Automatic sample preparation and sampling device for silicon wafer metal test

Abstract

The utility model relates to an automatic sample preparation and sampling device for silicon wafer metal testing, which comprises a base, an outer frame is arranged at the upper end of the base, an exhaust pipe is arranged at the top of the outer frame, a sample preparation table is mounted in the middle of the upper end of the base, and the sample preparation table is used for obliquely placing a silicon wafer. Two mechanical arms are mounted at the upper end of the base and behind the sample preparation table, a sample preparation tube is arranged at the upper end of one mechanical arm, a sampling tube is arranged at the upper end of the other mechanical arm, one end of the sample preparation tube is connected with a scanning liquid bottle, a peristaltic pump is arranged between the sample preparation tube and the scanning liquid bottle, one end of the sampling tube is connected with an ICP-MS (Inductively Coupled Plasma-Mass Spectrometer) sample injector, and the other end of the sampling tube is connected with an ICP-MS (Inductively Coupled Plasma-Mass Spectrometer) sample injector. And the other end of the sampling pipe is provided with a non-contact bubble sensor. According to the utility model, automatic sample preparation and sampling can be realized, the problem of contamination caused by traditional manual operation is solved, an operator can be prevented from being in direct contact with scanning liquid, and the harm to a human body is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer metal test, especially to an automatic sample preparation and sampling device for silicon wafer metal test. BACKGROUND

[0002] At present, the VPD space size of the existing automatic sample preparation and sampling device for silicon wafer metal test is large, which needs to occupy a large amount of space in the laboratory, and the space utilization rate of the semiconductor production clean room is high, so there is no more space to place the VPD equipment. At the same time, the semiconductor industry has reached 1E8 atoms / cm2 for metal concentration control, which puts forward very high requirements for sample preparation and sampling.

[0003] Under such background, many silicon wafer metal test sample preparations and samplings are manually operated. The scanning liquid is a mixture of HF and H2O2, which can cause certain harm to the health of the operator. Secondly, manual operation can cause contamination risk and affect the accuracy of the test. Therefore, a small automatic sample preparation and sampling device for silicon wafer metal test is needed. SUMMARY

[0004] The technical problem to be solved by the utility model is to provide an automatic sample preparation and sampling device for silicon wafer metal test, which can realize automatic sample preparation and sampling, solve the problem of contamination caused by traditional manual operation, and avoid direct contact of the operator with the scanning liquid, thereby reducing the harm to the human body.

[0005] The utility model adopts the technical scheme that an automatic sample preparation and sampling device for silicon wafer metal test is provided, which comprises a base. An outer frame is arranged at the upper end of the base. An exhaust pipe is arranged at the top of the outer frame. A sample preparation table is installed at the middle of the upper end of the base. The sample preparation table is used for placing silicon wafers obliquely. Two mechanical arms are installed at the rear of the sample preparation table at the upper end of the base. One mechanical arm is provided with a sample preparation pipe at the upper end. The other mechanical arm is provided with a sampling pipe at the upper end. A scanning liquid bottle is connected to one end of the sample preparation pipe. A peristaltic pump is arranged between the sample preparation pipe and the scanning liquid bottle. An ICP-MS sample injector is connected to one end of the sampling pipe. A non-contact bubble sensor is installed at the other end of the sampling pipe.

[0006] As a supplement to the technical scheme of the utility model, the sample preparation table comprises a plurality of support columns and a plurality of limiting columns. A plurality of support columns with different heights are installed at the middle of the upper end of the base. A plurality of limiting columns are installed at the side edges of the upper end of the base. Installation notches are formed at the upper ends of the limiting columns.

[0007] As a supplement to the technical scheme of the utility model, a supporting leg is vertically installed at each corner of the lower end of the base. A rubber pad is screwed to the lower end of each supporting leg.

[0008] As a supplement to the technical scheme of the utility model, the base is internally provided with a CPU, the CPU is connected with the non-contact bubble sensor, the ICP-MS sample injector, the peristaltic pump and the mechanical arm respectively, and a plurality of control buttons are arranged side by side at the front end of the base and are connected with the CPU.

[0009] As a supplement to the technical scheme of the utility model, the four sides and the top of the outer frame are all sealed, and the outer frame is provided with a switchable door plate on one side, so that the emission of harmful substances to the outside can be reduced.

[0010] Beneficial effects: the automatic sample preparation and sampling device for silicon wafer metal testing is compact and small in structure and has a high degree of automation, can realize automatic sample preparation and sampling, solves the problem of contamination caused by traditional manual operation, can also avoid direct contact of operators with scanning liquid, and reduces the harm to human bodies. BRIEF DESCRIPTION OF DRAWINGS

[0011] Figure 1 is a structural schematic view of the utility model;

[0012] Figure 2 is a structural schematic view of the utility model in different directions;

[0013] Figure 3 is a structural schematic view of the utility model without installing a silicon wafer;

[0014] Figure 4 is a structural schematic view of the limiting column of the utility model;

[0015] Figure 5 is a system block diagram of the utility model.

[0016] Illustration: 1, base, 2, support column, 3, control button, 4, rubber pad, 5, supporting leg, 6, silicon wafer, 7, sample preparation pipe, 8, exhaust pipe, 9, outer frame, 10, mounting gap, 11, mechanical arm, 12, sampling pipe, 13, limiting column, 14, non-contact bubble sensor, 15, CPU, 16, peristaltic pump, 17, ICP-MS sample injector. DETAILED DESCRIPTION

[0017] The utility model will be further described in combination with specific embodiments. It should be understood that these embodiments are only used for illustrating the utility model and are not used for limiting the scope of the utility model. In addition, it should be understood that after reading the content taught by the utility model, those skilled in the art can make various changes or modifications to the utility model, and these equivalent forms also fall within the scope defined by the appended claims of the present application.

[0018] The embodiment of the utility model relates to an automatic sample preparation and sampling device for silicon wafer metal testing, such as Figures 1-5 As shown, it includes a base 1, an outer frame 9 is provided on the upper end of the base 1, and an exhaust pipe 8 is provided on the top of the outer frame 9. The exhaust pipe 8 is used to extract the acid gas volatilized inside the device. A sample preparation table is installed in the middle of the upper end of the base 1, and the sample preparation table is used to place silicon wafers at an angle. The upper end of the base 1 is located behind the sample preparation table and is equipped with two mechanical arms 11, one of which is provided with a sample preparation tube 7 on the upper end of one of the mechanical arms 11, and a sampling tube 12 is provided on the upper end of the other mechanical arm 11. One end of the sample preparation tube 7 is connected to a scanning liquid bottle, and a peristaltic pump 16 is provided between the sample preparation tube 7 and the scanning liquid bottle. The scanning liquid inside the scanning liquid bottle is sucked out by the peristaltic pump 16 and then transported out through the sample preparation tube 7. One end of the sampling tube 12 is connected to an ICP-MS sampler 17, and the other end of the sampling tube 12 is provided with a non-contact bubble sensor 14. The non-contact bubble sensor 14 is used to confirm whether liquid is inhaled.

[0019] The automatic sample preparation and sampling device can be connected to an external power source through a power cord and a plug, or can be equipped with a battery, and the device is powered by a rechargeable battery.

[0020] The central processing unit (CPU for short) is the computing and control core of the computer system and is the final execution unit for information processing and program execution. Since its creation, the CPU has made great progress in logical structure, operating efficiency and functional extension. The base 1 is internally provided with a CPU 15, and the CPU 15 is respectively connected to the non-contact bubble sensor 14, the ICP-MS injector 17, the peristaltic pump 16 and the robotic arm 11. A plurality of control buttons 3 are arranged side by side at the front end of the base 1, and the control buttons 3 are connected to the CPU 15; the peristaltic pump 16, the non-contact bubble sensor 14, the ICP-MS injector 17 and the two robotic arms 11 are respectively controlled by a row of control buttons 3, and the control buttons 3 correspond to sample preparation functions, sampling functions, etc.

[0021] One end of the CPU 15 is connected to a parameter memory, which is used to store and record the operating parameters of the ICP-MS injector 17 , the peristaltic pump 16 and the robotic arm 11 .

[0022] The outer frame 9 is sealed on all sides and on the top, and the bottom of the outer frame 9 is sealed by the upper end face of the base 1. Only one side of the outer frame 9 is provided with a switchable door panel, which can reduce the emission of harmful substances. When used together with the exhaust pipe 8 on the top of the outer frame 9, the effect is better.

[0023] The sample preparation table comprises a plurality of support columns 2 and a plurality of limiting columns 13, the upper end of the base 1 is provided with a plurality of support columns 2 with different heights, the side of the upper end of the base 1 is provided with a plurality of limiting columns 13, and the upper end of the limiting column 13 is provided with a mounting gap 10. The mounting gap 10 and the upper end surface of the support column 2 serve as support points of the sample preparation table, the height difference between the support points is 2mm, the silicon wafer 6 is arranged in an inclined manner, and the inclination angle of the silicon wafer 6 is very small, so that the scanning liquid finally stays in a fixed area (i.e. the edge of the lower part of the silicon wafer 6).

[0024] The lower end of the base 1 is vertically provided with a support leg 5 at each corner, and the lower end of each support leg 5 is rotatably connected with a rubber pad 4, so that the rubber pad 4 can be replaced conveniently.

[0025] Each mechanical arm 11 is driven by two motors, so that it can rotate and ascend and descend, and the initial position of the motor is positioned by an optical coupler. The type of the mechanical arm 11 is a sample injection arm, the brand is Agilent, and the article number is J8410-80747. The mechanical arm 11 is a component in the prior art and can be purchased directly on the market, so that the detailed structure does not need to be introduced.

[0026] The use process of the automatic sample preparation and sampling device is as follows:

[0027] Firstly, an operator opens the door plate of the device, places the silicon wafer 6 to be measured on the sample preparation table, closes the door plate, and clicks the sample preparation function (i.e. the control button 3 corresponding to the function) on the device. One of the mechanical arms 11 moves the sample preparation pipe 7 above the silicon wafer 6, and then starts the peristaltic pump 16 to quantitatively suck out the scanning liquid in the scanning liquid bottle, and then the scanning liquid is delivered out through the sample preparation pipe 7 and drops on the surface of the silicon wafer 6. The scanning liquid will move on the surface of the silicon wafer 6 by itself, and then the height difference between the support points will make the scanning liquid stay in a fixed area.

[0028] Then, the operator clicks the sampling function (i.e. the control button 3 corresponding to the function) on the device, and the other mechanical arm 11 moves the sampling pipe 11 to the area where the scanning liquid stays. Then, the ICP-MS sampler 17 and the non-contact bubble sensor 14 start to work. The ICP-MS sampler 17 sucks the scanning liquid through the sampling pipe 11, and the non-contact bubble sensor 14 is used to confirm whether there is liquid flowing. When the non-contact bubble sensor 14 detects that there is no liquid flowing, the information is fed back to the CPU 15, and the CPU 15 adjusts the mechanical arm 11, so that the mechanical arm 11 controls the sampling pipe 11 to move downward by a distance. In this way, the sampling pipe 11 can contact the scanning liquid and complete the sampling.

[0029] In the description of the utility model, it needs to be understood that the directions such as '' front, back, up, down, left, right '' '' horizontal, vertical, perpendicular, horizontal '' and '' top, bottom '' and the like indicated direction or positional relationship is usually based on the direction or positional relationship shown in the drawing, only for the convenience of describing the utility model and simplifying the description, in the case where no contrary statement is made, these direction words do not indicate and imply that the indicated device or element must have a particular orientation or be constructed and operated in a particular orientation, therefore, it cannot be understood as the limitation of the protection scope of the utility model;Direction words '' inside, outside '' refer to the inside and outside relative to the contour of each component.

[0030] For the convenience of description, spatial relative terms such as '' above'', '' above'', '' upper surface'', '' upper '' and the like can be used here to describe the spatial position relationship of one device or feature with other devices or features as shown in the drawing. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation of the device described in the drawing. For example, if the device in the drawing is inverted, the device described as '' above '' or '' above '' other devices or structures will be positioned '' below '' or '' below '' other devices or structures. Thus, the exemplary term '' above '' can include both '' above '' and '' below '' orientations. The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein are interpreted accordingly.

[0031] In addition, it needs to be explained that the use of '' first'', '' second '' and the like to limit parts is only for the convenience of distinguishing the corresponding parts, and the above words have no special meaning unless otherwise stated, therefore, it cannot be understood as the limitation of the protection scope of the utility model.

[0032] The above provides a kind of automatic sample preparation sampling device for silicon wafer metal test, carries out detailed introduction, the principle and implementation mode of the present application are described in this paper by specific example, the above example is only used to help understand the method of the present application and its core idea;At the same time, for the general technical personnel in the art, according to the idea of the present application, there will be changes in specific implementation mode and application range, and the above description should not be understood as the limitation of the present application.

Claims

1. An automatic sample preparation and sampling device for silicon wafer metal testing, comprising a base (1), characterized in that: The upper end of the base (1) is provided with an outer frame (9), and the top of the outer frame (9) is provided with an exhaust pipe (8). A sample preparation table is installed in the middle of the upper end of the base (1), and the sample preparation table is used to place silicon wafers at an angle. The upper end of the base (1) is located behind the sample preparation table and is provided with two mechanical arms (11), one of which is provided with a sample preparation tube (7) at the upper end, and a sampling tube (12) at the upper end of the other mechanical arm (11). One end of the sample preparation tube (7) is connected to a scanning liquid bottle, and a peristaltic pump (16) is provided between the sample preparation tube (7) and the scanning liquid bottle. One end of the sampling tube (12) is connected to an ICP-MS sampler (17), and the other end of the sampling tube (12) is provided with a non-contact bubble sensor (14).

2. The automatic sample preparation and sampling device for silicon wafer metal testing according to claim 1, characterized in that: The sample preparation platform includes a plurality of support columns (2) and a plurality of limiting columns (13), a plurality of support columns (2) of different heights are installed in the middle of the upper end of the base (1), a plurality of limiting columns (13) are installed on the side of the upper end of the base (1), and a mounting notch (10) is opened at the upper end of the limiting column (13).

3. The automatic sample preparation and sampling device for silicon wafer metal testing according to claim 1, characterized in that: A foot (5) is vertically installed at the four corners of the lower end of the base (1), and a rubber pad (4) is screwed to the lower end of each foot (5).

4. The automatic sample preparation and sampling device for silicon wafer metal testing according to claim 1, characterized in that: The base (1) is provided with a CPU (15) therein, and the CPU (15) is respectively connected to a non-contact bubble sensor (14), an ICP-MS injector (17), a peristaltic pump (16) and a robotic arm (11). A plurality of control buttons (3) are arranged side by side at the front end of the base (1), and the control buttons (3) are connected to the CPU (15).

5. The automatic sample preparation and sampling device for silicon wafer metal testing according to claim 1, characterized in that: The outer frame (9) is sealed on all sides and the top, and a door panel that can be opened and closed is provided on one side of the outer frame (9).

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