedly arranged on the upper part of the device shell, the smoke exhaust pipe is connected and communicated with the purification device on the front side and the back side, the smoke exhaust pipe is connected and communicated with the curing area in the device shell through a pipeline, and the filter is installed on the left part of the purification device on the front side and the back side.

[0007] Optionally, the system further comprises a conveying device, a heat absorbing sheet and an air inlet pipe, the conveying device is installed on the front side and the back side of the device shell, the conveying device is connected and communicated with the preheating area in the device shell through the air inlet pipe on the same side, the heat absorbing sheet is symmetrically arranged on the left part of the inner side of the device shell on the front side and the back side, and the heat absorbing sheet is connected and communicated with the conveying device on the same side.

[0008] Optionally, the system further comprises a visual detector, and the visual detector is symmetrically installed on the left part of the inner side of the device shell.

[0009] The circuit board ultraviolet curing system has the following beneficial effects: before the coating is cured, the circuit board is preheated by the preheating area, so that the solvent components are not directly subjected to the irradiation of the high-temperature curing lamp when passing through the liquid surface, the solvent volatilization is prevented from being too fast due to the gasification of the solvent, the paint film surface forms a skin film with high sealing performance, the internal solvent volatilization is difficult to escape, and the coating appears bubbles in the drying and curing process, and finally quality problems are caused.

[0010] The purification device is used for collecting the gas volatilized from the solvent, the gas generated by the organic solvent is purified by the chemical agent in the purification device, the purified gas is discharged through the filter, some solvent organic volatile matters containing xylene and other components are volatilized when the coating is dried, the volatilized gas is prevented from not being treated in time, the harmful gas generated during the curing is prevented from escaping in the air, and the human health is affected.

[0011] The two visual detectors on the transmission assembly scan the state of the circuit board transmitted from the curing area, the influence of the temperature during the curing on the curing can be known according to the scanned state of the circuit board, the ultraviolet temperature in the curing area is adjusted in real time, and the curing effect is optimized. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is the three-dimensional structure schematic view of the utility model.

[0013] Figure 2 It is the sectional view of the utility model.

[0014] Figure 3 It is the sectional view of the utility model baffle two, curing lamp and visual detector etc.

[0015] Figure 4 It is the sectional view of the utility model baffle one, baffle two and heat absorbing sheet etc.

[0016] Figure 5 It is the three-dimensional structure schematic view of the utility model conveying device, heat absorbing sheet and air inlet pipe.

[0017] Mark explanation: 1_device shell, 2_transmission assembly, 3_baffle one, 4_baffle two, 5_curing lamp, 6_visual detector, 7_purification device, 8_smoke pipe, 9_filter, 10_baffle three, 11_conveying device, 12_heat absorbing sheet, 13_air inlet pipe. Specific implementation

[0018] The following described only the preferred embodiment of the utility model, and does not therefore limit the protection scope of the utility model.

[0019] Example 1: a circuit board ultraviolet curing system, as shown in Figures 1-5 The device shell 1 in fixed welding has baffle one 3 and baffle two 4, baffle one 3 and baffle two 4 divide in the device shell 1 and divide out a curing area, the right part of the device shell 1 in fixed welding has baffle three 10, baffle one 3 and baffle three 10 divide out a preheating area, baffle two 4 and baffle three 10 are made of material with good heat preservation performance, baffle one 3 is made of material with good conductivity, the device shell 1 is installed with transmission assembly 2, transmission assembly 2 passes through baffle one 3, baffle two 4 and baffle three 10, transmission assembly 2 is driven by motor, the transmission direction is from right to left conveying, baffle one 3, baffle two 4 and baffle three 10 all have material through slot, the material through slot is open, and the height of the lower side in the slot is consistent with the upper height of transmission assembly 2, baffle one 3 and baffle two 4 are symmetrically installed with two curing lamps 5 between upper and lower, and the distance between the curing lamp 5 on the upper and lower sides and transmission assembly 2 is equal, when the curing lamp 5 works, it will irradiate ultraviolet light with high temperature, and the intensity of the irradiation light can be adjusted, and the curing temperature can be changed with the output power of the curing lamp 5.

[0020] At the beginning, the curing lamp 5 in the curing area between the partition one 3 and the partition two 4 is in the open state, and the temperature of the light emitted is the required curing temperature. The partition one 3 is a material with good heat conduction, which will transfer part of the heat in the curing area to the preheating area when the curing area is heated, and the temperature in the preheating area will be lower than that in the curing area. When the coated circuit board needs to be cured, the circuit board is placed in the right position of the conveying assembly 2, and the circuit board is conveyed to the left by the conveying assembly. The circuit board will enter the preheating area through the material slot on the partition three 10. The solvent components of the coating will be volatilized when passing through the preheater, thereby avoiding the solvent volatilizing too fast when directly irradiated by the high-temperature curing lamp 5 when passing through the liquid surface, forming a skin film with strong sealing property on the surface of the paint film, making it difficult for the internal solvent to escape, resulting in bubbles in the drying and curing process of the coating, and finally causing quality problems. At the same time, preheating can increase the activity of the solvent in the subsequent curing process, speeding up the curing process. When the preheating is completed, the conveying assembly 2 continues to convey the circuit board to the left, and the circuit board enters the curing area through the material slot of the partition one 3. The high-temperature ultraviolet light emitted by the curing lamp 5 on both sides of the circuit board is cured. When the conveying assembly 2 is conveyed to the left, the curing is completed, and the circuit board is conveyed out through the material slot on the partition two 4, and finally moves to the left position of the conveying assembly 2 to discharge the circuit board, completing the ultraviolet curing work.

[0021] Example 2: Based on example 1, as shown in Figures 1-2 The device housing 1 is provided with a purification device 7, an exhaust pipe 8 and a filter 9. The purification device 7 is provided with an activated carbon layer, which can adsorb the gas generated by the volatilization of organic solvents. The porous solid adsorbent (activated carbon, silica gel, molecular sieve, etc.) is used to treat the organic waste gas generated by the volatilization of liquid solvents, and the harmful components are fully adsorbed by chemical bond or molecular attraction to achieve the effect of purification. The purification device 7 is connected and communicated with the exhaust pipe 8 on the front and rear sides, and the exhaust pipe 8 is connected and communicated with the curing area in the device housing 1 through the pipeline. When the purification device 7 works, the gas in the curing area will be sucked out through the exhaust pipe 8. The filter 9 is installed on the left front and rear sides of the purification device 7, and the purified gas is safely discharged through the filter 9.

[0022] As shown in Figures 2-5As shown, it also includes conveying device 11, heat absorbing sheet 12 and air inlet pipe 13, conveying device 11 is installed on the front and back of equipment shell 1, conveying device 11 is connected and communicated with the preheating area in equipment shell 1 through the air inlet pipe 13 on the same side, heat absorbing sheet 12 is symmetrically arranged on the left side of the inside of the equipment shell, heat absorbing sheet 12 is connected and communicated with conveying device 11 on the same side, heat absorbing sheet 12 on the front and back is next to transmission assembly 2, when the solidified circuit board is transmitted to the left, the circuit board will have high heat, and the heat will be transmitted to the outside, the escaped heat is collected through conveying device 11 and heat absorbing sheet 12, and is transmitted to the preheating area, so that the waste heat is recycled.

[0023] As shown, Figures 2-3 As shown, it also includes visual detector 6, visual detector 6 is symmetrically installed on the left side of the inside of the shell, the solidification state of the upper and lower surfaces of the circuit board transmitted from the solidification area is scanned, the solidification effect is detected, the temperature and time in the solidification area are adjusted according to the molding effect, so that the optimal implementation effect is achieved.

[0024] In a more preferred embodiment, the material passage openings on the partition plate one 3, the partition plate two 4 and the partition plate three 10 are small, which can effectively reduce the entry of cold air into the inside of the equipment shell, avoid the overflow of hot air in the equipment, and reduce energy consumption.

[0025] When the coating is solidified and dried in the solidification area, the purification device 7 is started, the purification device 7 collects the gas generated by the solvent volatilization during solidification through the smoke exhaust pipe 8, purifies the gas generated by the organic solvent through the internal adsorbent, and discharges the purified gas through the filter 9, some solvent organic volatile matters containing xylene and other components are generated during the drying of the coating, if not treated in time, harmful gas generated during solidification will escape in the air, long-term contact will affect human health, at the same time, when the conveying device 11 is started, the conveying device 11 collects the heat transferred to the outside by the circuit board with high temperature when passing through heat absorbing sheet 12, and transmits the collected heat to the preheating area through air inlet pipe 13, a certain amount of waste heat is recycled through the conveying device 11, energy consumption is reduced, at the same time, the state of the circuit board transmitted from the solidification area is scanned through the two visual detectors 6 on the transmission assembly 2, the influence of the temperature during solidification on solidification can be known according to the state of the scanned circuit board, the ultraviolet temperature in the solidification area is adjusted in real time, and the solidification effect is optimized.

[0026] The above only describes the preferred embodiment of the present application, and is not used to limit the present application, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A circuit board ultraviolet curing system, comprising a device housing (1), a transmission component (2), and the transmission component (2) being installed in the device housing (1); It is characterized by: The invention also includes a partition plate 1 (3), a partition plate 2 (4), a curing lamp (5) and a partition plate 3 (10). The partition plate 1 (3) and the partition plate 2 (4) are fixedly welded in the equipment housing (1). The partition plate 1 (3) and the partition plate 2 (4) divide the equipment housing (1) into a curing area. The partition plate 3 (10) is fixedly welded in the right part of the equipment housing (1). A preheating area is divided between the partition plate 1 (3) and the partition plate 3 (10). The transmission component (2) passes through the partition plate 1 (3), the partition plate 2 (4) and the partition plate 3 (10). The partition plate 1 (3), the partition plate 2 (4) and the partition plate 3 (10) are all provided with a material trough. Two curing lamps (5) are symmetrically installed between the partition plate 1 (3) and the partition plate 2 (4) in the upper and lower parts, and the distance between the curing lamps (5) on the upper and lower sides and the transmission component (2) is equal.

2. A circuit board ultraviolet curing system according to claim 1, characterized in that: The device further comprises a purification device (7), a smoke exhaust pipe (8) and a filter (9); the purification device (7) is fixedly provided on the upper portion of the device housing (1); the front and rear sides of the purification device (7) are connected and communicated with the smoke exhaust pipe (8); the smoke exhaust pipe (8) is connected and communicated with the curing area in the device housing (1) through a pipeline; and the filter (9) is installed on the front and rear sides of the left portion of the purification device (7).

3. A circuit board ultraviolet curing system according to claim 2, characterized in that: The device further comprises a conveying device (11), a heat absorbing plate (12) and an air inlet pipe (13). The conveying device (11) is installed on both the front and rear sides of the device housing (1). The conveying device (11) is connected and communicated with the preheating area in the device housing (1) through the air inlet pipe (13) on the same side. The heat absorbing plates (12) are symmetrically provided on the front and rear sides of the left side of the inner side of the device housing. The heat absorbing plates (12) are connected and communicated with the conveying device (11) on the same side.

4. A circuit board ultraviolet curing system according to claim 3, characterized in that: It also includes a visual inspection instrument (6), which is symmetrically installed on the left side of the shell body.

Images