Micro differential pressure chip, wafer structure and electronic equipment
By setting a design in which a vent hole intersects with a second through groove on the support structure of the micro-differential pressure chip and filling the release hole with insulating material, the problem of impurities entering the cavity is solved, and the transient response performance and reliability of the chip are improved.
Patent Information
- Application Number
- CN202422730138.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-08
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2034-11-08
AI Technical Summary
During the manufacturing process of existing micro-differential pressure chips, the release holes easily allow impurities to enter the cavity, damaging the chip and affecting product performance.
An air release hole is set on the support structure of the micro-differential pressure chip so that it intersects with the through direction of the second through groove, and insulating material is filled in the release hole. The flow area of the air release hole gradually increases to prevent impurities from entering the through groove and at the same time increase the air discharge speed.
It effectively prevents impurities from entering the diaphragm, improves the transient response performance of the micro-differential pressure chip, avoids chip damage, and improves product reliability and response speed.
Smart Images
Figure CN223458105U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to micro - machine - electron sensor technical field, especially in a kind of differential pressure chip, wafer structure and electronic equipment. BACKGROUND
[0002] Differential pressure chip is a kind of semiconductor chip integrated micro mechanical device and electronic element, it is manufactured by micro - nanometer processing technology Micron level mechanical structure, so that chip has the function of sensing, control and control small object.
[0003] The existing differential pressure chip is usually made in the process, support structure is made on the side surface of diaphragm, back plate is made on the side surface of support structure away from diaphragm, finally, release hole is made on back plate, part of surface of support structure is exposed in release hole, so that etching solution contacts support structure through release hole to remove part of support structure, to form cavity between diaphragm and back plate. At the same time, after the completion of differential pressure chip, release hole can also be used to act as air escape channel to balance the air pressure inside the cavity.
[0004] However, release hole is usually the opening along the thickness direction of diaphragm, penetrates back plate, in actual application, some impurities can directly enter the cavity through release hole, deposit on diaphragm, cause product failure. UTILITY MODEL CONTENTS
[0005] The embodiment of the utility model provides a kind of differential pressure chip, wafer structure and electronic equipment to avoid impurities into chip interior, damage chip.
[0006] To solve the above technical problems, the embodiment of the utility model discloses the following technical solutions:
[0007] First, a kind of differential pressure chip is provided, including the substrate, diaphragm, support structure and back plate of laminated setting, the substrate has the first through slot in its thickness direction, the support structure has the second through slot in its thickness direction, the projection of the first through slot on the diaphragm and the projection of the second through slot on the diaphragm overlap;
[0008] Gas escape hole is opened in the support structure and communicated with the second through slot, the through direction of the gas escape hole and the through direction of the second through slot intersect, from the inside of the second through slot to the outside of the second through slot, the flow area of the gas escape hole gradually increases;
[0009] Multiple release holes are opened in the back plate and penetrate in its thickness direction, the release hole is filled with insulating material to block the release hole.
[0010] In addition to one or more of the above disclosed features, or alternatively, the support structure includes a first wall, a second wall, a third wall, and a fourth wall, the first wall, the second wall, the third wall, and the fourth wall are connected in sequence and end to end to enclose the second through slot, the first wall and the third wall are arranged opposite to each other along a first direction, the second wall and the fourth wall are arranged opposite to each other along a second direction, the first wall, the second wall, the third wall, and the fourth wall are each provided with the air release hole, and the first direction, the second direction, and the thickness direction are perpendicular to each other in pairs.
[0011] In addition to one or more of the above disclosed features, or alternatively, the air release hole on the first wall and the air release hole on the third wall are opposite to each other, and the air release hole on the second wall and the air release hole on the fourth wall are opposite to each other.
[0012] In addition to one or more of the above disclosed features, or alternatively, the first wall, the second wall, the third wall, and the fourth wall are each provided with a plurality of air release holes arranged at intervals, the plurality of air release holes on the first wall each correspond to one of the plurality of air release holes on the third wall and are arranged opposite to each other, and the plurality of air release holes on the second wall each correspond to one of the plurality of air release holes on the fourth wall and are arranged opposite to each other.
[0013] In addition to one or more of the above disclosed features, or alternatively, the first wall, the second wall, the third wall, and the fourth wall are each provided with an auxiliary hole on a side away from the second through slot, each of the auxiliary holes is not in communication with the second through slot, the auxiliary holes and the air release holes on the same wall are arranged at intervals, the extension direction of the auxiliary holes on the same wall is the same as the through direction of the air release holes, the air release hole on the first wall and the auxiliary hole on the third wall are arranged opposite to each other, the auxiliary hole on the first wall and the air release hole on the third wall are arranged opposite to each other, the air release hole on the second wall and the auxiliary hole on the fourth wall are arranged opposite to each other, and the auxiliary hole on the second wall and the air release hole on the fourth wall are arranged opposite to each other.
[0014] In addition to one or more of the above disclosed features, or alternatively, the hole diameter of the auxiliary hole on each of the first wall, the second wall, the third wall, and the fourth wall at an end away from the second through slot is equal to the hole diameter of the air release hole opposite to the auxiliary hole at the end away from the second through slot.
[0015] In addition to one or more of the above disclosed features, or as an alternative, each of the first wall, the second wall, the third wall and the fourth wall is provided with a plurality of the air release holes and a plurality of the auxiliary holes, the air release holes on the first wall correspond one-to-one with the auxiliary holes on the third wall, the auxiliary holes on the first wall correspond one-to-one with the air release holes on the third wall, the air release holes on the second wall correspond one-to-one with the auxiliary holes on the fourth wall, and the auxiliary holes on the second wall correspond one-to-one with the air release holes on the fourth wall, and each of the corresponding auxiliary hole and the air release hole is arranged in a face-to-face manner.
[0016] In a second aspect, a wafer structure is provided, comprising a plurality of the micro differential pressure chips as described above, and the plurality of the micro differential pressure chips are arranged along a first direction and a second direction.
[0017] In addition to one or more of the above disclosed features, or as an alternative, the air release hole on the second through slot in the support structure of one of the micro differential pressure chips is in communication with the air release hole on the second through slot in the support structure of the adjacent micro differential pressure chip.
[0018] In addition to one or more of the above disclosed features, or as an alternative, the air release hole on the second through slot in the support structure of one of the micro differential pressure chips is in communication with the air release hole on the second through slot in the support structure of the adjacent micro differential pressure chip.
[0019] In a third aspect, a wafer structure is provided, comprising a plurality of the micro differential pressure chips as described above, and the plurality of the micro differential pressure chips are arranged along a first direction and a second direction.
[0020] In addition to one or more of the above disclosed features, or as an alternative, the auxiliary hole on the second through slot in the support structure of one of the micro differential pressure chips is in communication with the air release hole on the second through slot in the support structure of the adjacent micro differential pressure chip.
[0021] In a fourth aspect, an electronic device is provided, comprising any of the micro differential pressure chips as described above.
[0022] One of the above technical solutions has the following advantages or beneficial effects: the application fills the insulation material into the release hole after the second through groove is formed, which avoids that impurities directly enter the second through groove through the release hole and deposit on the diaphragm to damage the chip in actual application. Meanwhile, by opening the air release hole intersecting with the through direction of the second through groove, when the impurities enter the second through groove through the air release hole, the impurities will not directly enter the inside of the second through groove, but will be deposited at the end of the air release hole far away from the second through groove, thereby avoiding that the impurities enter the second through groove and damage the chip. Moreover, the flow area of the air release hole gradually increases from the inside of the second through groove to the outside of the second through groove, when the diaphragm is pressed, the airflow in the second through groove enters the air release hole through the smaller inside opening, and as the flow area gradually increases, the airflow can be quickly discharged, so that the pressure in the second through groove can be quickly released, and the transient response performance of the differential pressure chip is improved. BRIEF DESCRIPTION OF DRAWINGS
[0023] The technical solutions and other beneficial effects of the present application will be apparent from the following detailed description of the specific embodiments of the present application combined with the accompanying drawings.
[0024] Figure 1 is a cross-sectional schematic view of a differential pressure chip provided by the embodiments of the present application;
[0025] Figure 2 is a structural schematic view of a support structure in a differential pressure chip provided by the embodiments of the present application;
[0026] Figure 3 is a structural schematic view of another support structure in a differential pressure chip provided by the embodiments of the present application;
[0027] Figure 4 is a structural schematic view of a wafer structure provided by the embodiments of the present application;
[0028] Figure 5 is a structural schematic view of a support structure in a wafer structure provided by the embodiments of the present application;
[0029] Figure 6 is a structural schematic view of another support structure in a wafer structure provided by the embodiments of the present application.
[0030] Explanation of Reference Signs:
[0031] 10, differential pressure chip;
[0032] 100, base; 101, first through groove;
[0033] 200, diaphragm;
[0034] 300, support structure; 301, second through slot; 302, air bleed hole; 303, first wall; 304, second wall; 305, third wall; 306, fourth wall; 307, auxiliary hole;
[0035] 400, back plate; 401, release hole;
[0036] 500, connecting structure. DETAILED DESCRIPTION
[0037] In order to make the purpose, technical scheme and beneficial effects of the utility model clearer and more apparent, the utility model is further described in detail below in combination with the drawings and specific embodiments. It should be understood that the specific embodiments described in the specification are only for the purpose of explaining the utility model, and are not intended to limit the utility model.
[0038] In the description of the utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and is not intended to indicate or imply that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited.
[0039] In the description of the utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the communication between two elements or the interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0040] In the utility model, unless another definite provision and limitation, first feature is "on" or "under" second feature can include that first and second features are in direct contact, also can include that first and second features are not in direct contact but contact through other feature between them. Moreover, first feature "on", "above" and "on" second feature includes that first feature is directly above and obliquely above second feature, or only indicates that first feature is higher than second feature in horizontal height. First feature "under", "below" and "under" second feature includes that first feature is directly above and obliquely above second feature, or only indicates that first feature is lower than second feature in horizontal height.
[0041] In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, the utility model is further explained in detail below by combining with the drawings and specific embodiments.
[0042] The embodiment of the application provides a micro differential pressure chip, referring to Figure 1 , including the substrate 100, diaphragm 200, support structure 300 and back plate 400 of laminated arrangement, substrate 100 has the first through slot 101 in its thickness direction, support structure 300 has the second through slot 301 in its thickness direction, the projection of first through slot 101 on diaphragm 200 and the projection of second through slot 301 on diaphragm 200 overlap. Specifically, the micro differential pressure chip has the first direction, the second direction and the third direction, the first direction, the second direction and the third direction are perpendicular to each other, and the thickness direction of substrate 100 and the thickness direction of support structure 300 are both arranged along the third direction, that is, the through direction of first through slot 101 and second through slot 301 is the third direction.
[0043] In some embodiments, diaphragm 200 and substrate 100 have connecting structure 500, connecting structure 500 is used to support diaphragm 200. When making micro differential pressure chip, connecting structure 500 is usually made on one side surface in the thickness direction of substrate 100, connecting structure 500 covers the surface, then diaphragm 200 is made on the side surface of connecting structure 500 away from substrate 100. When the first through slot 101 through substrate 100 is opened, the first through slot 101 will usually extend to the connecting structure 500, so that the diaphragm 200 is exposed in the first through slot 101. It should be noted that support structure 300 and connecting structure 500 can be materials with sufficient removability, thermal stability and sufficient mechanical strength, such as silicon oxide.
[0044] The first through slot 101 and the second through slot 301 on both sides of the diaphragm 200 in the thickness direction of the diaphragm 200 are deformation spaces of the diaphragm 200, and the diaphragm 200 and the back plate 400 together constitute a variable capacitor of the micro differential pressure chip. The plurality of release holes 401 through the back plate 400 in the thickness direction of the back plate 400 are used for the etching liquid to pass through, that is, the release hole 401 penetrates the back plate 400 along the third direction, so as to etch the support structure 300 by the etching liquid, to open the second through slot 301 and the air release hole 302 on the support structure 300. It should be noted that the penetration direction of the air release hole 302 is a direction intersecting the third direction, and the air release hole 302 is described in detail with reference to Figure 2 Different air release holes 302 can penetrate the support structure 300 along the first direction or the second direction. Meanwhile, the air release hole 302 is described in detail with reference to Figure 1 In some embodiments, the air release hole has a large opening diameter, which penetrates the support structure 300 in the third direction, so that the back plate 400 and the diaphragm 200 on both sides of the support structure 300 are exposed in the air release hole 302. By opening the air release hole 302 whose penetration direction intersects the penetration direction of the second through slot 301, when the impurities enter the second through slot 301 through the air release hole 302, the impurities will not directly enter the inside of the second through slot 301, but will be deposited at the end of the air release hole 302 far away from the second through slot 301, avoiding the impurities entering the second through slot 301 and damaging the chip. After the second through slot 301 is opened, the release hole 401 is filled with insulating material to block the release hole 401, so as to avoid that in actual application, the impurities directly enter the second through slot 301 through the release hole 401 and are deposited on the diaphragm 200 to damage the diaphragm 200. Further, in some embodiments, the flow area of the air release hole 302 gradually increases from the inside of the second through slot 301 to the outside of the second through slot 301. When the diaphragm 200 is pressed, the airflow in the second through slot 301 enters the air release hole 302 through the smaller internal opening, and as the flow area gradually increases, the airflow can be quickly discharged, so that the pressure in the second through slot 301 can be quickly released, and the transient response performance of the micro differential pressure chip is improved.
[0045] In the following, the implementation of the air release hole 302 will be described in detail in combination with different embodiments.
[0046] Embodiment one
[0047] With reference to Figure 2The support structure 300 comprises a first wall 303, a second wall 304, a third wall 305 and a fourth wall 306, which are sequentially connected end to end to form the second through slot 301. The first wall 303 and the third wall 305 are oppositely arranged along a first direction, and the second wall 304 and the fourth wall 306 are oppositely arranged along a second direction. The first wall 303, the second wall 304, the third wall 305 and the fourth wall 306 are all provided with the air release hole 302. The first direction, the second direction and a thickness direction are perpendicular to each other. In some embodiments, the air release hole 302 on the first wall 303 and the air release hole 302 on the third wall 305 are oppositely arranged, and the air release hole 302 on the second wall 304 and the air release hole 302 on the fourth wall 306 are oppositely arranged. Specifically, the air release hole 302 on the first wall 303 and the air release hole 302 on the third wall 305 are oppositely arranged, which means that the air release holes 302 on the first wall 303 and the third wall 305 are overlapped or coincided when viewed along the first direction. The air release hole 302 on the second wall 304 and the air release hole 302 on the fourth wall 306 are oppositely arranged, which means that the air release holes 302 on the second wall 304 and the fourth wall 306 are overlapped or coincided when viewed along the second direction.
[0048] In some embodiments, a plurality of air release holes 302 are arranged on the first wall 303, the second wall 304, the third wall 305 and the fourth wall 306. The plurality of air release holes 302 on the first wall 303 are one-to-one corresponding to the plurality of air release holes 302 on the third wall 305 and oppositely arranged. The plurality of air release holes 302 on the second wall 304 are one-to-one corresponding to the plurality of air release holes 302 on the fourth wall 306 and oppositely arranged. In practical applications, the number of the air release holes 302 is designed according to the requirements of the differential pressure chip.
[0049] Embodiment two
[0050] Reference Figure 3, the difference between the second through slot 301 of embodiment two and the first embodiment is that the second through slot 301 is provided with an auxiliary hole 307. Specifically, the first wall 303, the second wall 304, the third wall 305 and the fourth wall 306 are provided with auxiliary holes 307 on the side away from the second through slot 301, and each auxiliary hole 307 is not communicated with the second through slot 301. The auxiliary holes 307 on the same wall are arranged in a spaced manner with the air release hole 302, and the extension direction of the auxiliary holes 307 on the same wall is the same as the through direction of the air release hole 302. Specifically, when the through direction of the air release hole 302 is the first direction, the extension direction of the auxiliary hole 307 on the same wall as the air release hole 302 is also the first direction. The air release hole 302 on the first wall 303 and the auxiliary hole 307 on the third wall 305 are arranged opposite to each other, the auxiliary hole 307 on the first wall 303 and the air release hole 302 on the third wall 305 are arranged opposite to each other, the air release hole 302 on the second wall 304 and the auxiliary hole 307 on the fourth wall 306 are arranged opposite to each other, and the auxiliary hole 307 on the second wall 304 and the air release hole 302 on the fourth wall 306 are arranged opposite to each other. The air release hole 302 and the auxiliary hole 307 are arranged opposite to each other, which means that in the first direction, the air release hole 302 on the first wall 303 and the auxiliary hole 307 on the third wall 305 overlap or coincide, the auxiliary hole 307 on the first wall 303 and the air release hole 302 on the third wall 305 overlap or coincide, and the air release hole 302 and the auxiliary hole 307 on the second wall 304 and the fourth wall 306 are arranged opposite to each other. The explanation of the first wall 303 and the third wall 305 is the same. In some embodiments, the hole diameter of the end of the auxiliary hole 307 away from the second through slot 301 is smaller than the hole diameter of the end close to the second through slot 301. And in some embodiments, the hole diameter of the end of each auxiliary hole 307 away from the second through slot 301 is equal to the hole diameter of the end of the air release hole 302 opposite to it away from the second through slot 301. Further, in some embodiments, a plurality of air release holes 302 and a plurality of auxiliary holes 307 are provided on the first wall 303, the second wall 304, the third wall 305 and the fourth wall 306, and the air release hole 302 on the first wall 303 corresponds to the auxiliary hole 307 on the third wall 305 one by one, the auxiliary hole 307 on the first wall 303 corresponds to the air release hole 302 on the third wall 305 one by one, the air release hole 302 on the second wall 304 corresponds to the auxiliary hole 307 on the fourth wall 306 one by one, and the auxiliary hole 307 on the second wall 304 corresponds to the air release hole 302 on the fourth wall 306 one by one. The corresponding auxiliary hole 307 and air release hole 302 are arranged opposite to each other.
[0051] Further, the application discloses a wafer structure, referring to Figure 4, including a plurality of any of the differential pressure chips 10 disclosed above, the plurality of differential pressure chips 10 are arranged along a first direction and a second direction. In the first direction, edges of adjacent differential pressure chips 10 are fit together to form a first dicing street of the wafer structure, and in the second direction, edges of adjacent differential pressure chips 10 are fit together to form a second dicing street of the wafer structure.
[0052] To ensure that the air vent hole 302 on the second through slot 301 in the support structure 300 of the differential pressure chip 10 is in a state of penetrating the second through slot 301 after the differential pressure chip 10 is separated along the first dicing street and the second dicing street, and to ensure that the second through slot 301 can communicate with the outside of the differential pressure chip 10 through the air vent hole 302, so that the differential pressure chip 10 can balance the air pressure through the air vent hole 302 when applied, in the wafer structure disclosed in the present application, the air vent hole 302 on the second through slot 301 in the support structure 300 of one differential pressure chip 10 extends to the second through slot 301 in the support structure 300 of the adjacent differential pressure chip 10. Specifically, when there is only one wall with an air vent hole 302 on the second through slot 301, the air vent hole 302 on the second through slot 301 in the support structure 300 of one differential pressure chip 10 is at least in communication with the air vent hole 302 on the second through slot 301 in the support structure 300 of the adjacent differential pressure chip 10, at this time, the second through slot 301 of one differential pressure chip 10 is at least in communication with the second through slot 301 of the adjacent differential pressure chip 10. Refer to Figure 5 When the differential pressure chip 10 is the differential pressure chip 10 disclosed in Embodiment One, each air vent hole 302 on the second through slot 301 in the support structure 300 of one differential pressure chip 10 is in communication with the air vent hole 302 on the second through slot 301 in the support structure 300 of the adjacent differential pressure chip 10, at this time, the second through slot 301 of one differential pressure chip 10 is in communication with the second through slot 301 of each adjacent differential pressure chip 10. Refer to Figure 6 When the differential pressure chip 10 is the differential pressure chip 10 disclosed in Embodiment Two, the auxiliary hole 307 on the second through slot 301 in the support structure 300 of one differential pressure chip 10 is in communication with the air vent hole 302 on the second through slot 301 in the support structure 300 of the adjacent differential pressure chip 10, at this time, the second through slot 301 of one differential pressure chip 10 is not in communication with the second through slot 301 of each adjacent differential pressure chip 10, so that when a single differential pressure chip 10 is processed and the solution diffusion causes the single differential pressure chip 10 to fail, the solution will not diffuse into other differential pressure chips 10, causing other differential pressure chips 10 to fail.
[0053] The application also discloses an electronic device comprising the differential pressure chip, and the electronic device can be an electronic product such as an electronic cigarette, a microphone, a breathing device or the like.
[0054] The above embodiments only express several implementation manners of the application, and the description is relatively specific and detailed, but should not be understood as a limitation on the patent application scope. It should be pointed out that, for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the application, and these all belong to the protection scope of the application. Therefore, the protection scope of the patent application of the application should be subject to the appended claims.
Claims
1. A micro differential pressure chip, characterized in that, The loudspeaker comprises a substrate (100), a diaphragm (200), a support structure (300) and a back plate (400) arranged in layers, the substrate (100) has a first through slot (101) penetrating in the thickness direction thereof, the support structure (300) has a second through slot (301) penetrating in the thickness direction thereof, the projection of the first through slot (101) on the diaphragm (200) and the projection of the second through slot (301) on the diaphragm (200) overlap; A vent hole (302) is formed in the support structure (300) and communicates with the second through slot (301), the through direction of the vent hole (302) intersects the through direction of the second through slot (301), and the flow area of the vent hole (302) gradually increases from the inside of the second through slot (301) to the outside of the second through slot (301); A plurality of release holes (401) penetrating in the thickness direction thereof are formed in the back plate (400), and the release holes (401) are filled with insulating material to block the release holes (401).
2. The differential pressure microchip of claim 1, wherein, The support structure (300) comprises a first wall (303), a second wall (304), a third wall (305) and a fourth wall (306), the first wall (303), the second wall (304), the third wall (305) and the fourth wall (306) are sequentially and circularly connected to form the second through slot (301), the first wall (303) and the third wall (305) are arranged opposite to each other along a first direction, the second wall (304) and the fourth wall (306) are arranged opposite to each other along a second direction, the first wall (303), the second wall (304), the third wall (305) and the fourth wall (306) are all provided with the vent hole (302), and the first direction, the second direction and the thickness direction are perpendicular to each other.
3. The differential pressure microchip of claim 2, wherein, The vent holes (302) on the first wall (303) and the vent holes (302) on the third wall (305) are arranged opposite to each other, and the vent holes (302) on the second wall (304) and the vent holes (302) on the fourth wall (306) are arranged opposite to each other.
4. The differential pressure microchip of claim 3, wherein, The first wall (303), the second wall (304), the third wall (305) and the fourth wall (306) are all provided with a plurality of spaced vent holes (302), the plurality of vent holes (302) on the first wall (303) one-to-one correspond to the plurality of vent holes (302) on the third wall (305) and are arranged opposite to each other, and the plurality of vent holes (302) on the second wall (304) one-to-one correspond to the plurality of vent holes (302) on the fourth wall (306) and are arranged opposite to each other.
5. The differential pressure microchip of claim 2, wherein, The first wall (303), the second wall (304), the third wall (305) and the fourth wall (306) are provided with auxiliary holes (307) on the side away from the second through slot (301), each auxiliary hole (307) is not communicated with the second through slot (301), the auxiliary holes (307) on the same wall are arranged at intervals with the air release hole (302), the extension direction of the auxiliary holes (307) on the same wall is the same as the through direction of the air release hole (302), the air release hole (302) on the first wall (303) and the auxiliary hole (307) on the third wall (305) are arranged opposite to each other, the auxiliary hole (307) on the first wall (303) and the air release hole (302) on the third wall (305) are arranged opposite to each other, the air release hole (302) on the second wall (304) and the auxiliary hole (307) on the fourth wall (306) are arranged, and the auxiliary hole (307) on the second wall (304) and the air release hole (302) on the fourth wall (306) are arranged opposite to each other.
6. The differential pressure microchip of claim 5, wherein, The hole diameter of one end of each auxiliary hole (307) away from the second through slot (301) is equal to the hole diameter of one end of the air release hole (302) opposite to it away from the second through slot (301).
7. The differential pressure microchip of claim 5, wherein, The first wall (303), the second wall (304), the third wall (305) and the fourth wall (306) are provided with a plurality of air release holes (302) and a plurality of auxiliary holes (307), the air release holes (302) on the first wall (303) correspond to the auxiliary holes (307) on the third wall (305) one by one, the auxiliary holes (307) on the first wall (303) correspond to the air release holes (302) on the third wall (305) one by one, the air release holes (302) on the second wall (304) correspond to the auxiliary holes (307) on the fourth wall (306) one by one, and the auxiliary holes (307) on the second wall (304) correspond to the air release holes (302) on the fourth wall (306) one by one, and the corresponding auxiliary holes (307) and air release holes (302) are arranged opposite to each other.
8. A wafer structure, characterized by A plurality of micro differential pressure chips (10) as claimed in any one of claims 1-4 are arranged along a first direction and a second direction. The air release hole (302) on the second through slot (301) in the support structure (300) of one micro differential pressure chip (10) extends to the second through slot (301) in the support structure (300) of the adjacent micro differential pressure chip (10).
9. The wafer structure of claim 8, wherein, The air release hole (302) on the second through slot (301) in the support structure (300) of one micro differential pressure chip (10) is communicated with the air release hole (302) on the second through slot (301) in the support structure (300) of the adjacent micro differential pressure chip (10).
10. A wafer structure, characterized by The differential pressure microchip (10) comprises a plurality of differential pressure microchips (10) as claimed in any one of claims 5-7, and the plurality of differential pressure microchips (10) are arranged along a first direction and a second direction. The auxiliary hole (307) in the second through slot (301) of the support structure (300) of one differential pressure microchip (10) is in communication with the air release hole (302) in the second through slot (301) of the support structure (300) of the differential pressure microchip (10) adjacent to the one differential pressure microchip (10).
11. An electronic device, comprising: The differential pressure microchip (10) comprises a plurality of differential pressure microchips (10) as claimed in any one of claims 5-7, and the plurality of differential pressure microchips (10) are arranged along a first direction and a second direction.