LED radiator and LED lamp

Abstract

The utility model belongs to the field of LED illumination, and particularly relates to an LED radiator and an LED lamp. Specifically, the LED radiator comprises an assembling part and a radiating part arranged on the assembling part in a sleeving mode, a cavity used for containing a control panel is formed in the assembling part, the radiating part is provided with a heat transfer area used for fixing an LED substrate, the radiating part and the assembling part are made of heat conduction plastic, the heat conduction coefficient of the radiating part is larger than that of the assembling part, and the assembling part is provided with a heat conduction area used for fixing the LED substrate. The assembling part is made of insulating heat-conducting plastic; and the heat dissipation part and the assembly part are integrally formed through a double-shot molding process or an insert process. According to the scheme, the radiator is simple in structure and small in size, and the requirement that the radiator is suitable for higher-power LED lamps is met.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of LED lighting, and particularly relates to an LED radiator and an LED lamp. BACKGROUND

[0002] As a lighting device with a wide range of applications, the heat dissipation effect of an LED lamp seriously restricts its service life. Conventional LED lamps need to control voltage, and thus need to be equipped with electronic components and circuits installed on a control board. For some lamps that need to be programmed to set light effects, such as intelligent control of light switches, light color and brightness adjustment, light flicker speed, time, and pattern, etc., a control board is needed. From the perspective of safety, the control board needs to be insulated from the outside world. On the one hand, it can effectively isolate the direct contact between the internal circuit and the external environment, preventing users from being accidentally electrocuted during use. On the other hand, it helps to maintain the stability of the LED control board. Specifically, in some cases, if the shell is not reliably grounded (such as no ground wire or dry environment), the shell potential may be unstable or have static problems. If the control board is directly connected to such a shell, it may damage the sensitive components on the control board.

[0003] In order to meet the insulation and heat dissipation requirements, an insulating and heat-conductive plastic shell is used as a radiator for a bulb lamp. On the one hand, it can protect the control board, and on the other hand, it can have certain heat dissipation effect, to some extent, meeting the heat dissipation requirements of low-power LED lamps. However, for high-power LED lamps, in order to meet the heat dissipation requirements, the size of the insulating and heat-conductive plastic radiator is large, resulting in an overall size that is too large.

[0004] In the prior art, a metal cup is embedded in an insulating and heat-conductive plastic shell to improve the overall heat dissipation performance of the LED lamp. However, the combination between the metal and the insulating and heat-conductive plastic material is poor, and the metal cup needs to be embedded in the insulating and heat-conductive plastic through a metal insert process. The metal cup is inside, and the insulating and heat-conductive plastic is outside. By clamping the metal edge inside the insulating and heat-conductive plastic, a rim structure is formed to ensure that the metal insert does not fall off during use. In this case, there are three ways for the LED substrate to utilize the heat dissipation effect of the metal cup: 1) the LED substrate transmits heat to the metal cup through air, and then the metal cup transmits heat to the insulating and heat-conductive plastic for heat dissipation (since the control board needs to be insulated, the conventional shell uses the same insulating and heat-conductive plastic as the position of the control board to reduce costs). However, the air heat transfer coefficient is very low, and although the air temperature in the gap will rise over a long period of time, it is difficult to quickly transfer heat to the metal cup, and the heat dissipation effect is limited; 2) the metal cup is usually in edge contact with the LED substrate with a large amount of heat (the control board and the LED substrate are basically installed in a vertical direction relative to each other, occupying a small volume), and the contact area is small, so the heat dissipation effect is not significantly improved.

[0005] There is also a metal plate designed for LED substrate in the prior art (the angle of the metal cup cannot meet the demand of bonding), however, only through the wire hole to electrically connect the LED substrate with the control panel, it leads to the installation of the control panel needs to be turned over, and the LED lamp assembly efficiency is reduced. Since the thickness of the metal plate is thin, it cannot provide the structure (such as screw column) for fixing the LED substrate. In view of this, it is more preferred to provide an additional component to provide the structure for fixing the LED substrate. In the prior art, a shell is coated outside the metal plate, and a screw column is arranged on the shell. The shell is usually made of insulating and heat-conducting plastic which is the same material as the control panel. Since the insulating and heat-conducting filler itself has low heat conduction performance, coating outside the metal plate limits the external diffusion of heat by the metal plate, so that the heat dissipation effect cannot reach the expected value. Moreover, the metal plate is located between two insulating and heat-conducting plastics, and due to the difference in the thermal expansion coefficient of the material, it is easy to crack under high and low temperature impact conditions. SUMMARY

[0006] In order to overcome one of the aforementioned problems in the prior art, the purpose of the present application is to provide a LED heat sink and a LED lamp with simple structure, small size and meeting the demand of the heat sink for higher power LED lamp, which is realized by the following technical scheme:

[0007] A LED heat sink, comprising an assembly part and a heat dissipation part sleeved on the assembly part, wherein a cavity for accommodating a control panel is arranged in the assembly part, the heat dissipation part is provided with a heat transfer area for fixing an LED substrate, the heat dissipation part and the assembly part are made of heat-conducting plastic, the heat conduction coefficient of the heat dissipation part is greater than that of the assembly part, and the assembly part is made of insulating and heat-conducting plastic; the heat dissipation part and the assembly part are integrally formed by a double-color injection molding process or an insert molding process.

[0008] Optionally, the assembly part is made of insulating and heat-conducting plastic with a heat conduction coefficient λ1 satisfying 0.5≤λ1≤3W / (m•K), and the heat dissipation part is made of heat-conducting plastic with a heat conduction coefficient λ2 satisfying λ2≥3W / (m•K).

[0009] Wherein, the heat conduction coefficient (λ) is the vertical heat conduction coefficient: tested according to the standard method of ASTM E-1461, the test condition is 80℃, and the sample thickness is 2mm.

[0010] Optionally, one or more ribs and / or undercut structures are arranged on the assembly part and / or the heat dissipation part at the position where the assembly part and the heat dissipation part are in contact, for limiting the rotation and displacement of the heat dissipation part and the assembly part from contact.

[0011] Optionally, the rib can also be a protrusion or other specific structure, which does not affect the realization of its function and is equivalent to the same feature, which belongs to the protection scope of the present application. The rib and the undercut structure can be combined to form a structure to limit the displacement.

[0012] Optionally, the assembly part is provided with a limiting ring for limiting the end position of the heat dissipation part structure during injection molding.

[0013] Optionally, the assembly part is provided with a mounting structure for fixing the control panel.

[0014] Optionally, the mounting structure includes a clamping groove for inserting and fixing the control panel.

[0015] Optionally, the mounting structure includes a horn structure to facilitate the installation of the control panel and improve the installation efficiency.

[0016] Optionally, the mounting structure further includes a limiting structure capable of limiting the installation position of the control panel. The limiting structure can be the side wall of the clamping groove, or other structures on the assembly part that hinder the movement of the control panel towards the side wall of the clamping groove, or a separate protrusion, etc. Those skilled in the art can easily think of similar structures based on the idea of the present application, which are all within the scope of protection of the present application.

[0017] Optionally, the limiting structure includes the side wall of the clamping groove.

[0018] Optionally, the mounting structure is located away from the side where the LED substrate is located. This facilitates the installation of the control panel, LED substrate and other components from the same side during installation, without the need to flip over to install different components, thereby improving the installation efficiency.

[0019] Optionally, the heat dissipation part is attached to the heat transfer area with the LED substrate through a heat-conducting adhesive, and / or the heat dissipation part fixes the LED substrate in the heat transfer area (the heat transfer area can be the position of the LED lamp bead or larger than the position of the LED lamp bead, which can be selected by those skilled in the art according to actual needs).

[0020] Optionally, the heat transfer area further includes a heat-conducting metal plate for quickly dispersing the heat of the LED substrate and improving the overall heat dissipation effect.

[0021] Optionally, the fixing mechanism includes a fixing column provided at the end of the assembly part to fix the LED substrate in the heat transfer area.

[0022] Optionally, the fixing column is in an inverted buckle structure on the side of the assembly part in contact with the heat dissipation part.

[0023] Optionally, the assembly part is provided with a wire slot and a wire hole, and the wire slot protrudes from the outer surface of the assembly part on the side of the assembly part in contact with the heat dissipation part, which can be used to limit the relative rotational displacement that may occur between the assembly part and the heat dissipation part.

[0024] Optionally, the assembly part further includes a threaded structure capable of being assembled with a metal threaded cap of a counterpart.

[0025] Optionally, it can also be a non-threaded structure, which can be installed only by cooperating with the corresponding metal cap, and it belongs to the equivalent technical features of the threaded structure of the application and is included in the protection scope of the application.

[0026] Optionally, the end of the assembly part on the side of the LED substrate is provided with a positioning structure for positioning the LED substrate and improving the installation efficiency.

[0027] Optionally, the end position of the assembly part is less than or equal to the end position of the heat dissipation part.

[0028] Optionally, the position where the assembly part contacts the heat dissipation part is a cylindrical structure.

[0029] Optionally, the heat dissipation part further comprises a plurality of fins, and the fin height gradually decreases in the direction away from the LED substrate.

[0030] The application also provides an LED lamp, and the heat sink of any one of the preceding solutions.

[0031] Optionally, the LED lamp includes a high-bay lamp, a bulb lamp, a mining lamp, a down lamp, a spotlight, an A lamp, a T lamp, and the like, and a lamp with an additional need for an insulating control panel installation.

[0032] Compared with the prior art, the application has the following beneficial effects: through the structural design of the heat dissipation part and the assembly part, and by setting the heat dissipation part and the assembly part as heat-conducting plastic, the heat conduction coefficient of the heat dissipation part is greater than that of the assembly part, the control panel is placed in the heat sink, the heat dissipation effect can be improved, it is beneficial to the heat dissipation of a larger-power LED lamp, the volume of the heat sink is reduced, and the heat sink can be injection molded through a double-color injection molding process or an insert molding process, thereby greatly improving the production efficiency. The problems that the heat conduction efficiency of the insulating heat-conducting plastic is low, a larger-power LED lamp cannot be applied, or the size of the heat sink cannot be increased to meet the heat dissipation demand in the prior art are overcome. The problem of the structural setting of the control panel installation caused by the non-insulating property of the high-heat-conduction-coefficient plastic heat sink is also solved.

[0033] Compared with the prior art, through the design scheme of the metal cup or the metal plate and the insulating heat-conducting plastic insert molding process structure, the application discards the use of the metal cup or the metal plate, and avoids the following problems caused by the metal cup or the metal plate and the insulating heat-conducting plastic insert structure: 1) the metal cup has no contact with the LED substrate or has a small contact area, and the heat dissipation effect is not obviously improved; 2) the metal cup or the metal plate is embedded in the insulating heat-conducting plastic, and due to the large difference in material and the large difference in thermal expansion coefficient between the two, the metal cup or the metal plate is prone to cracking under high and low temperature cold and hot impact conditions.

[0034] In addition, the application is more suitable for high-salt-mist, humid, acidic and alkaline environments such as offshore and chemical raw material exposed production environments. The technical problem that metal (such as aluminum and copper) cannot be used as a structural material due to high requirements for salt-mist resistance and acid-alkali resistance of LED lamps in such environments is overcome.

[0035] The application has simple structure, small size, and meets the demand of the heat sink for higher power LED lamps. BRIEF DESCRIPTION OF DRAWINGS

[0036] Figure 1 A perspective view of the LED heat sink described in Example 1;

[0037] Figure 2 A top view of the LED heat sink described in Example 1;

[0038] Figure 3 A bottom view of the LED heat sink described in Example 1;

[0039] Figure 4 A perspective view of the assembly part of the LED heat sink described in Example 1;

[0040] Figure 5 A perspective view of the heat dissipation part of the LED heat sink described in Example 1;

[0041] In the figure, the reference signs are: assembly part 1, convex rib 101, reverse buckle structure 102, wire slot 103, wire passing hole 104, fixing column 105, limiting ring 106, threaded structure 107, clamping groove 108, side wall 1081, blocking ring 109, assembly part end 110, positioning structure 111, heat dissipation part 2, heat transfer area 201, heat dissipation part end 202, fin 203. DETAILED DESCRIPTION

[0042] The specific embodiments of the application are described in detail below through examples, but the specific embodiments of the application are not intended to limit the technical solutions of the application, and any non-substantial changes to the technical solutions described in the examples of the application, such as replacement of common technical solutions in the field, are within the scope of protection of the application. Example 1

[0043] As shown in Figures 1 to 5 An LED heat sink includes an assembly part 1 and a heat dissipation part 2 sleeved on the assembly part 1. The assembly part 1 is provided with a cavity for accommodating a control board. The heat dissipation part 2 is provided with a heat transfer area 201 for fixing an LED substrate. The heat dissipation part 2 and the assembly part 1 are made of heat-conductive plastic, the heat conduction coefficient of the heat dissipation part 2 is greater than that of the assembly part 1, and the assembly part 1 is made of insulating heat-conductive plastic. The heat dissipation part 2 and the assembly part 1 are integrally formed by a double-color injection molding process or an insert molding process.

[0044] In this embodiment, the assembly part 1 is an insulating heat-conducting plastic with a thermal conductivity λ1 satisfying 0.5≤λ1≤3 W / (m•K), and the heat-dissipating part 2 is a heat-conducting plastic with a thermal conductivity λ2 satisfying λ2≥3 W / (m•K).

[0045] In this embodiment, the thermal conductivity (λ) is the vertical thermal conductivity, which is tested according to the standard method of ASTM E-1461, with a test condition of 80℃ and a sample thickness of 2mm.

[0046] Preferably, the micro-heat-conducting framework of the insulating heat-conducting plastic contains fibrous substances (such as glass fibers, carbon fibers, carbon nanotubes, etc.), which can be used in combination with heat-conducting fillers such as graphite and boron nitride. During the processing of the assembly part 1, the fibrous substances will be oriented, resulting in a much larger in-plane thermal conductivity than the vertical thermal conductivity. The present application scheme takes full advantage of this characteristic, on the one hand, reducing the high temperature of the external heat-dissipating part 2, which is directed back to the cavity inside the assembly part (the vertical thermal conductivity is relatively small), and on the other hand, fully utilizing the high in-plane thermal conductivity to quickly spread the heat on the assembly part 1 and transfer it to the outside, protecting the control board inside the cavity and improving the problem of reduced service life of the control board caused by long-term high temperature.

[0047] In this embodiment, the side wall 1081 of the assembly part 1 is a thin-walled structure. On the one hand, it reduces the material usage of the assembly part 1 and the size of the heat sink, and on the other hand, it is more conducive to the orientation of fibrous substances during the injection molding process of thin-walled materials, improving the in-plane thermal conductivity of the plane (a performance indicator of heat spreading around the part, which is different from the vertical thermal conductivity of heat penetrating the part).

[0048] If the assembly part 1 is made of conventional plastic with a thermal conductivity usually not higher than 0.5 W / (m•K), the heat in the cavity of the assembly part 1 will accumulate and cannot be dissipated during long-term use. The high temperature of the heat-dissipating part 2 is conducted back to the cavity, combined with the heat generated by the control board itself, and the accumulated heat, resulting in reduced service life of the control board.

[0049] In the embodiment, a plurality of reverse buckles and ribs 101 are arranged on the assembly part 1. In other embodiments, one or more ribs 101 and / or reverse buckle structures 102 are arranged on the assembly part 1 and / or the heat dissipation part 2 at the positions where the assembly part 1 and the heat dissipation part 2 contact, for limiting the rotation and displacement of the heat dissipation part 2 away from the assembly part 1. Arranging one or more ribs 101 and / or reverse buckle structures 102 only on the heat dissipation part 2, or arranging one or more ribs 101 and / or reverse buckle structures 102 on both the assembly part 1 and the heat dissipation part 2, which are matched with each other, all belong to the protection scope of the present application. Through the structural design, the present application can expand the realization of two-color injection molding of the high-thermal-conductivity plastic of the same resin matrix. The reason is that the high-thermal-conductivity plastic and the insulating thermal-conductivity plastic of the same resin matrix are different in the type and filling amount of the thermal-conductivity filler, so that it is difficult to realize the conventional two-color injection molding process. Generally, the two-color injection molding process requires that the melting points of the two plastic materials are different by more than 20℃, so that the first material can be melted to a certain extent during the injection molding of the second high-temperature material, and the combination of the two materials is more stable.

[0050] In other embodiments, the ribs 101 can also be protrusions or other specific structures, which do not affect the realization of the functions and are equivalent features, and belong to the protection scope of the present application.

[0051] In the embodiment, part of the ribs 101 and the reverse buckle structures 102 are combined to form a structure for limiting the rotation and displacement of the heat dissipation part 2 away from the assembly part 1.

[0052] In the embodiment, the assembly part 1 is provided with a limiting ring 106 for limiting the end position of the heat dissipation part 2 during the injection molding process.

[0053] In the embodiment, the assembly part 1 is provided with a mounting structure for fixing the control board.

[0054] In the embodiment, the mounting structure includes a clamping groove 108 for inserting and fixing the control board.

[0055] In the embodiment, the mounting structure includes a horn structure, which is convenient for mounting the control board and improves the mounting efficiency.

[0056] In the embodiment, the mounting structure further comprises a limiting structure capable of limiting the mounting position of the control board. Specifically, the limiting structure comprises a side wall 1081 of the clamping groove 108, so that the limiting structure simultaneously functions as fixing and limiting the mounting of the control board, and the structure is simple and the mounting efficiency is high. In other embodiments, other structures that hinder the control board from running towards the side wall 1081 of the clamping groove 108 on the assembly part 1 can also be provided, and a protrusion can also be provided separately, and those skilled in the art can easily think of similar structures according to the idea of the present application, which all belong to the protection scope of the present application. In the embodiment, the side wall 1081 of the clamping groove 108 and other structures that hinder the control board from running towards the side wall 1081 of the clamping groove 108 on the assembly part 1, such as the blocking ring 109, jointly serve as the limiting structure.

[0057] In the embodiment, the mounting structure is located on the side away from the LED substrate. During the mounting process, the control board, the LED substrate and other components can be mounted from the same side, without the need to turn over to mount different components, thereby improving the mounting efficiency.

[0058] In the embodiment, the mounting structure is located on the side away from the LED substrate, and the control board is mounted from the side of the cavity close to the LED substrate. The control board has a large volume and is difficult to be mounted from the screw structure 107 of the bulb, without the need to expand the size of the cavity on the side away from the LED substrate, and the cavity on the side away from the LED substrate does not need to be turned over to operate during the mounting, thereby improving the mounting efficiency. In other embodiments, the mounting structure can also be provided on the side close to the LED substrate, and the LED substrate can also be mounted from the side away from the LED substrate. When the control board is mounted from the side of the cavity away from the LED substrate, the cavity of the assembly part 1 can also be sealed at the end close to the LED substrate, and only the wire outlet hole 104 is needed.

[0059] The control board limiting part is provided on the threaded end, and can quickly guide the heat to the metal threaded cap, thereby reducing the heat transmitted to the control board by the limiting part.

[0060] In this embodiment, the heat dissipation part 2 is attached to the heat transfer area 201 (the indicated position in the figure is approximately indicated, and those skilled in the art can set different shapes and sizes of the heat transfer area 201 according to the actual structure requirements of the LED substrate, which is approximately located at the indicated position, such as the LED substrate, which can be annular, arranged around the assembly part 1, or can be sheet-shaped, covering the position of the assembly part 1 and erected on the fixed one) through the heat-conducting glue, and / or the heat dissipation part 2 fixes the LED substrate on the heat transfer area 201 through the fixing mechanism. In this embodiment, the heat transfer area 201 is larger than the position of the LED lamp bead, and in other embodiments, the heat transfer area 201 can also be the position of the LED lamp bead, or can be larger than the size of the LED substrate, which can accommodate the LED substrate. Those skilled in the art can choose according to actual needs, which belongs to the protection scope of the present application. In other embodiments, the heat transfer area 201 also includes a heat-conducting metal plate for quickly dispersing the heat of the LED substrate and improving the overall heat dissipation effect.

[0061] In this embodiment, the fixing mechanism includes a fixing column 105 arranged at the end of the assembly part 1 to fix the LED substrate on the heat transfer area 201. In other embodiments, the fixing mechanism can also not be in the form of fixing, such as the fixing mechanism being heat-conducting glue, or the fixing mechanism being a buckle structure, an insertion or embedding structure, etc. which can fix the LED substrate on the heat transfer area 201. The heat transfer area 201 can be arranged in the recess, protrusion or plane of the heat dissipation part 2, and the heat transfer area 201 can also include a metal heat-conducting plate arranged on the heat dissipation part 2. Those skilled in the art can easily understand that it belongs to the protection scope of the present application. It is preferred that the fixing column 105 is used to paste the substrate with heat-conducting glue. On the one hand, the risk of falling off increases under the condition of long-term cold and hot alternation, and on the other hand, if a heat-conducting glue with strong adhesion is used, it is not convenient to maintain and replace later. In addition, the cost of heat-conducting glue with high thermal conductivity is extremely high, and the thermal conductivity of low-cost heat-conducting glue is very low, which is difficult to balance the advantages of cost and heat dissipation performance.

[0062] In this embodiment, the fixing column 105 located on the side of the assembly part 1 in contact with the heat dissipation part 2 is a reverse buckle structure 102. On the one hand, the fixing column 105 is set to have a certain protrusion due to the structure requirement, which enhances the fixing effect of the fixing column 105, and on the other hand, the reverse buckle structure 102 can also prevent the disengagement of the assembly part 1 and the heat dissipation part 2, thereby improving the combination tightness and stability.

[0063] In this embodiment, the assembly part 1 is provided with a wire slot 103 and a wire hole 104, and the wire slot 103 protrudes from the outer surface of the assembly part 1 on the side of the assembly part 1 in contact with the heat dissipation part 2, which can be used to limit the relative rotational displacement that may occur between the assembly part 1 and the heat dissipation part 2.

[0064] In this embodiment, the assembly part 1 also includes a threaded structure 107, which can be assembled with a metal cap of the counterpart through the threaded structure 107. In other embodiments, it can also be a non-threaded structure 107, which can be installed only by cooperating with the corresponding metal cap, which belongs to the equivalent technical features of the threaded structure 107 of the present application and is included in the protection scope of the present application.

[0065] In this embodiment, the assembly part 1 is provided with a positioning structure 111 at the end on the side of the LED substrate, which is used to position the LED substrate and improve the installation efficiency.

[0066] Optionally, the position of the assembly part end 110 is less than or equal to the position of the heat dissipation part end 202. In this embodiment, the assembly part end 110 is basically level with the heat dissipation part end 202 (equal), and the depth of the assembly part 1 at the position where it contacts the heat dissipation part 2 is greater than or equal to the length after the control panel is installed, that is, it meets the requirement that the assembly part 1 protects the control panel. The problems existing in the prior art using high-thermal-conductivity plastic or metal cup are solved. In the prior art, a heat sink using high-thermal-conductivity plastic is used, but because the insulation performance of the high-thermal-conductivity plastic material is poor, there is a safety hazard when it is directly used to fix the control panel. The control panel needs to be fixed with other structures outside the heat sink, and cannot be directly in contact with the high-thermal-conductivity heat sink, which leads to complex structure, high mold cost, and low assembly efficiency. In addition, when the heat sink with the structure of high-thermal-conductivity plastic or metal cup is used, if the high-thermal-conductivity plastic or metal cup partially covers the area where the control panel is located, the heat from the LED substrate will be transferred to the control panel, which reduces the service life of the electronic components on the control panel after long-term use. If the area where the control panel is located is separately provided and separated from the structure of high-thermal-conductivity plastic or metal cup, the height (or other size) of the overall heat sink or heat dissipation shell will be greatly increased, which causes material waste and high cost. In addition, the present embodiment scheme fully utilizes the characteristics that the interfacial thermal conductivity coefficient (or the thermal conductivity coefficient in the direction of the flow of the adhesive) of the micro heat dissipation frame in the processing process of the assembly part 1 made of high-thermal-conductivity plastic material is higher than the vertical thermal conductivity coefficient (conventionally by 3-6 times, and there are thermal conductive materials that can reach a difference of 10 times), the assembly part end 110 is close to the LED substrate, and can utilize the advantage of high interfacial thermal conductivity coefficient to quickly transfer the heat (high-temperature reverse transfer from the LED substrate and the high-thermal-conductivity plastic) to the other end (also the cold end) of the assembly part 1. The other end of the assembly part 1 is not covered by the high-thermal-conductivity plastic, and directly dissipates heat to the air through air convection, or utilizes heat conduction to conduct the heat to other accessories assembled therewith for heat dissipation, such as the metal base of the bulb lamp, which is more conducive to rapid heat dissipation. On the one hand, it helps to dissipate the heat generated by the LED substrate, improves the service life of the LED substrate, and reduces the service life decay caused by heat, and on the other hand, it also improves the service life of the control panel, and avoids the reduction of the service life of the electronic components of the control panel in a high-temperature environment for a long time.

[0067] In other embodiments, the skilled in the art can set the length of the assembly end 110 shorter than the heat dissipation end 202 according to the idea of the present application, still have the function described in the present application, only the effect is slightly decreased, can block the metal cup or high thermal conductivity plastic to heat the heat through the heated air in reverse, and then affect the service life of the control panel, improve the original effect or meet the customer's cooling demand, all within the scope of the present application.

[0068] In the present embodiment, the position where the assembly part 1 contacts with the heat dissipation part 2 is a cylindrical structure, and in other embodiments, the skilled in the art can also design other structures according to the needs.

[0069] In the present embodiment, the heat dissipation part 2 further includes a plurality of fins 203, and the height of the fins 203 gradually decreases away from the LED substrate. It can guarantee the heat dissipation near the LED substrate while minimizing the size of the heat dissipation part 2.

[0070] It should be noted that the position on the heat dissipation part 2 which contacts with the assembly part 1 is matched with the structure of the assembly part 1, as shown in Figure 5 .

[0071] It should be noted that the volume resistivity of the insulating heat-conducting plastic is greater than 10 10 Ω•m. The skilled in the art can also limit according to other parameters representing insulation characteristics, without limitation, as long as it meets the safe use of the control panel.

[0072] It should be noted that the LED substrate refers to the basic structure that carries the LED chip and helps to dissipate heat. Usually, a heat dissipation structure needs to be set up to prevent performance degradation or shortened life caused by overheating. Embodiment 2

[0073] An LED lamp includes the LED heat sink in embodiment 1, and other structures such as the control panel for the bulb lamp, the LED substrate, the lamp holder, the bulb shell lamp structure are well known to the skilled in the art, which are not shown in the figure. The skilled in the art can realize the scheme according to the idea of the present application without creative labor.

[0074] In other embodiments, the LED lamp can also include high-bay lamp, bulb lamp, industrial and mining lamp, down lamp, spotlight, A lamp, T lamp, etc. The skilled in the art can use the reflector cup, lampshade and other components of each LED lamp according to the idea of the present application, without further description.

[0075] It should be noted that the components used in the above embodiments can be selected or replaced by the skilled in the art according to the needs, without going beyond the scope of the present application.

Claims

1. LED heat sink, characterized in that The LED heat sink comprises an assembling part and a heat dissipation part, the assembling part is provided with a cavity for accommodating a control board, the heat dissipation part is provided with a heat transfer area for fixing an LED substrate, the heat dissipation part and the assembling part are heat conductive plastics, the heat dissipation part has a larger heat conductivity than the assembling part, and the assembling part is an insulating heat conductive plastic; the heat dissipation part and the assembling part are integrally formed by a double-color injection molding process or an insert molding process.

2. The LED heat sink of claim 1, wherein: The assembling part is an insulating heat conductive plastic with a heat conductivity λ1 satisfying 0.5≤λ1≤3 W / (m•K), and the heat dissipation part is a heat conductive plastic with a heat conductivity λ2 satisfying λ2>3 W / (m•K).

3. The LED heat sink of claim 1, wherein: One or more ribs and / or reverse buckling structures are arranged on the assembling part and / or the heat dissipation part at the position where the assembling part and the heat dissipation part are in contact.

4. The LED heat sink of claim 1, wherein: A limiting ring is arranged on the assembling part, and the limiting ring is used for limiting the end position of the heat dissipation part structure during the injection molding process.

5. The LED heat sink of claim 1, wherein: The assembling part is provided with a mounting structure for fixing the control board, and the mounting structure comprises a clamping groove for inserting and fixing the control board, and the clamping groove is a horn-shaped structure.

6. The LED heat spreader of claim 5, wherein: The mounting structure further comprises a limiting structure for limiting the mounting position of the control board, and the limiting structure comprises the side wall of the clamping groove.

7. The LED heat spreader of claim 5, wherein: The mounting structure is located on the side away from the LED substrate.

8. The LED heat sink of claim 1, wherein: The heat transfer area further comprises a heat conductive metal plate.

9. The LED heat sink of claim 1, wherein: The heat dissipation part is attached to the heat transfer area through heat conductive glue, and / or the heat dissipation part fixes the LED substrate in the heat transfer area through a fixing mechanism.

10. The LED heat sink of claim 9, wherein: The fixing mechanism comprises a fixing column arranged at the end of the assembling part, and the fixing column fixes the LED substrate in the heat transfer area.

11. The LED heat spreader of claim 10, wherein: The fixing column located on the side where the assembling part and the heat dissipation part are in contact is a reverse buckling structure.

12. The LED heat sink of claim 1, wherein: The assembling part is provided with a wire slot and a wire hole, and the wire slot protrudes from the outer surface of the assembling part on the side where the assembling part and the heat dissipation part are in contact, and can limit the relative rotational displacement between the assembling part and the heat dissipation part.

13. The LED heat sink of claim 1, wherein: The end position of the assembling part is less than or equal to the end position of the heat dissipation part.

14. The LED heat sink of claim 1, wherein: A plurality of fins are further arranged on the heat dissipation part, and the height of the fins gradually decreases along the direction away from the LED substrate.

15. An LED lamp, characterized by: The LED heat sink comprises the LED heat sink according to any one of claims 1-14.

Images