PCB circuit board

Abstract

The utility model relates to the field of circuit boards, in particular to a printed circuit board (PCB), which comprises a backlight board, a top tray, a liquid crystal glass substrate, a liquid crystal imaging module, a PCB main body, an upper semi-solidified layer, upper mirror surface stainless steel, upper kraft paper and an upper aluminum film board, the top tray is arranged on the upper side of the backlight board, and the PCB main body is arranged between the backlight board and the top tray. A plurality of liquid crystal imaging modules are mounted on the outer side of the liquid crystal glass substrate; an upper semi-solidified layer is mounted in the middle of the upper side of the PCB; upper mirror stainless steel is mounted on the upper side of the upper semi-solidified layer; upper kraft paper is mounted on the upper side of the upper mirror stainless steel; the PCB main body is provided with the aluminum film plates on the upper and lower surfaces, so that heat can be quickly conducted and dissipated, the working temperature of components is effectively reduced, and the stability and reliability of equipment are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of circuit board, concretely relates to a PCB circuit board. BACKGROUND

[0002] PCB (printed circuit board) is an important component in the electronic industry, and is applied in almost all electronic devices, from small electronic watches, calculators to large computers, communication electronic devices, military weapon systems, etc. It is the support of electronic components, and also the carrier of electrical connection between electronic components. PCB is made through electronic printing technology, so it is called "printed" circuit board. This technology includes transferring the circuit design to the substrate, and then generating the circuit through chemical etching, so as to realize the connection of electronic components. There are various types of PCBs, including but not limited to ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, aluminum substrate, high-frequency board, thick copper board, impedance board, ultra-thin circuit board and flexible circuit board (FPC), the latter is made of polyimide or polyester film as the base material, and has high reliability and excellent electrical performance. The circuit board connects electronic components according to the circuit principle through the pre-designed conductive path, so as to realize the function of electronic equipment. This conductive path can be a conductive circuit on an insulating substrate, or a conductive circuit on a polyimide or polyester film in a flexible circuit board. Whether it is rigid PCB or flexible PCB, they are fixed with the designed circuit pattern on the substrate through image transfer and chemical etching, so as to complete the electrical connection between electronic components. Chinese patent discloses a kind of PCB circuit board (grant announcement number CN 206596287U), the PCB circuit board of the patent technology can be guaranteed through the cooling device of bottom, the working temperature of circuit board, increase the working efficiency and reaction speed of circuit board and electronic component, and circuit board has reinforcing alloy plate acting as framework, increase the firmness of circuit board, not easy to break again, while circuit board main body edge is embedded with anti-magnetic disturbance steel ring, avoid external electromagnetic interference, but, the design circuit board structure is not equipped with double-sided aluminum film plate material, only single installation semiconductor refrigeration piece, not do to multi-area coverage, affect the heat dissipation of circuit board, so that the accuracy of circuit board is not high. Therefore, the technical personnel in the art provides a kind of PCB circuit board to solve the problems raised in the above background technology. CONTENT OF UTILITY MODEL

[0003] To solve the above technical problems, the utility model provides a kind of PCB circuit board, including backlight plate, top disc, liquid crystal glass substrate, liquid crystal imaging module, PCB circuit board main body, upper half curing layer, upper mirror stainless steel, upper kraft paper and upper aluminium film plate, top disc is installed on backlight plate upside, and PCB circuit board main body is installed between backlight plate and top disc, liquid crystal glass substrate is installed on PCB circuit board main body upside edge, multiple liquid crystal imaging modules are installed on liquid crystal glass substrate outside, upper half curing layer is installed on PCB circuit board main body upside middle, upper mirror stainless steel is installed on upper half curing layer upside, upper kraft paper is installed on upper mirror stainless steel upside, and upper aluminium film plate is installed on upper kraft paper upside.

[0004] Preferably, the PCB circuit board main body is installed with a PCB circuit board side plate outside, and a semiconductor refrigeration sheet is installed on the lower side of the PCB circuit board side plate, and the semiconductor refrigeration sheet is installed on the inner side edge of the backlight plate.

[0005] Preferably, a groove is arranged at the middle position of the inner side of the backlight plate, and a lower half curing layer, a lower mirror stainless steel, a lower kraft paper and a lower aluminium film plate are installed in the groove, wherein the PCB circuit board main body is installed on the upper side of the lower half curing layer, the lower mirror stainless steel is installed on the lower side of the lower half curing layer, the lower kraft paper is installed on the lower side of the lower mirror stainless steel, and the lower aluminium film plate is installed on the lower side of the lower kraft paper.

[0006] Preferably, a first fixing column hole is arranged on the side of the backlight plate, a second fixing column hole is arranged on the side of the top disc, a copper column is installed in the first fixing column hole and the second fixing column hole, a protection groove is arranged at the middle position of the top disc, a driving groove is arranged at the edge position of the top disc, and the liquid crystal imaging module is installed in the driving groove.

[0007] The technical effects and advantages of the utility model are as follows:

[0008] 1. The PCB circuit board main body is installed with aluminium film plates on both upper and lower surfaces, which can quickly conduct and dissipate heat, effectively reduce the working temperature of components and devices, and improve the stability and reliability of the equipment.

[0009] 2. The PCB circuit board main body is installed with kraft papers on both upper and lower surfaces, which can provide an additional protective layer to protect the PCB from dust, moisture, corrosion and other environmental factors, reduce the wear and tear and scratches on the surface of the PCB, and reduce the risk of static accumulation. BRIEF DESCRIPTION OF DRAWINGS

[0010] Figure 1 is a structural schematic diagram of a PCB circuit board provided by the embodiment of the application;

[0011] Figure 2 is a sectional structure schematic diagram of a PCB circuit board provided by the embodiment of the application;

[0012] Figure 3is an explosion structure schematic diagram of a PCB circuit board provided by an embodiment of the present application;

[0013] Figure 4 is an explosion structure schematic diagram of a PCB circuit board provided by an embodiment of the present application Figure 1 ;

[0014] Figure 5 is an explosion structure schematic diagram of a PCB circuit board provided by an embodiment of the present application Figure 2 .

[0015] In the figure: 1, backlight plate; 2, top disc; 3, liquid crystal glass substrate; 4, liquid crystal imaging module; 5, PCB circuit board main body; 6, upper semi-cured layer; 7, upper mirror stainless steel; 8, upper kraft paper; 9, upper aluminum film plate; 10, copper column; 101, No. 1 fixed column hole; 102, semiconductor refrigeration piece; 103, groove; 201, No. 2 fixed column hole; 202, protection groove; 203, driving groove; 501, PCB circuit board edge plate; 601, lower semi-cured layer; 701, lower mirror stainless steel; 801, lower kraft paper; 901, lower aluminum film plate. DETAILED DESCRIPTION

[0016] The utility model will be further explained in detail in combination with the drawings and specific embodiments. The embodiments of the utility model are given for example and description, and are not exhaustive or limit the utility model to the disclosed forms. Many modifications and changes are obvious to those skilled in the art. The embodiments are selected and described to better illustrate the principles and practical application of the utility model, and to enable those skilled in the art to understand the utility model so as to design various embodiments with various modifications suitable for specific purposes.

[0017] EMBODIMENT

[0018] Please refer to Figures 1-5 , a PCB circuit board is provided in the embodiment, which comprises a backlight plate 1, a top disc 2, a liquid crystal glass substrate 3, a liquid crystal imaging module 4, a PCB circuit board main body 5, an upper semi-cured layer 6, an upper mirror stainless steel 7, an upper kraft paper 8 and an upper aluminum film plate 9, the top disc 2 is installed on the upper side of the backlight plate 1, the PCB circuit board main body 5 is installed between the backlight plate 1 and the top disc 2, the liquid crystal glass substrate 3 is installed on the upper side edge of the PCB circuit board main body 5, a plurality of liquid crystal imaging modules 4 are installed on the outer side of the liquid crystal glass substrate 3, the upper semi-cured layer 6 is installed on the upper side of the PCB circuit board main body 5, the upper mirror stainless steel 7 is installed on the upper side of the upper semi-cured layer 6, the upper kraft paper 8 is installed on the upper side of the upper mirror stainless steel 7, and the upper aluminum film plate 9 is installed on the upper side of the upper kraft paper 8;

[0019] Specifically, the PCB circuit board body 5 is installed with a PCB circuit board side plate 501 on the outer side, and the semiconductor refrigeration piece 102 is installed on the lower side of the PCB circuit board side plate 501, and the semiconductor refrigeration piece 102 is installed at the inner side edge position of the backlight plate 1, and a recess 103 is arranged at the middle position of the inner side of the backlight plate 1, and the lower semi-cured layer 601, the lower mirror stainless steel 701, the lower kraft paper 801 and the lower aluminum film plate 901 are installed in the recess 103, wherein the lower semi-cured layer 601 is installed with the PCB circuit board body 5 on the upper side, the lower semi-cured layer 601 is installed with the lower mirror stainless steel 701 on the lower side, the lower mirror stainless steel 701 is installed with the lower kraft paper 801 on the lower side, and the lower kraft paper 801 is installed with the lower aluminum film plate 901 on the lower side, and a first fixed column hole 101 is arranged at the side of the backlight plate 1, a second fixed column hole 201 is arranged at the side of the top disc 2, a copper column 10 is installed in the first fixed column hole 101 and the second fixed column hole 201, a protection groove 202 is arranged at the middle position of the top disc 2, a driving groove 203 is arranged at the edge position of the top disc 2, and the liquid crystal imaging module 4 is installed in the driving groove 203.

[0020] The working principle of the utility model is:

[0021] In use, the PCB circuit board is installed with the upper semi-cured layer 6 on the upper side and middle of the PCB circuit board body 1, the upper mirror stainless steel 7 is installed on the upper side of the upper semi-cured layer 6, the upper kraft paper 8 is installed on the upper side of the upper mirror stainless steel 7, the upper aluminum film plate 9 is installed on the upper side of the upper kraft paper 8, the lower semi-cured layer 601 is installed with the PCB circuit board body 5 on the upper side, the lower semi-cured layer 601 is installed with the lower mirror stainless steel 701 on the lower side, the lower mirror stainless steel 701 is installed with the lower kraft paper 801 on the lower side, and the lower kraft paper 801 is installed with the lower aluminum film plate 901 on the lower side, and the PCB circuit board body (1) is installed with the aluminum film plate on the upper and lower sides, can quickly conduct and radiate heat, effectively reduces the working temperature of the components, improves the stability and reliability of the equipment, the PCB circuit board body (1) is installed with the kraft paper on the upper and lower sides, can provide an additional protective layer, protects the PCB from dust, humidity, corrosion and other environmental factors, can reduce the wear and tear and scratches on the surface of the PCB, and reduces the risk of static accumulation.

[0022] Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary skilled in the art and related fields without creative labor should belong to the protection scope of the utility model. The structures, devices and operation methods not specifically described and explained in the utility model are implemented according to the conventional means in the art, unless specially described and limited.

Claims

1. A PCB circuit board, characterized in that: The invention comprises a backlight panel (1), a top plate (2), a liquid crystal glass substrate (3), a liquid crystal imaging module (4), a PCB circuit board body (5), an upper semi-cured layer (6), an upper mirror stainless steel (7), an upper kraft paper (8) and an upper aluminum film plate (9); the top plate (2) is installed on the upper side of the backlight panel (1); the PCB circuit board body (5) is installed between the backlight panel (1) and the top plate (2); the liquid crystal glass substrate (3) is installed on the upper edge of the PCB circuit board body (5); a plurality of liquid crystal imaging modules (4) are installed on the outer side of the liquid crystal glass substrate (3); the upper semi-cured layer (6) is installed in the middle of the upper side of the PCB circuit board body (5); the upper mirror stainless steel (7) is installed on the upper side of the upper semi-cured layer (6); the upper kraft paper (8) is installed on the upper side of the upper mirror stainless steel (7); and the upper aluminum film plate (9) is installed on the upper side of the upper kraft paper (8).

2. A PCB circuit board according to claim 1, characterized in that: A PCB circuit board side plate (501) is installed outside the PCB circuit board main body (5).

3. A PCB circuit board according to claim 2, characterized in that: A semiconductor cooling plate (102) is installed on the lower side of the PCB circuit board side plate (501), and the semiconductor cooling plate (102) is installed at the inner edge position of the backlight plate (1).

4. A PCB circuit board according to claim 3, characterized in that: A groove (103) is provided at the middle position of the inner side of the backlight plate (1).

5. A PCB circuit board according to claim 4, characterized in that: A lower semi-cured layer (601), a lower mirror stainless steel (701), a lower kraft paper (801) and a lower aluminum film plate (901) are installed in the groove (103), wherein a PCB circuit board body (5) is installed on the upper side of the lower semi-cured layer (601), the lower mirror stainless steel (701) is installed on the lower side of the lower semi-cured layer (601), the lower kraft paper (801) is installed on the lower side of the lower mirror stainless steel (701), and the lower aluminum film plate (901) is installed on the lower side of the lower kraft paper (801).

6. A PCB circuit board according to claim 1, characterized in that: A first fixing column hole (101) is provided on the side of the backlight plate (1), a second fixing column hole (201) is provided on the side of the top plate (2), and copper columns (10) are installed in the first fixing column hole (101) and the second fixing column hole (201).

7. A PCB circuit board according to claim 6, characterized in that: A protection groove (202) is provided in the middle of the top plate (2), a driving groove (203) is provided at the edge of the top plate (2), and a liquid crystal imaging module (4) is installed in the driving groove (203).

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