Wafer transportation confining device

Abstract

The utility model relates to the technical field of wafer production, in particular to a wafer transportation confining device, which comprises a confining ring and a blue film, the confining ring is of an annular structure, the outer contour of the confining ring is of an octagonal structure, the inner contour of the confining ring is of a circular structure and is the same as the outer contour of a wafer, the blue film is adhered to one side of the confining ring, and the outer contour of the blue film is the same as the outer contour of the confining ring; according to the utility model, the blue film is pasted on the annular plastic confining ring sheet, so that the core particles in the horizontal direction of the blue film are not extruded with each other; the annular device can support the periphery of the wafer in the transportation process, the stress of the blue film in the vertical direction is reduced, and the damage of core particles is reduced; a wafer positioning bayonet is arranged on the confining annular plastic sheet, so that the pasting direction of the blue film is ensured to be consistent during the operation of pasting the blue film; the imprisoning device is made of plastics with light weight, so that the transportation cost is reduced; when being placed in an outer packaging box, the packaging box does not shake in the horizontal direction during transportation; the device can be suitable for wafers of different sizes, and the wafers of different sizes can be freely switched.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer production technical field, concretely is a wafer transportation enclosure device. BACKGROUND

[0002] The wafer needs to be cut after the semiconductor chip manufacturing production and can be used for subsequent packaging operation, the wafer after cutting is very fragile, and the core grain between the core grain is prone to breakage and edge collapse after extrusion, and such defects will cause the packaging product to fail. In order to prevent the wafer from being damaged after cutting, generally, the wafer is not cut after testing, and the wafer cutting part is transferred to the packaging factory to complete, and the wafer is cut now, but some packaging factories do not have wafer cutting conditions, so a part of the wafer needs to be cut directly after testing, and then the wafer is shipped with a blue film, the blue film is peeled off from the iron support, a piece of strong plastic sheet is clamped between the blue films to play a reinforcing role, but the blue film directly shipped in the wafer transportation process cannot avoid the quality problems of a few core grains broken and edge collapse. UTILITY MODEL CONTENTS

[0003] The utility model aims at providing a wafer transportation enclosure device to solve the above problems.

[0004] In order to achieve the above purpose, the following technical scheme is provided:

[0005] A wafer transportation enclosure device is used in cooperation with the wafer after cutting, comprising: an enclosure ring and a blue film, the enclosure ring is a ring structure, the outer contour is an octagonal structure, and the inner contour is a circular structure, the blue film is adhered to one side of the enclosure ring, and the outer contour is the same as the outer contour of the enclosure ring.

[0006] Preferably, the wafer after cutting is adhered to one side of the blue film and located inside the enclosure ring.

[0007] Preferably, two corners of the enclosure ring are provided with wafer positioning sockets recessed inward.

[0008] Preferably, the thickness of the enclosure ring is greater than the thickness of the wafer after cutting.

[0009] Preferably, the inner contour diameter of the enclosure ring is greater than the diameter of the wafer after cutting.

[0010] Preferably, a wafer information label is adhered to one side of the blue film and located between the inner contour of the enclosure ring and the wafer after cutting.

[0011] Preferably, the material of the enclosure ring is light plastic.

[0012] The utility model has the advantages that:

[0013] The device pastes the blue film on the annular plastic confinement ring piece, keeps the core particles from extruding each other in the horizontal direction of the blue film. The annular device can support the wafer in the transportation process, reduces the stress of the blue film in the vertical direction, and reduces the damage of the core particles.

[0014] The confinement annular plastic piece is provided with a wafer positioning socket, which guarantees the consistent pasting direction of the blue film during the operation of pasting the blue film; meanwhile, the confinement device is made of light plastic, so that the transportation cost is reduced; the outer circle of the annular device is designed in an octagonal shape and placed in an outer packaging box, so that no horizontal shaking occurs during transportation; the inner circle of the annular device is designed in a circular shape, which can be applied to wafers of different sizes, and the size of the wafer can be switched freely. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a structural schematic view of the utility model;

[0016] Figure 2 It is a left view of Figure 1 ;

[0017] Figure 3 It is a structural schematic view of the confinement ring of the utility model;

[0018] Figure 4 It is a structural schematic view of the blue film of the utility model;

[0019] The reference signs shown in the drawing are as follows: 1-confinement ring, 2-cut wafer, 3-blue film, 4-wafer information label, 5-wafer positioning socket; DETAILED DESCRIPTION

[0020] The technical scheme of the structural schematic view in the embodiments of the utility model will be clearly and completely described below in conjunction with the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0021] A wafer transportation confinement device is used in cooperation with a cut wafer 2, comprising a confinement ring 1 and a blue film 3. The confinement ring 1 is of an annular structure, the outer contour of which is an octagonal structure, and is placed in an outer packaging box during transportation and tightly abuts against the packaging box, so that no shaking occurs. The inner contour of the confinement ring 1 is a circular structure, which is the same as the outer contour of the wafer. The blue film 3 is adhered to one side of the confinement ring 1, and the outer contour of the blue film 3 is the same as the outer contour of the confinement ring 1.

[0022] In some embodiments, the cut wafer 2 is adhered to one side of the blue film 3 inside the confinement ring 1, and the wafer edge does not touch the real object, avoiding damage caused by collision to the wafer.

[0023] In some embodiments, two corners of the confinement ring 1 are provided with inwardly recessed wafer positioning sockets 5, facilitating positioning when the blue film 3 is pasted.

[0024] In some embodiments, the thickness of the confinement ring 1 is greater than the thickness of the cut wafer 2, and when multiple wafers are stacked for wafer transportation, the wafers themselves are not touched, further avoiding damage caused by collision to the wafers.

[0025] In some embodiments, the inner contour diameter of the confinement ring 1 is greater than the diameter of the cut wafer 2, which can be applied to wafers of different diameters, facilitating transportation.

[0026] In some embodiments, the blue film 3 is further provided with a wafer information label 4 on one side, located between the inner contour of the confinement ring 1 and the cut wafer 2, facilitating the identification of wafers of different specifications.

[0027] In some embodiments, the material of the confinement ring is light plastic.

[0028] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "a specific embodiment", and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0029] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and purposes of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A wafer transport and confinement device, used in conjunction with cut wafers, characterized in that: include: The confinement ring and the blue film are annular in structure, with an outer contour of an octagonal structure and an inner contour of a circular structure. The blue film is adhered to one side of the confinement ring, and its outer contour is the same as that of the confinement ring. The cut wafer is adhered to one side of the blue film and is located inside the confinement ring.

2. The wafer transport and confinement device according to claim 1, characterized in that: Two corners of the locking ring are provided with inwardly recessed wafer positioning sockets.

3. The wafer transport and confinement device according to claim 2, characterized in that: The thickness of the confinement ring is greater than the thickness of the wafer after dicing.

4. The wafer transport and confinement device according to claim 3, characterized in that: The inner contour diameter of the confinement ring is larger than the diameter of the wafer after being cut.

5. The wafer transport and confinement device according to claim 4, characterized in that: A wafer information label is also adhered to one side of the blue film and is located between the inner contour of the confinement ring and the cut wafer.

6. The wafer transport and confinement device according to claim 5, characterized in that: The material of the confinement ring is plastic.

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