Wafer drying system
By using a jet mechanism to form airflow in the wafer drying system, the problem of low drying efficiency caused by the contact between the wafer and the wafer boat is solved, achieving more efficient drying effect and better drying quality.
Patent Information
- Application Number
- CN202422954835.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-02
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2034-12-02
AI Technical Summary
During the wafer drying process, there is contact between the wafer and the wafer boat, which makes it difficult to dry some moisture, resulting in long drying time and low efficiency.
A jet mechanism is used to blow air between the wafer and the wafer boat, and the first and second nozzles are used to provide gas in different conical ranges to form vertical and horizontal air walls, blowing the wafer to vibrate relative to the wafer carrier to avoid liquid residue.
The drying efficiency and quality are improved, ensuring that there is no residual liquid between the wafer and the wafer carrier, thus improving the drying effect.
Smart Images
Figure CN223448801U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a drying system, in particular to a wafer drying system. BACKGROUND
[0002] In the processing of wafers, cleaning and drying after cleaning are indispensable links to ensure the quality of wafer products. The purpose of drying is to remove moisture and other pollutants that may affect the process on the surface of the wafer to ensure the accuracy of the manufacturing process and the quality of the product.
[0003] There are many drying methods, such as spin drying, heating drying, or blow drying. Spin drying refers to the use of centrifugal force to throw out moisture during high-speed rotation of the wafer. Heating drying refers to placing the wafer in a heated oven to evaporate the moisture by high temperature. Blow drying refers to using dry gas (such as nitrogen) to dry the surface of the wafer.
[0004] However, during the drying process, wafers are processed in batches and must be placed in a wafer boat. Since the wafer and the wafer boat often come into contact with each other, the moisture in the contact area is difficult to dry, resulting in a longer drying time and lower drying efficiency. SUMMARY
[0005] The utility model aims to provide a wafer drying system that uses airflow to blow the wafer, so that there is no liquid left between the wafer and the wafer boat, which not only improves the drying efficiency but also improves the drying quality.
[0006] The utility model provides a wafer drying system suitable for drying at least one wafer, which comprises a tank body, a gas injection mechanism, and a gas extraction device. The tank body is provided with a containing space and a carrying part. The containing space includes four tank walls and a tank bottom, and defines a horizontal direction and a vertical direction. The carrying part is arranged on the tank bottom and can carry a wafer carrier. The wafer carrier contains at least one wafer. The gas injection mechanism includes a plurality of first nozzles and a plurality of second nozzles. Each first nozzle is arranged separately and erected on at least two tank walls. Each first nozzle on the same tank wall provides a first gas in a first conical range to form a vertical gas wall in the vertical direction. Each second nozzle is arranged separately and erected on at least two tank walls. Each second nozzle on the same tank wall provides a second gas in a second conical range to the wafer carrier, wherein the second conical range is larger than the first conical range and breaks through the vertical gas wall to blow the wafers to vibrate relative to the wafer carrier. The gas extraction device includes at least one gas extraction pipe. Each gas extraction pipe is connected to the tank bottom and located below the wafer carrier. The gas extraction device extracts gas to the wafer carrier.
[0007] In one embodiment, the wafer carrier includes a accommodating body, which is provided with four supporting bars, each of which is provided with a plurality of slots arranged at equal intervals, and each of the supporting bars is arranged symmetrically with each other, so that the symmetrically arranged slots can accommodate the same wafer; and when each wafer vibrates, the wafer is confined in the corresponding slot.
[0008] In one embodiment, the wafer drying system further includes a lifting mechanism disposed at the bottom of the tank and having a lift rod. When the wafer carrier is placed on the supporting portion, the lift rod lifts the wafer in the vertical direction.
[0009] In one embodiment, the wafer drying system further includes a plurality of first air supply pipes spaced apart from each other, each first air supply pipe can be equipped with at least two first nozzles, and each first air supply pipe is mounted on the tank walls.
[0010] In one embodiment, the wafer drying system further includes a plurality of second air supply pipes spaced apart from each other, each second air supply pipe is equipped with at least one second nozzle, and each second air supply pipe is mounted on the tank walls.
[0011] In one embodiment, the tank body includes an upper cover, which is disposed on a pair of vertical surfaces of the tank bottom.
[0012] In one embodiment, the upper cover is provided with a plurality of first nozzles, each of which is spaced apart and provides a first gas in a first conical range to form a horizontal gas wall in the horizontal direction.
[0013] In one embodiment, the upper cover is provided with a plurality of second nozzles, each second nozzle is arranged at intervals, and each second nozzle provides a second gas in a second conical range toward the wafer carrier.
[0014] In one embodiment, the above further includes a plurality of first air supply pipes arranged at intervals from each other, each first air supply pipe can be equipped with at least two first nozzles, and each first air supply pipe is mounted on the upper cover.
[0015] In one embodiment, the above also includes a plurality of second air supply pipes arranged at intervals from each other, each second air supply pipe can be equipped with at least one second nozzle, and each second air supply pipe is mounted on the upper cover, wherein the second conical range is larger than the first conical range and breaks through the horizontal air wall to blow these wafers relative to the wafer carrier to generate vibration.
[0016] In one embodiment, the first gas and the second gas have different temperatures.
[0017] In one embodiment, the first air supply pipe is connected to the second air supply pipe.
[0018] Based on the above, the jet mechanism in the wafer drying system of the utility model, its layout multiple first nozzles and multiple second nozzles provide different conical range gas respectively, wherein the first nozzles arranged on the same face groove wall form vertical gas wall in vertical direction, and the multiple second nozzles break through the vertical gas wall and blow gas to the wafer carrier, and the wafers can be blown to vibrate relative to the wafer carrier, so that the liquid between the wafer and the wafer carrier (wafer boat) is not left, which can not only improve the drying efficiency, but also improve the drying quality.
[0019] In order to make the utility model more obvious and easy to understand, the following examples are listed, and the following detailed description is made with the attached drawings. BRIEF DESCRIPTION OF DRAWINGS
[0020] Figure 1 It is a three-dimensional schematic view of an embodiment of the wafer drying system according to the utility model.
[0021] Figure 2 It is a three-dimensional schematic view of an embodiment of the wafer drying system according to the utility model.
[0022] Figure 3 It is a three-dimensional schematic view of an embodiment of the wafer drying system according to the utility model.
[0023] Figure 4 It is a three-dimensional schematic view of an embodiment of the wafer drying system according to the utility model.
[0024] Figure 5 It is a three-dimensional schematic view of an embodiment of the wafer drying system according to the utility model.
[0025] Figure 6 It is a three-dimensional schematic view of an embodiment of the wafer drying system according to the utility model.
[0026] Figure 7 It is a three-dimensional schematic view of an embodiment of the wafer drying system according to the utility model.
[0027] Figure 8 It is a three-dimensional schematic view of an embodiment of the wafer drying system according to the utility model.
[0028] Explanation of reference numerals: S-wafer; 1-wafer drying system; 10-tank body; 11-accommodation space; 111-tank wall; 113-tank bottom; 13-bearing portion; 15-upper cover; 20-wafer carrier; 21-supporting block; 23-insertion slot; 30-air injection mechanism; 31-first nozzle; 311-first conical range; 313-first gas; 315-vertical gas wall; 32-second nozzle; 321-second conical range; 323-second gas; 33-gas supply pipe; 331-first gas supply pipe; 332-second gas supply pipe; 40-air suction device; 41-air suction pipe; 43-liquid discharge pipe; 50-elevating mechanism; 51-elevating rod; X-X direction; Y-Y direction; Z-Z direction. DETAILED DESCRIPTION
[0029] The embodiments are described below in detail with reference to the accompanying drawings, but the embodiments provided are not intended to limit the scope of the present application. In addition, the accompanying drawings are for illustration purposes only and are not drawn to scale. For ease of understanding, the same elements will be denoted by the same reference numerals in the following description.
[0030] The terms "including", "containing", "having", and the like used in the present application are open-ended terms, that is, "including, but not limited to".
[0031] In the description of various embodiments, when the terms "first", "second", "third", "fourth", and the like are used to describe elements, they are only used to distinguish these elements from each other, and do not limit the order or importance of these elements.
[0032] In the description of various embodiments, "coupled" or "connected" can mean that two or more elements are in direct physical or electrical contact with each other, or are indirectly in physical or electrical contact with each other, and "coupled" or "connected" can also mean that two or more elements operate or act on each other.
[0033] Figure 1 A perspective view of an embodiment of a wafer drying system 1 according to the present application. Figure 2 A partial cross-sectional perspective view of a tank body 10 according to the present application. Figure 3 A partial cross-sectional perspective view of a wafer drying system 1 according to the present application when an air injection mechanism 30 is actuated. Figure 4 A perspective view of a wafer carrier 20 according to the present application. Figure 5 A top view of an air injection mechanism 30 according to the present application when the air injection mechanism 30 is actuated. Figure 6 A side view of an air injection mechanism 30 according to the present application when the air injection mechanism 30 is actuated. Figure 7 A side view of an air injection mechanism 30 according to the present application when the air injection mechanism 30 is actuated. Figure 8It is a partial side view schematic diagram when the air injection mechanism 30 is actuated according to the utility model. Please refer to Figures 1 to 6 The wafer drying system 1 of the utility model is suitable for drying at least one wafer S. The wafer drying system 1 comprises a tank 10, an air injection mechanism 30 and a gas suction device 40.
[0034] The tank 10 is provided with a containing space 11 and a bearing part 13. The containing space 11 comprises four (plane) tank walls 111 and a tank bottom 113. The containing space 11 defines a horizontal direction and a vertical direction. As shown in the figure, among the X direction X, Y direction Y and Z direction Z of the coordinate axis, the horizontal direction can be the X direction and the Y direction, and the vertical direction can be the Z direction Z. The bearing part 13 is arranged on the tank bottom 113. The bearing part 13 can hold a wafer carrier 20. The wafer carrier 20 contains at least one wafer S. Figure 1
[0035] The air injection mechanism 30 comprises a plurality of first nozzles 31 and a plurality of second nozzles 32. Each first nozzle 31 is arranged separately. Each first nozzle 31 is arranged on at least two (plane) tank walls 111 among the tank walls 111. Each first nozzle 31 on the same (plane) tank wall 111 provides a first gas 313 of a first conical range 311 to form a vertical gas wall 315 in the vertical direction. Each second nozzle 32 is arranged separately. Each second nozzle 32 is arranged on at least two (plane) tank walls 111 among the tank walls 111. Each second nozzle 32 on the same (plane) tank wall 111 provides a second gas 323 of a second conical range 321 to the wafer carrier 20. The second conical range 321 is larger than the first conical range 311 and breaks through the vertical gas wall 315 to blow the wafers S to vibrate relative to the wafer carrier 20.
[0036] The gas suction device 40 comprises at least one gas suction pipe 41. Each gas suction pipe 41 can be connected to the tank bottom 113. The gas suction pipe 41 is located below the wafer carrier 20. The gas suction device 40 sucks gas to the wafer carrier 20.
[0037] The utility model can blow each wafer S to vibrate relative to the wafer carrier 20 by the combination of the first nozzles 31 and the second nozzles 32, so that there is no liquid between each wafer and the wafer carrier 20. This not only improves the drying efficiency, but also improves the drying quality.
[0038] Please refer to Figure 4 and Figure 5 , the wafer carrier 20 comprises a containing body, the containing body is provided with four support blocks 21, each support block 21 is respectively provided with a plurality of equidistantly arranged slots 23, and each support block 21 is respectively arranged symmetrically, so that the symmetrically arranged slots 23 can accommodate the same wafer S; and each wafer S generates vibration, and the wafer can be limited in the corresponding slot 23; further, the slots 23 are in a divergent pattern, that is, as shown in Figure 5 , the slots 23 gradually expand from a small width W1 to a large width W2 in the X direction, which has the advantages that it helps the wafer S to be inserted without being inserted obliquely; in addition, the thickness of the wafer S is less than 0.1mm and is easy to bend, and is therefore easy to be affected by the physical force (suction force) of the liquid, so that the wafer S is easy to adhere to the slot 23; however, the vertical air wall 315 established by the first nozzles 31 on the same wall surface of the utility model first limits the flow field range, and then the second nozzles 32 break through the vertical air wall 315 and blow towards the wafer carrier 20, so that the wafer generates vibration relative to the slot 23 of the wafer carrier 20, so that the wafer can be separated from the corresponding slot 23, so that the wafer can be dried, and the surface of the slot 23 can also be dried.
[0039] Next, please refer to Figure 2 , the wafer drying system 1 of the utility model further comprises a jacking mechanism 50, the jacking mechanism 50 is arranged on the groove bottom 113, the jacking mechanism 50 is provided with a jack 51, when the wafer carrier 20 is placed on the bearing part 13, the jack 51 lifts the wafers S in the vertical direction (Z direction). It is worth mentioning that the lifting range of the jack 51 to the wafers S is between 1mm and 7mm, mainly to reduce the contact between the wafers and the slots 23 in the vertical direction (Z direction), in other words, the wafers S are originally supported by the two support blocks 21 below the wafer carrier 20 in the vertical direction (Z direction), after the wafer carrier 20 is placed on the bearing part 13, the wafers are supported by the jack 51 alone; of course, the wafers S are still limited by the corresponding slots 23 in the horizontal direction (X direction and Y direction), and the wafers S will not be displaced and become obliquely inserted during the vibration process; further, the lifting range of the jack 51 can be adjusted according to the different sizes of the wafer carrier 20, and the adjustment method can use the combination of the long slot and the screw to adjust the position of the jack 51 relative to the bearing part 13 in the vertical direction. In addition, Figure 2As shown, the air extraction device 40 is provided with two air extraction pipes 41, and a liquid discharge pipe 43 is further provided to communicate with the bottom 113 of the groove. Of course, the bottom 113 is designed to have an inclined shape, which is helpful for the liquid in the groove 10 to flow to the liquid discharge pipe 43. During the drying process of the wafer S, the air extraction pipes 41 can extract the air in the accommodation space 11, which is helpful for the stable air flow field in the accommodation space 11, and further helps the wafer S drying operation.
[0040] Further, please refer to Figure 7 , which is a partial side view schematic diagram of the jet mechanism 30 of an embodiment of the present application. The wafer drying system 1 further comprises a plurality of first gas supply pipes 331 arranged at intervals, each of the first gas supply pipes 331 is provided with at least two first nozzles 31, and each of the first gas supply pipes 331 is arranged on the groove wall 111.
[0041] In addition, the wafer drying system 1 further comprises a plurality of second gas supply pipes 332 arranged at intervals, each of the second gas supply pipes 332 is provided with at least one second nozzle 32, and each of the second gas supply pipes 332 is arranged on the groove wall 111, wherein Figure 7 Therefore, one second nozzle 32 is taken as an example, if the number is two or more, the arrangement position can be found by the overall flow field experiment.
[0042] Next, please refer to Figure 6 , the main difference between the embodiment and Figure 7 is that the first gas supply pipes 331 and the second gas supply pipes 332 are connected to form a gas supply pipe, in other words, the first gas supply pipe 331 provided with the first nozzle 31 is connected to the second gas supply pipe 332 provided with the second nozzle 32; that is, there is no need to distinguish the first gas supply pipe 331 or the second gas supply pipe 332, that is, both are gas supply pipes 33; of course, one end of each gas supply pipe 33 can be further connected to use the same gas source (not shown), so that the gas circuit design of the jet mechanism 30 is the same as the embodiment shown in Figures 1 to 3 .
[0043] In addition, in another embodiment, the connection mode of the first gas supply pipe 331 and the second gas supply pipe 332 can be as shown in Figure 8 , and the same gas source (not shown) is used. In other words, the first nozzle 31 and the second nozzle 32 can use the same gas source, so that the temperature of the gas jetted out by the first nozzle 31 is the same as the temperature of the gas jetted out by the second nozzle 32.
[0044] Furthermore, in some embodiments, the first nozzles 31 or the second nozzles 32 can be mounted directly on the tank walls 111, and the flow rate, gas temperature, or gas type of each nozzle can be individually controlled. Of course, if cost is a concern, a modular concept can be introduced for assembly and control, whereby multiple first nozzles 31 are first mounted on the first gas supply pipe 331 to form a separate small module, which is then mounted on the tank wall 111. Similarly, at least one second nozzle 32 can be first mounted on the second gas supply pipe 332 to form a separate small module, which is then mounted on the tank wall 111 and spaced apart from each first gas supply pipe 331. In other words, in addition to being directly mounted on the tank wall 111, the first nozzles 31 or the second nozzles 32 can also be indirectly mounted on the tank wall 111 through the first gas supply pipe 331 or the second gas supply pipe 332. However, these embodiments not only meet the purpose of preventing liquid from remaining between each wafer S and the wafer carrier 20 , but also achieve the effect of improving drying efficiency and enhancing drying quality.
[0045] Furthermore, see Figure 1 and Figure 3 , Figure 3 In order to highlight the jet mechanism 30, the upper cover 15 is provided. The upper cover 15 structure can be made of Figure 1 It is known that the wafer drying system 1 further includes an upper cover 15, which is disposed opposite the tank bottom 113. When the wafer carrier 20 is manually or automatically placed in or removed from the tank body 10, the upper cover 15 is in an open state. When the air injection mechanism 30 is actuated, the upper cover 15 is closed on the tank body 10, making the accommodating space 11 in a sealed state. This helps control the flow field and improves drying efficiency.
[0046] In some embodiments, please refer to Figure 3 and Figure 1 As shown, the upper cover 15 is provided with a plurality of first nozzles 31, each of which is arranged at intervals, and each of the first nozzles 31 provides a first gas 313 in a first conical range 311 to form a horizontal gas wall (not shown) in the horizontal direction; the main purpose of the horizontal gas wall is to improve the uniformity of the gas flow field in the tank body 10. Of course, in this embodiment, the gas flow field is jointly established by the plurality of first nozzles 31 on the tank wall 111, the plurality of second nozzles 32 and the plurality of first nozzles 31 mounted on the upper cover 15.
[0047] Furthermore, in some embodiments, the upper cover 15 is provided with a plurality of second nozzles 32, each of which is spaced apart and provides a second gas 323 in a second conical range 321 toward the wafer carrier 20, wherein the second conical range 321 is larger than the first conical range 311 and breaks through the horizontal air wall to blow the wafers S to vibrate relative to the wafer carrier 20.
[0048] Of course, in some embodiments, the wafer drying system 1 further comprises a plurality of first gas supply pipes 331 arranged at intervals, each first gas supply pipe 331 is capable of being equipped with at least two first nozzles 31, and each first gas supply pipe 331 is capable of being arranged on the upper cover 15.
[0049] In addition, in some embodiments, in addition to being provided with a plurality of first gas supply pipes 331, the upper cover 15 further comprises a plurality of second gas supply pipes 332 arranged at intervals, each second gas supply pipe 332 is capable of being equipped with at least one second nozzle 32.
[0050] It is worth noting that the aforementioned first nozzles 31 or the second nozzles 32 can be arranged on the groove wall 111 in a more direct manner, or indirectly through the corresponding first gas supply pipe 331 or second gas supply pipe 332, or both the first nozzles 31 and the second nozzles 32 are arranged on the same gas supply pipe 33 in a modular manner. These arrangement techniques can also be applied to the upper cover 15 and have the same effect. Changes, modifications or replacements of elements with the same function within the equivalent scope of the present application should still be covered by the patent scope of the present application. Therefore, it is hereby announced in advance.
[0051] In addition, in some embodiments, when the first nozzles 31 and the second nozzles 32 are independently supplied with gas, the temperature of the first gas 313 supplied by the first nozzles 31 can be independently controlled; similarly, the temperature of the second gas 323 supplied by the second nozzles 32 can also be independently controlled, so that the temperature of the first gas 313 can be different from the temperature of the second gas 323; in an embodiment, the temperature of the first gas 313 can be 30±5 degrees Celsius, and the temperature of the second gas 323 can be between 40 and 100 degrees Celsius; in this way, not only can the working temperature in the accommodation space 11 be effectively maintained, but also when the next wafer carrier 20 is placed, the working temperature in the accommodation space 11 can be quickly established, thereby effectively shortening the working time.
[0052] In addition, in some embodiments, whether the first nozzles 31 and the second nozzles 32 are independently supplied with gas or use the same gas source, the first gas 313 and the second gas 323 can also be controlled at the same gas temperature; the way to control the gas temperature can be to use a heater (not shown) wrapped outside the pipe to achieve temperature control of the gas; or the gas pipeline can be connected to the heater.
[0053] Finally, in the embodiment shown in Figure 6 , the configuration of the first nozzles 31, the second nozzles 32 and the gas supply pipes 33 is similar to that of Figure 3Wherein, the distance HZ between each nozzle is between 40mm to 60mm; the distance WY between each gas supply pipe 33 is between 110mm to 160mm; as shown in Figure 3 each gas supply pipe 33 is connected to the same gas source at one end, the flow rate of each first nozzle 31 is between 5L / min to 20L / min, and the flow rate of each second nozzle 32 is also between 5L / min to 20L / min, so that a uniform flow field can be established in the accommodation space 11; the gas used in the embodiment of the present application can be compressed dry air (CDA), inert gas or nitrogen.
[0054] In summary, the jet mechanism in the wafer drying system of the present application provides a plurality of first nozzles and a plurality of second nozzles to provide gas with different conical ranges, the first nozzles arranged on the same side of the slot wall form a vertical gas wall in the vertical direction, the plurality of second nozzles have a larger jet range than each first nozzle and can break through the vertical gas wall and blow gas towards the wafer carrier, which can vibrate the wafers relative to the wafer carrier, so that there is no liquid left between the wafers and the wafer carrier (wafer boat), which not only improves the drying efficiency, but also improves the drying quality.
[0055] Although the present application has been disclosed by the above-mentioned embodiments, it is not intended to limit the present application, and any person skilled in the art with ordinary knowledge can make some changes and modifications without departing from the spirit and scope of the present application, which shall be within the protection scope of the present application.
Claims
1. A wafer drying system, suitable for drying at least one wafer, characterized in that: The wafer drying system comprises: A tank body having a receiving space and a supporting portion, wherein the receiving space includes four tank walls and a tank bottom, the receiving space is defined by a horizontal direction and a vertical direction, and the supporting portion is disposed on the tank bottom, the supporting portion can accommodate a wafer carrier, and the wafer carrier accommodates the at least one wafer; An air jet mechanism, comprising: a plurality of first nozzles, each of which is spaced apart and mounted on at least two of the four slot walls, each of which provides a first gas in a first conical range to form a vertical gas wall in the vertical direction; and a plurality of second nozzles, each of the second nozzles being spaced apart and mounted on at least two of the four slot walls, wherein each of the second nozzles on the same slot wall provides a second gas in a second conical range toward the wafer carrier, wherein the second conical range is larger than the first conical range and breaks through the vertical gas wall to blow the at least one wafer to generate vibration relative to the wafer carrier; and An air extraction device includes at least one air extraction pipe, each air extraction pipe is connected to the bottom of the tank, and the air extraction pipe is located below the wafer carrier. The air extraction device extracts air toward the wafer carrier.
2. The wafer drying system according to claim 1, wherein: The wafer carrier includes a accommodating body, which is provided with four supporting blocks. Each of the supporting blocks is provided with a plurality of slots arranged at equal intervals, and each of the supporting blocks is arranged symmetrically with each other, so that the symmetrically arranged slots can accommodate the same wafer; and when each wafer vibrates, each wafer is confined in the corresponding slot.
3. The wafer drying system according to claim 2, wherein: Also includes: A lifting mechanism is arranged at the bottom of the groove. The lifting mechanism is provided with a lifting rod. When the wafer carrier is placed on the supporting portion, the lifting rod lifts the at least one wafer in the vertical direction.
4. The wafer drying system according to claim 1, wherein: The invention also comprises a plurality of first air supply pipes which are arranged at intervals from each other, each of which can be equipped with at least two first nozzles, and each of which is mounted on the four tank walls.
5. The wafer drying system according to claim 4, wherein: The invention also comprises a plurality of second air supply pipes which are arranged at intervals from each other, each of which can be equipped with at least one second nozzle, and each of which is mounted on the four tank walls.
6. The wafer drying system according to claim 1, wherein: The tank body includes an upper cover, which is arranged on a pair of vertical surfaces of the tank bottom.
7. The wafer drying system according to claim 6, wherein: The upper cover is provided with a plurality of first nozzles, each of which is spaced apart and provides the first gas in the first cone range to form a horizontal gas wall in the horizontal direction.
8. The wafer drying system according to claim 7, wherein: The upper cover is provided with a plurality of second nozzles, each of which is spaced apart and provides the second gas in the second conical range toward the wafer carrier, wherein the second conical range is larger than the first conical range and breaks through the horizontal gas wall to blow the at least one wafer to vibrate relative to the wafer carrier.
9. The wafer drying system according to claim 7, wherein: The invention also comprises a plurality of first air supply pipes which are arranged at intervals from each other, each of which can be equipped with at least two first nozzles, and each of which is mounted on the upper cover.
10. The wafer drying system according to claim 9, wherein: The invention also comprises a plurality of second air supply pipes which are arranged at intervals from each other. Each of the second air supply pipes can be equipped with at least one second nozzle, and each of the second air supply pipes is mounted on the upper cover.
11. The wafer drying system according to claim 1, wherein: The first gas and the second gas are gases with different temperatures.
12. The wafer drying system according to claim 5 or 10, wherein: The first air supply pipe is connected to the second air supply pipe.