Split type chopper polishing and fixing device

Abstract

The utility model discloses a split type chopper polishing and fixing device, and belongs to the technical field of aluminum wire bonding. The split type chopper polishing and fixing device comprises a mounting base, a clamping jig and a lower pressing die. The mounting base is provided with a first fluid channel and a first embedding groove, the first fluid channel is used for allowing a polishing medium to circulate between the two opposite end faces of the mounting base, and the first embedding groove communicates with the first fluid channel; the clamping jig can be embedded in the first embedding groove, the clamping jig is provided with a second embedding groove for embedding the chopper, and the chopper in the second embedding groove can extend into the first fluid channel to be polished; and the lower pressing die is used for pressing the chopper in the second embedding groove, a second fluid channel is formed in the lower pressing die, and when the lower pressing die presses the chopper in the second embedding groove, the second fluid channel is used for allowing the polishing medium to pass through so as to enter and exit the first fluid channel. The split type chopper polishing and fixing device has the advantage of improving the clamping efficiency of the chopper.

Description

TECHNICAL FIELD

[0001] The utility model relates to aluminum wire bonding technical field especially relates to a split type cleaver polishing fixing device. BACKGROUND

[0002] Coarse wire cleaver is often used in aluminum / copper wire bonding process in microelectronic packaging, its principle is that aluminum wire is fixed on the substrate through cleaver, and ultrasonic energy is transmitted, so that metallurgical bonding is formed between bonded aluminum wire and pad, thereby realizing close connection of lead wire and substrate pad. Coarse wire cleaver is restricted by electrical processing preparation process, the roughness Sa of V-groove part of tool bit is generally as high as 300-500nm, and too high roughness may cause problems such as cleaver sticking, bonded wire scratching, uneven ultrasonic energy transmission and poor weld appearance, which cannot meet the standard of semiconductor packaging.

[0003] The patent with publication number CN204935404U discloses a kind of abrasive grain fluid polishing machine, by using the above-mentioned fluid polishing machine to the tool bit of cleaver is polished, and the roughness Sa of tool bit can be reduced to within 100nm after polishing. However, in the prior art, two movable clamps are usually added to the fluid polishing machine to fix the cleaver, and the clamps need to be moved every time the cleaver is clamped or removed. The above-mentioned cleaver fixing method is complicated to operate, which is not conducive to improving the clamping efficiency. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of split type cleaver polishing fixing device, with the advantage of improving cleaver clamping efficiency.

[0005] In the first aspect, the utility model provides a kind of split type cleaver polishing fixing device, comprising:

[0006] The mounting base is provided with a first fluid channel and a first embedding slot, the first fluid channel is used for the polishing medium to flow between the opposite two end faces of the mounting base, and the first embedding slot is communicated with the first fluid channel;

[0007] The clamping jig can be embedded in the first embedding slot, the clamping jig is provided with a second embedding slot for embedding the cleaver, and the cleaver in the second embedding slot can be inserted into the first fluid channel for polishing;

[0008] The lower pressing die is used for pressing the cleaver in the second embedding slot, and the lower pressing die is provided with a second fluid channel, when the lower pressing die presses the cleaver in the second embedding slot, the second fluid channel is used for the polishing medium to pass in and out of the first fluid channel.

[0009] The split type split blade polishing fixing device provided by the utility model, comprising an installation base, a clamping jig and a pressing die, a first embedding groove is arranged on the installation base, the clamping jig can be embedded in the first embedding groove, the split blade can be embedded in the second embedding groove of the clamping jig, and the pressing die is used for pressing the split blade in the second embedding groove. The split type assembly structure simplifies the clamping process of the split blade, when the fluid polishing machine polishes the blade head of the first batch of split blades, the second batch of split blades can be clamped on the separate clamping jig first, after the first batch of split blades are polished, the clamping jig with the second batch of split blades only needs to be put into the first embedding groove, so that the polishing and fixing of the second batch of split blades can be quickly completed, the quick rotation clamping of the split blade is realized, and the clamping efficiency of the split blade is improved.

[0010] Further, the installation base is provided with at least two first embedding grooves, each first embedding groove is respectively provided with a corresponding first fluid channel, and the first fluid channel can polish the polishing medium transported to the split blade in the first embedding groove.

[0011] By arranging at least two first embedding grooves and respective corresponding first fluid channels, the plurality of split blades can be polished simultaneously, the problem that the traditional split blade polishing device can only polish one split blade is solved, and the polishing efficiency is greatly improved. Meanwhile, the split blade in each first embedding groove operates in an independent first fluid channel, ensuring that the polishing medium of each split blade can fully act on the polishing part of the split blade, improving the uniformity and quality of polishing.

[0012] Further, the first embedding grooves are divided into two groups, and the two groups of first embedding grooves are respectively arranged on opposite sides of the installation base, and each group of first embedding grooves comprises at least one first embedding groove.

[0013] By arranging the two groups of first embedding grooves on opposite sides of the installation base, the number of first embedding grooves in each group is multiple and distributed on the installation base. Through this arrangement, the number of clamped split blades can be increased, thereby improving the working efficiency of the polishing fixing device.

[0014] Further, the number of second fluid channels is one, and the second fluid channel can simultaneously communicate with a plurality of first fluid channels.

[0015] By using one second fluid channel to serve multiple first fluid channels simultaneously, the medium transportation problem when multiple split blades are polished simultaneously is solved. Through this design, the uniform distribution of polishing medium between multiple polishing areas can be ensured, and the consistency and efficiency of polishing effect are improved. This structure reduces the complexity of setting multiple fluid channels, and reduces the production cost and maintenance difficulty.

[0016] Further, the clamping jig is provided with a plurality of second embedding grooves, and the plurality of second embedding grooves are arranged on the clamping jig along the length direction of the first fluid channel.

[0017] By adopting the above technical scheme, a plurality of cleavers can be fixed on one clamping jig, and the plurality of cleavers can simultaneously contact the polishing medium in the first fluid channel, so that the plurality of cleavers can be polished at the same time. This arrangement not only significantly improves the overall efficiency of polishing, but also ensures that the polishing medium can fully and uniformly cover each cleaver, thereby improving the polishing effect.

[0018] Further, the second embedding groove is a circular groove, the diameter of the second embedding groove is D1, and the distance between the centers of adjacent two second embedding grooves is H1, and H1≥1.6*D1.

[0019] By adopting the above technical scheme, by designing the second embedding groove as a circular groove and stipulating that the distance between the centers of adjacent two second embedding grooves is not less than 1.6 times the groove diameter, the interference between adjacent cleavers is effectively avoided, thereby improving the polishing precision and effect.

[0020] Further, the thickness of the clamping jig is H2, the second embedding groove is a circular groove, the distance from the center of the circular groove to the end surface of the clamping jig is H3, and the diameter of the second embedding groove is D1, wherein H2≥1.5*D1 and H3≤D1 / 3.

[0021] Further, the thickness of the lower pressing die is H4, wherein 5mm≤H4≤10mm.

[0022] Further, the flow area of the second fluid channel is S1, and the outer contour area of the lower pressing die is S2, wherein S2 / 4≤S1≤S2 / 2.

[0023] By adopting the above technical scheme, by designing the area ratio, the flow of the polishing medium in the device can be optimized, and the polishing efficiency and effect can be improved. Specifically, such a proportional control helps to manage the flow rate and flow of the polishing medium, so that the polishing medium can fully contact the surface of the cleaver, thereby achieving more uniform and efficient polishing effect.

[0024] Further, the length of the first fluid channel is L1, and the length of the clamping jig is L2, wherein L2≤L1≤1.5*L2.

[0025] By adopting the above technical scheme, by stipulating the length ratio of the first fluid channel and the clamping jig, it is ensured that the clamping jig can be completely accommodated in the first fluid channel and effectively contacted, and it is ensured that the polishing medium can uniformly act on the cleaver when flowing.

[0026] From the above, the split type cleaver polishing fixing device provided by the utility model, including installation base, clamping fixture and lower pressing die, through setting first embedding groove on installation base, clamping fixture can be embedded in first embedding groove, cleaver can be embedded in second embedding groove of clamping fixture, and lower pressing die is used for pressing cleaver in second embedding groove. This split type assembly structure simplifies the clamping process of cleaver, when the fluid polishing machine polishes the cutter head of the first batch of cleavers, the second batch of cleavers can be clamped on the separate clamping fixture first, after the first batch of cleavers are polished, only need to put the clamping fixture with the second batch of cleavers into the first embedding groove, and the polishing and fixing of the second batch of cleavers can be quickly completed, realizing the quick rotation clamping of cleavers and having the advantage of improving the clamping efficiency of cleavers.

[0027] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent from the description, or can be learned by practice of the present application. The objects and other advantages of the present application will be realized and attained by the structure particularly pointed out in the written description and the appended drawings. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 It is an exploded schematic view of the split type cleaver polishing fixing device.

[0029] Figure 2 It is a schematic view of the cleaver structure fixed by the split type cleaver polishing fixing device.

[0030] Figure 3 It is Figure 1 It is an assembly structure schematic view of the split type cleaver polishing fixing device.

[0031] Figure 4 It is Figure 1 It is a structure schematic view of another embodiment of the installation base.

[0032] In the drawings: 100, installation base; 110, first fluid channel; 120, first embedding groove; 200, clamping fixture; 210, second embedding groove; 300, lower pressing die; 310, second fluid channel. DETAILED DESCRIPTION

[0033] The embodiments of the present application will be described in detail below, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0034] The following disclosure provides many different embodiments, or examples, for implementing different structures of the present application. For the purpose of simplifying the present application, the components and arrangements of specific examples are described in the following. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can refer to the same reference numerals and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, and does not indicate the relationship between the various embodiments and / or arrangements discussed.

[0035] In the field of modern microelectronic packaging, a thick wire wedge knife is a key tool for aluminum / copper wire bonding process. This tool realizes the close connection of the lead and the substrate pad by fixing the aluminum wire on the substrate and transmitting ultrasonic energy. However, due to the limitation of electrochemical machining process, the roughness of the V-groove part of the wedge knife head is usually high, up to 300-500 nm. This high roughness can cause a variety of problems, such as wedge knife wire sticking, bonded wire scratching, uneven ultrasonic energy transmission, and poor solder joint appearance, etc., which is difficult to meet the strict standards of semiconductor packaging.

[0036] To solve this problem, the industry uses a fluid polisher to reduce the roughness of the wedge knife head to within 100 nm. However, the existing polishing equipment still has some deficiencies in use. For example, every time the wedge knife is clamped or removed, the clamping plate needs to be moved, which not only is cumbersome, but also greatly reduces the clamping efficiency, affecting the overall production efficiency.

[0037] The utility model discloses a split wedge polishing fixing device, which aims to solve the above problems.

[0038] Reference is made to the accompanying drawings Figure 1 , the accompanying drawings Figure 2 , the accompanying drawings Figure 3 In one embodiment, the split wedge polishing fixing device includes a mounting base 100, a clamping jig 200, and a pressing die 300. The mounting base 100 is provided with a first fluid channel 110 and a first embedding groove 120. The first fluid channel 110 is used for the flow of polishing medium between the opposite end faces of the mounting base 100, and the first embedding groove 120 is in communication with the first fluid channel 110. The clamping jig 200 can be embedded in the first embedding groove 120, and the clamping jig 200 is provided with a second embedding groove 210 for embedding the wedge knife. The wedge knife in the second embedding groove 210 can be inserted into the first fluid channel 110 for polishing. The pressing die 300 is used to press the wedge knife in the second embedding groove 210, and the pressing die 300 is provided with a second fluid channel 310. When the pressing die 300 presses the wedge knife in the second embedding groove 210, the second fluid channel 310 is used for the polishing medium to pass in and out of the first fluid channel 110.

[0039] The specific mounting base 100 can be fixed on the abrasive grain fluid polisher, and the fixing mode can be welding; the fluid polisher can be a one-way fluid polisher or a bidirectional reciprocating circulation type fluid polisher.

[0040] In actual application, the working principle of the device is as follows: first, the cleaver is placed in the second embedding groove 210 of the clamping jig 200, and then the clamping jig 200 embedded with the cleaver is placed in the first embedding groove 120 of the mounting base 100. Then, the lower pressing die 300 is pressed on the cleaver, and the polishing medium is received or transported to the first fluid channel 110 through the second fluid channel 310 on the lower pressing die 300. The polishing medium flows between the first fluid channel 110 and the second fluid channel 310 to uniformly polish the cleaver. After polishing, the lower pressing die 300 is removed, and the next clamping jig 200 with a cleaver is replaced to continue polishing, and the whole process is simple and efficient.

[0041] As can be seen from the above, the split type cleaver polishing fixing device comprises a mounting base 100, a clamping jig 200 and a lower pressing die 300. The first embedding groove 120 is arranged on the mounting base 100, the clamping jig 200 can be embedded in the first embedding groove 120, the cleaver can be embedded in the second embedding groove 210 of the clamping jig 200, and the lower pressing die 300 is used for pressing the cleaver in the second embedding groove 210. The split type assembly structure simplifies the clamping process of the cleaver. When the fluid polisher polishes the first batch of cleaver heads, the second batch of cleavers can be clamped on a separate clamping jig 200. After the first batch of cleavers are polished, the clamping jig 200 with the second batch of cleavers is only needed to be placed in the first embedding groove 120 to quickly complete the polishing and fixing of the second batch of cleavers, realize the rapid rotation clamping of the cleavers, and have the advantage of improving the clamping efficiency of the cleavers.

[0042] In one of the embodiments, the mounting base 100 is provided with at least two first embedding grooves 120, and each first embedding groove 120 is respectively provided with a corresponding first fluid channel 110, and the first fluid channel 110 can respectively polish the cleavers in the first embedding grooves 120.

[0043] By adopting the above technical scheme, the at least two first embedding grooves 120 and the respective corresponding first fluid channels 110 are arranged, so that multiple cleavers can be polished at the same time, the problem that the traditional cleaver polishing device can only polish one cleaver is solved, and the polishing efficiency is greatly improved. Meanwhile, the cleavers in each first embedding groove 120 are operated in the independent first fluid channel 110, so that the polishing medium of each cleaver can fully act on the polishing part of the cleaver, and the uniformity and quality of polishing are improved.

[0044] In one of the embodiments, the number of the second fluid channels 310 is one, and the second fluid channel 310 can simultaneously communicate with multiple first fluid channels 110.

[0045] By using the above technical solution, one second fluid channel 310 simultaneously serves multiple first fluid channels 110, thereby solving the medium delivery problem when multiple split blades are polished at the same time. Through this design, the uniform distribution of polishing medium between multiple polishing areas can be ensured, and the consistency and efficiency of polishing effect can be improved. This structure reduces the complexity of setting multiple fluid channels, and reduces the production cost and maintenance difficulty.

[0046] Referring to the accompanying drawings Figure 4 In one of the embodiments, the first embedding slots 120 are divided into two groups, and the two groups of first embedding slots 120 are respectively arranged on opposite sides of the mounting base 100. Each group of first embedding slots 120 includes at least one first embedding slot 120.

[0047] By using the above technical solution, two groups of first embedding slots 120 are arranged on opposite sides of the mounting base 100, and the number of first embedding slots 210 in each group is multiple and distributed on the mounting base 100. Through this arrangement, the number of split blades clamped can be increased, thereby improving the working efficiency of the polishing fixture.

[0048] In one of the embodiments, the clamping jig 200 is provided with multiple second embedding slots 210, and the multiple second embedding slots 210 are arranged on the clamping jig 200 in the length extension direction of the first fluid channel 110.

[0049] By using the above technical solution, multiple split blades can be fixed on one clamping jig 200, and multiple split blades can simultaneously contact the polishing medium in the first fluid channel 110, thereby realizing the simultaneous polishing of multiple split blades. This arrangement not only significantly improves the overall efficiency of polishing, but also ensures that the polishing medium can fully and uniformly cover each split blade, thereby improving the polishing effect.

[0050] In one of the embodiments, the second embedding slot 210 is a circular slot, the diameter of the second embedding slot 210 is D1, and the center distance between adjacent two second embedding slots 210 is H1, H1≥1.6*D1.

[0051] By using the above technical solution, the second embedding slot 210 is designed as a circular slot, and the center distance between adjacent two second embedding slots 210 is not less than 1.6 times the slot diameter, which effectively avoids the interference between adjacent split blades, thereby improving the polishing accuracy and effect.

[0052] In one of the embodiments, the thickness of the clamping jig 200 is H2, the second embedding groove 210 is a circular groove, the distance from the center of the circular groove to the end surface of the clamping jig 200 is H3, and the diameter of the second embedding groove 210 is D1, wherein H2≥1.5*D1 and H3≤D1 / 3.

[0053] In one of the embodiments, the diameter tolerance of the second embedding groove 210 is +0.02mm.

[0054] In one of the embodiments, the thickness of the lower pressing mold 300 is H4, wherein 5mm≤H4≤10mm.

[0055] In one of the embodiments, the flow area of the second fluid channel 310 is S1, and the outer contour area of the lower pressing mold 300 is S2, wherein S2 / 4≤S1≤S2 / 2.

[0056] Specifically, the outer contour area of the lower pressing mold 300 refers to the area surrounded by the outer contour line projected on the horizontal plane of the lower pressing mold.

[0057] By adopting the above technical solution, the flow of the polishing medium in the device can be optimized through the design of the area ratio, and the polishing efficiency and effect are improved. Specifically, the proportional control helps to manage the flow rate and flow of the polishing medium, ensuring that the polishing medium can fully contact the surface of the cleaver, thereby achieving more uniform and efficient polishing effect.

[0058] In one of the embodiments, the length of the first fluid channel 110 is L1, and the length of the clamping jig 200 is L2, wherein L2≤L1≤1.5*L2.

[0059] Specifically, the length direction of the clamping jig 200 is parallel to the length direction of the first fluid channel 110.

[0060] By adopting the above technical solution, the length ratio of the first fluid channel 110 and the clamping jig 200 is specified, ensuring that the clamping jig 200 can be completely accommodated in the first fluid channel 110 and effectively contacted, and ensuring that the polishing medium can uniformly act on the cleaver when flowing.

[0061] In the description of the present specification, the description of the terms "one embodiment", "certain embodiments", "illustrative embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0062] The above merely describes some embodiments of the present application. For those skilled in the art, without departing from the inventive concept, several modifications and improvements can be made, which are all within the protection scope of the present application.

Claims

1. A split-type cleaver polishing and fixing device, characterized in that: The application relates to a polishing device, which comprises the following components: a mounting base (100) provided with a first fluid channel (110) for polishing medium to flow between opposite end faces of the mounting base (100) and a first embedding groove (120) connected with the first fluid channel (110); a clamping jig (200) capable of being embedded in the first embedding groove (120), the clamping jig (200) being provided with a second embedding groove (210) for embedding a cleaver, and the cleaver in the second embedding groove (210) being capable of extending into the first fluid channel (110) for polishing; a lower pressing die (300) for pressing the cleaver in the second embedding groove (210), the lower pressing die (300) being provided with a second fluid channel (310), and the second fluid channel (310) being used for the polishing medium to pass in and out of the first fluid channel (110) when the lower pressing die (300) presses the cleaver in the second embedding groove (210).

2. The split cleaver polishing fixture of claim 1, wherein, The mounting base (100) is provided with at least two first embedding grooves (120), each of the first embedding grooves (120) is provided with a corresponding first fluid channel (110), and the first fluid channel (110) can respectively transport the polishing medium to polish the cleaver in the first embedding groove (120).

3. The split blade polishing fixture of claim 2, wherein, The first embedding grooves (120) are divided into two groups, and the two groups of first embedding grooves (120) are respectively arranged on opposite sides of the mounting base (100), and each group of first embedding grooves (120) comprises at least one first embedding groove (120).

4. A split blade polishing fixture according to claim 2 or 3, wherein, The number of the second fluid channels (310) is one, and the second fluid channel (310) can simultaneously communicate with multiple first fluid channels (110).

5. The split blade polishing fixture of claim 1, wherein, The clamping jig (200) is provided with multiple second embedding grooves (210), and the multiple second embedding grooves (210) are arranged on the clamping jig (200) in a spaced manner along the length extension direction of the first fluid channel (110).

6. The split blade polishing fixture of claim 5, wherein, The second embedding groove (210) is a circular groove, the diameter of the second embedding groove (210) is D1, the distance between the centers of adjacent two second embedding grooves (210) is H1, and H1>=1.6*D1.

7. The split blade polishing fixture of claim 1, wherein, The thickness of the clamping jig (200) is H2, the second embedding groove (210) is a circular groove, the distance from the center of the circular groove to the end face of the clamping jig (200) is H3, and the diameter of the second embedding groove (210) is D1, wherein H2>=1.5*D1 and H3<=D1 / 3.

8. The split blade polishing fixture of claim 1, wherein, The thickness of the lower pressing die (300) is H4, wherein 5mm<=H4<=10mm.

9. The split blade polishing fixture of claim 1, wherein, The flow area of the second fluid channel (310) is S1, and the outer contour area of the lower pressing die (300) is S2, wherein S2 / 4<=S1<=S2 / 2.

10. The split cleaver polishing fixture of claim 1, wherein, The length of the first fluid channel (110) is L1, and the length of the clamping jig (200) is L2, wherein L2<=L1<=1.5*L2.

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