Automatic IC (integrated circuit) loading disc feeding mechanism and IC loading disc warping degree detection equipment

Abstract

The utility model provides an IC loading disc automatic feeding mechanism and IC loading disc warping degree detection equipment, the IC loading disc automatic feeding mechanism comprises two first conveying assemblies which are arranged along the Y direction and have opposite conveying directions, a second conveying assembly arranged along the X direction, and a pick-and-place assembly arranged above the first conveying assemblies and the second conveying assembly, the first conveying assembly comprises two belt lines arranged side by side and a jacking assembly arranged between the two belt lines, the jacking assembly is used for jacking the IC carrying discs on the belt lines, and the taking and placing assembly is used for taking and placing the IC carrying discs on the jacking assembly onto the second conveying assembly. According to the automatic feeding device, the taking and placing assembly is arranged to transfer the IC carrier plates between the two first conveying assemblies and the second conveying assembly, when one first conveying assembly is empty and needs to be supplemented, the taking and placing assembly is switched to the other first conveying assembly to take materials, the material supplementing and taking processes are independently carried out, and the feeding efficiency is greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to automatic detection technical field especially relates to a kind of IC tray automatic feeding mechanism and IC tray warping degree detection equipment. BACKGROUND

[0002] IC Tray is the packaging plastic tray used in semiconductor chip (IC) package test, it ensures the safety, accurate placement and operation of chip, so it plays an important role in the automatic transmission of chip. Before use, the relevant project detection of IC Tray is needed, such as warping degree, cleanliness etc. In the existing IC Tray detection / cleaning equipment, the multi-tray feeding machine generally has the problems of insufficient flexibility, low feeding efficiency, etc., which affects the detection efficiency or cleaning efficiency of IC Tray, and further affects the subsequent production process.

[0003] Therefore, it is necessary to design an IC tray automatic feeding mechanism and IC tray warping degree detection equipment to solve the above problems. SUMMARY

[0004] The utility model discloses a kind of IC tray automatic feeding mechanism of continuous batch feeding.

[0005] To achieve the above object, the utility model adopts the following technical scheme: a kind of IC tray automatic feeding mechanism, it includes two first conveying components being set along Y direction and the conveying direction opposite, second conveying component being set along X direction, is set on the first conveying component and the second conveying component upper taking and placing assembly, the first conveying component includes two belt lines being arranged side by side and is set between the two belt lines jacking assembly, the jacking assembly is used to jacking IC tray on the belt line, the taking and placing assembly is used to take and place IC tray on the jacking assembly to the second conveying component.

[0006] As a further improved technical scheme of the utility model, the first conveying component further includes first support, first motor for driving the belt line and lifting stop block being set on the first support, the lifting stop block is located at the conveying end of the belt line.

[0007] As a further improved technical scheme of the utility model, the jacking assembly includes jacking drive and top plate that moves up and down under the drive of the jacking drive, the front and rear two side edges of the top plate are provided with stop edge, when the jacking assembly jacks up the IC tray, the IC tray is located between the front and rear two side edges.

[0008] As a further improved technical scheme of the utility model, the jacking drive is electric cylinder module.

[0009] As a further improved technical scheme of the present application, the jacking assembly further comprises a guide rod arranged on the top plate and a guide sleeve arranged on the first support, the guide rod is arranged in the guide sleeve and moves up and down along the guide sleeve.

[0010] As a further improved technical scheme of the present application, the taking and placing assembly comprises a support which spans the second conveying assembly, a Y linear guide rail arranged on the support, and two suction disc assemblies, the suction disc assembly comprises a mounting seat, a lifting module arranged on the mounting seat, and a suction disc arranged on the lifting module, the two suction discs are respectively arranged on the Y linear guide rail through the respective mounting seats, and the suction disc moves in the Y direction and the Z direction.

[0011] As a further improved technical scheme of the present application, the suction disc is a sponge suction disc.

[0012] As a further improved technical scheme of the present application, the taking and placing assembly further comprises a capacitive proximity sensor which moves synchronously with the suction disc, and the capacitive proximity sensor is arranged on the lifting module.

[0013] As a further improved technical scheme of the present application, the second conveying assembly comprises a second support, a second motor arranged on the second support, a second belt driven by the second motor, and a pneumatic stopper arranged on the transmission line of the second belt.

[0014] The present application aims to provide an IC carrier disc warping degree detection device with high detection efficiency.

[0015] To achieve the above object, the present application adopts the following technical scheme: an IC carrier disc warping degree detection device comprises the IC carrier disc automatic feeding mechanism, the warping degree detection mechanism and the NG unloading mechanism according to any one of the above, the warping degree detection mechanism is located on the conveying line of the second conveying assembly, the NG unloading mechanism comprises an NG conveying line which is horizontal and perpendicular to the conveying direction of the second conveying assembly, and an NG taking and placing assembly, and the NG taking and placing assembly is used to take and place the NG IC carrier disc on the second conveying assembly to the NG conveying line.

[0016] According to the above technical scheme, the IC carrier disc automatic feeding mechanism of the present application can transfer the IC carrier disc between the two first conveying assemblies and the second conveying assembly through the taking and placing assembly, when one of the first conveying assemblies needs to be replenished, the taking and placing assembly switches to the other first conveying assembly to take the material, the replenishment and the taking process are independent and do not affect each other, so that the feeding is not waiting, the feeding efficiency is greatly improved; in addition, the jacking assembly is arranged to take the material at the same height, which reduces the stroke of the taking assembly, makes the taking process rhythm compact, and further improves the feeding speed. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 The IC carrier plate warping degree detection equipment of the embodiment of the utility model.

[0018] Figure 2 The utility model discloses a kind of IC carrier plate warping degree detection equipment, which comprises IC carrier plate automatic feeding mechanism, warping degree detection mechanism 50 and NG unloading mechanism. Figure 1

[0019] Figure 3 The utility model discloses a kind of IC carrier plate warping degree detection equipment, which comprises IC carrier plate automatic feeding mechanism, warping degree detection mechanism 50 and NG unloading mechanism. Figure 2

[0020] Figure 4 The utility model discloses a kind of IC carrier plate warping degree detection equipment, which comprises IC carrier plate automatic feeding mechanism, warping degree detection mechanism 50 and NG unloading mechanism. Figure 1 Specific embodiment

[0021] In order to make the purpose, technical scheme and advantage of the utility model more clear, the utility model is described in detail below with the combination of drawing and specific embodiment.

[0022] Please refer to Figure 1 The utility model provides a kind of IC carrier plate warping degree detection equipment, it includes IC carrier plate automatic feeding mechanism, warping degree detection mechanism 50 and NG unloading mechanism.

[0023] IC carrier plate automatic feeding mechanism includes two first conveying assemblies 10,20 being set along Y direction and the opposite conveying direction, second conveying assembly 40 being set along X direction and taking and placing assembly 30 being arranged on the top of first conveying assembly 10 and second conveying assembly 40.Warping degree detection mechanism 50 is located on the conveying line of second conveying assembly 40, for measuring the warping degree of carrier plate on second conveying assembly 40.

[0024] Please refer to Figure 2 First conveying assembly 10,20 is used for batch transmission IC carrier plate.The structure of first conveying assembly 10,20 is symmetrical, and here with first conveying assembly 20 as example to be described in detail.First conveying assembly 20 includes first support 21, first motor 22 being arranged on first support 21, two belt lines 23 being arranged side by side and driven by first motor 22, lifting stop block 24 and jacking assembly 25 being arranged between two belt lines 23.Lifting stop block 24 is located at the conveying end of belt line 23.

[0025] Jacking assembly 25 is used for lifting IC carrier plate on belt line 23.Please refer to Figure 3 ​​​As shown, the lifting assembly 25 includes a lifting drive 251 and a top plate 252 moving up and down under the driving of the lifting drive 251, and the front and rear edges of the top plate 252 are provided with stop edges 2521, and when the lifting assembly 25 lifts the IC tray, the IC tray is located between the stop edges 2521 on the front and rear sides. The lifting drive 251 is an electric cylinder module. The lifting assembly 25 further includes a guide rod 253 provided on the top plate 252 and a guide sleeve 254 provided on the first support 21, and the guide rod 253 is arranged in the guide sleeve 254 and moves up and down along the guide sleeve 254.

[0026] The taking and placing assembly 30 is used to take and place the IC tray on the lifting assembly 25 to the second conveying assembly 40. Please refer to Figure 4 As shown, the taking and placing assembly 30 includes a support 31 crossing the second conveying assembly 40, a Y linear guide rail 32 provided on the support 31, and two suction cup assemblies 33 and 34. The suction cup assemblies 33 and 34 are the same in structure, and hereinafter the suction cup assembly 33 will be taken as an example to be described in detail. The suction cup assembly 33 includes a mounting seat 332, a lifting module 331 provided on the mounting seat 332, and a capacitive proximity sensor 333 and a suction cup 334 provided on the lifting module 331. The proximity sensor 333 and the suction cup 334 are synchronously moved in a capacitive manner. The two suction cups of the suction cup assemblies 33 and 34 are respectively slidably arranged on the Y linear guide rail 32 through the respective mounting seats, and the suction cup 334 moves in the Y direction and the Z direction. The suction cup 334 is a sponge suction cup, and the sponge suction cup realizes the universality of various trays.

[0027] Please refer to Figure 1 As shown, the NG unloading mechanism includes an NG conveying line 70 horizontal and perpendicular to the conveying direction of the second conveying assembly 40 and an NG taking and placing assembly 60, and the NG taking and placing assembly 60 is used to take and place the NG IC tray on the second conveying assembly 40 to the NG conveying line 70.

[0028] The second conveying assembly 40 includes a second support, a second motor 41 provided on the second support, a second belt 42 driven by the second motor 41, and pneumatic stops provided on the transmission line of the second belt 42. Specifically, the pneumatic stops are a plurality of pneumatic stops respectively arranged at the front end of the warping detection mechanism 50, the front end of the NG conveying line 70, and the end of the second belt 42, so as to position the IC tray on the second belt 42 at the required station.

[0029] When the IC carrier plate warping degree detection device of the embodiment is in operation, the IC carrier plates stacked are conveyed from the first conveying assembly 20 to the top lifting assembly 25, the first conveying assembly 20 is paused, the top plate 252 of the top lifting assembly 25 lifts the IC carrier plates, the IC carrier plates are separated from the first belt 23, the taking and placing assembly 30 takes and places the IC carrier plates on the top lifting assembly 25 to the second conveying assembly 40 one by one; when the IC carrier plates on the first conveying assembly 20 are taken, the taking and placing assembly 30 switches to the first conveying assembly 10 to further take and place the IC carrier plates, and the first conveying assembly 20 is replenished during this period. When the IC carrier plates flow into the detection station of the warping degree detection mechanism 50, the second conveying assembly 40 is stopped, the warping degree is measured, and the warping degree is further judged as OK / NG. The NG carrier plates are taken and placed to the NG conveying line 70 by the NG taking and placing assembly 60 and flow out.

[0030] The terms such as "upper", "lower" and the like used herein to indicate spatial relative positions are used for the purpose of facilitating the description to describe the relationship of one feature relative to another feature as shown in the drawings. It can be understood that the terms of spatial relative positions can be intended to include different orientations other than the orientation shown in the drawings according to the different placement positions of the IC carrier plates, and should not be understood as the limitation of the claims.

[0031] In addition, the above embodiments are only used to illustrate the technical solutions described in the utility model and not to limit the technical solutions described in the utility model. The understanding of the specification should be based on the technical personnel in the technical field. Although the utility model has been described in detail with reference to the above embodiments, it should be understood by those skilled in the art that the technical personnel in the technical field can still modify or equivalently replace the utility model, and all technical solutions and improvements which do not deviate from the spirit and scope of the utility model should be covered in the claim scope of the utility model.

Claims

1. An automatic loading mechanism for an IC carrier, characterized by: The IC wafer carrier automatic feeding mechanism comprises two first conveying assemblies arranged along the Y direction and conveying in opposite directions, a second conveying assembly arranged along the X direction, and a taking and placing assembly arranged above the first conveying assembly and the second conveying assembly.

2. The IC tray automatic feeding mechanism according to claim 1, wherein: The first conveying assembly further comprises a first support, a first motor arranged on the first support and driving the belt line, and a lifting stopper arranged at the conveying end of the belt line.

3. The IC tray automatic feeding mechanism according to claim 2, wherein: The lifting assembly comprises a lifting drive and a lifting plate moving up and down under the driving of the lifting drive, and the front and rear edges of the lifting plate are provided with stop edges, and when the IC wafer carrier is lifted by the lifting assembly, the IC wafer carrier is located between the front and rear stop edges.

4. The IC tray automatic feeding mechanism according to claim 3, wherein: The lifting drive is an electric cylinder module.

5. The IC tray automatic feeding mechanism according to claim 3, wherein: The lifting assembly further comprises a guide rod arranged on the lifting plate and a guide sleeve arranged on the first support, and the guide rod is arranged in the guide sleeve and moves up and down along the guide sleeve.

6. The IC tray automatic feeding mechanism according to claim 5, wherein: The taking and placing assembly comprises a support across the second conveying assembly, a Y linear guide rail arranged on the support, and two suction cup assemblies, the suction cup assembly comprises a mounting seat, a lifting module arranged on the mounting seat, and a suction cup arranged on the lifting module, two suction cups are respectively arranged on the Y linear guide rail through the respective mounting seats, and the suction cups move in the Y direction and the Z direction.

7. The IC tray automatic feeding mechanism according to claim 6, wherein: The suction cup is a sponge suction cup.

8. The IC tray automatic feeding mechanism according to claim 6, wherein: The taking and placing assembly further comprises a capacitive proximity sensor moving synchronously with the suction cup, and the capacitive proximity sensor is arranged on the lifting module.

9. The IC tray automatic feeding mechanism according to claim 8, wherein: The second conveying assembly comprises a second support, a second motor arranged on the second support, a second belt driven by the second motor, and a pneumatic stopper arranged on the transmission line of the second belt.

10. An IC carrier warpage detection device, characterized in that: The IC wafer carrier automatic feeding mechanism, the warping degree detection mechanism and the NG unloading mechanism, the warping degree detection mechanism is arranged on the conveying line of the second conveying assembly, and the NG unloading mechanism comprises an NG conveying line and an NG taking and placing assembly, and the NG taking and placing assembly is used for taking and placing the NG IC wafer carrier on the second conveying assembly to the NG conveying line.

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