Grinding device

Abstract

The utility model discloses a grinding device which comprises a grinding pad, a dresser of the grinding pad and a grinding pad consumption detection device, and the dresser is in contact with the grinding pad. The grinding pad consumption detection device comprises an eddy current sensor, a frequency detection module and a consumption determination module, the eddy current sensor is detachably arranged on the trimmer, one end of the frequency detection module is electrically connected with the eddy current sensor, and the other end of the frequency detection module is electrically connected with the consumption determination module; the frequency detection module is used for detecting frequency data corresponding to the eddy current sensor and sending the frequency data to the consumption determination module under the condition that the eddy current sensor approaches the grinding pad along with the trimmer, and the consumption determination module is used for determining consumption data of the grinding pad based on the frequency data. The consumption data of the grinding pad can be automatically determined, and meanwhile the accuracy and efficiency of determining the consumption data are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor technical field especially relates to a kind of grinding devices. BACKGROUND

[0002] Chemical mechanical polishing device generally includes the grinding pad for grinding wafer, groove structure on it can store large polishing slurry, and ensure the fluidity of slurry, but the byproduct generated by grinding wafer film will block the groove structure of grinding pad, so that slurry flow difficulty and uneven distribution, which leads to the inconsistent wafer grinding rate of different areas of grinding pad, and the planarization effect is poor, and then affect the overall yield. Currently, mainly through trimmer constantly trimming grinding pad, removing grinding byproduct and ensuring that grinding pad has good groove structure, so that grinding pad constantly exposes fresh surface, while also making grinding pad produce consumption, the storage capacity and fluidity of polishing slurry are poor, and the mechanical properties of grinding pad are also weakening. In order to ensure the grinding effect, the consumption condition of grinding pad needs to be understood in time and accurately. SUMMARY

[0003] In view of the above problems of the prior art, the utility model discloses a kind of grinding devices, can automatically determine the consumption data of grinding pad, while improving the precision and efficiency of consumption data determination. The technical scheme disclosed by the utility model is as follows:

[0004] The utility model provides a kind of grinding devices, the grinding device includes grinding pad, the trimmer of the grinding pad and grinding pad consumption detection device, the trimmer is contacted with the grinding pad;The grinding pad consumption detection device includes eddy current sensor, frequency detection module and consumption determination module, the eddy current sensor is detachably arranged on the trimmer, one end of the frequency detection module is electrically connected with the eddy current sensor, another end of the frequency detection module is electrically connected with the consumption determination module;

[0005] The frequency detection module is used to detect the frequency data corresponding to the eddy current sensor when the eddy current sensor approaches the grinding pad with the trimmer, and send to the consumption determination module, and the consumption determination module is used to determine the consumption data of the grinding pad based on the frequency data.

[0006] Optionally, the grinding device further includes a bearing mechanism, the bearing mechanism has a magnetic coating, and the grinding pad is detachably arranged on the bearing mechanism.

[0007] Optionally, the eddy current sensor includes a resonance module, the resonance module is electrically connected with the frequency detection module, and the frequency detection module is used to detect the frequency data of the resonance module.

[0008] Optionally, the eddy current sensor further comprises an oscillator, the oscillator is electrically connected with the resonance module, and the oscillator is used for providing a high-frequency signal to the resonance module.

[0009] Optionally, the grinding pad consumption detection device further comprises a signal amplification module, one end of the signal amplification module is electrically connected with the resonance module, and the other end of the signal amplification module is electrically connected with the frequency detection module.

[0010] Optionally, the grinding pad consumption detection device further comprises a noise reduction module, one end of the noise reduction module is electrically connected with the resonance module, and the other end of the noise reduction module is electrically connected with the frequency detection module.

[0011] Optionally, the resonance module comprises a series connection of an eddy current coil, a capacitor and a resistor.

[0012] Optionally, the trimmer comprises a moving structure and a trimming head, the moving structure is arranged above the grinding pad, the eddy current sensor is detachably arranged on the moving structure and faces the grinding pad, the trimming head is in contact with the grinding pad, and the moving structure and the trimming head are rotationally connected.

[0013] Optionally, the grinding pad consumption detection device further comprises a prompt module, the prompt module is electrically connected with the consumption determination module, and the prompt module is used for alarming and prompting when the consumption data is greater than or equal to a preset threshold.

[0014] Optionally, the grinding device further comprises a grinding structure, the grinding structure is used for adsorbing a wafer to be ground and placing the wafer on the grinding pad.

[0015] The technical scheme provided by the disclosed embodiments of the utility model at least brings the following beneficial effects:

[0016] The grinding device provided by the utility model, the grinding device includes a grinding pad, a trimmer of the grinding pad and a grinding pad consumption detection device, the trimmer is in contact with the grinding pad; the grinding pad consumption detection device includes an eddy current sensor, a frequency detection module and a consumption determination module, the eddy current sensor is detachably arranged on the trimmer, one end of the frequency detection module is electrically connected with the eddy current sensor, and the other end of the frequency detection module is electrically connected with the consumption determination module; the frequency detection module is used for detecting the frequency data corresponding to the eddy current sensor under the condition that the eddy current sensor is close to the grinding pad along with the trimmer, and the frequency data is sent to the consumption determination module, and the consumption determination module is used for determining the consumption data of the grinding pad based on the frequency data. Thus, in the grinding process, the eddy current sensor is close to the grinding pad along with the trimmer, the frequency data corresponding to the eddy current sensor changes, the corresponding frequency data is collected through the frequency detection module, and the consumption data of the grinding pad is determined based on the frequency data through the consumption determination module, so that the consumption data of the grinding pad can be automatically determined, and the precision and efficiency of the consumption data determination are improved.

[0017] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory and are not restrictive of the disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0018] The drawings incorporated by reference in the specification and forming a part thereof illustrate embodiments consistent with the present utility model disclosure and together with the description serve to explain the principles of the present utility model disclosure, and do not constitute an undue limitation on the present utility model disclosure.

[0019] Figure 1 It is a structure schematic view of a grinding device provided by the utility model embodiment;

[0020] Figure 2 It is a schematic view of a grinding pad provided by the utility model embodiment;

[0021] Figure 3 It is a principle schematic view of a grinding pad consumption detection device provided by the utility model embodiment;

[0022] Figure 4 It is a structure schematic view of an eddy current sensor provided by the utility model embodiment;

[0023] Figure 5 It is a structure schematic view of a grinding pad consumption detection device provided by the utility model embodiment;

[0024] Figure 6 It is a structure schematic view of another grinding pad consumption detection device provided by the utility model embodiment;

[0025] In the figure, the reference signs correspond to: 1-grinding pad; 11-groove structure; 2-trimmer; 21-moving structure; 22-trimming head; 3-eddy current sensor; 31-eddy current coil; 32-housing; 33-thread structure; 4-bearing structure; 5-rubber layer; 110-frequency detection module; 120-consumption determination module; 130-resonance module; 140-oscillator; 150-signal amplification module; 160-noise reduction module; 170-prompting module. DETAILED DESCRIPTION

[0026] In order to make the ordinary people in the art better understand the technical solutions disclosed by the utility model, the technical solutions in the utility model disclosed embodiments will be described clearly and completely below in conjunction with the drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skilled in the art without making creative efforts belong to the scope of protection of the utility model.

[0027] It should be noted that the terms "first", "second" and the like in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that the data used in this way can be exchanged under appropriate circumstances, so that the embodiments of the utility model described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, device, product or equipment including a series of steps or units does not have to be limited to the clearly listed steps or units, but can include other steps or units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0028] In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer and more apparent, the embodiments of the utility model will be further described in detail below in conjunction with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the embodiments of the utility model, and are not used to limit the embodiments of the utility model.

[0029] Chemical mechanical polishing device usually includes a polishing pad for polishing a wafer, the groove structure on which can store large polishing slurry and ensure the fluidity of the slurry, so that the polishing slurry can be evenly distributed on the polishing pad, but the by-product generated by polishing the wafer film will block the groove structure of the polishing pad, so that the slurry flow is difficult and unevenly distributed, which leads to inconsistent wafer polishing rate in different areas of the polishing pad, poor planarization effect, and ultimately affects the overall yield. At present, the polisher of the polishing pad is continuously trimmed to remove the polishing by-product and ensure that the polishing pad has a good groove structure, so that the polishing pad continuously exposes a fresh surface, but this will cause the groove depth of the polishing pad to continuously decrease, the storage amount and fluidity of the polishing slurry to become poor, and the mechanical properties of the polishing pad to continuously weaken, and ultimately the polishing effect becomes worse and worse. Therefore, in order to ensure the polishing effect, it is necessary to know the consumption of the polishing pad in time.

[0030] Based on this, the application provides a kind of for polishing device, in the polishing device, vortex sensor is provided on the polisher of polishing pad, and frequency detection module is respectively connected with vortex sensor, consumption determination module, so that in the process of polishing, vortex sensor is close to polishing pad with polisher, corresponding frequency data is collected by frequency detection module, consumption data of polishing pad is determined based on frequency data by consumption determination module, so that the consumption data of polishing pad can be determined automatically, and the precision and efficiency of consumption data determination are improved.

[0031] The technical scheme in the embodiments of the present application will be described below with reference to the drawings.

[0032] Please refer to Figures 1-6 The polishing device provided in the embodiments of the present application comprises a polishing pad 1, a polisher 2 of the polishing pad 1 and a polishing pad consumption detection device, the polisher 2 is in contact with the polishing pad 1; the polishing pad consumption detection device comprises a vortex sensor 3, a frequency detection module 110 and a consumption determination module 120, the vortex sensor 3 is detachably arranged on the polisher 2, one end of the frequency detection module 110 is electrically connected with the vortex sensor 3, and the other end of the frequency detection module 110 is electrically connected with the consumption determination module 120; the frequency detection module 110 is used for detecting the frequency data corresponding to the vortex sensor 3 when the vortex sensor 3 is close to the polishing pad 1 with the polisher 2, and sending the frequency data to the consumption determination module 120, and the consumption determination module 120 is used for determining the consumption data of the polishing pad 1 based on the frequency data.

[0033] In one specific embodiment, as Figure 2As shown, the grinding pad 1 is provided with a groove structure 11 for storing grinding slurry as an abrasive to grind the surface of the object to be ground. In actual application, the grinding process mainly depends on the surface condition of the grinding pad 1, and the surface of the grinding pad 1 will be filled with grinding debris when grinding the object to be ground, which means that the surface of the grinding pad 1 is not rough and it is difficult to continue grinding, and it can also cause fine scratches on the surface of the object to be ground. The dresser 2 can be used to dress the grinding pad 1 to continuously expose the new groove surface of the grinding pad 1, while also causing the grinding pad 1 to be consumed, the thickness of the grinding pad 1 becomes thinner, the groove depth decreases, and the grinding effect is affected. The consumption of the grinding pad 1 can be detected by the eddy current sensor 3 so as to timely understand the consumption and replace the new grinding pad 1.

[0034] In one embodiment, the consumption data of the grinding pad 1 can be the thickness reduction amount of the grinding pad 1 within a preset time period, the frequency data can be the corresponding resonance frequency of the eddy current sensor 3 at any time, and the frequency detection module 110 can be a digital frequency meter. The preset time period can be set according to the actual application requirements, for example, it can be the time period between any historical time (such as the time one hour ago) and the current time.

[0035] In the embodiment of the present application, the eddy current sensor 3 is a sensor made according to the eddy current effect, and the working frequency of the eddy current sensor 3 can be 1 MHz to 100 MHz. As shown in the figure, Figure 3 When the sensor is connected with current, the current signal is sent to the sensor head through the cable, and an alternating magnetic field is generated around the head. When a metal conductor material approaches the sensor head, the alternating magnetic field will generate an eddy current field on the surface of the conductor, and the eddy current field will also generate an alternating magnetic field opposite to the above-mentioned magnetic field. After the grinding pad 1 is dressed by the dresser 2, the longitudinal distance between the grinding pad 1 and the eddy current sensor 3 becomes shorter, the equivalent inductance corresponding to the eddy current sensor 3 increases, and the resonance frequency changes. The frequency detection module 110 detects the resonance frequencies at different times and sends them to the consumption determination module 120, and then the consumption determination module 120 determines the consumption data of the grinding pad 1 within a certain time period based on the frequency data at different times. Specifically, the consumption determination module 120 determines the above-mentioned longitudinal distance corresponding to different times based on the frequency data at different times, and determines the difference between the longitudinal distances as the consumption data of the grinding pad 1 within the corresponding time period. In the embodiment of the present application, the detection accuracy of the consumption data of the grinding pad 1 can be 0.1 mil to 30 mil.

[0036] Specifically, the eddy current sensor 3 can be installed on the dresser 2 through a fastener, or directly connected to the dresser 2 through the threaded structure 33 on the shell 32 of the eddy current sensor 3. Specifically, the fastener includes but is not limited to a screw. Specifically, as shown in the figure, Figure 4As shown, the eddy current sensor 3 comprises an eddy current coil 31 which can be fixedly arranged in a shell 32 of the eddy current sensor 3 and arranged at one end of the shell 32, and the threaded structure 33 is arranged at the other end of the shell 32.

[0037] Specifically, the grinding device further comprises a grinding structure (not shown) which adsorbs a wafer to be ground (not shown) and places the wafer to be ground on the grinding pad 1. Specifically, the wafer to be ground is clamped by the grinding structure, and then a downward pressure is applied to the grinding structure, so that the wafer to be ground is pressed on the grinding pad 1, and the grinding pad 1 is supplied with a grinding slurry. The grinding structure and the grinding pad 1 are both rotated, the grinding slurry flows between the wafer to be ground and the grinding pad 1, and the wafer is planarized under the combined action of chemical corrosion and mechanical grinding. Optionally, the grinding device further comprises a driving mechanism (not shown) for driving the grinding structure to rotate.

[0038] In one specific embodiment, as shown in Figure 1 The grinding device further comprises a bearing mechanism having a magnetic coating on the bearing mechanism, and the grinding pad 1 is detachably arranged on the bearing mechanism. Specifically, the grinding pad 1 has a size close to the circumference of the bearing mechanism. Optionally, a glue layer 5 can be arranged between the grinding pad 1 and the bearing mechanism, and the bottom surface of the grinding pad 1 is adhered to the bearing mechanism through the glue layer 5.

[0039] In actual application, during the grinding process, after the eddy current sensor 3 is supplied with working current, a high-frequency alternating magnetic field is generated. Due to the skin effect, the magnetic coating on the surface of the bearing structure 4 generates a reverse impedance to hinder the change of its own magnetic flux, so that the equivalent inductance of the eddy current sensor 3 increases, and the corresponding resonant frequency of the eddy current sensor 3 changes.

[0040] Optionally, as shown in Figures 5-6 The eddy current sensor 3 comprises a resonant module 130 which is electrically connected with the frequency detection module 110, and the frequency detection module 110 is used for detecting the frequency data of the resonant module 130. Specifically, the resonant module 130 comprises the eddy current coil 31, a capacitor C and a resistor R connected in series.

[0041] In one specific embodiment, after the eddy current sensor 3 is supplied with working current, a high-frequency alternating magnetic field is generated, and the magnetic coating on the surface of the bearing structure 4 generates a reverse impedance to hinder the change of its own magnetic flux. After the grinding pad 1 is trimmed by the trimmer 2, the longitudinal distance between the bearing structure 4 and the eddy current sensor 3 becomes shorter, the equivalent inductance of the eddy current coil 31 increases, and through the series capacitor C, the resonant frequency of the resonant module 130 changes.

[0042] Specifically, when affected by the eddy current, the equivalent inductance L of the eddy current sensor 3 is related to multiple parameters such as the distance x (i.e. the above-mentioned longitudinal distance) between the eddy current sensor 3 and the metal conductor. If only one parameter is changed and the other parameters remain unchanged, the equivalent inductance L of the sensor is only related to the parameter. In actual application, the distance x between the sensor and the conductor is usually changed, and the other parameters remain unchanged, that is, the equivalent inductance L becomes a single-valued function of the distance x. Further, according to the relationship between the resonant frequency and the equivalent inductance, the relationship between the resonant frequency f and the above-mentioned longitudinal distance x is: wherein C represents the capacitance.

[0043] Specifically, the frequency detection module 110 detects the resonant frequencies corresponding to the current time and the historical time respectively, and then calculates the distances corresponding to the current time and the historical time respectively according to the above formula. The difference between the distances is determined as the consumption data of the polishing pad 1 from the historical time to the current time.

[0044] Optionally, as shown in Figures 5-6 the eddy current sensor 3 further comprises an oscillator 140, the oscillator 140 is electrically connected with the resonance module 130, and the oscillator 140 is used to provide a high-frequency signal to the resonance module 130. Specifically, the oscillator 140 module outputs a high-frequency alternating current signal to the eddy current coil 31, so that the voltage input by the power supply end is applied to the eddy current coil 31 according to the frequency and duty cycle of the above-mentioned high-frequency alternating current signal, so that the eddy current coil 31 generates a high-frequency alternating magnetic field.

[0045] Optionally, as shown in Figure 6 the polishing pad consumption detection device further comprises a signal amplification module 150, one end of the signal amplification module 150 is electrically connected with the resonance module 130, and the other end of the signal amplification module 150 is electrically connected with the frequency detection module 110. Specifically, the signal amplification module 150 is used to amplify the signal input by the resonance module 130 to the frequency detection module 110, so that the frequency detection module 110 can more easily detect the resonant frequency and the detection is more accurate. The signal amplification module 150 comprises an operational amplifier. Optionally, one end of the oscillator 140 can be electrically connected with the resonance module 130, and the other end can be electrically connected with the signal amplification module 150.

[0046] Optionally, as shown in Figure 6 the polishing pad consumption detection device further comprises a noise reduction module 160, one end of the noise reduction module 160 is electrically connected with the resonance module 130, and the other end of the noise reduction module 160 is electrically connected with the frequency detection module 110. Specifically, the noise reduction module 160 is used to reduce or eliminate the noise of the signal input by the resonance module 130 to the frequency detection module 110, so that the resonant frequency detected by the frequency detection module 110 is more accurate, for example, the noise signal can be filtered out by filtering.

[0047] Optionally, an input end of the noise reduction module 160 is electrically connected with the resonance module 130, an output end of the noise reduction module 160 is electrically connected with an input end of the signal amplification module 150, and an output end of the signal amplification module 150 is electrically connected with the frequency detection module 110. The signal output by the resonance module 130 can contain useless noise signals. Before the signal is input into the signal amplification module 150 for amplification, the noise signals possibly existing are filtered out by the noise reduction module 160, so that the interference in the signal can be reduced and the measurement accuracy can be improved. Optionally, one end of the oscillator 140 can be electrically connected with the resonance module 130, and the other end can be electrically connected with the noise reduction module 160.

[0048] Optionally, as shown in Figure 6 The polishing pad consumption detection device further includes a prompt module 170, the prompt module 170 is electrically connected with the consumption determination module 120, and the prompt module 170 is used for alarming and prompting in the case that the consumption data is greater than or equal to a preset threshold. Specifically, the consumption data of the polishing pad 1 calculated by the consumption determination module 120 is sent to the prompt module 170, the prompt module 170 can alarm and prompt when the consumption of the polishing pad 1 is large, so as to replace the polishing pad 1 in time. The above-mentioned preset threshold can be set according to actual application requirements.

[0049] Optionally, as shown in Figure 1 The trimmer 2 includes a moving structure 21 and a trimming head 22. The moving structure 21 is arranged above the polishing pad 1, the eddy current sensor 3 is detachably arranged on the moving structure 21 and faces the polishing pad 1, the trimming head 22 is in contact with the polishing pad 1, and the moving structure 21 and the trimming head 22 are rotationally connected. Specifically, the moving structure 21 drives the circumferential movement of the trimmer 2 and applies axial pressure to the trimmer 2. Optionally, the trimmer 2 can further include a driving mechanism (not shown) for driving the trimming head 22 to move and rotate.

[0050] Optionally, the polishing device further includes a control mechanism (not shown), which is electrically connected with the eddy current sensor 3, the frequency detection module 110, the consumption determination module 120, the signal amplification module 150, the noise reduction module 160, the prompt module 170 and the above-mentioned driving mechanism, so as to control the wafer polishing process and the consumption detection of the polishing pad 1.

[0051] In a specific embodiment, the wafer to be polished is clamped by a polishing structure, then a downward pressure is applied to the polishing structure so that the wafer to be polished is pressed on the polishing pad 1, the polishing pad 1 is supplied with polishing slurry, the polishing structure and the polishing pad 1 are rotated, and the polishing slurry flows between the wafer to be polished and the polishing pad 1. During the polishing of the wafer to be polished, the trimmer 2 contacts the polishing pad 1 and constantly trims the polishing pad 1, and the polishing pad 1 is continuously consumed, that is, the distance between the eddy current sensor 3 provided on the trimmer 2 and the polishing pad 1 is reduced. The bearing structure 4 of the polishing pad 1 is provided with a magnetic coating, and the eddy current sensor 3 generates a high-frequency alternating magnetic field after passing through a working current. The surface magnetic coating of the bearing structure 4 generates a reverse impedance to hinder the change of its own magnetic flux. As the above distance is reduced, the equivalent inductance of the coil in the eddy current sensor 3 increases, and the resonant frequency of the resonant module 130 changes through the series capacitor C. Further, the resonant frequencies corresponding to the current time and the historical time are detected by the frequency detection module 110, and then the distances corresponding to the current time and the historical time are calculated by the consumption determination module 120 according to the resonant frequencies, and the difference between the distances is determined as the consumption data of the polishing pad 1 from the historical time to the current time.

[0052] The specific embodiments of the utility model are introduced based on the above technical solutions.

[0053] Embodiment 1

[0054] Please refer to Figures 1-5 , embodiment 1 provides a kind of polishing device, the polishing device includes polishing pad 1, the trimmer 2 of polishing pad 1 and polishing pad consumption detection device, trimmer 2 is contacted with polishing pad 1;Polishing pad consumption detection device includes eddy current sensor 3, frequency detection module 110 and consumption determination module 120, eddy current sensor 3 can be detachably arranged on trimmer 2, one end of frequency detection module 110 is electrically connected with eddy current sensor 3, the other end of frequency detection module 110 is electrically connected with consumption determination module 120;Frequency detection module 110 is used to detect the frequency data corresponding to eddy current sensor 3 when eddy current sensor 3 is close to polishing pad 1 with trimmer 2, and sends to consumption determination module 120, consumption determination module 120 is used to determine the consumption data of polishing pad 1 based on frequency data.

[0055] In a specific embodiment, as Figure 2 Indicated, polishing pad 1 is provided with groove structure 11, and the groove structure 11 is used to store polishing slurry, and the slurry is used as polishing agent to polish the surface of the object to be polished.

[0056] In the embodiments of the present application, the eddy current sensor 3 is a sensor made according to the eddy current effect, and the working frequency of the eddy current sensor 3 can be 1MHz-100MHz. As Figure 3As shown, when the sensor is supplied with current, a current signal is sent to the sensor head through the cable, and an alternating magnetic field is generated around the head. When a metal conductor material is close to the sensor head, the alternating magnetic field will generate an electric eddy current field on the surface of the conductor, and the electric eddy current field will also generate an alternating magnetic field in the opposite direction of the above-mentioned magnetic field. After the polishing pad 1 is trimmed by the trimmer 2, the longitudinal distance between the polishing pad 1 and the eddy current sensor 3 becomes smaller, the corresponding equivalent inductance of the eddy current sensor 3 increases, so that the resonant frequency changes. The frequency detection module 110 detects the resonant frequencies at different times and sends them to the consumption determination module 120. Then, the consumption determination module 120 determines the consumption data of the polishing pad 1 within a certain time period based on the frequency data at different times. Specifically, the consumption determination module 120 determines the above-mentioned longitudinal distance corresponding to different times based on the frequency data at different times, and determines the difference between the longitudinal distances as the consumption data of the polishing pad 1 within the corresponding time period. In the embodiment of the application, the detection accuracy of the consumption data of the polishing pad 1 can be 0.1mil-30mil.

[0057] Specifically, the eddy current sensor 3 can be installed on the trimmer 2 through a fastener, or can be directly connected to the trimmer 2 through a threaded structure 33 on the shell 32 of the eddy current sensor 3. Specifically, the fastener includes but is not limited to a screw. Figure 4 As shown, the eddy current sensor 3 includes an eddy current coil 31, which can be fixedly arranged in the shell 32 of the eddy current sensor 3 and arranged at one end of the shell 32. The threaded structure 33 is arranged at the other end of the shell 32.

[0058] Specifically, the polishing device further includes a polishing structure, which adsorbs a wafer to be polished and places it on the polishing pad 1. Specifically, the wafer to be polished is clamped by the polishing structure, and then a downward pressure is applied to the polishing structure, so that the wafer to be polished is pressed on the polishing pad 1, and polishing slurry is supplied to the polishing pad 1. The polishing structure and the polishing pad 1 are rotated, and the polishing slurry flows between the wafer to be polished and the polishing pad 1, so that the wafer is planarized under the combined action of chemical corrosion and mechanical grinding. Optionally, the polishing device further includes a driving mechanism (not shown) for driving the polishing structure to rotate.

[0059] In one specific embodiment, as shown in Figure 1 The polishing device further includes a bearing mechanism having a magnetic coating on the bearing mechanism, and the polishing pad 1 is detachably arranged on the bearing mechanism. Specifically, the bottom surface of the polishing pad 1 is adhered to the bearing mechanism, and the polishing pad 1 has a circumferential dimension close to that of the bearing mechanism.

[0060] Optionally, as shown in Figure 5As shown, the eddy current sensor 3 comprises a resonance module 130, the resonance module 130 is electrically connected with the frequency detection module 110, and the frequency detection module 110 is used for detecting frequency data of the resonance module 130. Specifically, the resonance module 130 comprises the eddy current coil 31, the capacitor C and the resistor R connected in series.

[0061] Optionally, as shown in Figure 5 As shown, the eddy current sensor 3 further comprises an oscillator 140, the oscillator 140 is electrically connected with the resonance module 130, and the oscillator 140 is used for providing a high-frequency signal to the resonance module 130. Specifically, the oscillator 140 module outputs a high-frequency alternating current signal to the eddy current coil 31, so that the voltage input from the power supply end is applied to the eddy current coil 31 according to the frequency and duty cycle of the high-frequency alternating current signal, so that the eddy current coil 31 generates a high-frequency alternating magnetic field.

[0062] Optionally, as shown in Figure 1 As shown, the dresser 2 comprises a moving structure 21 and a dresser head 22, the moving structure 21 is arranged above the polishing pad 1, the eddy current sensor 3 is detachably arranged on the moving structure 21 and faces the polishing pad 1, the dresser head 22 is in contact with the polishing pad 1, and the moving structure 21 and the dresser head 22 are rotationally connected. Specifically, the moving structure 21 drives the circumferential movement of the dresser 2 and applies an axial pressure to the dresser 2. Optionally, the dresser 2 can further comprise a driving mechanism (not shown) for driving the movement and rotation of the dresser head 22.

[0063] Optionally, the polishing device further comprises a control mechanism (not shown), the control mechanism is electrically connected with the eddy current sensor 3, the frequency detection module 110, the consumption determination module 120 and the above-mentioned driving mechanism respectively, so as to control the wafer polishing process and the consumption detection of the polishing pad 1.

[0064] Embodiment 2

[0065] Embodiment 2 and embodiment 1 are different in the setting of the polishing pad consumption detection device, and the same parts as embodiment 1 will not be repeated here. Now the differences between embodiment 2 and embodiment 1 will be described as follows:

[0066] As shown in Figure 6 The polishing pad consumption detection device further comprises a signal amplification module 150, one end of the signal amplification module 150 is electrically connected with the resonance module 130, and the other end of the signal amplification module 150 is electrically connected with the frequency detection module 110. Specifically, the signal amplification module 150 is used for amplifying the signal input from the resonance module 130 to the frequency detection module 110, so that the frequency detection module 110 can more easily detect the resonance frequency and the detection is more accurate.

[0067] Optionally, the grinding pad consumption detection device further comprises a noise reduction module 160, one end of the noise reduction module 160 is electrically connected with the resonance module 130, and the other end of the noise reduction module 160 is electrically connected with the frequency detection module 110. Specifically, the noise reduction module 160 is used for reducing or removing noise of the signal input by the resonance module 130 to the frequency detection module 110, so that the resonance frequency detected by the frequency detection module 110 is more accurate, for example, the noise signal can be filtered out by filtering.

[0068] Optionally, the grinding pad consumption detection device further comprises a prompt module 170, the prompt module 170 is electrically connected with the consumption determination module 120, and the prompt module 170 is used for alarming when the consumption data is greater than or equal to a preset threshold. Specifically, the consumption determination module 120 sends the consumption data of the grinding pad 1 to the prompt module 170 after calculation, and the prompt module 170 can alarm when the consumption of the grinding pad 1 is large, so as to replace the grinding pad 1 in time.

[0069] Through the above embodiment of the utility model, the grinding device comprises a grinding pad, a dresser of the grinding pad and a grinding pad consumption detection device, the dresser is in contact with the grinding pad; the grinding pad consumption detection device comprises an eddy current sensor, a frequency detection module and a consumption determination module, the eddy current sensor is detachably arranged on the dresser, one end of the frequency detection module is electrically connected with the eddy current sensor, and the other end of the frequency detection module is electrically connected with the consumption determination module; the frequency detection module is used for detecting the frequency data corresponding to the eddy current sensor and sending to the consumption determination module when the eddy current sensor approaches the grinding pad with the dresser, and the consumption determination module is used for determining the consumption data of the grinding pad based on the frequency data. Thus, in the grinding process, the eddy current sensor approaches the grinding pad with the dresser, the frequency data corresponding to the eddy current sensor changes, the corresponding frequency data is collected through the frequency detection module, and the consumption data of the grinding pad is determined based on the frequency data through the consumption determination module, so that the consumption data of the grinding pad can be automatically determined, and the accuracy and efficiency of the consumption data determination are improved.

[0070] Other embodiments of the utility model disclosed herein will be apparent to those skilled in the art from consideration of the specification and practice of the utility model disclosed herein. The utility model is intended to cover any variations, uses or adaptations of the utility model disclosed herein that follow, in general, the principles of the utility model disclosed herein and include any presently known or later-discovered equivalents of the methods and techniques disclosed herein. The specification and examples are to be regarded as exemplary only, and the true scope and spirit of the utility model disclosed herein are indicated by the following claims.

[0071] It should be understood that the present disclosure is not limited to the precise construction that has been described above and shown in the accompanying drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A grinding device, characterized by, The grinding device comprises a grinding pad (1), a trimmer (2) of the grinding pad (1) and a grinding pad consumption detection device, the trimmer (2) is in contact with the grinding pad (1); the grinding pad consumption detection device comprises an eddy current sensor (3), a frequency detection module (110) and a consumption determination module (120), the eddy current sensor (3) is detachably arranged on the trimmer (2), one end of the frequency detection module (110) is electrically connected with the eddy current sensor (3), and the other end of the frequency detection module (110) is electrically connected with the consumption determination module (120); The frequency detection module (110) is used for detecting frequency data corresponding to the eddy current sensor (3) when the eddy current sensor (3) approaches the grinding pad (1) along with the trimmer (2), and the frequency data is sent to the consumption determination module (120), and the consumption determination module (120) is used for determining consumption data of the grinding pad (1) based on the frequency data.

2. The polishing apparatus according to claim 1, wherein The grinding device further comprises a bearing mechanism (4), the bearing mechanism (4) has a magnetic coating, and the grinding pad (1) is detachably arranged on the bearing mechanism (4).

3. The polishing apparatus according to claim 1, wherein The eddy current sensor (3) comprises a resonance module (130), the resonance module (130) is electrically connected with the frequency detection module (110), and the frequency detection module (110) is used for detecting frequency data of the resonance module.

4. The abrading device of claim 3, wherein, The eddy current sensor (3) further comprises an oscillator (140), the oscillator (140) is electrically connected with the resonance module (130), and the oscillator (140) is used for providing a high-frequency signal to the resonance module (130).

5. The abrading device of claim 3, wherein, The grinding pad consumption detection device further comprises a signal amplification module (150), one end of the signal amplification module (150) is electrically connected with the resonance module (130), and the other end of the signal amplification module (150) is electrically connected with the frequency detection module (110).

6. The abrading device of claim 3, wherein, The grinding pad consumption detection device further comprises a noise reduction module (160), one end of the noise reduction module (160) is electrically connected with the resonance module (130), and the other end of the noise reduction module (160) is electrically connected with the frequency detection module (110).

7. The abrading device of claim 3, wherein, The resonance module (130) comprises an eddy current coil (31), a capacitor (C) and a resistor (R) connected in series.

8. The abrading device of claim 1, wherein, The trimmer (2) comprises a moving structure (21) and a trimming head (22), the moving structure (21) is arranged above the grinding pad (1), the eddy current sensor (3) is detachably arranged on the moving structure (21) and faces the grinding pad (1), the trimming head (22) is in contact with the grinding pad (1), and the moving structure (21) and the trimming head (22) are rotationally connected.

9. The abrading device of claim 1, wherein, The grinding pad consumption detection device further comprises a prompt module (170), the prompt module (170) is electrically connected with the consumption determination module (120), and the prompt module (170) is used for alarming and prompting when the consumption data is greater than or equal to a preset threshold.

10. The abrading device of claim 1, wherein, The polishing apparatus further comprises a polishing structure which adsorbs a wafer to be polished and is placed on the polishing pad (1).

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