Tool for chip coating

Abstract

The utility model relates to a tool for chip coating, and belongs to the field of chip clamping devices. Comprising a base and a cover plate; a chip placing groove is formed in the base, and the length and the width of the chip placing groove are both larger than those of a chip; an L-shaped blocking piece is detachably installed in the chip containing groove, and a chip is pressed at one corner of the chip containing groove through the blocking piece. The cover plate covers the base, the cover plate is provided with a through hole corresponding to the position of the chip placing groove, the size of the through hole corresponds to the size of a protective film needing to be coated on the chip, and the edge of the upper side of the through hole is provided with a chamfer; wherein after the chip is placed in the chip placing groove, the through hole directly faces the position, needing to be coated with the protective film, of the chip. According to the invention, the upper edge of the through hole in the cover plate is provided with the chamfer to avoid the irradiation of the light beam, so that the generation of light and shadow is effectively avoided, and the quality of chip coating is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of chip clamping devices, in particular to a tooling for chip coating. Background Art

[0002] In order to protect the chip surface and improve chip performance and stability, a protective film is usually coated on the chip. The chip coating is now usually carried out using a Leybold coating machine. During coating, the chip is placed on a tooling, and then the tooling is placed in the coating machine for coating. The working principle of the coating machine is to evaporate or ionize the target material through electron beam bombardment or arc discharge. The formed atoms or ions are deposited on the substrate surface in a vacuum environment, gradually forming a uniform and dense thin film coating.

[0003] The clamping position of existing tooling is basically inside the tooling, and the gap between the chip coating position and the upper surface of the tooling is large. During coating, when the electron beam obliquely irradiates the chip, part of the beam will be blocked by the tooling, resulting in light and shadow, causing coating failure near the edge of the chip and even damage to the chip. Utility Model Content

[0004] In order to solve or partially solve the problems existing in the related art, the utility model provides a tool for chip coating, which aims to reduce the generation of light and shadow during coating.

[0005] The above-mentioned chip coating tooling includes a base and a cover plate;

[0006] The base is provided with a chip placement groove, the length and width of which are both greater than the length and width of the chip; an L-shaped blocking piece is detachably installed in the chip placement groove, and the chip is pressed against a corner of the chip placement groove through the blocking piece;

[0007] The cover plate is arranged on the base, and a through hole is provided on the cover plate corresponding to the position of the chip placement groove, and the size of the through hole corresponds to the size of the chip that needs to be coated with a protective film, and the upper side edge of the through hole is provided with a chamfer;

[0008] Wherein, after the chip is placed in the chip placement groove, the through hole is directly opposite to the position of the chip where the protective film needs to be coated.

[0009] In some embodiments, the chamfer has an angle of 30 to 60 degrees.

[0010] In some embodiments, the distance between the lower edge of the chamfer and the bottom surface of the cover plate is less than 1 mm.

[0011] In some embodiments, the top corner of the chip placement groove that contacts the top corner of the chip is arc-shaped and hollowed out.

[0012] In some embodiments, a connecting hole is provided on the blocking piece, and a connecting screw passes through the connecting hole and is screwed to the base.

[0013] In some embodiments, the depth of the chip placement groove is greater than the thickness of the chip.

[0014] In some embodiments, a countersunk hole is provided on the cover plate, and the locking bolt passes through the countersunk hole and is screwed to the base thread.

[0015] In some embodiments, the chip placement slots are evenly spaced apart on the base.

[0016] The technical solution provided by the utility model may have the following beneficial effects:

[0017] The present application provides a chamfer on the upper edge of the through hole on the cover plate to avoid the irradiation of the light beam, thereby effectively avoiding the generation of light and shadow, and thus ensuring the quality of the chip coating.

[0018] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory and are not restrictive of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and other objects, features and advantages of the present invention will become more apparent through a more detailed description of exemplary embodiments of the present invention in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments of the present invention.

[0020] Figure 1 This is a schematic structural diagram of a clamp shown in an embodiment of the present utility model;

[0021] Figure 2 This is a schematic structural diagram of a through hole on a cover plate of a clamp shown in an embodiment of the present utility model;

[0022] Figure 3 This is a structural schematic diagram of the base of the clamp shown in an embodiment of the present utility model;

[0023] Reference numerals:

[0024] 1. Base; 101. Chip placement slot; 2. Cover; 201. Through hole; 202. Chamfer; 203. Countersunk hole; 3. Baffle; 301. Connecting hole. DETAILED DESCRIPTION

[0025] The present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments, but the protection scope of the present invention is not limited to the contents described above.

[0026] See also Figure 1 and Figure 2 The present application provides a tool for chip coating, including a base 1 and a cover plate 2. The base 1 and the cover plate 2 are of the same size and shape, and are circular, square or other shapes.

[0027] The base 1 is provided with a chip placement groove 101; the cover plate 2 is covered on the base 1, and the cover plate 2 is provided with a through hole 201 corresponding to the position of the chip placement groove 101, and the size of the through hole 201 corresponds to the size of the chip that needs to be coated with a protective film.

[0028] When applying the protective film, place the chip in the chip placement groove 101, and then cover the cover plate 2 on the base 1. At this time, the through hole 201 is facing the position where the chip needs to be coated with the protective film. Finally, place the tooling in the Leybold coating machine. The Leybold coating machine works and applies the protective film to the chip through the through hole 201.

[0029] In this embodiment, a chamfer 202 is provided on the upper edge of the through hole 201. By avoiding the chamfer 202, when the light beam is irradiated at an angle, the light beam will not be blocked by the side wall of the through hole 201, thereby effectively avoiding the generation of light and shadow and effectively ensuring the chip coating quality.

[0030] In this embodiment, the angle a of the chamfer 202 is 30 degrees to 60 degrees, such as 30 degrees, 40 degrees, 50 degrees, 60 degrees, or any angle between 30 degrees and 60 degrees.

[0031] In this embodiment, the distance between the lower edge of the chamfer 202 and the bottom surface of the cover plate 2 is less than 1 mm, thereby greatly reducing the generation of light and shadow, and effectively ensuring the quality of chip coating.

[0032] In this embodiment, the depth of the chip placement groove 101 is greater than the thickness of the chip.

[0033] In this embodiment, a countersunk hole 203 is provided on the cover plate 2. After the locking bolt passes through the countersunk hole 203, it is screwed to the base 1. When in use, the cover plate 2 is fixed to the base 1 by tightening the locking bolt.

[0034] In this embodiment, the chip placement slots 101 are evenly spaced on the base 1, so that the tooling can load multiple chips at one time, which is beneficial to improving the efficiency of chip coating.

[0035] In some embodiments, such as Figure 3 As shown, the length and width of the chip placement groove 101 are both greater than the length and width of the chip; an L-shaped blocking piece 3 is detachably installed in the chip placement groove 101.

[0036] When installing the chip, after placing the chip in the chip placement groove 101, the chip is pushed to the specified position by the baffle 3. At this time, the two adjacent side surfaces of the chip are respectively abutted against the two adjacent side walls of the chip placement groove 101, and the other two side surfaces of the chip are respectively abutted against the two inner side walls of the baffle 3, thereby fixing the chip in the chip placement groove 101.

[0037] Such a design allows the chip to be gently placed into the chip placement slot 101 when being placed, effectively avoiding damage to the chip caused by a large contact between the chip and the bottom of the chip placement slot 101 when being placed, and effectively ensuring the safety of the chip during the chip placement process.

[0038] In this embodiment, a connecting hole 301 is provided on the baffle 3, and a connecting screw passes through the connecting hole 301 and is screwed to the base 1. In this way, the baffle 3 can be firmly installed in the chip placement groove 101 by simply tightening the connecting screw, making the installation and removal of the baffle 3 more convenient.

[0039] In this embodiment, the top corner of the chip placement groove 101 that contacts the top corner of the chip is arc-shaped and hollowed out, which effectively avoids the problem of chip damage caused by direct contact between the top corner of the chip and the top corner of the chip placement groove 101, ensuring the safety of the chip.

[0040] While various embodiments of the present invention have been described above, the above descriptions are illustrative and non-exhaustive, and are not intended to be limiting of the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is selected to best explain the principles of the embodiments, their practical applications, or improvements to existing technologies, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A chip coating tool, characterized by: It comprises a base (1) and a cover plate (2); The base (1) is provided with a chip placement groove (101), the length and width of the chip placement groove (101) are both greater than the length and width of the chip; an L-shaped blocking piece (3) is detachably installed in the chip placement groove (101), and the chip is pressed against a corner of the chip placement groove (101) through the blocking piece (3); The cover plate (2) is placed on the base (1), and a through hole (201) corresponding to the position of the chip placement groove (101) is provided on the cover plate (2). The size of the through hole (201) corresponds to the size of the chip that needs to be coated with a protective film, and the upper edge of the through hole (201) is provided with a chamfer (202); After the chip is placed in the chip placement groove (101), the through hole (201) is directly opposite to the position of the chip where the protective film needs to be coated.

2. A chip coating tool according to claim 1, characterized in that: The angle of the chamfer (202) is 30 to 60 degrees.

3. The chip coating tool according to claim 1, characterized in that: The distance between the lower edge of the chamfer (202) and the bottom surface of the cover plate (2) is less than 1 mm.

4. The chip coating tool according to claim 1, characterized in that: The top corner of the chip placement groove (101) that contacts the top corner of the chip is in an arc shape and is hollowed out.

5. The chip coating tool according to claim 1, characterized in that: The blocking piece (3) is provided with a connecting hole (301), and a connecting screw passes through the connecting hole (301) and is screwed to the base (1).

6. The chip coating tool according to claim 1, characterized in that: The depth of the chip placement groove (101) is greater than the thickness of the chip.

7. The chip coating tool according to claim 1, characterized in that: The cover plate (2) is provided with a countersunk hole (203), and the locking bolt passes through the countersunk hole (203) and is screwed to the base (1).

8. The chip coating tool according to claim 1, characterized in that: The chip placement slots (101) are evenly spaced and distributed on the base (1).

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