Circuit board and motor controller
By integrating the input terminals, capacitors, output terminals and signal circuits on the same substrate surface and placing the power components on another substrate surface, the problems of extended circuit paths and large space occupation in three-phase AC motor controllers are solved, and the risk of overvoltage failure is reduced and a miniaturized design is achieved.
Patent Information
- Application Number
- CN202422587284.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-24
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2034-10-24
AI Technical Summary
In existing three-phase AC motor controllers, the layered arrangement of power capacitors and power components results in a longer circuit path, increases the risk of overvoltage failure of power components, and occupies a larger space.
The input terminals, capacitors, output terminals and signal circuits are arranged on the surface of the same substrate, and the power components are arranged on the surface of another substrate, eliminating the guide columns, shortening the circuit path, and integrating the power components with the input terminals, capacitors, output terminals and signal circuits.
This reduces the risk of overvoltage failure of power components, reduces space occupancy, facilitates miniaturization, and improves the overall performance and reliability of the circuit.
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Figure CN223452164U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of motor controller, in particular to a circuit board and a motor controller. BACKGROUND
[0002] The three-phase alternating current motor controller is used to ensure the efficient, safe and intelligent operation of the motor. At present, the components of the three-phase inverter circuit of the three-phase alternating current motor controller are arranged in layers. The power components are arranged on the bottom layer of the aluminum substrate, the input terminal post, the power capacitor, the output terminal post and the signal circuit are arranged on the top layer of the PCB, and the power components are connected with the PCB through the current guide column between the aluminum substrate and the PCB. The layered arrangement makes the power capacitor and the power component need to be connected through the current guide column, which prolongs the circuit path between the power capacitor and the power component, is not conducive to the power capacitor to suppress the peak voltage of the power component, and increases the risk of overvoltage failure of the power component. CONTENT OF THE UTILITY MODEL
[0003] In view of the problems in the background art, the purpose of the present application is to provide a circuit board and a motor controller, which overcome the above problems or at least partially solve the above problems.
[0004] According to a first aspect of the present application, a circuit board is provided, comprising: a first substrate, an input terminal post, a capacitor, an output terminal post, a second substrate and a power component. The first substrate comprises a first surface and a second surface arranged oppositely. The input terminal post is arranged on the first surface. The capacitor is arranged on the first surface. The output terminal post is arranged on the first surface. The second substrate is provided with a signal circuit, and the second substrate is arranged on the first surface. The power component is arranged on the second surface.
[0005] In one or more optional embodiments above, in the first direction, the first substrate comprises a first part, a second part and a third part connected in sequence, the input terminal post, the capacitor and the output terminal post are arranged in sequence on the first part, the second part and the third part respectively, the input terminal post is connected with the capacitor, the capacitor is connected with the power component, the power component is arranged on the third part, and the power component is connected with the output terminal post. Wherein, the first direction is perpendicular to the direction from the first surface to the second surface.
[0006] In one or more optional embodiments above, the number of input terminals is two, the two input terminals are respectively used for connecting to a positive pole of a power supply and a negative pole of the power supply, the number of capacitors is multiple, the number of output terminals is three, the three output terminals are respectively used for connecting to three phases of a motor, and the two input terminals, the multiple capacitors, and the three output terminals are arranged along a second direction. The first direction, the second direction, and a direction from the first surface to the second surface are perpendicular to each other.
[0007] In one or more optional embodiments above, the power assembly includes a first power assembly, a second power assembly, and a third power assembly, the first power assembly, the second power assembly, and the third power assembly are arranged along the second direction in sequence, and the first power assembly, the second power assembly, and the third power assembly are respectively connected to the three output terminals one by one.
[0008] In one or more optional embodiments above, along the second direction, one output terminal, the first power assembly, another output terminal, the second power assembly, and the third power assembly are arranged in sequence.
[0009] In one or more optional embodiments above, the first substrate includes a fourth portion, along the first direction, the third portion and the fourth portion are connected in sequence, the second substrate is arranged on the fourth portion, and the second substrate is arranged to extend along the second direction.
[0010] In one or more optional embodiments above, the first substrate is provided with a mounting hole, one end of the second substrate is provided with a mounting protrusion, the mounting protrusion is inserted into the mounting hole, and the mounting protrusion is welded to the mounting hole to electrically connect the second substrate to the first substrate.
[0011] In one or more optional embodiments above, a third substrate and a current sensor are included, the current sensor is arranged on the third substrate, the third substrate is arranged on a side of the first surface away from the second surface, one end of the output terminal is connected to the first substrate, and the other end of the output terminal passes through the third substrate and the current sensor.
[0012] In one or more optional embodiments above, a connector is further included, two ends of the connector are respectively connected to the third substrate and the first substrate.
[0013] According to a second aspect of the present application, a motor controller is provided, including the circuit board as described above.
[0014] The circuit board provided by the embodiment of the present application has the beneficial effects that: by arranging the input terminal post, the capacitor, the output terminal post and the second substrate provided with the signal circuit on the first surface of the first substrate, and arranging the power component on the second surface of the first substrate, compared with the traditional way of arranging the power capacitor and the power component on the aluminum substrate and the PCB board separately, the circuit board provided by the embodiment of the present application saves the flow guide column, the circuit path between the capacitor and the power component is shorter, which is beneficial to the capacitor to suppress the peak voltage of the power component, thereby reducing the risk of overvoltage failure of the power component; and the power component, the input terminal post, the capacitor, the output terminal post and the second substrate provided with the signal circuit are integrated on the first substrate, which reduces the space required, and is beneficial to meet the design requirement of miniaturization. BRIEF DESCRIPTION OF DRAWINGS
[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual proportion.
[0016] Figure 1 A schematic diagram of a circuit board provided by the embodiment of the present application;
[0017] Figure 2 A schematic diagram of a circuit board provided by the embodiment of the present application;
[0018] Figure 3 A schematic diagram of a circuit board provided by the embodiment of the present application;
[0019] Figure 4 A schematic diagram of a circuit board provided by the embodiment of the present application; Figure 3 A cross-sectional schematic diagram at A-A in FIG. 4. DETAILED DESCRIPTION
[0020] In order to facilitate the understanding of the present application, the present application will be described in more detail below in combination with the drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element or one or more intervening elements can be present therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element or one or more intervening elements can be present therebetween. The terms "vertical", "horizontal", "left", "right", "inner", "outer" and similar expressions used in the present specification are for illustrative purposes only.
[0021] Unless otherwise defined, all technical and scientific terms used in the present disclosure have the same meanings as those commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. All publications, patent applications, patents, and other references mentioned in this specification are herein incorporated by reference in their entirety for the purpose of describing and disclosing, for example, the methodologies described in such publications, which might provide useful background to the present application.
[0022] In the description of the present application, unless otherwise explicitly defined and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the internal communication of two elements or the interaction relationship of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0023] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as there is no conflict.
[0024] Please refer to Figure 1 and Figure 2 The circuit board 1000 includes a first substrate 1, an input terminal 2, a capacitor 3, an output terminal 4, a second substrate 5 and a power component 6. The first substrate 1 includes a first surface 1a and a second surface 1b arranged oppositely, the input terminal 2, the capacitor 3 and the output terminal 4 are arranged on the first surface 1a. The second substrate 5 is provided with a signal circuit (not shown in the figure), and the second substrate 5 is arranged on the first surface 1a. The power component 6 is arranged on the second surface 1b.
[0025] The circuit board 1000 provided by the embodiment of the present application, by arranging the input terminal 2, the capacitor 3, the output terminal 4 and the second substrate 5 provided with the signal circuit on the first surface 1a of the first substrate 1, and arranging the power component on the second surface 1b of the first substrate 1, compared with the traditional way of arranging the power capacitor and the power component separately on the aluminum substrate and the PCB board in the three-phase AC motor controller, the circuit board 1000 provided by the embodiment of the present application eliminates the flow guide column, the circuit path between the capacitor 3 and the power component 6 is shorter, which is conducive to the capacitor 3 to suppress the peak voltage of the power component 6, thereby reducing the risk of overvoltage failure of the power component 6; and the power component 6, the input terminal 2, the capacitor 3, the output terminal 4 and the second substrate 5 provided with the signal circuit are integrated and arranged on the first substrate 1, which reduces the space required, and is conducive to meeting the design requirements of miniaturization.
[0026] In some embodiments, along the first direction X, the first substrate 1 comprises a first portion 11, a second portion 12 and a third portion 13 connected in sequence, the input terminal 2, the capacitor 3 and the output terminal 4 are arranged in sequence on the first portion 11, the second portion 12 and the third portion 13 respectively, the input terminal 2 is connected with the capacitor 3, the capacitor 3 is connected with the power component 6, the power component 6 is arranged on the third portion 13, and the power component 6 is connected with the output terminal 4, wherein the first direction X is perpendicular to the direction Y from the first surface 1a to the second surface 1b. By arranging the input terminal 2, the capacitor 3 and the output terminal 4 in sequence along the first direction X on the first surface 1a in the areas of the first portion 11, the second portion 12 and the third portion 13 respectively, and arranging the power component 6 on the second surface 1b in the area of the third portion 13, the circuit path of the power loop composed of the input terminal 2, the capacitor 3, the power component 6 and the output terminal 4 is shortened, thereby improving the overall performance and reliability of the power loop.
[0027] In some embodiments, the input terminal 2, the capacitor 3, the output terminal 4 and the power component 6 together constitute a three-phase inverter bridge circuit. The input terminal 2 is used to connect the power supply. The capacitor 3 is used to smooth the input voltage, filter out the ripple and noise in the power supply, and ensure the stability of the power supply. The power component 6 is used to convert the direct current power supply into three-phase alternating current, and the power component 6 includes but is not limited to metal oxide semiconductor field effect transistor (MOSFET). The output end of the power component 6 is connected to the output terminal 4, and the output terminal 4 is used to connect the load or other circuits.
[0028] In some embodiments, the number of input terminals 2 is two, and the two input terminals 2 are respectively used to connect the positive electrode of the power supply and the negative electrode of the power supply. The number of capacitors 3 is multiple, and the number of output terminals 4 is three, and the three output terminals 4 are respectively used to connect the three-phase input end of the motor. The two input terminals 2, the multiple capacitors 3 and the three output terminals 4 are arranged along the second direction Z, wherein the first direction X, the second direction Z and the direction Y from the first surface 1a to the second surface 1b are perpendicular to each other.
[0029] In some embodiments, the power component 6 comprises a first power component 61, a second power component 62 and a third power component 63, the first power component 61, the second power component 62 and the third power component 63 are arranged in sequence along the second direction Z, and the first power component 61, the second power component 62 and the third power component 63 are respectively connected with the three output terminals 4 arranged in sequence along the second direction Z.
[0030] In some embodiments, the first power component 61, the second power component 62 and the third power component 63 are all metal oxide semiconductor field effect transistors.
[0031] In some embodiments, along the second direction Z, the output terminal 4, the first power component 61, another output terminal 4, the second power component 62, still another output terminal 4 and the third power component 63 are arranged in sequence.
[0032] In some embodiments, the first substrate 1 comprises a fourth portion 14, along the first direction X, the third portion 13 and the fourth portion 14 are connected in sequence, and the second substrate 5 is arranged on the fourth portion 14, and the second substrate 5 extends along the second direction Z. The second substrate 5 is arranged on the fourth portion 14 adjacent to the power component 6, which is conducive to shortening the circuit path between the signal circuit on the second substrate 5 and the power component 6, and the wiring between the signal circuit and the power component 6 is shorter, which is conducive to improving the signal anti-interference performance.
[0033] In some embodiments, the first substrate 1 is provided with a mounting hole 14a, and one end of the second substrate 5 is provided with a mounting protrusion 51, the mounting protrusion 51 is inserted into the mounting hole 14a, and the mounting protrusion 51 is welded to the mounting hole 14a to electrically connect the second substrate 5 and the first substrate 1.
[0034] In some embodiments, the second substrate 5 and the first substrate 1 are arranged perpendicular to each other.
[0035] In some embodiments, the outer side wall of the mounting protrusion 51 is provided with a first solder pad (not shown), the first solder pad is electrically connected to the circuit of the second substrate 5, the inner wall of the mounting hole 14a is provided with a second solder pad (not shown), the second solder pad is electrically connected to the circuit of the first substrate 1, and the first solder pad is welded to the second solder pad.
[0036] It can be understood that the first substrate 1 and the second substrate 5 are not limited to being fixed and electrically connected by the mounting protrusion 51 and the mounting hole 14a as described above, for example, in some other embodiments, the first substrate 1 and the second substrate 5 can also be connected by using a circuit board connector.
[0037] Please refer to Figures 1-3 In some embodiments, the circuit board 1000 further comprises a copper bar 7, along the first direction X, the copper bar 7 is arranged between the capacitor 3 and the output terminal 4, the copper bar 7 comprises a main body portion 71, a first connecting portion 72, a second connecting portion 73 and a third connecting portion 74, the main body portion 71 extends along the second direction Z, the first connecting portion 72, the second connecting portion 73 and the third connecting portion 74 are arranged in sequence and spaced apart along the second direction Z on the main body portion 71, and the first connecting portion 72, the second connecting portion 73 and the third connecting portion 74 are connected to the first power component 61, the second power component 62 and the third power component 63 respectively.
[0038] In some embodiments, the circuit board 1000 includes a socket 8 , which is used for connecting the circuit board 1000 to other devices. The socket 8 is disposed on the first surface 1 a .
[0039] In some embodiments, the socket 8 is located in the first portion 11 , and the two input terminals 2 and the socket 8 are arranged along the second direction Z.
[0040] See also Figure 3 and Figure 4 In some embodiments, circuit board 1000 includes a third substrate 9 and a current sensor 10. Third substrate 9 is used to carry current sensor 10, which is used to measure the current of output terminal 4. Current sensor 10 is disposed on third substrate 9, which is disposed on the side of first surface 1a facing away from second surface 1b. One end of output terminal 4 is connected to first substrate 1, and the other end of output terminal 4 passes through third substrate 9 and current sensor 10.
[0041] In some embodiments, the third substrate 9 and the first substrate 1 are arranged parallel to each other.
[0042] In some embodiments, the circuit board 1000 further includes a connector 11 , and two ends of the connector 11 are respectively connected to the third substrate 9 and the first substrate 1 .
[0043] In some embodiments, pins are provided at both ends of the connector 11 , and the two ends of the connector 11 are respectively soldered to the first substrate 1 and the third substrate 9 through the pins.
[0044] Based on the same inventive concept, the present application also provides a motor controller, including the circuit board 1000 in any of the above embodiments.
[0045] In some embodiments, the motor controller includes a housing, and the circuit board 1000 is disposed in the housing.
[0046] In some embodiments, the motor controller includes a radiator seat, which is arranged on the housing. The second surface 1b is arranged opposite to the heat dissipation surface of the radiator seat, and the side of the power component 6 facing away from the second surface 1b is in contact with the heat dissipation surface.
[0047] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. A circuit board, characterized in that: include: A first substrate comprising a first surface and a second surface opposite to each other; Input terminals, disposed on the first surface; a capacitor, disposed on the first surface; Output terminals, disposed on the first surface; a second substrate provided with a signal circuit, the second substrate being disposed on the first surface; The power component is disposed on the second surface.
2. The circuit board according to claim 1, wherein: Along the first direction, the first substrate includes a first portion, a second portion, and a third portion connected in sequence, the input terminal, the capacitor, and the output terminal are respectively arranged in the first portion, the second portion, and the third portion, the input terminal is connected to the capacitor, the capacitor is connected to the power component, the power component is arranged in the third portion, and the power component is connected to the output terminal; The first direction is perpendicular to a direction from the first surface to the second surface.
3. The circuit board according to claim 2, wherein: There are two input binding posts, each of which is used to connect to the positive electrode of a power supply and the negative electrode of a power supply, respectively; there are multiple capacitors; there are three output binding posts, each of which is used to connect to the three phases of a motor, respectively; the two input binding posts, the multiple capacitors, and the three output binding posts are all arranged along the second direction; The first direction, the second direction, and the direction from the first surface to the second surface are perpendicular to each other.
4. The circuit board according to claim 3, wherein: The power component includes a first power component, a second power component and a third power component. The first power component, the second power component and the third power component are arranged in sequence along the second direction. The first power component, the second power component and the third power component are respectively connected to the three output terminals in a one-to-one correspondence.
5. The circuit board according to claim 4, characterized in that Along the second direction, one of the output terminals, the first power component, another of the output terminals, the second power component, another of the output terminals and the third power component are arranged in sequence.
6. The circuit board according to claim 3, wherein: The first substrate includes a fourth portion. Along the first direction, the third portion and the fourth portion are sequentially connected. The second substrate is disposed on the fourth portion. The second substrate is extended along the second direction.
7. The circuit board according to claim 1, wherein: The first substrate is provided with a mounting hole, and one end of the second substrate is provided with a mounting protrusion, the mounting protrusion is inserted into the mounting hole, and the mounting protrusion is welded to the mounting hole to electrically connect the second substrate to the first substrate.
8. The circuit board according to claim 1, wherein: It includes a third substrate and a current sensor, wherein the current sensor is arranged on the third substrate, and the third substrate is arranged on the side of the first surface facing away from the second surface. One end of the output terminal is connected to the first substrate, and the other end of the output terminal is passed through the third substrate and the current sensor.
9. The circuit board according to claim 8, wherein: A connector is also included, with two ends of the connector connected to the third substrate and the first substrate respectively.
10. A motor controller, characterized in that: Comprising the circuit board according to any one of claims 1 to 9.