Mobile phone cover die cutting device suitable for manual or automatic production

Abstract

The utility model provides a mobile phone cover die-cutting device suitable for manual or automatic production, a die-cutting base comprises a die-cutting material buffer hole and a die-cutting material accommodating hole, the die-cutting material buffer hole is positioned at the upper part of the die-cutting base, the inner wall of the die-cutting material buffer hole is in interference fit with the outer edge of a die-cutting material, and the die-cutting material accommodating hole is positioned at the lower part of the die-cutting base. The die-cutting material containing hole is located on the lower portion of the die-cutting material temporary storage hole, and the hole diameter of the die-cutting material containing hole is larger than that of the die-cutting material temporary storage hole. By the adoption of the structure, after the upper die and the die cutter move downwards to complete die cutting operation, die cutting materials are still retained in the die cutting material temporary storage hole, at the moment, die cutting operation of a next mobile phone cover can be conducted without manual taking away, manual operation steps are reduced, and production efficiency can be greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the related technical field of mobile phone cover processing, specifically to a mobile phone cover die cutting device suitable for manual or automatic production. BACKGROUND

[0002] The existing mobile phone cover die cutting device suitable for manual or automatic production generally comprises an upper die, a lower die and a die cutter located at the lower part of the upper die, the upper part of the lower die is fixedly provided with a die cutting base for placing the mobile phone cover, the upper die reciprocates up and down relative to the lower die, driving the die cutter to die cut the semi-finished mobile phone cover to form corresponding mobile phone cover hole positions (such as camera hole positions).

[0003] The existing mobile phone cover die cutting device suitable for manual or automatic production has the problem that after the die cutting operation is completed by manually or automatically controlling the downward movement of the upper die and the die cutter, the die cutting material needs to be manually taken away by a worker for the die cutting operation of the next mobile phone cover, and the production efficiency is low. UTILITY MODEL CONTENTS

[0004] To solve the technical problems and defects in the prior art, the utility model provides a mobile phone cover die cutting device suitable for manual or automatic production.

[0005] To solve the above technical problems, the utility model provides the following technical scheme: a mobile phone cover die cutting device suitable for manual or automatic production, comprising an upper die, a lower die and a die cutter located at the lower part of the upper die, the upper part of the lower die is fixedly provided with a die cutting base for placing the mobile phone cover, characterized in that the die cutting base comprises a die cutting material buffer hole and a die cutting material containing hole, the die cutting material buffer hole is located at the upper part of the die cutting base, the inner wall of the die cutting material buffer hole is in interference fit with the outer edge of the die cutting material, the die cutting material containing hole is located at the lower part of the die cutting material buffer hole, and the hole diameter of the die cutting material containing hole is greater than the hole diameter of the die cutting material buffer hole.

[0006] Specifically, the upper die is connected to an automatic control device, and reciprocates up and down relative to the lower die under the control of the automatic control device.

[0007] The utility model has the advantages of:

[0008] The utility model provides a mobile phone case die-cutting device suitable for manual or automated production, wherein the die-cutting base includes a die-cutting material buffer hole and a die-cutting material accommodating hole, wherein the die-cutting material buffer hole is located at the upper portion of the die-cutting base, and the inner wall of the die-cutting material buffer hole is interference-fitted with the outer edge of the die-cutting material, and the die-cutting material accommodating hole is located at the lower portion of the die-cutting material buffer hole, and the aperture of the die-cutting material accommodating hole is larger than the aperture of the die-cutting material buffer hole. By adopting the above structure, after the upper mold and the die knife move downward to complete the die-cutting operation, the die-cutting material still remains in the die-cutting material buffer hole. At this time, the die-cutting operation of the next mobile phone case can be carried out without manual removal, thereby reducing the number of manual operation steps and greatly improving production efficiency. For the die-cutting material retained in the die-cutting material buffer hole, if an automated production line is used, the die-cutting material can be sucked away by a suction cup by controlling a manipulator with a suction cup at the end to match automated production. If manual control of die cutting is adopted, when the die cutting material retained in the die cutting material buffer hole exceeds the depth of the die cutting material buffer hole, the die cutting material can automatically escape from the die cutting buffer hole and enter the die cutting accommodating hole under the action of the upper die and the downward die cutting force of the die knife. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0010] Figure 1 This is an overall structural diagram of a mobile phone case die-cutting device suitable for manual or automated production;

[0011] Figure 2 This is an exploded view of the structure of a mobile phone case die-cutting device suitable for manual or automated production;

[0012] Figure 3 This is a cross-sectional structural diagram of a mobile phone case die-cutting device suitable for manual or automated production according to an embodiment;

[0013] Figure 4 This is a structural diagram of the die-cut base from a first perspective in an embodiment;

[0014] Figure 5 It is a structural diagram of the die-cut base from the second perspective of the embodiment.

[0015] In the figure: 1. Upper mold; 2. Lower mold; 3. Die cutter; 4. Mobile phone case; 5. Die-cutting base; 6. Die cutter fixing block; 7. Die-cutting material. DETAILED DESCRIPTION

[0016] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention and are not used to limit the present invention.

[0017] The utility model discloses a mobile phone cover die cutting device suitable for manual or automatic production, and its overall structural drawing refers to the attached Figure 1 Its structural exploded view refers to the attached Figure 2 Its sectional structure view refers to the attached Figure 3 Including upper die 1, lower die 2, die cutter fixed block 6, die cutter 3, die cutting base 5, die cutting base 5 is fixed in the upper portion of lower die 2, and die cutting base 5 is used to place mobile phone cover 4, and die cutter 3 is fixedly installed on die cutter fixed block 6, and die cutter fixed block 6 is fixedly installed on the lower portion of upper die 1, and die cutting base 5 includes die cutting material buffer hole 51 and die cutting material containing hole 52, and die cutting material buffer hole 51 is located in the upper portion of die cutting base 5, and the inner wall of die cutting material buffer hole 51 is in interference fit with the outer edge of die cutting material 7, and die cutting material containing hole 52 is located in the lower portion of die cutting material buffer hole 51, and the hole diameter of die cutting material containing hole 52 is greater than the hole diameter of die cutting material buffer hole 51.

[0018] When being implemented, the interference fit between the inner wall of die cutting material buffer hole 51 and the outer edge of die cutting material 7 can adopt the mode that the inner wall hole diameter of die cutting material buffer hole 51 is substantially equal to or slightly greater than the size of the outer edge of die cutting material 7, and those skilled in the art should understand that other similar modes can also realize interference fit.Meanwhile, upper die 1 can be connected with an automatic control device, and the automatic control device controls the up-and-down reciprocating motion of upper die 1 relative to lower die 2, and then drives die cutter 3 to move to realize automatic die cutting.

[0019] The mobile phone cover die cutting device suitable for manual or automatic production provided by the utility model, the die cutting base includes die cutting material buffer hole and die cutting material containing hole, the die cutting material buffer hole is located in the upper portion of the die cutting base, the inner wall of the die cutting material buffer hole is in interference fit with the outer edge of die cutting material, the die cutting material containing hole is located in the lower portion of the die cutting material buffer hole, and the hole diameter of the die cutting material containing hole is greater than the hole diameter of the die cutting material buffer hole.Through adopting the above structure, after the down movement of upper die and die cutter completes die cutting operation, the die cutting material still lingers in the die cutting material buffer hole, and at this time, the next die cutting operation of mobile phone cover can be carried out without manual removal, thereby reducing manual operation steps and greatly providing production efficiency.For the die cutting material lingering in the die cutting material buffer hole, if an automatic production line is adopted, the die cutting material can be sucked away by a mechanical hand with a suction cup at the tail end to match automatic production.If manual control die cutting is adopted, when the die cutting material lingering in the die cutting material buffer hole exceeds the depth of the die cutting material buffer hole, the die cutting material can automatically separate from the die cutting buffer hole and enter the die cutting containing hole under the action force of the down movement of upper die and die cutter.

[0020] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and is not intended to limit the present application, although the foregoing embodiments of the present application have been described in detail, for the skilled in the art, it still can be modified, or for the equivalent replacement of part of the technical features of the technical solutions recorded in the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application, shall be included within the scope of the present application.

Claims

1. A die-cutting device for mobile phone cases suitable for manual or automated production, comprising an upper die (1), a lower die (2), and a die cutter (3) located below the upper die (1), a die-cutting base (5) for placing a mobile phone case (4) fixedly provided on the upper part of the lower die (2), and characterized in that: The die-cutting base (5) comprises a die-cutting material buffer hole (51) and a die-cutting material accommodating hole (52); the die-cutting material buffer hole (51) is located at the upper part of the die-cutting base (5); the inner wall of the die-cutting material buffer hole (51) is interference-fitted with the outer edge of the die-cutting material; the die-cutting material accommodating hole (52) is located at the lower part of the die-cutting material buffer hole (51); the aperture of the die-cutting material accommodating hole (52) is larger than the aperture of the die-cutting material buffer hole (51).

2. A mobile phone case die-cutting device suitable for manual or automated production according to claim 1, characterized in that: The upper die (1) is connected to an automatic control device, and the automatic control device controls its up and down reciprocating motion relative to the lower die (2).

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