Equipment for magnetron sputtering process

Abstract

The utility model relates to the technical field of magnetron sputtering, and discloses equipment for a magnetron sputtering process, which comprises a vacuum box, a first servo motor is arranged on one side of the middle part of the upper end in the vacuum box, a gear is sleeved outside the output end of the first servo motor, the lower end of the gear is meshed with a half gear, and the half gear is meshed with a second servo motor. A sample frame is fixedly connected to the lower end of the half gear, a two-way motor is arranged in the middle of the interior of the sample frame, threaded rods are fixedly connected to the two ends of the two-way motor, and supporting rods are arranged on one sides of the exteriors of the two threaded rods in a threaded mode. According to the device, the bidirectional motor drives the threaded rod to drive the supporting rod to move, and the bolt rotates to drive the pressing plate to move so as to adapt to substrates with different sizes and thicknesses, so that the universality and the flexibility of the device are enhanced, and meanwhile, the stability of the substrate to be coated in the sputtering process is ensured; and the quality and adhesive force of the film are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to magnetron sputtering technical field especially relates to a device for magnetron sputtering process. BACKGROUND

[0002] Sputtering is a kind of phenomenon that high-energy particles bombard the surface of solid target material, so that the atoms and molecules on the surface of target material exchange kinetic energy with incident particles and fly out, these sputtered atoms or atomic groups can recondense and deposit on solid substrate to form a thin film due to obtaining certain energy;And magnetron sputtering is to change the electron motion direction by introducing magnetic field on this basis, prolongs the electron trajectory, thereby improves the ionization probability of electron to working gas, increases the number of high-energy ions bombarding target material, reduces the number of high-energy electrons bombarding substrate at the same time, makes electron energy more effectively utilized, usually in magnetron sputtering method, argon is used as sputtering gas and bombards target material after being ionized, and the generated sputtering particles are then deposited on the substrate to form the required thin film.

[0003] In the prior art, most of the magnetron sputtering devices are usually clamped on the end of the sample holder by the clamp, but the position of the clamp is fixed, and only the fixed size substrate can be effectively fixed, if the substrate is too large or too small, it may be difficult to fix it, thereby limiting the application range of the device.

[0004] Therefore, the technical personnel in the art provide a device for magnetron sputtering process to solve the problems in the above background. UTILITY MODEL CONTENT

[0005] The utility model content aims at solving the shortcomings in the prior art, and provides a device for magnetron sputtering process, which drives the support rod to move through the bidirectional motor driving screw rod, and drives the pressing plate to move through the bolt rotation, to adapt to the substrates of different sizes and thicknesses, this design enhances the versatility and flexibility of the device, and ensures the stability of the substrate to be coated in the sputtering process, improves the quality and adhesion of the thin film.

[0006] To achieve the above object, the utility model provides the following technical scheme.

[0007] The utility model relates to a kind of equipment for magnetron sputtering process, including vacuum box, the inside upper end middle part of the vacuum box is provided with first servo motor, the output end of the first servo motor is externally equipped with gear, the lower end of the gear is engaged and connected with half gear, the lower end of the half gear is fixedly connected with sample holder, the inside middle part of the sample holder is provided with bidirectional motor, the both ends of the bidirectional motor are fixedly connected with threaded rod, the outer side of two the threaded rod is screw threaded with support rod, the inside lower end side of two the support rod is rotatably connected with rotating shaft, the side end face of two the rotating shaft is fixedly connected with fixed frame, the upper end both sides of two the fixed frame are screw connected with screw, the lower end of multiple the screw is all penetrated fixed frame and rotatably connected with pressing plate, the inside lower end of the vacuum box is provided with magnetron sputtering target;

[0008] Through the above technical scheme, the equipment moves the support rod by driving threaded rod by bidirectional motor, and moves the pressing plate by bolt rotation, to adapt to different sizes and thicknesses of substrate, this design enhances the versatility and flexibility of the equipment, while ensuring the stability of the substrate to be coated in the sputtering process, improves the quality and adhesion of thin film.

[0009] Further, the inside upper end of the vacuum box is fixedly connected with slide rod at four corners, the outer middle part of multiple slide rods is slidably connected with slide cylinder, the lower end of multiple slide cylinders is fixedly connected with first rotating block, the inside of multiple first rotating blocks is rotatably connected with connecting rod, the lower end of multiple connecting rods is rotatably connected with second rotating block, and the lower end of multiple second rotating blocks is fixedly connected with sample holder.

[0010] Through the above technical scheme, through the ingenious combination of slide rod, slide cylinder, rotating block and connecting rod, the sample holder can be flexibly rotated and positioned in the vacuum chamber, and the advantage of this design is to improve the adjustment accuracy of the sample holder, so that the sputtering process is more accurate, and it is also convenient for operators to quickly adjust the position of the substrate according to different experimental requirements.

[0011] Further, the inside middle part of the half gear is sleeved with rotating shaft, and the both ends of the rotating shaft are fixedly connected with the vacuum box.

[0012] Through the above technical scheme, the setting of the rotating shaft ensures the stable rotation of the half gear in the vacuum box, improves the operation stability of the equipment, and ensures the uniform rotation of the sample holder in the sputtering process, so as to help obtain uniform thin film deposition.

[0013] Further, the outside of one rotating shaft is sleeved with driven bevel gear, the inside lower end of one support rod is provided with second servo motor, the output end of the second servo motor is externally sleeved with driving bevel gear, and the driving bevel gear and the driven bevel gear are engaged with each other.

[0014] Through the technical scheme, the meshing of the driven bevel gear and the driving bevel gear and the application of the second servo motor realize accurate control of the rotation of the supporting rod, and help improve the uniformity and repeatability of the film.

[0015] Further, a vacuum pump is arranged at one side end surface of the vacuum box, and the lower end of the vacuum pump extends into the interior of the vacuum box.

[0016] Through the technical scheme, the arrangement of the vacuum pump enables the interior of the vacuum box to rapidly and effectively establish a vacuum environment, thereby providing necessary conditions for the magnetron sputtering and ensuring the accuracy of the magnetron sputtering.

[0017] Further, a slide groove is arranged at the upper end of the interior of the sample holder on both sides, and a slide block is fixedly connected to the upper end of each of the two supporting rods, and the two slide blocks are in sliding connection with the slide groove.

[0018] Through the technical scheme, the sliding connection of the slide groove and the slide block enables the supporting rod to stably move on the sample holder, thereby reducing deviation caused by vibration.

[0019] Further, a control panel is arranged at one corner of the side end surface of the vacuum box, and a storage battery is arranged at the lower end of the vacuum box, and the control panel, the storage battery, the first servo motor, the second servo motor, the bidirectional motor and the magnetron sputtering target are in electric connection.

[0020] Through the technical scheme, the arrangement of the control panel and the storage battery and the electric connection with various motors provide an operator with a centralized control platform, thereby simplifying the operation process and improving the automation degree and production efficiency of the equipment.

[0021] Further, the side end surface of each of the two threaded rods is in rotational connection with the sample holder.

[0022] Through the technical scheme, the rotational connection of the threaded rod and the sample holder provides stronger structural support, thereby ensuring the fixation of the substrate in the magnetron sputtering and avoiding possible displacement and interference.

[0023] The utility model has the advantages of:

[0024] 1. The device for the magnetron sputtering process, when in use, the threaded rod is driven to move the supporting rod by the bidirectional motor, and the pressing plate is driven to move by the bolt, thereby realizing accurate clamping and fixation of substrates of different sizes and thicknesses. This design not only significantly improves the versatility and flexibility of the device, making it easily adapt to diversified substrate requirements, but also ensures the stability of the substrate to be coated during the sputtering process, effectively preventing any potential displacement or deformation, thereby enabling the deposition process of the film to be more uniform and consistent, and improving the quality and adhesion of the film.

[0025] 2、The utility model provides a device for magnetron sputtering process, the device uses, through being provided first servo motor drive gear half gear rotation to the driving bevel gear drive driven bevel gear rotation to the substrate can realize overturn and angle inclination in the process of film -coating, this design improves the uniformity of film -coating significantly, ensures that each part of the substrate can evenly receive film material, effectively avoids the film thickness uneven problem caused by fixed position, provides powerful guarantee for high precision, high quality film preparation. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 It is a perspective view of the device for magnetron sputtering process provided by the utility model;

[0027] Figure 2 It is a vacuum box internal structure display drawing of the device for magnetron sputtering process provided by the utility model;

[0028] Figure 3 It is a sample holder structure display drawing of the device for magnetron sputtering process provided by the utility model;

[0029] Figure 4 It is a fixed frame and pressing plate expansion schematic drawing of the device for magnetron sputtering process provided by the utility model;

[0030] Figure 5 It is a sectional view of the device for magnetron sputtering process provided by the utility model.

[0031] LEGEND:

[0032] 1, vacuum box;2, first servo motor;3, gear;4, half gear;5, sample holder;6, two-way motor;7, threaded rod;8, support rod;9, fixed frame;10, screw;11, pressing plate;12, slide bar;13, slide cylinder;14, first rotating block;15, connecting rod;16, second rotating block;17, rotating shaft;18, driven bevel gear;19, driving bevel gear;20, second servo motor;21, sliding block;22, slide groove;23, magnetron sputtering target;24, battery;25, vacuum pump;26, control panel;27, rotating shaft. DETAILED DESCRIPTION

[0033] Specific embodiments of the present application will be described below with reference to the accompanying drawings. It should be noted that the specific embodiments described are merely a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the specific embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0034] Referring to Figures 1-5 The present application provides a kind of specific embodiment: a kind of equipment for magnetron sputtering process, including vacuum box 1, the inside upper end middle part of vacuum box 1 is provided with first servo motor 2, the output end of first servo motor 2 is externally provided with gear 3, the lower end of gear 3 is engagedly connected with half gear 4, the lower end of half gear 4 is fixedly connected with sample holder 5, the inside middle part of sample holder 5 is provided with bidirectional motor 6, the both ends of bidirectional motor 6 are fixedly connected with threaded rod 7, the outside one side of two threaded rods 7 is screwed with support rod 8, the inside lower end one side of two support rods 8 is rotatably connected with rotating shaft 27, the one side end surface of two rotating shafts 27 is fixedly connected with fixed frame 9, the upper end both sides of two fixed frames 9 are screw-connected with screw 10, the lower end of multiple screws 10 is all penetrated fixed frame 9 and rotatably connected with pressing plate 11, the inside lower end of vacuum box 1 is provided with magnetron sputtering target 23;

[0035] The equipment moves support rod 8 by bidirectional motor 6 driving threaded rod 7, and moves pressing plate 11 by bolt rotation, to adapt to different size and thickness of substrate, this design enhances the versatility and flexibility of equipment, while ensuring the stability of the substrate to be coated in sputtering process, improves the quality and adhesion of thin film.

[0036] The upper end of the inside of the vacuum box 1 is fixedly connected with a slide rod 12 at four corners, the outer middle part of the plurality of slide rods 12 is slidably connected with a slide cylinder 13, the lower end of the plurality of slide cylinders 13 is fixedly connected with a first rotating block 14, the inside of the plurality of first rotating blocks 14 is rotatably connected with a connecting rod 15, the lower end of the plurality of connecting rods 15 is rotatably connected with a second rotating block 16, the lower end of the plurality of second rotating blocks 16 is fixedly connected with the sample holder 5, through the ingenious combination of the slide rod 12, the slide cylinder 13, the rotating block and the connecting rod 15, the sample holder 5 can be flexibly rotated and positioned in the vacuum chamber, the advantage of this design is to improve the adjustment accuracy of the sample holder 5, so that the sputtering process is more accurate, and it is also convenient for the operator to quickly adjust the substrate position according to different experimental requirements, the inside of the middle part of the half gear 4 is sleeved with a rotating shaft 17, both ends of the rotating shaft 17 are fixedly connected with the vacuum box 1, the setting of the rotating shaft 17 ensures the stable rotation of the half gear 4 in the vacuum box 1, improves the running stability of the equipment, and ensures the uniform rotation of the sample holder 5 in the sputtering process, thereby helping to obtain uniform film deposition, the outside of the one side rotating shaft 27 is sleeved with a driven bevel gear 18, the inside of the lower end of the one side supporting rod 8 is provided with a second servo motor 20, the output end of the second servo motor 20 is sleeved with a driving bevel gear 19, the driving bevel gear 19 and the driven bevel gear 18 are meshed with each other, the meshing of the driven bevel gear 18 and the driving bevel gear 19, and the application of the second servo motor 20 realize accurate control of the rotation of the supporting rod 8, which helps to improve the uniformity and repeatability of the film, one side end face of the vacuum box 1 is provided with a vacuum pump 25, the lower end of the vacuum pump 25 extends to the inside of the vacuum box 1, the setting of the vacuum pump 25 enables the inside of the vacuum box 1 to quickly and effectively establish a vacuum environment, providing necessary conditions for magnetron sputtering, ensuring the accuracy of magnetron sputtering, the inside of the upper end of the sample holder 5 is provided with a sliding groove 22 on both sides, the upper end of the two supporting rods 8 is fixedly connected with a sliding block 21, the two sliding blocks 21 are slidably connected with the sliding groove 22, the sliding connection design of the sliding groove 22 and the sliding block 21 enables the supporting rod 8 to move stably on the sample holder 5, reducing the deviation caused by vibration, one corner of the one side end face of the vacuum box 1 is provided with a control panel 26, the lower end of the vacuum box 1 is provided with a battery 24, the control panel 26 and the battery 24, the first servo motor 2, the second servo motor 20, the bidirectional motor 6 and the magnetron sputtering target 23 are electrically connected, the configuration of the control panel 26 and the battery 24, and the electrical connection with various motors provide an operator with a centralized control platform, simplify the operation process, improve the degree of automation and production efficiency of the equipment, the one side end face of the two threaded rods 7 is rotatably connected with the sample holder 5, the threaded rod 7 is rotatably connected with the sample holder 5, providing stronger structural support to ensure the fixation of the substrate in the magnetron sputtering, avoiding possible displacement and interference.

[0037] Working principle: when using the magnetron sputtering device, the worker controls the bidirectional motor 6 through the control panel 26 according to the size of the substrate to be coated, drives the threaded rod 7 to move the supporting rod 8 to the appropriate position, then places the substrate on the upper end of the fixed frame 9, then rotates the screw 10 to move the pressing plate 11 for fixing the substrate, then closes the door, then the vacuum pump 25 is used to pump out the air, and the magnetron sputtering target 23 is started to coat the substrate, in the coating process, the first servo motor 2 is operated through the control panel 26, the half gear 4 is driven to rotate by the gear 3, and the driven bevel gear 18 is driven to rotate by controlling the second servo motor 20 to drive the driving bevel gear 19, so that the substrate can be turned over and inclined, this design ensures that the thin film material uniformly covers each part of the substrate, effectively avoids the problem of uneven film thickness caused by fixed position, and provides a strong guarantee for high-precision and high-quality film preparation.

[0038] Finally, it should be noted that: the above only for the preferred specific embodiments of the present application, and is not intended to limit the present application, although the foregoing detailed description of the present application, for those skilled in the art, it still can be modified, or part of the technical features of the equivalent replacement, within the spirit and principles of the present application, any modification, equivalent replacement, improvement, etc., should be included in the scope of protection of the present application.

Claims

1. An apparatus for a magnetron sputtering process, comprising a vacuum box (1), characterized in that: A first servo motor (2) is provided on one side of the middle of the upper end of the vacuum box (1); a gear (3) is sleeved on the outside of the output end of the first servo motor (2); the lower end of the gear (3) is meshedly connected with a half gear (4); the lower end of the half gear (4) is fixedly connected with a sample holder (5); a bidirectional motor (6) is provided in the middle of the sample holder (5); both ends of the bidirectional motor (6) are fixedly connected with threaded rods (7); the outer sides of the two threaded rods (7) are threaded with support rods (8); the inner lower ends of the two support rods (8) are rotatably connected with rotating shafts (27); one end surface of each of the two rotating shafts (27) is fixedly connected with a fixing frame (9); both sides of the upper ends of the two fixing frames (9) are threaded with screws (10); the lower ends of the plurality of screws (10) pass through the fixing frame (9) and are rotatably connected with a pressure plate (11); a magnetron sputtering target (23) is provided at the lower end of the vacuum box (1).

2. The device for magnetron sputtering process according to claim 1, characterized in that: The four corners of the upper end of the vacuum box (1) are fixedly connected with sliding rods (12), the middle parts of the outer parts of the plurality of sliding rods (12) are slidably connected with sliding cylinders (13), the lower ends of the plurality of sliding cylinders (13) are fixedly connected with first rotating blocks (14), the interiors of the plurality of first rotating blocks (14) are rotatably connected with connecting rods (15), the lower ends of the plurality of connecting rods (15) are rotatably connected with second rotating blocks (16), and the lower ends of the plurality of second rotating blocks (16) are fixedly connected to the sample rack (5).

3. The device for magnetron sputtering process according to claim 1, characterized in that: A rotating shaft (17) is sleeved on the inner middle portion of the half gear (4), and both ends of the rotating shaft (17) are fixedly connected to the vacuum box (1).

4. The device for magnetron sputtering process according to claim 1, characterized in that: A driven bevel gear (18) is sleeved on the outside of the rotating shaft (27) on one side, a second servo motor (20) is provided at the inner lower end of the support rod (8) on one side, and a driving bevel gear (19) is sleeved on the outside of the output end of the second servo motor (20), and the driving bevel gear (19) and the driven bevel gear (18) are meshed with each other.

5. The device for magnetron sputtering process according to claim 1, characterized in that: A vacuum pump (25) is provided at the upper end of one end surface of the vacuum box (1), and the lower end of the vacuum pump (25) extends into the interior of the vacuum box (1).

6. The device for magnetron sputtering process according to claim 1, characterized in that: Slide grooves (22) are provided on both sides of the inner upper end of the sample rack (5), and the upper ends of the two support rods (8) are fixedly connected with sliders (21), and the two sliders (21) are slidably connected to the slide grooves (22).

7. The device for magnetron sputtering process according to claim 1, characterized in that: A control panel (26) is provided at a corner of one end surface of the vacuum box (1), a battery (24) is provided at the lower end of the vacuum box (1), and the control panel (26) is electrically connected to the battery (24), the first servo motor (2), the second servo motor (20), the bidirectional motor (6), and the magnetron sputtering target (23).

8. The device for magnetron sputtering process according to claim 1, characterized in that: One end surface of each of the two threaded rods (7) is rotatably connected to the sample rack (5).

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