Cold and hot drying device and intelligent closestool

By introducing a cooling system with semiconductor cooling chips and heat dissipation components into the drying module of the smart toilet, the problem that existing smart toilets can only blow warm air has been solved, achieving an upgrade to the cold air function and improving user experience and heat dissipation efficiency.

CN223453158UActive Publication Date: 2025-10-21GUANGDONG LEHUA HOME FURNISHING CO LTD
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Patent Information

Application Number
CN202422468007.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-12
Publication Date
2025-10-21
Estimated Expiration
2034-10-12

AI Technical Summary

Technical Problem

Current smart toilets' drying modules can only blow out warm or normal temperature air, and cannot provide a choice of cold air.

Method used

A semiconductor cooling chip is added to the drying module. The cooling chip, cold end fins and heat dissipation components form a cooling system. Direct current is used to transfer the heat of the semiconductor cooling chip to form a cold end and a hot end. The cold end is connected to the cold end fins to cool the air in the air duct. The hot end is connected to the heat dissipation components outside the air duct through the heat dissipation port to realize the cold air function.

Benefits of technology

The drying module can blow out cold air, giving users more options. It has a simple structure, is easy to upgrade, and has high heat dissipation efficiency.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN223453158U_ABST
    Figure CN223453158U_ABST
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Abstract

The cold and hot drying device comprises a shell, a draught fan, a heater, a semiconductor chilling plate, a cold end fin and a heat dissipation assembly, an air duct is arranged in the shell, an air inlet and an air outlet are formed in the shell, the heater and the cold end fin are arranged in the air duct, the cold end of the semiconductor chilling plate is connected with the cold end fin, and the heat dissipation assembly is arranged in the shell. The heat dissipation assembly is located outside the air channel, a heat dissipation opening is formed in the side wall of the air channel, and the hot end of the semiconductor chilling plate is connected with the heat dissipation assembly through the heat dissipation opening. According to the drying module, the semiconductor chilling plate is added into an existing drying module, so that the drying module has the function of blowing out cold air. The semiconductor chilling plate, the cold end fin and the heat dissipation assembly form a refrigeration system, the cold end of the semiconductor chilling plate is connected with the cold end fin to cool air in the air duct, the hot end of the semiconductor chilling plate is connected with the heat dissipation assembly outside the air duct through the heat dissipation opening, and therefore heat of the air passing through the air duct is transferred into a cooling medium of the heat dissipation assembly.
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Description

TECHNICAL FIELD

[0001] The utility model relates to intelligent closestool technical field especially, and it is a cold and hot drying device and intelligent closestool. BACKGROUND

[0002] The existing intelligent closestool drying module is used for after defecation and hip washing, and hot air generated by a fan, a heating assembly and other components is usually used to dry the hips. The heating power of the heating assembly can be adjusted to adjust the air temperature of the hot air. However, the existing intelligent closestool drying module can only blow warm air or normal temperature air and cannot provide cold air. SUMMARY

[0003] The utility model aims at at least in a certain extent solves one of the above technical problems in the prior art. To this end, the utility model provides a cold and hot drying device.

[0004] To achieve the above-mentioned purpose, the technical scheme of the utility model is as follows:

[0005] The utility model further provides an intelligent closestool with the above-mentioned cold and hot drying device.

[0006] According to the cold and hot drying device of the first aspect embodiment of the utility model, the shell has an air duct, the shell is provided with an air inlet and an air outlet, the air inlet and the air outlet are respectively arranged at two ends of the air duct and communicate with the air duct, the fan is installed in the shell and located at the air inlet, the heating device and the cold end fin are arranged in the air duct, the cold end of the semiconductor refrigeration piece is connected with the cold end fin, the heat dissipation assembly is located outside the air duct, the side wall of the air duct is provided with a heat dissipation opening, and the hot end of the semiconductor refrigeration piece is connected with the heat dissipation assembly through the heat dissipation opening.

[0007] According to the cold and hot drying device of the utility model embodiment, at least the following beneficial effects are obtained:

[0008] 1. In the existing drying module, the semiconductor refrigeration piece is added, so that the drying module has the function of blowing cold air. The semiconductor refrigeration piece, the cold end fin and the heat dissipation assembly form a refrigeration system. When direct current is passed through the semiconductor refrigeration piece, the heat of the semiconductor refrigeration piece is transferred from one end to the other end, so that the cold end and the hot end are formed. The cold end is connected with the cold end fin to cool the air in the air duct. The hot end is connected with the heat dissipation assembly outside the air duct through the heat dissipation opening, so that the heat of the air passing through the air duct is transferred to the cooling medium of the heat dissipation assembly.

[0009] 2. The cold and hot drying device can blow cold air, providing customers with more choices; the semiconductor refrigerating sheet is simple in structure and easy to upgrade on the existing drying module.

[0010] According to some embodiments of the utility model, the heat dissipation assembly comprises a cooling water tank, the rear wall of the cooling water tank is close to the hot end of the semiconductor refrigerating sheet, the left side of the cooling water tank is provided with a water inlet, and the right side is provided with a water outlet.

[0011] According to some embodiments of the utility model, the cooling water tank is internally provided with heat dissipation fins, and the heat dissipation fins are composed of a plurality of heat dissipation fins arranged at intervals.

[0012] According to some embodiments of the utility model, the water inlet is located at the lower part of the cooling water tank, and the water outlet is located at the upper part of the cooling water tank.

[0013] According to some embodiments of the utility model, the cooling water tank comprises a water tank shell, a left end cover and a right end cover, the left end cover and the right end cover are respectively sealed and connected to the left and right sides of the water tank shell, the water inlet is arranged on the left end cover, and the water outlet is arranged on the right end cover.

[0014] According to some embodiments of the utility model, the left end cover and the right end cover are respectively sealed and connected to the water tank shell through rubber gaskets.

[0015] According to some embodiments of the utility model, the heating device and the cold end fin are arranged along the air outlet direction of the air duct.

[0016] According to some embodiments of the utility model, the temperature sensor is arranged in the air duct and close to the air outlet.

[0017] According to some embodiments of the utility model, the cold end fin is composed of a plurality of condensing fins arranged at intervals, and one end of the condensing fin is close to the cold end of the semiconductor refrigerating sheet.

[0018] The intelligent closestool according to the second aspect of the utility model comprises the cold and hot drying device.

[0019] Additional aspects and advantages of the utility model will be partially given in the following description, some will become obvious from the following description, or be known by the practice of the utility model. BRIEF DESCRIPTION OF DRAWINGS

[0020] The above and / or additional aspects and advantages of the utility model will become apparent and more readily appreciated from the following description of the embodiments, with reference to the following drawings, in which:

[0021] Figure 1is a whole structure diagram of the cold and hot drying device of the utility model;

[0022] Figure 2 is an explosion view of the cold and hot drying device of the utility model;

[0023] Figure 3 is a structure diagram of the refrigeration system of the utility model;

[0024] Figure 4 is an explosion view of the heat dissipation assembly of the utility model;

[0025] Figure 5 is a sectional view of the heat dissipation assembly of the utility model.

[0026] The drawing label: casing 100, air inlet 110, air outlet 120, heat dissipation port 130, upper shell 140, lower shell 150, fan 200, heating device 300, semiconductor refrigeration piece 400, cold end fin 500, heat dissipation assembly 600, water tank casing 610, heat dissipation fin 611, left end cover 620, water inlet 621, right end cover 630, water outlet 631, rubber washer 640, temperature sensor 700. DETAILED DESCRIPTION

[0027] The embodiments of the utility model are described in detail below, the examples of the embodiments are shown in the drawings, wherein the same or similar signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary, and are intended to explain the utility model, and cannot be understood as the limitation of the utility model.

[0028] In the description of the utility model, it is understood that the terms "upper", "lower", "front", "rear", "left", "right", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as the limitation of the utility model.

[0029] Refer to Figures 1-2The utility model provides a cold and hot drying device, including casing 100, fan 200, heater 300, semiconductor refrigeration piece 400, cold end fin 500 and heat dissipation assembly 600, the air duct has in casing 100, and the air duct is equipped with air inlet 110 and air outlet 120 on casing 100, and air inlet 110 and air outlet 120 are equipped with respectively in the both ends of air duct and communicate with air duct, fan 200 is installed in casing 100 and is located at air inlet 110 place, heater 300 and cold end fin 500 are equipped in air duct, and the cold end of semiconductor refrigeration piece 400 is connected with cold end fin 500, and heat dissipation assembly 600 is located at the outside of air duct, and the lateral wall of air duct is opened with heat dissipation mouth 130, and the hot end of semiconductor refrigeration piece 400 is connected with heat dissipation assembly 600 through heat dissipation mouth 130, specifically, casing 100 is composed of upper shell 140 and lower shell 150, and upper shell 140 and lower shell 150 adopt buckle and the like form to fasten, fan 200 is installed in casing 100 head position, and the air outlet of fan 200 is opposite the direction of air duct, to guarantee good heat conduction efficiency, and the heat conduction silica gel can be added between semiconductor refrigeration piece 400, heat dissipation assembly 600 and cold end fin 500.

[0030] Working principle: direct current is passed to semiconductor refrigeration piece 400, then the heat of semiconductor refrigeration piece 400 is transferred from one end to another end, thereby forming cold end and hot end, the cold end is connected with cold end fin 500, and the air in the air duct is cooled, the hot end is connected with the heat dissipation assembly 600 outside the air duct through heat dissipation mouth 130, thereby the heat of the air passing through the air duct is transferred to the cooling medium of heat dissipation assembly 600.

[0031] In some embodiments of the utility model, refer to Figures 3-5 , heat dissipation assembly 600 includes cooling water tank, the rear wall of cooling water tank is close to the hot end of semiconductor refrigeration piece 400, and the left side of cooling water tank is equipped with water inlet 621, and the right side is equipped with water outlet 631. Cooling water flows into cooling water tank from water inlet 621, absorbs the heat transferred from the hot end of semiconductor refrigeration piece 400, and then flows out from water outlet 631, achieves the effect of water-cooling heat dissipation, removes the air heat through water-cooling, and compared with air-cooling heat dissipation, the heat dissipation efficiency of water-cooling heat dissipation is high, and the volume can be made smaller.

[0032] In some embodiments of the utility model, the cooling water tank is equipped with radiating fin 611, and the radiating fin 611 is composed of a plurality of interval arranged radiating fins. The radiating fin adopts the material that is good in heat conductivity and easy to pull into shape, such as pull into shape aluminum alloy etc. The radiating fin 611 makes the inside of cooling water tank form hollow, multi-joint structure, the radiating fin is excellent in heat conductivity, the radiating fin extends from the water inlet end to the water outlet end of cooling water tank, the radiating fin 611 increases the radiating area, and further improves the heat dissipation efficiency.

[0033] In some embodiments of the utility model, the water inlet 621 is located at the lower part of the cooling water tank, and the water outlet 631 is located at the upper part of the cooling water tank. The water inlet 621 is located at the low position, and the water outlet 631 is located at the high position. By controlling the water distribution valve outside the heat dissipation assembly 600, water is introduced into the water inlet 621 at the low position. The water will fill the entire interior of the heat dissipation fins 611. All surfaces inside the heat dissipation fins 611 are in contact with the cooling water. After the cooling water carries away the heat of the heat dissipation fins 611, it flows out from the water outlet 631.

[0034] In some embodiments of the utility model, the cooling water tank comprises a water tank shell 610, a left end cover 620 and a right end cover 630. The left end cover 620 and the right end cover 630 are respectively sealed and connected to the left and right sides of the water tank shell 610. The water inlet 621 is arranged on the left end cover 620, and the water outlet 631 is arranged on the right end cover 630. The water tank shell 610 and the heat dissipation fins 611 are an integral structure. The heat received by the hot end of the semiconductor refrigeration sheet 400 can be immediately transmitted to the heat dissipation fins 611.

[0035] In some embodiments of the utility model, the left end cover 620 and the right end cover 630 are respectively sealed and connected to the water tank shell 610 through rubber gaskets 640.

[0036] In some embodiments of the utility model, the heating device 300 and the cold end fin 500 are arranged along the air outlet direction of the air duct.

[0037] In some embodiments of the utility model, a temperature sensor 700 is further included, which is arranged in the air duct and close to the air outlet 120.

[0038] In some embodiments of the utility model, the cold end fin 500 is composed of a plurality of condenser sheets arranged at intervals. One end of the condenser sheet is in close contact with the cold end of the semiconductor refrigeration sheet 400. The condenser sheet is made of a material with good thermal conductivity and easy to be pultruded, such as pultruded aluminum alloy. It can be understood that the semiconductor refrigeration sheet 400 does not necessarily only install at one end of the condenser sheet, but can also install at both ends of the condenser sheet.

[0039] An intelligent toilet comprises the above cooling and heating drying device. For the toilet with a water tank, the water flowing out of the water outlet 631 can be introduced into the water tank for standby. For the toilet without a water tank, the water can be introduced into the toilet bowl. It can also be used for cleaning the spray gun nozzle and the like. The switch of the fan 200, the switch of the semiconductor refrigeration sheet 400 and the switch of the cooling water are linked, that is, after receiving the instruction of blowing cold air, the fan 200 is turned on at the same time, and the semiconductor refrigeration sheet 400 and the cooling water are turned on.

[0040] Although the embodiments of the utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and purposes of the utility model, and the scope of the utility model is defined by the claims and their equivalents.

Claims

1. A cold and hot drying device, characterized by, The application relates to a cold and hot drying device, which comprises a shell (100), a fan (200), a heating device (300), a semiconductor refrigeration sheet (400), a cold end fin (500) and a heat dissipation assembly (600), the shell (100) is internally provided with an air duct, the shell (100) is provided with an air inlet (110) and an air outlet (120), the air inlet (110) and the air outlet (120) are arranged at two ends of the air duct and communicate with the air duct, the fan (200) is arranged in the shell (100) and located at the air inlet (110), the heating device (300) and the cold end fin (500) are arranged in the air duct, the cold end of the semiconductor refrigeration sheet (400) is connected with the cold end fin (500), the heat dissipation assembly (600) is located outside the air duct, the side wall of the air duct is provided with a heat dissipation opening (130), and the hot end of the semiconductor refrigeration sheet (400) is connected with the heat dissipation assembly (600) through the heat dissipation opening (130).

2. The cold and hot drying device according to claim 1, characterized in that, The heat dissipation assembly (600) comprises a cooling water tank, the rear wall of the cooling water tank is close to the hot end of the semiconductor refrigeration sheet (400), the left side of the cooling water tank is provided with a water inlet (621), and the right side is provided with a water outlet (631).

3. The cold and hot drying device according to claim 2, characterized in that, The cooling water tank is internally provided with heat dissipation fins (611), and the heat dissipation fins (611) are composed of a plurality of heat dissipation fins arranged at intervals.

4. The cold and hot drying device according to claim 3, characterized in that, The water inlet (621) is located at the lower part of the cooling water tank, and the water outlet (631) is located at the upper part of the cooling water tank.

5. The cold and hot drying device according to any one of claims 2-4, characterized in that, The cooling water tank comprises a water tank shell (610), a left end cover (620) and a right end cover (630), the left end cover (620) and the right end cover (630) are respectively sealed and connected to the left and right sides of the water tank shell (610), the water inlet (621) is arranged on the left end cover (620), and the water outlet (631) is arranged on the right end cover (630).

6. The cold and hot drying device according to claim 5, characterized in that, The left end cover (620) and the right end cover (630) are respectively sealed and connected to the water tank shell (610) through rubber gaskets (640).

7. The cold and hot drying device according to claim 1, characterized in that, The heating device (300) and the cold end fin (500) are arranged along the air outlet direction of the air duct.

8. The cold and hot drying device according to claim 1, characterized in that, A temperature sensor (700) is further arranged in the air duct and close to the air outlet (120).

9. The cold and hot drying device according to claim 1, characterized in that, The cold end fin (500) is composed of a plurality of condensing fins arranged at intervals, and one end of the condensing fin is close to the cold end of the semiconductor refrigeration sheet (400).

10. A smart toilet, characterized by comprising: The application further relates to a cold and hot drying device. The application further relates to a cold and hot drying device.