Electroplating liquid disturbance device and electroplating bath device

Abstract

The utility model discloses an electroplating liquid disturbance device which comprises a first supporting plate, a linkage piece and at least one fan blade. The first supporting plate is provided with at least one pivoting part. The linkage piece is provided with a first part. The first part is close to the pivoting part of the first supporting plate; the fan blade is connected with the first part of the linkage piece and is pivoted to the pivoting part. The fan blades are configured to be soaked in electroplating liquid. And the first part of the linkage piece drives the fan blade to move, so that the fan blade rotates relative to the pivoting part to disturb the electroplating liquid.

Description

TECHNICAL FIELD

[0001] The utility model discloses a kind of electroplating liquid disturbance devices and a kind of electroplating tank device. BACKGROUND

[0002] In the manufacturing process of circuit board, electroplating treatment is one of important processes, and the spray electroplating method is one of the more common electroplating methods. The spray electroplating method mainly sprays the electroplating solution containing metal ions in the electroplating tank directly on the circuit board to be electroplated. However, the current spray electroplating method has limited spraying range, and the metal ions in the electroplating solution cannot be evenly distributed on the surface of the circuit board due to the difference in electric field at different parts of the circuit board surface, which affects the overall electroplating quality of the circuit board. SUMMARY

[0003] The technical problem solved by the utility model is a kind of electroplating liquid disturbance devices.

[0004] The technical means adopted by the utility model are as follows.

[0005] According to an embodiment of the utility model, an electroplating liquid disturbance device includes a first support plate, a linkage member, and at least one fan blade. The first support plate has at least one pivot connection part. The linkage member has a first part. The first part is close to the pivot connection part of the first support plate. The fan blade is connected to the first part of the linkage member and is pivoted to the pivot connection part. The fan blade is configured to be immersed in the electroplating solution. The first part of the linkage member drives the fan blade to move, so that the fan blade rotates relative to the pivot connection part to disturb the electroplating solution.

[0006] In an embodiment of the utility model, the fan blade has an initial disturbance direction. The fan blade rotates to have a first predetermined disturbance direction. The first angle between the initial disturbance direction and the first predetermined disturbance direction is less than 25 degrees. The fan blade rotates to have a second predetermined disturbance direction relative to the first predetermined disturbance direction. The second angle between the initial disturbance direction and the second predetermined disturbance direction is less than 25 degrees.

[0007] In an embodiment of the utility model, the linkage member has an initial position and first and second limit positions on both sides relative to the initial position. The period from the initial position to the first limit position, from the first limit position to the second limit position, and from the second limit position back to the initial position of the linkage member is between 0.5 seconds and 1.5 seconds.

[0008] In an embodiment of the utility model, the number of fan blades corresponds to the number of pivot connection parts.

[0009] In an embodiment of the utility model, the first, second, and third side walls of the fan blade form a stepped structure.

[0010] In one embodiment of the present application, the third side wall of the fan blade is closer to the pivot joint of the first support plate than the first side wall.

[0011] In one embodiment of the present application, the first support plate has a first sliding rail. The first part of the linkage is located in the first sliding rail.

[0012] In one embodiment of the present application, the first part of the linkage has a first contact portion. One end of the first contact portion is located in the fan blade.

[0013] In one embodiment of the present application, the linkage has a second part. The second part has a second contact portion. One end of the second contact portion is located in the fan blade.

[0014] In one embodiment of the present application, the electroplating liquid disturbance device further comprises a second support plate. The second support plate has a second sliding rail. The second part of the linkage is located in the second sliding rail.

[0015] One technical embodiment of the present application is an electroplating tank device.

[0016] According to one embodiment of the present application, an electroplating tank device comprises the electroplating liquid disturbance device and a push rod. The push rod extends into the electroplating liquid disturbance device. The third part of the linkage is connected to one end of the push rod. The third part of the linkage connects the first part and the second part.

[0017] In one embodiment of the present application, the electroplating tank device further comprises an actuating assembly. The actuating assembly is located outside the electroplating liquid disturbance device and is connected to the other end of the push rod.

[0018] The technical effects produced by the present application are:

[0019] In the above-mentioned embodiments of the present application, the electroplating liquid disturbance device of the electroplating tank device can drive the fan blade to move by the linkage. The fan blade rotates relative to the pivot joint of the first support plate. The fan blade moves with the linkage and rotates relative to the pivot joint to disturb the electroplating liquid in the electroplating liquid disturbance device. The metal ions in the electroplating liquid can be evenly distributed on the surface of the circuit board. Therefore, when the circuit board is powered on for electroplating treatment, the uniformity of the electroplating film thickness on the surface of the circuit board can be improved, thereby improving the overall electroplating quality. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 The electroplating tank device according to one embodiment of the present application is shown in a perspective view.

[0021] Figure 2 is Figure 1 The electroplating tank device is shown in a cross-sectional view along line segment 2-2.

[0022] Figure 3 isFigure 1 A partial enlarged view of the electroplating tank device on the first sliding rail.

[0023] Figure 4 Figure 1 A partial enlarged view of the electroplating tank device on the second sliding rail.

[0024] Figure 5 Figure 6 Figure 7 A schematic view of the electroplating tank device according to an embodiment of the present application in operation with the fan blade at different positions.

[0025] Symbol explanation:

[0026] 100: electroplating liquid disturbance device

[0027] 110: first support plate

[0028] 112: pivot joint

[0029] 114: first sliding rail

[0030] 120: connecting member

[0031] 122: first part

[0032] 122a: first contact portion

[0033] 124: second part

[0034] 124a: second contact portion

[0035] 126: third part

[0036] 130: fan blade

[0037] 132: first side wall

[0038] 134: second side wall

[0039] 136: third side wall

[0040] 140: second support plate

[0041] 144: second sliding rail

[0042] 200: electroplating tank device

[0043] 210: push rod

[0044] 220: actuating assembly

[0045] 2-2: line segment

[0046] D3: initial disturbance direction

[0047] D4: first predetermined disturbance direction ​​​

[0048] D5: second predetermined disturbance direction

[0049] L: electroplating solution

[0050] θ1: first included angle

[0051] θ2: second included angle DETAILED DESCRIPTION

[0052] Figure 1 A perspective view of an electroplating tank device 200 according to an embodiment of the present application. Figure 2 is Figure 1 a cross-sectional view of the electroplating tank device 200 along line segment 2-2. Please refer to Figure 1 and Figure 2 simultaneously, the electroplating tank device 200 can be applied to an apparatus of an electroplating process, especially an apparatus applied to a vertical electroplating process. The electroplating tank device 200 includes an electroplating solution disturbance device 100. The electroplating solution disturbance device 100 includes a first support plate 110, a linkage 120, and a fan blade 130. The first support plate 110 has a pivot portion 112. For example, the pivot portion 112 of the first support plate 110 can be cylindrical, but is not limited thereto. The linkage 120 has a first portion 122 and a second portion 124. The first portion 122 of the linkage 120 is close to the pivot portion 112 of the first support plate 110. The first portion 122 of the linkage 120 is located at one side of the pivot portion 112 of the first support plate 110 and does not contact the pivot portion 112 of the first support plate 110. The fan blade 130 is connected to the first portion 122 of the linkage 120 and is pivoted to the pivot portion 112 of the first support plate 110. The pivot portion 112 of the first support plate 110 has a pivot point (not shown in the figure) so that the fan blade 130 can be pivoted thereto. The fan blade 130 is configured to be soaked by an electroplating solution L (to be described in detail below). The first portion 122 of the linkage 120 drives the fan blade 130 to move, so that the fan blade 130 rotates relative to the pivot portion 112 to disturb the electroplating solution L in a tank of the electroplating solution disturbance device 100. Figure 5

[0053] ​In some embodiments, the linkage 120 has a third portion 126. The third portion 126 of the linkage 120 is perpendicular to the first portion 122 of the linkage 120. The third portion 126 of the linkage 120 is perpendicular to the second portion 124 of the linkage 120. The second portion 124 of the linkage 120 is parallel to the first portion 122 of the linkage 120. The third portion 126 of the linkage 120 is between the first portion 122 of the linkage 120 and the second portion 124 of the linkage 120. In addition, the electroplating tank apparatus 200 further comprises a push rod 210 and an actuating assembly 220. The push rod 210 extends into the electroplating solution agitating device 100. The third portion 126 of the linkage 120 connects one end of the push rod 210. The third portion 126 of the linkage 120 connects the first portion 122 and the second portion 124. The actuating assembly 220 is outside the electroplating solution agitating device 100 and connects the other end of the push rod 210. The actuating assembly 220 can push the push rod 210 to move. The third portion 126 of the linkage 120 connecting the push rod 210 can drive the first portion 122 of the linkage 120 and the second portion 124 of the linkage 120 to move. The fan blade 130 follows the first portion 122 of the linkage 120 and the second portion 124 of the linkage 120 to move and the fan blade 130 rotates relative to the pivot portion 112 to agitate the electroplating solution L in the electroplating solution agitating device 100.

[0054] In particular, the electroplating solution agitating device 100 of the electroplating tank apparatus 200 can drive the fan blade 130 to move by the linkage 120 and the fan blade 130 can rotate relative to the pivot portion 112 of the first support plate 110. The fan blade 130 following the linkage 120 to move can agitate the electroplating solution L in the electroplating solution agitating device 100 so that the metal ions in the electroplating solution L can be evenly distributed on the surface of the circuit board W (in Figure 5 The detailed description) so that when the circuit board W is powered to electroplate, the uniformity of the electroplating film thickness on the surface of the circuit board W can be improved and the overall electroplating quality can be improved.

[0055] Figure 3 is Figure 1 a partial enlarged view of the electroplating tank apparatus 200 at the first slide rail 114 of the first support plate 110. Please refer to Figure 2 and Figure 3 , the number of the fan blades 130 can correspond to the number of the pivot portions 112 of the first support plate 110. For example, Figure 3 the number of the fan blades 130 is eleven and the number of the pivot portions 112 of the first support plate 110 is also eleven. The fan blades 130 are evenly arranged in the electroplating solution agitating device 100 and the pivot portions 112 of the first support plate 110 are evenly arranged on the plate body of the first support plate 110. The evenly arranged fan blades 130 and pivot portions 112 can improve the effect of agitating the electroplating solution L and one fan blade 130 is matched with one pivot portion 112 to form a mechanism for agitating the electroplating solution L.

[0056] In addition, the first support plate 110 has a first sliding rail 114. The first sliding rail 114 of the first support plate 110 can be a long strip shape, and the first portion 122 of the linkage 120 can also be a long strip shape. The first portion 122 of the linkage 120 is located in the first sliding rail 114 of the first support plate 110. The first portion 122 of the linkage 120 can move back and forth in the first sliding rail 114 of the first support plate 110. In some embodiments, the first side wall 132, the second side wall 134, and the third side wall 136 of the fan blade 130 form a stepped structure. The first side wall 132, the second side wall 134, and the third side wall 136 of the stepped structure can increase the effect of the fan blade 130 disturbing the electroplating solution L, so that the metal ions in the electroplating solution L can be evenly distributed. In addition, the third side wall 136 of the fan blade 130 is closer to the pivot portion 112 of the first support plate 110 than the first side wall 132. The first side wall 132 of the fan blade 130 can be a side wall of a vertical portion, the second side wall 134 of the fan blade 130 can be a side wall of a horizontal portion, and the third side wall 136 of the fan blade 130 can be a side wall of a vertical portion, to form a stepped structure.

[0057] In some embodiments, the first portion 122 of the linkage 120 has a first contact portion 122a. For example, the first contact portion 122a of the linkage 120 extends from the first portion 122 of the linkage 120 to the center of the fan blade 130, and the first contact portion 122a of the linkage 120 can be a cylindrical shape, but is not limited thereto. One end of the first contact portion 122a of the linkage 120 is located in the fan blade 130, and the other end is located on the first portion 122 of the linkage 120. The first contact portion 122a of the linkage 120 is used to transmit the force for moving the first portion 122 of the linkage 120 to the fan blade 130, so that the fan blade 130 moves in the electroplating solution disturbing device 100.

[0058] Figure 4 is Figure 1 A partial enlarged view of the electroplating tank device 200 in the second sliding rail 144 of the second support plate 140. Please refer to Figure 2 and Figure 4The electroplating solution disturbance device 100 further comprises a second support plate 140. The second support plate 140 is disposed relative to the first support plate 110, and the fan blade 130 is located between the second support plate 140 and the first support plate 110. The second support plate 140 has a second sliding rail 144. The second portion 124 of the linkage 120 is located in the second sliding rail 144. The second portion 124 of the linkage 120 is connected to the third portion 126 of the linkage 120. The third portion 126 of the linkage 120 drives the second portion 124 of the linkage 120 to move in the second sliding rail 144 of the second support plate 140. The second sliding rail 144 of the second support plate 140 is in a strip shape, and the second portion 124 of the linkage 120 is also in a strip shape.

[0059] In some embodiments, the second portion 124 of the linkage 120 has a second contact portion 124a. One end of the second contact portion 124a of the second portion 124 is located in the fan blade 130. For example, the second contact portion 124a of the second portion 124 of the linkage 120 is from the second portion 124 of the linkage 120 to the center of the fan blade 130, and the second contact portion 124a of the second portion 124 of the linkage 120 can be in a cylindrical shape, but is not limited thereto. The second contact portion 124a of the second portion 124 of the linkage 120 is used to transmit the force for moving the second portion 124 of the linkage 120 to the fan blade 130, so that the fan blade 130 is disturbed in the electroplating solution disturbance device 100.

[0060] Figure 5 、 Figure 6 and Figure 7 The schematic diagrams of the fan blade 130 in different positions when the electroplating tank device 200 is operated according to an embodiment of the present application. Meanwhile, referring to Figure 2 and Figure 5 to Figure 7 First, the linkage 120 has an initial position, and the fan blade 130 has an initial disturbance direction D3, that is, when the linkage 120 is located in the initial position, the fan blade 130 is opposite to the circuit board W, as shown in Figure 5As shown. Then, the plating solution L can be filled in the entire tank of the plating solution agitating device 100, and the fan blade 130 can be immersed in the plating solution L. After the fan blade 130 is immersed in the plating solution L, the push rod 210 can be pushed backward by the actuating assembly 220, and the third portion 126 of the connecting member 120 can be moved with the push rod 210 to drive the first portion 122 and the second portion 124 to move backward (the connecting member 120 moves from the initial position to the first limit position). The first portion 122 and the second portion 124 of the connecting member 120 can drive the fan blade 130 to move backward. In the process of moving backward, the fan blade 130 rotates relative to the pivot portion 112 and swings to the left to agitate the plating solution L on the left side of the circuit board W. The fan blade 130 swinging to the left makes the fan blade 130 have a first predetermined agitation direction D4, and the first included angle θ1 between the initial agitation direction D3 and the first predetermined agitation direction D4 is less than 25 degrees. The connecting member 120 moves from the initial position to the first limit position relative to the initial position.

[0061] Then, after the third portion 126 of the push rod 210 moves backward, the push rod 210 can be pushed forward by the actuating assembly 220, and the third portion 126 of the connecting member 120 can be moved forward to drive the first portion 122 of the connecting member 120 and the second portion 124 of the connecting member 120 to move (the connecting member 120 moves from the first limit position to the second limit position). The first portion 122 and the second portion 124 of the connecting member 120 can drive the fan blade 130 to move forward. In the process of moving forward, the fan blade 130 rotates relative to the pivot portion 112 and swings to the right to agitate the plating solution L on the right side of the circuit board W. The fan blade 130 swinging to the right makes the fan blade 130 have a second predetermined agitation direction D5 relative to the first predetermined agitation direction D4, and the second included angle θ2 between the initial agitation direction D3 and the second predetermined agitation direction D5 is less than 25 degrees. The connecting member 120 moves forward through the initial position and moves to the second limit position relative to the first limit position.

[0062] In some embodiments, the actuation assembly 220 pushes and pulls the push rod 210 back and forth, causing the first portion 122 of the link member 120 to move back and forth with the second portion 124 of the link member 120. The fan blade 130 can follow the first portion 122 of the link member 120 and the second portion 124 of the link member 120 to move back and forth and rotate relative to the pivot portion 112. The back-and-forth swinging of the fan blade 130 can fully disturb the plating solution L to evenly distribute the metal ions on the surface of the circuit board W. The concentration of the metal ions on the surface of the circuit board W can be made uniform by the back-and-forth swinging of the fan blade 130. In this way, when the circuit board W is powered on for plating, the uniformity of the plating film thickness of the circuit board W can be improved, thereby improving the overall plating quality. In addition, the period of the link member 120 from the initial position to the first limit position, from the first limit position to the second limit position, and from the second limit position back to the initial position is between 0.5 seconds and 1.5 seconds, for example, 1 second. In other words, the time required to complete a round of swinging of the fan blade 130 is about 1 second.

Claims

1. An electroplating fluid perturbation device, comprising: Comprising: a first support plate (110) having at least one pivot portion (112); a linkage member (120) having a first portion (122) near the at least one pivot portion (112) of the first support plate (110), and at least one leaf (130) connected to the first portion (122) of the linkage member (120) and pivoted to the at least one pivot portion (112), wherein the at least one leaf (130) is configured to be immersed in an electroplating solution (L), and the first portion (122) of the linkage member (120) drives the at least one leaf (130) to move, so that the at least one leaf (130) rotates relative to the at least one pivot portion (112) to disturb the electroplating solution (L).

2. The electroplating fluid perturbation apparatus of claim 1, wherein, The at least one leaf (130) has an initial disturbance direction (D3), and the at least one leaf (130) rotates so that the at least one leaf (130) has a first predetermined disturbance direction (D4), a first included angle (θ1) between the initial disturbance direction (D3) and the first predetermined disturbance direction (D4) is less than 25 degrees, and the at least one leaf (130) rotates so that the at least one leaf (130) has a second predetermined disturbance direction (D5) relative to the first predetermined disturbance direction (D4), a second included angle (θ2) between the initial disturbance direction (D3) and the second predetermined disturbance direction (D5) is less than 25 degrees.

3. The electroplating fluid perturbation apparatus of claim 1, wherein, The linkage member (120) has an initial position and a first limit position and a second limit position on both sides relative to the initial position, and a period from the initial position to the first limit position, from the first limit position to the second limit position, and from the second limit position back to the initial position is between 0.5 seconds and 1.5 seconds.

4. The electroplating fluid perturbation apparatus of claim 1, wherein, The number of the at least one leaf (130) corresponds to the number of the at least one pivot portion (112).

5. The electroplating fluid perturbation apparatus of claim 1, wherein, A first side wall (132), a second side wall (134), and a third side wall (136) of the at least one leaf (130) form a stepped structure.

6. The electroplating fluid perturbation apparatus of claim 5, wherein, The third side wall (136) of the at least one leaf (130) is closer to the at least one pivot portion (112) of the first support plate (110) than the first side wall (132).

7. The electroplating fluid perturbation apparatus of claim 1, wherein, The first support plate (110) has a first sliding rail (114), and the first portion (122) of the linkage member (120) is located in the first sliding rail (114).

8. The electroplating fluid perturbation apparatus of claim 1, wherein, The first portion (122) of the linkage member (120) has a first contact portion (122a), and one end of the first contact portion (122a) is located in the at least one leaf (130).

9. The electroplating fluid perturbation apparatus of claim 1, wherein, The linkage member (120) has a second portion (124), and the second portion (124) has a second contact portion (124a), and one end of the second contact portion (124a) is located in the at least one leaf (130).

10. The electroplating fluid perturbation apparatus of claim 9, wherein, Further comprising: a second support plate (140) having a second sliding rail (144), wherein the second portion (124) of the linkage member (120) is located in the second sliding rail (144).

11. An electroplating cell apparatus for use in an electroplating fluid perturbation apparatus, the electroplating cell apparatus comprising: The plating solution disturbance device (100) as claimed in any one of claims 1 to 10, further comprising a push rod (210) extending into the plating solution disturbance device (100), wherein a third portion (126) of the linkage (120) is connected to an end of the push rod (210), and the third portion (126) of the linkage (120) is connected to the first portion (122) and a second portion (124).

12. The electroplating cell apparatus of claim 11, wherein, Further comprising: an actuating assembly (220) located outside the plating solution disturbance device (100) and connected to another end of the push rod (210).

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