Heat dissipation device and electric equipment

Abstract

The utility model relates to the technical field of electronic device heat dissipation devices, in particular to a heat dissipation device and electric equipment. The heat dissipation device comprises a first shell and a second shell, the second shell is connected to the first shell, and a mounting space is defined by the first shell and the second shell; the circuit board is arranged in the mounting space; the heat dissipation structure is arranged on the second shell, the heat dissipation structure comprises a plurality of heat dissipation fins and a turbulent flow structure, the heat dissipation fins are arranged on the second shell at intervals, and the turbulent flow structure is arranged on the heat dissipation fins and protrudes out of the heat dissipation fins in the thickness direction of the heat dissipation fins. According to the technical scheme, the problem that the heat dissipation effect of a heat dissipation device in the related technology is poor can be effectively solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic device heat dissipation devices, and particularly relates to a heat dissipation device and an electric equipment. BACKGROUND

[0002] With the progress of algorithms, more and more data needs to be processed by chips, and the power consumption also increases. At present, a heat dissipation device is generally set to improve the heat dissipation effect of the chip and ensure the stability of the chip operation.

[0003] In the related art, the heat dissipation device of the chip mainly adopts a self-heat dissipation mode, that is, heat is dissipated through radiation, convection and conduction. Compared with heat dissipation through a cooling liquid, this mode has lower cost and energy consumption, and does not need to consider the risk of cooling liquid leakage. The current heat dissipation device mainly dissipates heat through the setting of heat dissipation fins to increase the heat dissipation area and thus improve the heat dissipation effect.

[0004] However, the heat dissipation effect of this heat dissipation mode is limited and it is difficult to meet the heat dissipation demand of a large algorithm chip. CONTENT OF THE INVENTION

[0005] The present application provides a heat dissipation device and an electric equipment to solve the problem of poor heat dissipation effect of the heat dissipation device in the related art.

[0006] In one aspect, the present application provides a heat dissipation device, comprising: a first shell;

[0007] a second shell connected to the first shell, the first shell and the second shell enclosing an installation space;

[0008] a circuit board arranged in the installation space;

[0009] a heat dissipation structure arranged in the second shell, the heat dissipation structure comprising a plurality of heat dissipation fins and a turbulence structure, the plurality of heat dissipation fins being arranged in the second shell at intervals, and the turbulence structure being arranged on the heat dissipation fins and protruding from the heat dissipation fins in the thickness direction of the heat dissipation fins.

[0010] In some embodiments, the heat dissipation fin comprises a first surface and a second surface arranged oppositely;

[0011] The turbulence structure comprises a turbulence protrusion, and the turbulence protrusion protrudes from the first surface and the second surface.

[0012] In some embodiments, the heat dissipation fin comprises a top portion and a bottom portion arranged oppositely, the bottom portion is close to the second shell, the top portion is away from the second shell, and the turbulence protrusion is arranged on the top portion of the heat dissipation fin.

[0013] In some embodiments, the thickness of the heat dissipation fin is H1, the size of the spoiler protrusion in the thickness direction of the heat dissipation fin is H2, and H1 and H2 satisfy: 0.25≤H1:H2≤1.5.

[0014] In some embodiments, the spoiler structure includes a plurality of spoiler structures, and each heat dissipation fin is provided with at least one spoiler structure.

[0015] In some embodiments, the heat dissipation device further comprises a heat dissipation layer coated on the surface of the heat dissipation fin and / or the outer surface of the second shell.

[0016] In some embodiments, the circuit board comprises a circuit board body and a chip disposed on the circuit board body.

[0017] The surface of the first shell close to the circuit board is provided with a first boss, the first boss is in contact with the chip, or the first boss is in contact with the chip through a heat conductive layer.

[0018] And / or,

[0019] The surface of the second shell close to the circuit board is provided with a second boss, the second boss is in contact with the chip, or the second boss is in contact with the chip through a heat conductive layer.

[0020] In some embodiments, the heat dissipation device further comprises a heat dissipation conductive layer coated on the surface of the first shell.

[0021] In some embodiments, the first shell is provided with a first edge extending towards the second shell, the second shell is provided with a second edge extending towards the first shell, the first edge and the second edge are arranged in the thickness direction of the first shell, one of the first edge and the second edge is provided with a protrusion protruding towards the other, and the first edge and the second edge are in abutting fit through the protrusion.

[0022] In another aspect, the application provides an electric device comprising the heat dissipation device.

[0023] The heat dissipation device provided by the application increases the spoiler structure on the heat dissipation fin. The main function of the spoiler structure is to change the fluid path through the heat dissipation fin, break the fluid boundary layer, and increase the turbulence degree of the fluid and the surface of the heat dissipation fin, thereby improving the heat exchange efficiency. The spoiler structure can effectively destroy the low-speed laminar flow formed by the fluid on the surface of the heat dissipation fin, reduce the thermal resistance, increase the contact area between the fluid and the heat dissipation fin, and increase the heat dissipation efficiency.

[0024] In addition, the second shell, the heat dissipation ribs and the spoiler structure can be integrally formed by injection molding. The spoiler structure can act as a thimble structure during injection molding, so that the ejection mechanism of the injection mold can cooperate with the thimble structure to be ejected, thereby facilitating demolding. Therefore, the design of the spoiler structure comprehensively considers the demolding factor of the injection mold and the spoiler function after the part is formed, thereby improving the processing efficiency of the heat dissipation device and the heat dissipation effect of the heat dissipation device. BRIEF DESCRIPTION OF DRAWINGS

[0025] The accompanying drawings, which are incorporated into and form a part of the specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the application.

[0026] Figure 1 An exploded structural schematic view of a heat dissipation device provided for an embodiment of the present application;

[0027] Figure 2 A sectional view of a heat dissipation device provided for an embodiment of the present application;

[0028] Figure 3 An enlarged structural schematic view of A of the heat dissipation device; Figure 2

[0029] A structural schematic view of a first shell of a heat dissipation device provided for an embodiment of the present application; Figure 4

[0030] A structural schematic view of a second shell of a heat dissipation device provided for an embodiment of the present application; Figure 5

[0031] A structural schematic view of a circuit board of a heat dissipation device provided for an embodiment of the present application. Figure 6 BRIEF DESCRIPTION OF DRAWINGS

[0032] 10, heat dissipation device; 101, mounting space;

[0033] 100, first shell; 110, first boss; 120, first heat conduction layer; 130, first edge;

[0034] 200, second shell; 210, second edge; 220, second heat conduction layer;

[0035] 300, circuit board; 310, circuit board body; 320, chip;

[0036] 400, heat dissipation structure; 410, heat dissipation rib; 420, spoiler structure; 421, spoiler protrusion;

[0037] 510, heat dissipation conductive layer; 520, heat dissipation layer;

[0038]

[0039] ​600. a protrusion. DETAILED DESCRIPTION

[0040] For the purposes of the present application, the technical solutions and advantages will be more clearly described below. The technical solutions in the embodiments of the present application will be clearly and completely described with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application.

[0041] With the increase of algorithm complexity, the amount of data processed by the chip increases, resulting in a significant increase in power consumption. To ensure stable operation of the chip, heat dissipation becomes a key technical challenge.

[0042] Existing heat dissipation solutions rely on natural heat dissipation mechanisms, using radiation, convection and conduction principles to effectively dissipate heat. Compared with liquid cooling, this solution has lower cost, less energy consumption, and avoids the potential risk of leakage of cooling liquid.

[0043] At present, heat dissipation fins are the mainstream choice to improve heat dissipation efficiency, which enhances heat dissipation by increasing surface area. However, in the face of the heat dissipation needs of high-performance chips, the heat dissipation capacity of traditional heat dissipation fins is obviously insufficient.

[0044] Therefore, the present application provides a heat dissipation device, which breaks the fluid boundary layer of the fluid by setting a turbulence structure on the heat dissipation fin, thereby improving the convective heat transfer efficiency between the heat dissipation structure and the air.

[0045] The specific structure of the heat dissipation device of the present application will be described below with reference to the drawings.

[0046] As shown in Figures 1 to 6 The heat dissipation device 10 of the embodiment of the present application includes a first housing 100, a second housing 200, a circuit board 300 and a heat dissipation structure 400.

[0047] The second housing 200 is connected to the first housing 100, and the first housing 100 and the second housing 200 form an installation space 101 for accommodating electronic components such as the circuit board 300. The circuit board 300 is provided with a chip 320.

[0048] The heat dissipation structure 400 is provided on the second housing 200, and the heat dissipation structure 400 includes a plurality of heat dissipation fins 410 and a turbulence structure 420. The plurality of heat dissipation fins 410 are arranged at intervals on the second housing 200, and the turbulence structure 420 is arranged on the heat dissipation fin 410 and protrudes from the heat dissipation fin 410 in the thickness direction of the heat dissipation fin 410.

[0049] The heat dissipation device 10 provided in the present application increases the turbulence structure 420 on the heat dissipation fin 410, the main function of the turbulence structure 420 is to break the fluid boundary layer by changing the fluid path through the heat dissipation fin 410, increase the turbulence degree of the fluid and the surface of the heat dissipation fin 410, thereby improving the heat exchange efficiency. The turbulence structure 420 can effectively destroy the low-speed laminar flow formed by the fluid on the surface of the heat dissipation fin 410, reduce the thermal resistance, increase the contact area between the fluid and the heat dissipation fin 410, and increase the heat dissipation efficiency.

[0050] In addition, the second shell 200, the heat dissipation fin 410 and the turbulence structure 420 can be integrally formed by injection molding, and the turbulence structure 420 can act as a thimble structure during injection molding to enable the ejection mechanism of the injection mold to cooperate with the thimble structure for ejection, thereby facilitating demolding. Therefore, the design of the turbulence structure 420 takes into account the demolding factor of the injection mold and the turbulence function after the part is formed, which improves the processing efficiency of the heat dissipation device 10 and also improves the heat dissipation effect of the heat dissipation device 10.

[0051] Exemplarily, one or more turbulence structures 420 can be provided on each heat dissipation fin 410, and the turbulence structures 420 on different heat dissipation fins 410 can also be staggered. Of course, the turbulence structure 420 can also be provided only on part of the heat dissipation fins 410.

[0052] It should be further pointed out that the heat dissipation device described above can also be a controller or the like.

[0053] The position and specific structure of the turbulence structure 420 will be described below in conjunction with the drawings.

[0054] As shown in Figure 1 and Figure 5 In some embodiments, the heat dissipation fin 410 includes oppositely arranged first and second surfaces, which can significantly increase the contact area between the heat dissipation structure 400 and the air, thereby ensuring the heat dissipation effect of the heat dissipation device 10 on the circuit board 300 and the chip 320.

[0055] Specifically, the turbulence structure 420 includes a turbulence protrusion 421, which is arranged on the first surface and / or the second surface, and the design of the turbulence protrusion 421 has a significant effect on improving the heat dissipation efficiency.

[0056] When the turbulence protrusion 421 protrudes from the first surface and / or the second surface, it can effectively break the laminar flow of air flowing through the surface of the heat dissipation fin 410 and promote the formation of turbulent flow. This turbulent flow state can significantly enhance the heat exchange efficiency between the air and the heat dissipation fin 410, and the turbulent flow can more effectively carry away heat than the laminar flow.

[0057] In addition, the spoiler protrusion 421 indirectly increases the contact time and area between the air and the heat dissipation structure 400 by increasing the complexity of the air flow path, thereby further improving the heat dissipation performance.

[0058] Therefore, the ingenious design of the spoiler structure 420 not only increases the heat dissipation area, but also significantly improves the overall heat dissipation effect by promoting more efficient heat exchange, ensuring that the circuit board 300 and the chip 320 can maintain good working condition even under high load.

[0059] Furthermore, if Figure 5 As shown, in some embodiments, the heat dissipation rib 410 includes a top and a bottom that are oppositely disposed, with the bottom being close to the second housing 200 and the top being away from the second housing 200, and the spoiler protrusion 421 being disposed on the top of the heat dissipation rib 410. Of course, in some embodiments, the spoiler protrusion 421 may also extend from the top to the bottom of the heat dissipation rib 410 to further ensure the spoiler effect.

[0060] The spoiler protrusion 421 can also serve as a component of the injection molding ejection mechanism. Specifically, the protruding structure of the spoiler protrusion 421 serves as an ejection point during mold opening, facilitating smooth demolding of the product. This eliminates the need for an additional ejection mechanism, simplifies the mold structure, and reduces production costs. Furthermore, this design helps reduce material stress concentration, improving the stability and reliability of the product structure.

[0061] Therefore, the provision of the spoiler protrusion 421 not only enhances the heat dissipation performance, but also optimizes the manufacturing process, reflecting the exquisiteness and practicality of the design.

[0062] In some embodiments, the thickness of the heat dissipation rib 410 is H1, and the dimension of the spoiler protrusion 421 in the thickness direction of the heat dissipation rib 410 is H2, and H1 and H2 satisfy: 0.25≤H1:H2≤1.5.

[0063] When the ratio of H1 to H2 is small, that is, the difference between the thickness of the heat dissipation ribs 410 and the thickness of the spoiler protrusions 421 is large, the spoiler protrusions 421 can fully disturb the airflow without affecting the smoothness of air circulation, promoting more effective turbulent heat exchange. This not only increases the heat exchange efficiency between the air and the heat dissipation structure 400.

[0064] When the ratio of H1 to H2 is large, that is, the difference between the thickness of the heat dissipation rib 410 and the thickness of the spoiler protrusion 421 is small, this method ensures the structural strength and stability of the heat dissipation rib 410 and avoids insufficient mechanical strength due to being too thin.

[0065] This proportional design balances the structural reliability and functionality of the heat dissipation structure 400. On the one hand, it ensures that the heat dissipation fins 410 are not deformed or damaged when subjected to external pressure and temperature changes; on the other hand, it maximizes the heat dissipation assistance effect of the spoiler protrusion 421.

[0066] It should be noted that, in some embodiments, the spoiler structure 420 may include one or more spoiler structures. Preferably, each heat dissipation rib 410 is provided with at least one spoiler structure 420 to ensure the heat dissipation effect of the heat dissipation structure 400 .

[0067] To further enhance the heat dissipation effect of the heat dissipation device 10 , in some embodiments, the heat dissipation device 10 further includes a heat dissipation layer 520 , which is coated on the surface of the heat dissipation ribs 410 and / or the outer surface of the second housing 200 .

[0068] The heat dissipation layer 520 is typically made of a high-thermal-conductivity material that significantly increases the speed of heat conduction, quickly directing heat from the chip 320 or other heat-generating components to the heat dissipation fins 410 and the housing, and then dispersing it to the surrounding environment, thereby accelerating heat dissipation. Furthermore, the presence of the coating helps evenly distribute heat across the heat dissipation surface, avoiding hot spots. Even if certain areas generate a lot of heat, the heat dissipation layer 520 ensures that this heat is quickly diffused across the entire heat dissipation surface, maintaining the system's thermal balance.

[0069] At the same time, in addition to improving heat dissipation efficiency, the coating can also play a role in corrosion prevention and oxidation prevention, thereby extending the service life of the heat dissipation device 10. This layer of protection is particularly important when operating in harsh environments.

[0070] For example, the heat dissipation layer 520 may be formed by a black anodizing process or a black electrophoresis process to improve the emissivity of the surface of the second housing 200 .

[0071] Further, if Figure 2 and Figure 6 As shown, the circuit board 300 includes a circuit board body 310 and a chip 320 arranged on the circuit board body 310. In order to improve the heat dissipation effect of the chip 320, a first boss 110 can be set on the surface of the first shell 100 close to the circuit board 300, and the first boss 110 is in contact with the chip 320, or the first boss 110 is in contact with the chip 320 through the first heat conductive layer 120 to ensure that the heat generated by the chip 320 can be quickly conducted to the first shell 100, thereby improving the heat dissipation effect of the chip 320.

[0072] Correspondingly, a second boss can also be arranged on the surface of the second shell 200 close to the circuit board 300, and the second boss is in contact with the chip 320, or the second boss is in contact with the chip 320 through the second heat-conducting layer 220, so that the heat generated by the chip 320 can be quickly conducted to the second shell 200, thereby further improving the heat dissipation effect of the chip 320.

[0073] It should be noted that the first boss 110 or the second boss can be machined by CNC (Computer Numerical Control), which is a high-precision manufacturing technology that can realize the machining of complex shapes while ensuring machining precision. The design of the first boss 110 and / or the second boss helps to reduce the thickness of the heat-conducting glue, so as to realize heat transfer with lower thermal resistance.

[0074] In some embodiments, the heat dissipation device 10 further comprises a heat dissipation conductive layer 510 coated on the surface of the first shell 100. The introduction of the heat dissipation conductive layer 510 is an improvement on the traditional heat dissipation device 10, which optimizes the heat dissipation structure 400 by improving the heat conduction efficiency and conductivity, improves the heat dissipation stability, and can simplify the manufacturing process, thereby comprehensively improving the heat dissipation performance and overall performance of the electronic equipment.

[0075] For example, the heat dissipation conductive layer 510 can be arranged by a black zinc electroplating process, thereby improving the conductivity and heat dissipation of the first shell 100. That is, while improving the surface emissivity, the conductivity of the lower shell is retained, ensuring good grounding performance between the first shell 100 and the circuit board 300.

[0076] It should also be noted that the heat dissipation device 10 further comprises heat-conducting glue, which can be filled in the mounting space 101, and the circuit board 300 is in contact with the first shell 100 and the second shell 200 through the heat-conducting glue, so that the heat of the circuit board 300 can be quickly conducted to the first shell 100 and the second shell 200, thereby reducing the temperature rise of the circuit board 300.

[0077] As shown in FIG. 1, Figures 2 to 4 In some embodiments, the first shell 100 is provided with a first edge 130 extending towards the second shell 200, the second shell 200 is provided with a second edge 210 extending towards the first shell 100, the first edge 130 and the second edge 210 are arranged in the thickness direction of the first shell 100, one of the first edge 130 and the second edge 210 is provided with a protruding part 600 protruding towards the other, and the first edge 130 and the second edge 210 are in abutting cooperation through the protruding part 600.

[0078] The protruding portion 600 is arranged to improve the clamping effect of the first shell 100 and the second shell 200, so that the first shell 100 and the second shell 200 can be clamped by extrusion. This arrangement effectively fills the gap between the first edge 130 and the second edge 210, so that noise cannot leak from the gap, thereby quickly attenuating high-frequency noise and improving electromagnetic shielding performance.

[0079] In addition, when the first shell 100 and the second shell 200 do not have a good clamping abutting effect, the noise on the circuit board 300 can have two return paths: the first is: noise source-fastener-second shell 200-ground; the second is: noise source-fastener-first shell 100. Therefore, the arrangement of the protruding portion 600 can improve the clamping tightness of the first shell 100 and the second shell 200, and optimize the transmission path of the above-mentioned noise, which is along the path of noise source-fastener-first shell 100-second shell 200-ground. The arrangement of the protruding portion 600 greatly improves the EMC performance (electromagnetic compatibility performance) of the product on the basis of reducing costs (such as eliminating the need for conductive foam and spring sheets).

[0080] It should be noted that the protruding portion 600 can be a spherical segment-shaped protrusion.

[0081] It should be further noted that the first edge 130 and / or the second edge 210 with the protruding portion 600 can be provided with a notch to make the first edge 130 and / or the second edge 210 elastic, so as to produce elastic deformation during assembly, thereby achieving rapid assembly at low cost and better improving the EMC shielding effect.

[0082] On the other hand, the application provides an electric device, and an embodiment of the electric device includes the heat dissipation device 10 described above. Since the heat dissipation device 10 has the effect of improving the heat dissipation of the chip 320, the electric device with the heat dissipation device 10 also has the advantages of low heat generation rate and good stability.

[0083] Exemplarily, the electric device can be a vehicle, a drone, a robot, a computer, or the like.

[0084] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", and "connection" should be understood in a broad sense, for example, they can be fixedly connected, or indirectly connected through an intermediate medium, or the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0085] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like are intended to indicate the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0086] The terms "first", "second", "third", "fourth" and the like used in the description and in the claims of the present application, if any, are used to distinguish similar objects and are not necessarily used to describe a particular sequential or chronological order. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented, for example, in an order other than that illustrated or described herein.

[0087] In addition, the terms "comprise" and "have" and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product or apparatus that includes a list of steps or units as an example, does not have to be limited to those steps or units clearly listed, but can include other steps or units that are not clearly listed or inherent to these processes, methods, products or apparatus.

[0088] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit it; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation device, characterized in that: include: a first shell; a second shell connected to the first shell, wherein the first shell and the second shell form an installation space; A circuit board is arranged in the installation space; A heat dissipation structure is arranged in the second shell, and the heat dissipation structure includes multiple heat dissipation ribs and a spoiler structure. The multiple heat dissipation ribs are arranged at intervals in the second shell, and the spoiler structure is arranged on the heat dissipation ribs and protrudes from the heat dissipation ribs in the thickness direction of the heat dissipation ribs.

2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation fin comprises a first surface and a second surface arranged opposite to each other; The spoiler structure includes a spoiler convex portion, and the spoiler convex portion protrudes from the first surface and the second surface.

3. The heat dissipation device according to claim 2, characterized in that: The heat dissipation rib includes a top and a bottom that are oppositely arranged, the top is close to the second shell, and the bottom is far away from the second shell. The spoiler protrusion is arranged on the top of the heat dissipation rib.

4. The heat dissipation device according to claim 3, characterized in that: The thickness of the heat dissipation rib is H1, and the dimension of the spoiler protrusion in the thickness direction of the heat dissipation rib is H2, and H1 and H2 satisfy: 0.25≤H1:H2≤1.

5.

5. The heat dissipation device according to any one of claims 1 to 4, characterized in that: The spoiler structure includes a plurality of spoiler structures, and each of the heat dissipation ribs is provided with at least one spoiler structure.

6. The heat dissipation device according to any one of claims 1 to 4, characterized in that: The heat dissipation device further includes a heat dissipation layer, which is coated on the surface of the heat dissipation ribs and / or the outer surface of the second shell.

7. The heat dissipation device according to any one of claims 1 to 4, characterized in that: The circuit board includes a circuit board body and a chip arranged on the circuit board body; A first boss is provided on a surface of the first housing close to the circuit board, the first boss contacts and cooperates with the chip, or the first boss contacts and cooperates with the chip through a first heat-conducting layer; and / or, A second boss is provided on the surface of the second housing close to the circuit board. The second boss is in contact with and matched with the chip, or the second boss is in contact with and matched with the chip through a second heat conducting layer.

8. The heat dissipation device according to any one of claims 1 to 4, characterized in that: The heat dissipation device further includes a heat dissipation conductive layer, which is coated on the surface of the first shell.

9. The heat dissipation device according to any one of claims 1 to 4, characterized in that: The first shell is provided with a first edge extending toward the second shell, and the second shell is provided with a second edge extending toward the first shell. The first edge and the second edge are overlapped in the thickness direction of the first shell. One of the first edge and the second edge is provided with a protrusion protruding toward the other, and the first edge and the second edge are abutted and matched through the protrusion.

10. An electrical device, characterized in that: The heat dissipation device comprises any one of claims 1 to 9.

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