Reflow soldering machine with heat dissipation mechanism

Abstract

The utility model discloses a reflow soldering machine with a heat dissipation mechanism, which relates to the technical field of reflow soldering machines and comprises a reflow soldering machine body, a first motor is arranged in the center of the front of the reflow soldering machine body, and a conveyor belt is mounted on the inner side of the reflow soldering machine body. A welding box is arranged at the left end of the inner side of the reflow soldering machine body, a control panel is installed on the left side of the front face of the reflow soldering machine body, an air conditioner is arranged at the upper end of the reflow soldering machine body, and a transmission pump is installed at the upper end of the air conditioner; compared with the prior art, the reflow soldering machine has the advantages that after the reflow soldering machine is used for soldering the PCB, the PCB can be quickly cooled, the PCB can be quickly taken out, the position of the PCB cannot be deviated, the reflow soldering machine can quickly move the position of the reflow soldering machine body when the reflow soldering machine is used for coping with different production tasks and overhauling, and the reflow soldering machine is convenient to use. And the production flexibility of the reflow soldering machine is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to reflow soldering machine technical field, concretely is a kind of reflow soldering machine with heat dissipation mechanism. BACKGROUND

[0002] Reflow soldering machine, also called reflow soldering machine or "reflow oven", is a kind of welding equipment for surface mounted components. Its working principle is mainly based on heat conduction and heat cycle, by controlling temperature and time, make welding material melt and connect with electronic components and printed circuit board (PCB) each other;

[0003] Through search, patent number CN219026220U discloses a kind of clean reflow soldering machine, is equipped with hanger plate, connecting rod and fan in the discharge end of soldering machine body, fan is 45 degrees angle and discharge port of circuit board is directly opposite, through fan, the circuit board processed can be cooled again, not only can improve the cooling effect of circuit board, while it can minimize the air flow in the internal of soldering machine body from discharge port overflow to cause pollution to environment;But the heat dissipation effect of the device to PCB board is limited, and when the fan is cooling, the position of PCB board is easy to deviate, leading to inconvenient recovery, for this reason, we provide a kind of reflow soldering machine with heat dissipation mechanism. SUMMARY

[0004] The utility model aims at providing a kind of reflow soldering machine with heat dissipation mechanism.

[0005] To solve the problems raised in the above background art, the utility model provides the following technical scheme: a kind of reflow soldering machine with heat dissipation mechanism, including reflow soldering machine body, the center position of the front of reflow soldering machine body is provided with first motor, the inside of reflow soldering machine body is installed with conveyer belt, the left end in the inside of reflow soldering machine body is provided with welding box, the left side of the front of reflow soldering machine body is installed with control panel, the upper end of reflow soldering machine body is provided with cold air machine, the upper end of cold air machine is installed with transmission pump, the front and back of transmission pump are all installed with gas pipeline, the lower end of gas pipeline is installed with plug, the right end in the inside of reflow soldering machine body is provided with heat dissipation box, the upper end of heat dissipation box is penetrated and is provided with rotating tube, the lower end of rotating tube is installed with cold air cavity, the inside of heat dissipation box is provided with second motor, the upper end of second motor is installed with gear.

[0006] Preferably, the plug is rotatably connected to the rotating tube.

[0007] Preferably, the cold air cavity has a plurality of nozzles fixedly connected to an outer side thereof, and the nozzles are in communication with the cold air cavity.

[0008] Preferably, the rotating tube has a plurality of tooth blocks fixedly connected to an outer side thereof, and the tooth blocks are in meshing connection with the gear.

[0009] Preferably, the lower end of the reflow soldering machine body is provided with a base, both ends of the inner side of the base are provided with mounting blocks, the inner side of the mounting block is provided with a moving wheel, the front of the mounting block is provided with a rotating column, the outer side wall of the rotating column is respectively provided with a first transmission gear and a third transmission gear, the center of the inner side of the base is provided with a bidirectional motor, both sides of the bidirectional motor are provided with transmission columns, and the outer side of the transmission column is provided with a second transmission gear.

[0010] Preferably, the second transmission gear is meshed with the first transmission gear and the third transmission gear.

[0011] Preferably, the front and back of the base are fixedly connected with electric push rods, and the lower end of the electric push rod is fixedly connected with a friction disc.

[0012] By the above technical scheme, the cooling machine is started through the control panel, external air is sucked in, and refrigeration is performed, after the refrigeration is completed, the transmission pump is started again through the control panel, the transmission pump cooperates with the gas conveying pipeline and the plug to inject the cooling air into the rotating pipe, and the cooling air is injected into the heat dissipation box through the cooperation of the cooling air cavity and the nozzle, so that the PCB board in the heat dissipation box is cooled, then the second motor is started through the control panel, the second motor cooperates with the gear and the toothed block to drive the nozzle to rotate, so that the cooling air can be fully distributed in the heat dissipation box, the cooling air in the heat dissipation box is uniformly distributed, the reflow soldering machine can quickly cool the PCB board after the PCB board is welded, the PCB board can be quickly taken out, and the position of the PCB board is not deviated.

[0013] By the above technical scheme, the bidirectional motor is started through the control panel, the first transmission gear and the third transmission gear are driven to rotate under the cooperation of the transmission column and the second transmission gear, the moving wheel is driven to move in the inner side of the mounting block through the cooperation of the rotating column, so that the base and the reflow soldering machine body above the base are moved, and the position of the reflow soldering machine body can be quickly moved when different production tasks and maintenance are dealt with, and the production flexibility of the reflow soldering machine is improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a structure schematic view of the utility model embodiment;

[0015] Figure 2 It is a sectional view of the utility model embodiment;

[0016] Figure 3 It is an internal structure schematic view of the heat dissipation box in the utility model embodiment;

[0017] Figure 4 It is the internal structure schematic view of the base in the embodiment of the utility model.

[0018] In the figure: 1, reflow soldering machine body; 2, first motor; 3, conveying belt; 4, welding box; 5, control panel; 6, cold air machine; 7, transmission pump; 8, gas pipeline; 9, plug; 10, rotary tube; 11, cold air cavity; 12, nozzle; 13, second motor; 14, gear; 15, gear block; 16, heat sink; 17, base; 18, mounting block; 19, moving wheel; 20, rotating column; 21, first transmission gear; 22, second transmission gear; 23, transmission column; 24, bidirectional motor; 25, third transmission gear; 26, electric push rod; 27, friction disc. DETAILED DESCRIPTION

[0019] The specific embodiments of the utility model will be further described below in combination with the drawings. It needs to be explained here that the description of these embodiments is used to help understanding the utility model, but does not constitute the limitation to the utility model. In addition, the technical features involved in each embodiment of the utility model described below can be combined with each other as long as they do not conflict with each other.

[0020] Example 1:

[0021] Please refer to Figures 1-4 The utility model provides a kind of technical scheme: a reflow soldering machine with heat dissipation mechanism, including reflow soldering machine body 1, the center position of the front of reflow soldering machine body 1 is provided with first motor 2, conveying belt 3 is installed in the inner side of reflow soldering machine body 1, welding box 4 is provided at the left end of the inner side of reflow soldering machine body 1, control panel 5 is installed in the left side of the front of reflow soldering machine body 1, cold air machine 6 is provided at the upper end of reflow soldering machine body 1, transmission pump 7 is installed in the upper end of cold air machine 6, gas pipeline 8 is installed in the front and back of transmission pump 7, plug 9 is installed in the lower end of gas pipeline 8, heat sink 16 is provided at the right end of the inner side of reflow soldering machine body 1, rotary tube 10 is provided at the upper end of heat sink 16, cold air cavity 11 is installed in the lower end of rotary tube 10, second motor 13 is provided in the inner side of heat sink 16, gear 14 is installed in the upper end of second motor 13.

[0022] Plug 9 is rotatably connected with rotary tube 10.

[0023] The outer side of cold air cavity 11 is fixedly connected with multiple groups of nozzles 12, and nozzle 12 is through with cold air cavity 11.

[0024] The outer side of rotary tube 10 is fixedly connected with gear block 15, and gear block 15 is meshingly connected with gear 14.

[0025] When in use, the first motor 2 is started through the control panel 5, so that the first motor 2 drives the conveyor belt 3 to rotate, then the PCB board is placed on the conveyor belt 3, so that the conveyor belt 3 drives the PCB board to move, at this time, when the PCB board moves into the heat dissipation box 16, the air conditioner 6 is started through the control panel 5, so that the air conditioner 6 inhales external air and performs refrigeration, after refrigeration, the transmission pump 7 is started through the control panel 5 again, so that the transmission pump 7 inhales the cold air in the air conditioner 6 through the gas pipeline 8 and injects the cold air into the rotating pipe 10 through the plug 9, at this time, the cold air moves downward in the rotating pipe 10, so that the cold air reaches the cold air cavity 11, at the same time, the second motor 13 is started through the control panel 5, so that the second motor 13 drives the gear 14 to rotate, at this time, the gear block 15 meshing with the gear 14 drives the rotating pipe 10 to rotate with the gear 14, so that the cold air cavity 11 drives the nozzle 12 to rotate, then the nozzle 12 uniformly sprays the cold air in the cold air cavity 11 into the heat dissipation box 16 when rotating, so that the PCB board in the heat dissipation box 16 is cooled, so that the reflow soldering machine can quickly cool the PCB board after welding, so that the PCB board can be quickly taken out and the position of the PCB board is not deviated.

[0026] Embodiment 2

[0027] Please refer to Figures 1-4 The utility model provides a technical scheme: a reflow soldering machine with heat dissipation mechanism, the lower end of reflow soldering machine body 1 is installed with base 17, both ends of base 17 inboard are installed with mounting block 18, the inboard of mounting block 18 is installed with moving wheel 19, the front of mounting block 18 is installed with the rotation column 20, the outer side wall of rotation column 20 is installed with first transmission gear 21 and third transmission gear 25 respectively, the center of base 17 inboard is provided with bidirectional motor 24, both sides of bidirectional motor 24 are installed with transmission column 23, the outer side of transmission column 23 is installed with second transmission gear 22.

[0028] Second transmission gear 22 is meshed with first transmission gear 21 and third transmission gear 25 respectively.

[0029] The front and back of base 17 are fixedly connected with electric push rod 26, and the lower end of electric push rod 26 is fixedly connected with friction disc 27.

[0030] Specific, need to move the position of the reflow soldering machine body 1, through the control panel 5 start electric push rod 26, make electric push rod 26 will friction disc 27 back, so that the friction disc 27 and the ground connection disappears, then through the control panel 5 start bidirectional motor 24, so that the bidirectional motor 24 drive transmission column 23 rotation, at this time transmission column 23 in rotation, will drive the second transmission gear 22 rotation, then the second transmission gear 22 respectively drive the first transmission gear 21 and the third transmission gear 25 rotation, at this time the first transmission gear 21 and the third transmission gear 25 will drive the rotation column 20 to the left side rotation, at this time with the rotation column 20 connected moving wheel 19 will in the inside of the mounting block 18 rotation, so as to drive the base 17 and the base 17 above the reflow soldering machine body 1 movement, to the required position after stop, then again through the control panel 5 start electric push rod 26, make friction disc 27 again with the ground connection, make the reflow soldering machine can be in response to different production tasks and maintenance, can quickly move the position of the reflow soldering machine body 1, improve the production flexibility of reflow soldering machine.

[0031] The embodiments of the present application are described in detail above with reference to the drawings, but the present application is not limited to the described embodiments. For those skilled in the art, various changes, modifications, replacements and variations of the embodiments can be made without departing from the principles and spirits of the present application, and still fall within the protection scope of the present application.

Claims

1. A reflow soldering machine with a heat dissipation mechanism, comprising a reflow soldering machine body (1), characterized in that: A first motor (2) is provided at the center position of the front of the reflow soldering machine body (1), a conveyor belt (3) is installed on the inner side of the reflow soldering machine body (1), a welding box (4) is provided at the left end of the inner side of the reflow soldering machine body (1), a control panel (5) is installed on the left side of the front of the reflow soldering machine body (1), an air cooler (6) is provided at the upper end of the reflow soldering machine body (1), a transmission pump (7) is installed at the upper end of the air cooler (6), gas pipelines (8) are installed on the front and back of the transmission pump (7), a plug (9) is installed at the lower end of the gas pipeline (8), a heat dissipation box (16) is provided at the right end of the inner side of the reflow soldering machine body (1), a rotating tube (10) is provided through the upper end of the heat dissipation box (16), a cold air cavity (11) is installed at the lower end of the rotating tube (10), a second motor (13) is provided on the inner side of the heat dissipation box (16), and a gear (14) is installed at the upper end of the second motor (13).

2. The reflow soldering machine with a heat dissipation mechanism according to claim 1, characterized in that: The plug (9) is rotatably connected to the rotating tube (10).

3. The reflow soldering machine with a heat dissipation mechanism according to claim 1, characterized in that: Multiple groups of nozzles (12) are fixedly connected to the outside of the cold air cavity (11), and the nozzles (12) are connected to the cold air cavity (11).

4. The reflow soldering machine with a heat dissipation mechanism according to claim 2, characterized in that: A gear block (15) is fixedly connected to the outer side of the rotating tube (10), and the gear block (15) is meshedly connected to the gear (14).

5. The reflow soldering machine with a heat dissipation mechanism according to claim 1, characterized in that: A base (17) is installed at the lower end of the reflow soldering machine body (1), and mounting blocks (18) are installed at both ends of the inner side of the base (17), and a moving wheel (19) is installed on the inner side of the mounting block (18). A rotating column (20) is provided through the front of the mounting block (18), and a first transmission gear (21) and a third transmission gear (25) are respectively installed on the outer side wall of the rotating column (20). A bidirectional motor (24) is provided at the center of the inner side of the base (17), and transmission columns (23) are installed on both sides of the bidirectional motor (24), and a second transmission gear (22) is installed on the outer side of the transmission column (23).

6. The reflow soldering machine with a heat dissipation mechanism according to claim 5, characterized in that: The second transmission gear (22) is meshedly connected with the first transmission gear (21) and the third transmission gear (25).

7. The reflow soldering machine with a heat dissipation mechanism according to claim 5, characterized in that: The front and back sides of the base (17) are both fixedly connected to an electric push rod (26), and the lower end of the electric push rod (26) is fixedly connected to a friction disk (27).

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