Temperature measurement module and probe station temperature calibration system

Abstract

The utility model provides a temperature measurement module and a probe station temperature calibration system, and the temperature measurement module comprises a flexible circuit board, a housing which is disposed on a first surface of the flexible circuit board, a temperature sensor IC which is disposed in the housing and is electrically connected with the flexible circuit board, and a heat conduction part which is fixed on a second surface of the flexible circuit board. A part of the heat conduction part is in contact with the temperature sensor IC; wherein the temperature sensor IC is used for measuring temperature data of the surface of an object to be subjected to temperature measurement; the flexible circuit board is used for transmitting the temperature data of the surface of the object subjected to temperature measurement; the heat-conducting member has a heat-conducting surface for conducting the surface temperature of a measured object. The temperature measurement module can adapt to a complex installation layout space, the flexible circuit board is located in the shell and can isolate heat loss caused by air flow, and the heat conduction piece is provided with a heat conduction surface and can rapidly conduct the temperature of the surface of an object to be subjected to temperature measurement to the temperature sensor IC, so that the temperature measurement efficiency is improved. Therefore, the temperature measuring module can accurately obtain the temperature of the surface of the object with the temperature measured.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor integrated circuit testing, and more particularly to a temperature measurement module and a probe station temperature calibration system. BACKGROUND

[0002] An important indicator of a digital temperature sensor IC is the accuracy range of temperature measurement, and the digital temperature sensor IC does not fully meet the design indicators in the manual after being manufactured. Due to the wafer manufacturing process, the manufactured digital temperature sensor ICs have inconsistent temperature measurement, and each batch and each digital temperature sensor IC has a certain degree of deviation. In order to meet the design indicators in the manual, temperature calibration is usually required before shipment to improve the measurement accuracy and keep the shipped products within the same error range.

[0003] Wafer-level digital temperature sensor IC calibration requires high temperature control of the probe station equipment. The probe station equipment has a built-in temperature control system, and the temperature control accuracy of most probe station equipment is low, usually only about 1-2℃. The accuracy of calibrating the digital temperature sensor IC in this environment is affected by the low-precision probe station equipment temperature control accuracy. The calibrated digital temperature sensor IC is usually difficult to achieve a higher level than the temperature control accuracy of the low-precision probe station. While the temperature control accuracy of high-precision probe station equipment can be improved, high-precision probe station equipment is expensive and will greatly increase the testing cost. CONTENT OF THE INVENTION

[0004] The purpose of the embodiment of the application is to provide a temperature measurement module and a probe station temperature calibration system to solve the problem of low temperature control accuracy of ordinary probe station equipment in the prior art.

[0005] To achieve the above purpose, the technical solution adopted by the application is to provide a temperature measurement module, comprising: a flexible circuit board, a shell mounted on a first surface of the flexible circuit board, a temperature sensor IC located in the shell and electrically connected to the flexible circuit board, and a heat-conducting member fixed on a second surface of the flexible circuit board, part of the heat-conducting member being in contact with the temperature sensor IC.

[0006] The temperature sensor IC is used to measure the temperature data of the surface of the measured temperature object.

[0007] The flexible circuit board is used to transmit the temperature data of the surface of the measured temperature object.

[0008] The heat-conducting member has a heat-conducting surface that conducts the temperature of the surface of the measured temperature object.

[0009] In an optional implementation of the first aspect, the flexible circuit board is provided with a through hole, and part of the heat-conducting member passes through the through hole to contact the temperature sensor IC.

[0010] In an optional implementation of the first aspect, the heat-conducting member comprises a metal heat-conducting layer having a first surface and a second surface facing away from each other, the first surface of the metal heat-conducting layer is provided with a protrusion, the protrusion passes through the through hole to contact the temperature sensor IC, and the second surface of the metal heat-conducting layer is used to conduct the temperature of the surface of the measured temperature object.

[0011] In an optional implementation of the first aspect, the temperature measurement module further comprises a heat-conducting silica gel layer bonded to the second surface of the metal heat-conducting layer.

[0012] In an optional implementation of the first aspect, the flexible circuit board is in a strip shape, the temperature sensor IC and the heat-conducting member are located at one end of the flexible circuit board, and the other end of the flexible circuit board is provided with a solder pad.

[0013] In an optional implementation of the first aspect, the solder pad at the other end of the temperature sensor IC is a vertical parallel solder pad and / or an oblique arrangement solder pad.

[0014] In an optional implementation of the first aspect, the temperature measurement module further comprises:

[0015] a bonding layer covering the area of the second surface of the flexible circuit board where the heat-conducting member is not arranged, the bonding layer being used to bond the second surface of the flexible circuit board to the surface of the measured temperature object, so that the heat-conducting surface of the heat-conducting member is attached to the surface of the measured temperature object.

[0016] In an optional implementation of the first aspect, the flexible circuit board comprises a plurality of wires respectively electrically connected to the VCC, GND, SCL and SDA pins of the temperature sensor IC, wherein a capacitor is connected to the wire electrically connected to the VCC pin, and the SDA pin adopts an open-drain output and is connected to a pull-up resistor.

[0017] In an optional implementation of the first aspect, the material of the shell is foam.

[0018] In a second aspect, the embodiments of the present application further provide a probe station temperature calibration system, comprising:

[0019] a probe station internally provided with a tray;

[0020] the temperature measurement module of any one of the first aspect is attached to the side of the tray;

[0021] A tester is electrically connected to the temperature measurement module.

[0022] The temperature measurement module of the embodiment can adapt to complex installation layout space, the flexible circuit board is located in the shell to isolate heat loss caused by air flow, and the heat conduction member has a heat conduction surface to quickly conduct the temperature of the surface of the measured temperature object to the temperature sensor IC, so that the temperature measurement module of the embodiment can more accurately obtain the temperature of the surface of the measured temperature object. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0024] Figure 1 The front view of the temperature measurement module provided by the embodiment of the present application;

[0025] Figure 2 The top view of the temperature measurement module provided by the embodiment of the present application;

[0026] Figure 3 The top view of the flexible circuit board provided by the embodiment of the present application;

[0027] Figure 4 The structure schematic diagram of the probe station temperature calibration system provided by the embodiment of the present application.

[0028] In the drawings, various reference signs represent:

[0029] 1-temperature measurement module, 11-flexible circuit board, 111-via, 112-solder pad, 113-capacitive element, 114-wire, 12-heat conduction member, 121-heat conduction silica gel layer, 122-metal heat conduction layer, 1221-protruding part, 13-adhesive layer, 14-temperature sensor IC, 15-shell, 2-probe station interior, 21-tray, 3-wafer, 4-tester, 5-cable. DETAILED DESCRIPTION

[0030] In order to make the technical problems, technical solutions and beneficial effects of the present application more clearly understood, the following will further describe the present application in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

[0031] In the description of the embodiments of the present application, the term "a plurality of" refers to two or more (including two).

[0032] It should be noted that when an element is referred to as being "fixed" or "set" on another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or indirectly connected to the other element.

[0033] In the description of the embodiments of the present application, unless otherwise explicitly specified and limited, the technical terms "mount", "connect", "connect", "fix", and other terms should be understood in a broad sense, for example, can be fixedly connected, or can be detachably connected, or integrated; can be mechanically connected, or can be electrically connected; can be directly connected, or indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0034] It should be understood that in the embodiments of the present application, "electrical connection" can be understood as physical contact and electrical conduction of components; it can also be understood as the form of connection between different components in the circuit structure through the entity line of the copper foil or wire of the printed circuit board (PCB) that can transmit electrical signals.

[0035] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the embodiments of the present application.

[0036] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited.

[0037] In the description of the embodiments of the present application, the term "and / or" is merely an association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are an "or" relationship.

[0038] Reference herein to "embodiments" means that the particular features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase appears at various places in the specification does not necessarily all refer to the same embodiments, nor is it necessarily independent or alternative embodiments to other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined in any suitable manner with other embodiments.

[0039] Please refer to Figure 1 and Figure 2 , now a temperature measurement module provided by the embodiments of the present application will be described, the temperature measurement module 1, comprising: a flexible circuit board 11, a shell 15 mounted on the first surface of the flexible circuit board 11, a temperature sensor IC 14 located in the shell 15 and electrically connected with the flexible circuit board 11, and a heat conducting member 12 fixed on the second surface of the flexible circuit board 11, part of the heat conducting member 12 contacts with the temperature sensor IC 14; wherein the temperature sensor IC 14 is used for measuring the temperature data of the surface of the measured temperature object; the flexible circuit board 11 is used for transmitting the temperature data of the surface of the measured temperature object; the heat conducting member 12 has a heat conducting surface for conducting the temperature of the surface of the measured temperature object.

[0040] The temperature sensor IC 14 (Integrated Circuit, integrated circuit) has high precision and can accurately measure the temperature data of the surface of the measured temperature object.

[0041] Specifically, the temperature sensor IC 14 can be a high-precision digital temperature sensor IC, such as TMP117 high-precision digital temperature sensor, which has a measurement accuracy of 0.1℃. The digital temperature sensor IC outputs digital signals (0 or 1), which are easy to process and analyze. The temperature sensor IC 14 can also use an analog temperature sensor IC, which outputs an analog signal, which is a voltage or current signal proportional to temperature. When used, the analog signal needs to be converted into a digital signal by an analog-to-digital converter (ADC) for processing.

[0042] The flexible printed circuit 11 (FPC) adopted by the embodiment of the present application can be bent, folded and curled to enable the temperature measurement module 1 to adapt to complex installation layout space. The flexible printed circuit 11 is electrically connected with the temperature sensor IC 14 to output temperature data (i.e. digital signal or analog signal) collected by the temperature sensor IC 14. If the temperature sensor IC 14 is a digital temperature sensor IC 14, the flexible printed circuit 11 is used to output digital signal. If the temperature sensor IC 14 is an analog temperature sensor IC 14, the flexible printed circuit 11 is used to output analog signal.

[0043] The shell 15 is fixed on the first surface of the flexible printed circuit 11, which refers to Figure 1 the upper surface of the flexible printed circuit 11. Since the temperature sensor IC 14 has high temperature accuracy and extremely high sensitivity, the embodiment has the design of the shell 15 on the side and top of the module sensor IC, thereby being able to isolate heat loss caused by air flow and reduce temperature loss caused by the environment. Optionally, the shell 15 is a heat preservation foam shell. Figure 1

[0044] The heat conduction member 12 is fixed on the second surface of the flexible printed circuit 11, which refers to Figure 1 the lower surface of the flexible printed circuit 11; the first surface of the flexible printed circuit 11 and the second surface of the flexible printed circuit 11 are opposite to each other.

[0045] Part of the heat conduction member 12 is in contact with the temperature sensor IC 14, thereby conducting heat on the surface of the measured temperature object to the temperature sensor IC 14. The heat conduction member 12 has a heat conduction surface for conducting the surface temperature of the measured temperature object, which can be directly or indirectly seamlessly attached to the surface of the measured temperature object, thereby quickly conducting the surface temperature of the measured temperature object to the temperature sensor IC 14.

[0046] Specifically, the heat conduction surface of the heat conduction member 12 can be attached to the surface of the measured temperature object in various ways. For example, the heat conduction surface of the heat conduction member 12 can be fixed on the surface of the measured temperature object by means of sticking or welding.

[0047] The temperature measurement module 1 of the embodiment of the present application can adapt to complex installation layout space, the flexible printed circuit 11 is located in the shell 15, which can isolate heat loss caused by air flow, and the heat conduction member 12 has a heat conduction surface, which can quickly conduct the surface temperature of the measured temperature object to the temperature sensor IC 14, so that the temperature measurement module 1 of the embodiment of the present application can more accurately obtain the surface temperature of the measured temperature object.

[0048] As an optional implementation, refer to​Figure 1 The flexible circuit board 11 is provided with a through hole 111, and the partial heat conducting member 12 passes through the through hole 111 to contact the temperature sensor IC 14.

[0049] In this embodiment, the through hole 111 is provided on the flexible circuit board 11, and the heat conducting member 12 and the temperature sensor IC 14 are arranged on different surfaces of the flexible circuit board 11, and the heat conducting member 12 passes through the through hole 111 to contact the temperature sensor IC 14, thereby reducing the volume of the temperature measurement module 1 and enabling the temperature measurement module 1 to adapt to a narrow installation environment.

[0050] As an optional implementation, the heat conducting member 12 includes a metal heat conducting layer 122, and the metal heat conducting layer 122 has a first surface and a second surface facing away from each other. Figure 1 The first surface of the metal heat conducting layer 122 refers to Figure 1 the upper surface of the metal heat conducting layer 122, and the second surface of the metal heat conducting layer 122 refers to the lower surface of the metal heat conducting layer 122. The first surface of the metal heat conducting layer 122 is provided with a protruding portion 1221, and the protruding portion 1221 passes through the through hole 111 to contact the temperature sensor IC 14.

[0051] It is easy to understand that, in this embodiment, the second surface of the metal heat conducting layer 122 can serve as the heat conducting surface of the heat conducting member 12. In addition, in order to enable the second surface of the metal heat conducting layer 122 to be attached to the surface of the temperature-measured object without gaps, high-thermal-conductivity silicone grease can be filled between the second surface of the metal heat conducting layer 122 and the surface of the temperature-measured object during use. Optionally, the metal heat conducting layer 122 is a copper foil, and the copper foil has high thermal conductivity and can quickly conduct the temperature of the surface of the temperature-measured object to the temperature sensor IC 14. Since the copper foil has good flexibility, it can adapt to the shape of the surface of the temperature-measured object, thereby enabling the surface of the copper foil to be more attached to the surface of the temperature-measured object. In order to improve the thermal conductivity, the area of the copper foil needs to be greater than a set size, for example, greater than 40 mm 2 .

[0052] As an optional implementation, the temperature measurement module 1 further includes a heat conducting silicone layer 121, and the heat conducting silicone layer 121 is bonded to the second surface of the metal heat conducting layer 122.

[0053] After the heat conducting silicone layer 121 is bonded to the second surface of the metal heat conducting layer 122, the heat conducting silicone layer 121 completely covers the second surface of the metal heat conducting layer 122. It is easy to understand that, in this embodiment, the surface of the heat conducting silicone layer 121 away from the metal heat conducting layer 122 corresponds to the heat conducting surface of the heat conducting member 12. By arranging the heat conducting silicone layer 121, it is not necessary to fill high-thermal-conductivity silicone grease again, thereby reducing the installation difficulty of the temperature measurement module 1. Optionally, the heat conducting silicone layer 121 can be a heat conducting silicone pad, a heat conducting silicone sheet, or the like.

[0054] As an optional embodiment, the flexible circuit board 11 is in the shape of an elongated strip, the temperature sensor IC 14 and the heat conductor 12 are located at one end of the flexible circuit board, and a solder pad is provided at the other end of the temperature sensor IC 14 .

[0055] Optionally, the pad 112 at the other end of the temperature sensor IC 14 is a vertical parallel pad 112 (ie Figure 2 A row of pads 112 in the vertical direction) and / or obliquely arranged pads 112 (i.e. Figure 2 A row of pads 112 in an oblique direction).

[0056] In this embodiment, the flexible circuit board 11 adopts a long-tail design. Because the temperature sensor IC 14 and thermal conductor 12 are located at one end of the flexible circuit board, the conductors 114 of the flexible circuit board 11 have a longer preheating distance. The reserved vertically parallel and diagonally arranged solder pads 112 at the other end (i.e., the tail) allow for soldering of conductors 114 in three directions. This reduces the stress caused by bending the conductors 114 after being led out in a single direction, which can lead to unstable adhesion, facilitating installation on the surface of the object being measured.

[0057] As an optional embodiment, the temperature measurement module 1 also includes an adhesive layer 13, covering the area on the second surface of the flexible circuit board 11 where the thermal conductor 12 is not provided. The adhesive layer 13 is used to bond the second surface of the flexible circuit board 11 to the surface of the object to be measured, so that the heat-conducting surface of the thermal conductor 12 is in contact with the surface of the object to be measured.

[0058] Because ambient temperature differences and various heat losses can cause temperature differences between the temperature measurement module 1 and the actual object being measured, heat loss due to heat transfer must be considered to reduce temperature deviation and measurement error. To minimize these temperature deviations and measurement errors, this embodiment adheres the flexible circuit board 11 to the surface of the object being measured via an adhesive layer 13. A significant distance is maintained between the conductive wires 114 within the flexible circuit board 11 and the temperature sensor IC 14 for preheating. This minimizes heat loss from the temperature sensor IC 14 due to the conductive wires 114, thereby reducing measurement error.

[0059] Specifically, the adhesive layer 13 has a first surface and a second surface facing away from each other; the first surface of the adhesive layer 13 is Figure 1 The upper surface of the adhesive layer 13 is Figure 1The first surface of the adhesive layer 13 is adhered to the second surface of the flexible circuit board 11, and the second surface of the adhesive layer 13 is flush with the heat-conducting surface of the heat-conducting member 12 or higher than the heat-conducting surface of the heat-conducting member 12. It is to be noted that the projection area of the adhesive layer 13 on the second surface of the flexible circuit board 11 does not overlap the projection area of the heat-conducting member 12 on the second surface of the flexible circuit board 11, and the projection area of the adhesive layer 13 on the second surface of the flexible circuit board 11 and the projection area of the heat-conducting member 12 on the second surface of the flexible circuit board 11 cover the second surface of the flexible circuit board 11.

[0060] It is to be understood that if the second surface of the metal heat-conducting layer 122 is adhered to the heat-conducting silica gel layer 121, the second surface of the adhesive layer 13 can be flush with the heat-conducting surface of the heat-conducting member 12. If the second surface of the metal heat-conducting layer 122 is not adhered to the heat-conducting silica gel layer 121, the second surface of the adhesive layer 13 can be higher than the heat-conducting surface of the heat-conducting member 12, and the height difference between the second surface of the adhesive layer 13 and the second surface of the metal heat-conducting layer 122 can be filled by filling the high-heat-conducting silicone grease between the heat-conducting surface of the heat-conducting member 12 and the surface of the object to be measured in use.

[0061] For example, the adhesive layer 13 can be double-sided adhesive tape, such as 3M ultra-thin double-sided adhesive tape.

[0062] In this embodiment, the adhesive layer 13 is arranged on the second surface of the flexible circuit board 11, so that the temperature measurement module 1 can be conveniently and quickly adhered to the surface of the object to be measured, and the installation difficulty of the temperature measurement module 1 is reduced.

[0063] As an optional implementation, referring to Figure 3 The flexible circuit board 11 includes four wires 114, which are respectively electrically connected to the VCC, GND, SCL and SDA pins of the temperature sensor IC 14. In addition, the temperature sensor IC 14 can also be provided with ADD0 and ALERT pins.

[0064] The VCC (Voltage Common Collector) is the positive power supply pin; the GND (Ground) is the ground pin; the SCL (Serial Clock Line) is the serial clock line pin, which is used for synchronizing data transmission in I2C communication; and the SDA (Serial Data Line) is the serial data line pin, which is used for transmitting data in I2C communication. In addition, the flexible circuit board 11 is also built-in with a resistance-capacitance element 113, referring to Figure 3, including pull-up resistor R2, pull-up resistor R3, function reserved resistor R4, capacitor C1, and alert pin (ALERT), integrated circuit U1. The SDA pin uses open drain output and is connected to pull-up resistor R3. The SCL can be connected to pull-up resistor R2 or not. The wire 114 connected to the VCC pin is connected to capacitor C1. The alert pin (ALERT) is used for multi-heat alarm or data ready signal, and the pin uses open drain output and is connected to pull-up resistor R4. The integrated circuit U1 is used to install temperature sensor IC14.

[0065] The pin functions are shown in the following table:

[0066]

[0067]

[0068] For example, the width of the flexible circuit board 11 of the embodiment of the present application is 4 mm ± 0.2 mm, the length is greater than or equal to 70 mm, and the thickness is 4 mm ± 0.5 mm. It can be seen that the temperature measurement module 1 of the embodiment has a small size, and thus has low requirements on the installation environment and can adapt to a more complex and narrow installation environment. In addition, the flexible circuit board 11 of the embodiment uses a long tail design, which lengthens the distance between the lead wire 114 lead-out position and the temperature sensor IC14, reduces the line width of the lead wire 114, and reduces the heat transfer loss caused by wiring. At the same time, the lead wire 114 can be preheated to reduce the temperature difference caused by wiring and improve the measurement accuracy.

[0069] Referring to Figure 4 The embodiment of the present application also provides a temperature calibration system, which comprises: a probe station, which is internally provided with a tray 21; the temperature measurement module 1 of any of the above embodiments, which is attached to the side of the tray 21; and a tester 4, which is electrically connected to the temperature measurement module 1.

[0070] The tester 4 of the embodiment can be an ATE (Automatic Test Equipment) tester, which has a temperature control test program embedded therein. The tail of the lead wire 114 of the temperature measurement module 1 is connected to the ATE tester through a cable 5. Specifically, the interface of the ATE tester is a general programmable interface, the IO end of the ATE tester is connected to the I2C two ports (SLC and SDA) of the temperature sensor IC14, and the VCC of the temperature sensor IC14 can be connected to the IO end of the ATE tester or an external power supply.

[0071] Specifically, the probe station is internally provided with a tray 21, and the tray 21 is used to place a wafer 3, and a plurality of temperature sensors IC to be calibrated are arranged on the wafer 3. The temperature sensors IC to be calibrated refer to semi-finished chips in the wafer that have not undergone processes such as cutting, packaging, and calibration. The temperature sensors IC 14 in the present application refer to finished chips that have completed all processes such as cutting, packaging, and calibration. When calibrating the temperature, the wafer 3 is placed on and fixed to the tray 21 of the probe station. The probe station is internally provided with a probe card, and the probe card is provided with probes corresponding to the pins of the temperature sensors IC 14 of the wafer 3. The probe card is aligned with the pins of the temperature sensors IC to be calibrated on the wafer 3 to achieve electrical connection.

[0072] The probe station is internally provided with a temperature control system for heating or cooling the tray 21. The control precision of the temperature control system of the probe station with low precision is usually only about 1-2℃. If the temperature calibration of the temperature sensors IC to be calibrated is performed by using the temperature control precision of the probe station with low precision, the error of the temperature sensors IC to be calibrated will be large.

[0073] Since the wafer 3 is fixed to the tray 21 of the probe station, the temperature of the tray 21 is transmitted to the wafer 3, and thus the temperature measured by the temperature sensors IC to be calibrated in the wafer 3 is the temperature of the tray 21 (ignoring the heat loss in the transmission process). In the present embodiment, the temperature of the tray 21 is accurately measured, and the temperature sensors IC to be calibrated are calibrated by taking the accurate temperature of the tray 21 as a reference. Instead of calibrating the temperature sensors IC to be calibrated by using the temperature of the temperature control system of the probe station with low precision, the temperature calibration precision of the temperature sensors IC to be calibrated can be improved.

[0074] Specifically, the temperature measurement module 1 is attached to the side of the tray 21 of the probe station with low precision. It should be noted that the precision of the temperature sensors IC 14 is higher than the temperature control precision of the probe station with low precision. For example, the temperature control precision of the probe station with low precision is 1℃, and the precision of the temperature sensors IC 14 is 0.1℃. Since the precision of the temperature sensors IC 14 is high, the temperature measurement module 1 can measure the accurate temperature of the tray 21.

[0075] In addition, the temperature measurement module 1 of the present embodiment adopts a high-thermal-conductivity design and a long-tail FPC design, can be attached to the tray 21, and can be quickly preheated by using the tray 21, reduce the heat transfer caused by the wires 114, and reduce heat loss. In addition, by designing the shell 15 on the surface of the temperature sensors IC 14 of the temperature measurement module 1, the influence of air flow on the temperature measurement of the temperature sensors IC 14 during the movement of the tray 21 can be effectively avoided, and the heat loss caused by external heat dissipation and the temperature fluctuation caused by air flow can be reduced. Therefore, the temperature of the temperature sensors IC 14 is closer to the real temperature value of the tray 21.

[0076] Since the temperature measurement module 1 is designed in a super miniaturized manner, and the wiring between the temperature measurement module 1 and the tester and the power line wiring originally used for heating under the tray 21 are consistent, the high-precision temperature calibration can be realized without affecting any function of the existing low-precision probe station, without disassembling the equipment for complex modification, and without lossless installation and disassembly.

[0077] The temperature measurement module 1 of the embodiment can be installed on the tray 21 of the low-precision probe station without loss, high-precision temperature data of the tray 21 can be obtained, and then transmitted to the ATE tester. The temperature sensor IC to be calibrated in the wafer 3 is calibrated in cooperation with the ATE tester, and the high-precision temperature calibration is completed.

[0078] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should be covered in the scope of the claims and the specification of the present application. Especially, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims

1. A temperature measurement module, characterized in that: include: A flexible circuit board, a housing mounted on a first surface of the flexible circuit board, a temperature sensor IC located within the housing and electrically connected to the flexible circuit board, and a heat conductor fixed to a second surface of the flexible circuit board, a portion of the heat conductor being in contact with the temperature sensor IC; Wherein, the temperature sensor IC is used to measure the temperature data of the surface of the object being measured; The flexible circuit board is used to transmit the temperature data of the surface of the object to be measured; The heat conducting member has a heat conducting surface for conducting the surface temperature of the object to be measured.

2. The temperature measurement module according to claim 1, wherein: The flexible circuit board is provided with a through hole, and part of the heat conducting member passes through the through hole and contacts the temperature sensor IC.

3. The temperature measurement module according to claim 2, wherein: The heat conducting member includes a metal heat conducting layer, which has a first surface and a second surface that are opposite to each other. The first surface of the metal heat conducting layer has a protrusion, which passes through the through hole and contacts the temperature sensor IC; the second surface of the metal heat conducting layer is used to conduct the temperature of the surface of the object to be measured.

4. The temperature measurement module according to claim 3, wherein: The temperature measurement module further includes a thermally conductive silicone layer, and the thermally conductive silicone layer is adhered to the second surface of the metal thermally conductive layer.

5. The temperature measurement module according to claim 1, wherein: The flexible circuit board is in the shape of a long strip. The temperature sensor IC and the heat conductor are located at one end of the flexible circuit board. A soldering pad is provided at the other end of the flexible circuit board.

6. The temperature measurement module according to claim 5, wherein: The pads at the other end of the temperature sensor IC are vertically parallel pads and / or obliquely arranged pads.

7. The temperature measurement module according to any one of claims 1 to 6, wherein: The temperature measurement module further includes: An adhesive layer covers an area on the second surface of the flexible circuit board where the thermal conductor is not provided. The adhesive layer is used to adhere the second surface of the flexible circuit board to the surface of the object to be measured so that the heat-conducting surface of the thermal conductor fits the surface of the object to be measured.

8. The temperature measurement module according to any one of claims 1 to 6, wherein: The flexible circuit board includes multiple wires, which are electrically connected to the VCC, GND, SCL, and SDA pins of the temperature sensor IC respectively. The wire electrically connected to the VCC pin is connected to a capacitor, and the SDA pin adopts an open-drain output and is connected to a pull-up resistor.

9. The temperature measurement module according to any one of claims 1 to 6, wherein: The shell is made of foam.

10. A probe station temperature calibration system, characterized in that: include: A probe station with a tray inside; The temperature measurement module according to any one of claims 1 to 9, attached to the side of the tray; The tester is electrically connected to the temperature measurement module.

Images