High-voltage isolation type temperature sensor packaging structure

Abstract

The embodiment of the utility model provides a high-voltage isolation type temperature sensor packaging structure. The high-voltage isolation type temperature sensor packaging structure comprises at least one isolation type temperature sensor core body, at least one electric signal conduction piece group, at least one heat conduction piece and a plastic packaging body, each isolated temperature sensor core body is arranged on the heat conduction piece and is electrically connected with one electric signal conduction piece group; each electric signal conduction piece group comprises at least two electric signal conduction pieces; the electric signal conduction piece and the heat conduction piece are arranged at intervals; the plastic package body wraps the isolation type temperature sensor core body, part of the electric signal conduction piece and part of the heat conduction piece. A first high-voltage isolation gate is formed between the electric signal conduction piece and the heat conduction piece, and a second high-voltage isolation gate is formed between the isolation type temperature sensor core body and the heat conduction piece. The high-voltage electrical environment on one side of the temperature sensor packaging structure can be isolated through the first high-voltage isolation gate and the second high-voltage isolation gate, temperature measurement in the high-voltage electrical environment is achieved, and universality and replaceability are achieved.

Description

TECHNICAL FIELD

[0001] The embodiment of the present disclosure belongs to the technical field of temperature sensors, and particularly relates to a high-voltage isolation type temperature sensor packaging structure. BACKGROUND

[0002] In the prior art, there are thermal resistance type, thermocouple type, semiconductor type, ultrasonic type and optical type temperature sensors, among which the thermal resistance type, thermocouple type and semiconductor type have the largest market application ratio, but the temperature solution in a high-voltage electrical environment is not mature. For example, in the application of a charging pile, the data communication between a charging gun and the charging pile usually uses isolation type CAN and isolation type RS485 devices for isolation communication, which can effectively prevent the interference such as transient voltage change and electric spark generated when the charging gun is connected with or disconnected from the automobile, and provide reliable bus protection function. The voltage resistance of the isolation type bus device is usually up to 2500V, but a temperature sensor is needed to detect the temperature at the charging gun and feed back the signal to the charging pile. In order to meet the isolation voltage resistance requirement, the temperature sensor usually needs to be kept at a certain distance from the measured temperature point, which results in inaccurate temperature measurement, slow temperature response and large reserved area for temperature measurement.

[0003] The conventional temperature sensor is in the form of a temperature measurement probe. In order to improve the response speed, the temperature measurement probe needs to be in contact with the measured point. The temperature measurement probe can be a thermistor, a thermocouple or a semiconductor temperature measurement device. In order to improve the electrical resistance of the temperature measurement probe, an insulating coating or an insulating protective sleeve is usually additionally needed, which results in large product volume, low integration, high production and testing cost and low intelligentization. The optical type non-contact temperature measurement scheme has very good electrical resistance and anti-interference capability, but the system is complex, the power consumption is large and the cost is high.

[0004] In view of the above problems, it is necessary to provide a high-voltage isolation type temperature sensor packaging structure which is reasonable in design and can effectively improve the above problems. INVENTION CONTENTS

[0005] The embodiment of the present disclosure aims to at least solve one of the technical problems existing in the prior art, and provides a high-voltage isolation type temperature sensor packaging structure.

[0006] The embodiment of the present disclosure provides a high-voltage isolation type temperature sensor packaging structure, which comprises at least one isolation type temperature sensor core, at least one electric signal conducting element group, at least one heat conducting element and a plastic package body.

[0007] Each of the isolation type temperature sensor cores is arranged on the heat conducting element and electrically connected with one of the electric signal conducting element groups.

[0008] Each of the electric signal conducting element groups comprises at least two electric signal conducting elements.

[0009] The electric signal conductor is arranged apart from the heat conductor;

[0010] The plastic package body wraps the isolated temperature sensor core, part of the electric signal conductor and part of the heat conductor; wherein,

[0011] A first high-voltage isolation barrier is formed between the electric signal conductor and the heat conductor, and a second high-voltage isolation barrier is formed between the isolated temperature sensor core and the heat conductor.

[0012] Optionally, the isolated temperature sensor core comprises an isolation substrate and a temperature sensing element arranged on the isolation substrate.

[0013] Optionally, the electric signal conductor and the heat conductor are respectively located on opposite sides of the packaging structure.

[0014] Optionally, the isolated temperature sensor core further comprises a metal pad arranged on the temperature sensing element.

[0015] The temperature sensing element is electrically connected to the electric signal conductor through the metal pad.

[0016] Optionally, further comprising an electrical connector, a first end of the electrical connector being electrically connected to the isolated temperature sensor core, and a second end of the electrical connector being electrically connected to the electric signal conductor.

[0017] Optionally, the heat conductor comprises a bearing portion, a first lead-out portion extending from the bearing portion in a direction away from the isolated temperature sensor core, and a first support portion extending horizontally outward from the first lead-out portion; wherein,

[0018] The bearing portion is provided with the isolated temperature sensor core, and the first lead-out portion and the first support portion both extend out of the plastic package body.

[0019] Optionally, there are two or more heat conductors, and the bearing portions of at least two of the heat conductors are integrated.

[0020] Optionally, the electric signal conductor comprises an electrical connection portion, a second lead-out portion extending from the electrical connection portion in a direction away from the isolated temperature sensor core, and a second support portion extending horizontally outward from the second lead-out portion.

[0021] The electrical connection portion is electrically connected to the isolated temperature sensor core, and the second lead-out portion and the second support portion both extend out of the plastic package body.

[0022] Optionally, a heat-conducting adhesive layer is further included, and the isolation type temperature sensor core is fixed to the heat conduction member through the heat-conducting adhesive layer.

[0023] Optionally, the material of the heat-conducting adhesive layer is one of conductive glue, sintered silver material or insulating glue.

[0024] The high-voltage isolation type temperature sensor packaging structure of the embodiment of the present disclosure can isolate the high-voltage electrical environment on the heat conduction member side of the temperature sensor packaging structure, so that the high-voltage region does not harm the circuit and components in the low-voltage region including the isolation type temperature sensor core, realizes temperature measurement in a high-voltage electrical environment, provides a solution for temperature measurement in a high-voltage electrical environment, and has universality and replaceability; no additional isolation member is needed, the structure is simple, the volume of the high-voltage isolation type temperature sensor packaging structure is reduced, and the cost of high-voltage environment isolation temperature measurement is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a sectional view of a high-voltage isolation type temperature sensor packaging structure of the embodiment of the present disclosure;

[0026] Figure 2 is a plan view of a high-voltage isolation type temperature sensor packaging structure of the embodiment of the present disclosure;

[0027] Figure 3 is a structural schematic diagram of the dielectric distance in the first voltage-withstanding path of the embodiment of the present disclosure;

[0028] Figure 4 is a structural schematic diagram of the dielectric distance in the second voltage-withstanding path of the embodiment of the present disclosure. DETAILED DESCRIPTION

[0029] In order for those skilled in the art to better understand the technical solutions of the embodiments of the present disclosure, the embodiments of the present disclosure are further described in detail below with reference to the drawings and specific embodiments.

[0030] As shown in Figure 1 and Figure 2 , the embodiment of the present disclosure provides a high-voltage isolation type temperature sensor packaging structure 100, which includes at least one isolation type temperature sensor core 110, at least one electrical signal conduction member group, at least one heat conduction member 130 and a plastic package 140.

[0031] Each isolation type temperature sensor core 110 is arranged on the heat conduction member 130 and electrically connected with one electrical signal conduction member group.

[0032] Each of the groups of electrical signal conductors includes at least two electrical signal conductors 120 responsible for the input and output of signals of the isolated temperature sensor core 110.

[0033] The electrical signal conductors 120 are spaced apart from the heat conductors 130.

[0034] In the present embodiment, the electrical signal conductors 120 are used for the input and output of electrical signals of the isolated temperature sensor core 110, and play a role of conducting electrical signals with other circuits and / or components in a low-voltage area. The other end of the heat conductors 130 away from the isolated temperature sensor core 110 is in contact with a measured point in a high-voltage electrical environment in use, so that heat conduction between the isolated temperature sensor core 110 and the measured point is achieved to realize the measurement of the temperature of the measured point, and the heat conductors 130 play a role of conducting heat. Meanwhile, the heat conductors 130 also play a role of supporting the isolated temperature sensor core 110 thereon, and support the entire packaging structure.

[0035] It should be noted that the specific number of the electrical signal conductors 120 is not limited in the present embodiment, and can be selected according to actual needs, as long as the input and output of signals of the isolated temperature sensor core 110 can be realized. The arrangement of each of the electrical signal conductors 120 can be the same, and it is also possible that in actual use, it is not necessary to distinguish which one is the input end and which one is the output end. When a plurality of isolated temperature sensor cores 110 are arranged in the same packaging structure (packaging cavity), each of the isolated temperature sensor cores 110 should have corresponding electrical signal conductors 120 for input and output signals.

[0036] It should be further noted that in the present embodiment, the isolated temperature sensor core 110 can be obtained by batch production through MEMS process or semiconductor process. The isolated temperature sensor core 110 has a certain isolation voltage resistance due to the isolation substrate.

[0037] The plastic package 140 wraps the isolated temperature sensor core 110, part of the electrical signal conductors 120 and part of the heat conductors 130, and plays a role of protecting the isolated temperature sensor core 110, part of the electrical signal conductors 120 and part of the heat conductors 130. In the present embodiment, the material of the plastic package 140 can be epoxy resin plastic sealing material.

[0038] A first high-voltage isolation barrier is formed between the electrical signal conductors 120 and the heat conductors 130, and a second high-voltage isolation barrier is formed between the isolated temperature sensor core 110 and the heat conductors 130.

[0039] Specifically, when the high-voltage isolation type temperature sensor packaging structure 100 is used for temperature measurement in a high-voltage electrical environment, the heat conducting element 130 is placed in a high-voltage area, that is, in a high-voltage electrical environment; the isolation type temperature sensor core 110 and the electrical signal conducting element 120 are placed in a low-voltage area, that is, in a low-voltage electrical environment. Since the first high-voltage isolation barrier is formed between the electrical signal conducting element 120 and the heat conducting element 130, the first high-voltage isolation barrier can isolate the electrical high voltage at the heat conducting element 130, ensuring that the circuit and components connected to the electrical signal conducting element 120 in the low-voltage electrical environment are not affected by the electrical high voltage. Similarly, since the second high-voltage isolation barrier is formed between the isolation type temperature sensor core 110 and the heat conducting element 130, the second high-voltage isolation barrier can isolate the electrical high voltage at the heat conducting element 130, ensuring that the isolation type temperature sensor core 110 in the low-voltage electrical environment is not affected by the electrical high voltage, thereby realizing temperature measurement of the high-voltage isolation type temperature sensor packaging structure 100 in a high-voltage electrical environment.

[0040] The high-voltage isolation type temperature sensor packaging structure of the embodiments of the present disclosure uses IC packaging technology to package the isolation type temperature sensor core into a standard plastic package, and forms a high-voltage isolation barrier between the electrical signal conducting element and the heat conducting element, and forms a high-voltage isolation barrier between the temperature sensor core and the heat conducting element. The high-voltage isolation barrier can isolate the high-voltage electrical environment on the heat conducting element side of the temperature sensor packaging structure, so that the high-voltage area does not harm the low-voltage area, realizing temperature measurement in a high-voltage electrical environment, providing a solution for temperature measurement in a high-voltage electrical environment, and having universality and replaceability. The high-voltage isolation type temperature sensor packaging structure does not need to additionally increase isolation members, has a simple structure, reduces the volume of the high-voltage isolation type temperature sensor packaging structure, reduces the cost of high-voltage environment isolation temperature measurement, reduces the complexity of subsequent application scenarios, saves the area of the application scenarios, and helps to improve the integration and reliability of the application scenarios.

[0041] For example, the isolation type temperature sensor core 110 includes an isolation substrate and a temperature sensing element disposed on the isolation substrate. The isolation substrate of the isolation type temperature sensor core 110 is fixed to the heat conducting element 130.

[0042] Specifically, the isolation substrate is used to isolate the temperature sensing element disposed on the upper surface of the isolation substrate from the high-voltage electrical environment below the isolation substrate, protecting the temperature sensing element from being damaged by the electrical high voltage. At the same time, the isolation substrate is used for heat conduction between the temperature sensing element and the heat conducting element 130. The voltage resistance of the isolation substrate determines the isolation capability of the final isolation type temperature sensor core 110, and the thermal conductivity of the isolation substrate determines the temperature measurement response rate of the final isolation type temperature sensor core 110. By providing the isolation substrate, the isolation type temperature sensor core 110 itself has a certain isolation voltage resistance.

[0043] In the embodiment, the material of the isolation substrate can be one of insulating glass, insulating ceramic, insulating crystal, insulating single element, insulating polymer organic matter, silicon on sapphire, silicon on glass, and silicon on insulator.

[0044] It should be noted that the material of the isolation substrate is not limited to the above-mentioned materials, and other materials can also be used as long as the function of isolating high voltage can be achieved. The material can be selected according to actual needs, and the embodiment of the present disclosure is not specifically limited.

[0045] It should be further noted that in the embodiment, the temperature sensing element can be a thermocouple, a thermal resistor, a thermistor, or a semiconductor temperature sensing element, and the sensitive mechanism of the temperature sensing element to temperature is not limited to thermal resistance, thermistor, thermocouple, thermal-optic effect, and semiconductor device thermal effect. The specific structure of the temperature sensing element can be selected according to actual needs, and the embodiment of the present disclosure is not specifically limited.

[0046] For example, as shown in FIG. 1, the high-voltage isolation type temperature sensor packaging structure 100 includes an isolation type temperature sensor core 110 and an electrical signal conductor 120. Figure 1 The electrical signal conductor 120 and the heat conductor 130 are located on opposite sides of the packaging structure, respectively. Specifically, as shown in FIG. 1, the electrical signal conductor 120 and the heat conductor 130 are located on the left and right sides of the packaging structure, respectively. Figure 1 The electrical signal conductor 120 and the heat conductor 130 are located on opposite sides of the packaging structure, respectively. Specifically, as shown in FIG. 1, the electrical signal conductor 120 and the heat conductor 130 are located on the left and right sides of the packaging structure, respectively.

[0047] For example, as shown in FIG. 1, the high-voltage isolation type temperature sensor packaging structure 100 includes an isolation type temperature sensor core 110 and an electrical signal conductor 120. Figure 2 The isolation type temperature sensor core 110 further includes a metal pad 111 disposed on the temperature sensing element, and the temperature sensing element is electrically connected to the electrical signal conductor 120 through the metal pad 111.

[0048] For example, as shown in FIG. 1, the high-voltage isolation type temperature sensor packaging structure 100 includes an isolation type temperature sensor core 110 and an electrical signal conductor 120. Figures 1 to 4 The high-voltage isolation type temperature sensor packaging structure 100 further includes an electrical connector 150, a first end of the electrical connector 150 is electrically connected to the isolation type temperature sensor core 110, and a second end of the electrical connector 150 is electrically connected to the electrical signal conductor 120. Specifically, as shown in FIG. 1, the first end of the electrical connector 150 is electrically connected to the metal pad 111 of the isolation type temperature sensor core 110. Figure 2 In the embodiment, the electrical connector 150 can be but is not limited to a bonding wire.

[0049] Specifically, the electrical signal generated by the temperature sensing element is led out to the electrical signal conductor 120 through the metal pad 111 and the electrical connector 150 in sequence, and is led out to the outside of the packaging structure through the electrical signal conductor 120.

[0050] For example, as shown in FIG. 1, the high-voltage isolation type temperature sensor packaging structure 100 includes an isolation type temperature sensor core 110 and an electrical signal conductor 120. Figure 1As shown, the heat conducting member 130 includes a bearing part 131, a first leading-out part 132 extending from the bearing part 131 to a direction away from the isolated temperature sensor core 110, and a first supporting part 133 extending horizontally from the first leading-out part 132 to an outer side.

[0051] The bearing part 131 is provided with the isolated temperature sensor core 110. The first leading-out part 132 and the first supporting part 133 both extend out of the plastic package 140, and in addition to the function of conducting heat, they also support the isolated temperature sensor core 110 and the entire packaging structure.

[0052] For example, in the embodiment, two or more heat conducting members 130 are included, and the bearing parts 131 of at least two heat conducting members 130 are integrated. Specifically, as shown in Figure 2 In the embodiment, two heat conducting members 130 are included, two first leading-out parts 132 and two first supporting parts 133 are included, and the two heat conducting members share one bearing part 131, which can also be regarded as the bearing parts 131 of the two heat conducting members being integrated. Specifically, in other embodiments, only one heat conducting member 130 can be provided.

[0053] In the embodiment, the heat conducting member 130 can be, but is not limited to, a metal pin.

[0054] For example, as shown in Figure 1 The electrical signal conducting member 120 includes an electrical connection part 121, a second leading-out part 122 extending from the electrical connection part 121 to a direction away from the isolated temperature sensor core 110, and a second supporting part 123 extending horizontally from the second leading-out part 122 to an outer side.

[0055] The electrical connection part 121 is electrically connected with the isolated temperature sensor core 110. The second leading-out part 122 and the second supporting part 123 both extend out of the plastic package, and in addition to the function of conducting electrical signals, they also support the entire packaging structure.

[0056] Specifically, as shown in Figure 2 In the embodiment, the high-voltage isolated temperature sensor packaging structure 100 includes two electrical signal conducting members 120, and correspondingly, two electrical connecting members 150 and two metal pads 111. The two ends of the electrical connecting member 150 are respectively bonded and connected with the corresponding metal pad 111 and the electrical signal conducting member 120.

[0057] In the embodiment, the electrical signal conducting member 120 can be, but is not limited to, a metal pin.

[0058] For example, as shown in Figure 1 and Figure 2As shown, the high-voltage isolation type temperature sensor packaging structure 100 further comprises a heat-conducting adhesive layer 160, and the isolation type temperature sensor core 110 is fixed to the heat-conducting member 130 through the heat-conducting adhesive layer 160.

[0059] Specifically, the material of the heat-conducting adhesive layer 160 can be one of conductive glue, sintered silver material or insulating glue. Of course, the heat-conducting adhesive layer 160 can also adopt other materials, and the present embodiment is not limited in this regard, and can be selected according to actual needs.

[0060] The specific structure of the high-voltage isolation type temperature sensor packaging structure 100 of the present embodiment will be further described below in combination with specific embodiments.

[0061] In the present embodiment, the high-voltage isolation barrier actually refers to isolating the low-voltage region from the high-voltage region, so that the high-voltage region does not harm the low-voltage region. For example, the voltage in the high-voltage region can be several hundred to several thousand volts, while the low-voltage region is usually a region with a voltage of about 3V-5V or so for computing and data processing functions. Obviously, the components in the low-voltage region cannot withstand the voltage of several hundred to several thousand volts at all. In order to avoid the influence of such high voltage, the size of the dielectric strength of different materials and the distance of the part involved in the packaging structure need to be considered according to the creepage distance during packaging, so as to achieve high isolation withstand voltage.

[0062] Specifically, in the present embodiment, the high-voltage isolation type temperature sensor packaging structure 100 has three withstand voltage paths. The isolation withstand voltage value of each withstand voltage path ≥ the isolation withstand voltage value of the high-voltage isolation type temperature sensor packaging structure. Wherein, the isolation withstand voltage value = dielectric strength of medium x dielectric distance. When the withstand voltage path includes multiple segments of medium, the isolation withstand voltage value corresponding to each segment of the withstand voltage path needs to be calculated and added to obtain the isolation withstand voltage value corresponding to the withstand voltage path.

[0063] It should be noted that in the high-voltage isolation type temperature sensor packaging structure, the distance of each withstand voltage path is a necessary condition to ensure its isolation withstand voltage. There are multiple discharge paths that can be broken down in the packaging structure, which is equivalent to multiple paths in parallel. If one path is lower than the required value, it will cause voltage breakdown. Therefore, the isolation withstand voltage capacity of the packaging structure should be determined by the withstand voltage path with the lowest isolation withstand voltage. In order to ensure that the packaging structure has high voltage withstand characteristics, the isolation withstand voltage value of all withstand voltage paths needs to be calculated to ensure that the isolation withstand voltage value of all withstand voltage paths is higher than the withstand voltage capacity of the packaging structure, and the dielectric distance of each withstand voltage path is determined according to the isolation withstand voltage value.

[0064] As shown in FIG. 1, the high-voltage isolation type temperature sensor packaging structure 100 comprises a heat-conducting member 130, an isolation type temperature sensor core 110 and a high-voltage isolation barrier 120. Figure 3 and Figure 4As shown, in the embodiment, the isolation substrate material of the isolation type temperature sensor core 110 is taken as an example of aluminum nitride, so that the dielectric strength of aluminum nitride is 23V / μm, the dielectric strength of air is 3V / μm, and the dielectric strength of plastic packaging material is 15V / μm. To achieve the target isolation withstand voltage value of 2500V of the high-voltage isolation type temperature sensor packaging structure 100 satisfying the above structure, it generally includes a first withstand voltage path in the horizontal direction and a second withstand voltage path in the vertical direction. The first withstand voltage path determines the withstand voltage between the electrical signal conductor 120 and the heat conductor 130, and the structure involved corresponds to the first high-voltage isolation gate. The second withstand voltage path determines the withstand voltage between the isolation type temperature sensor core 110 and the heat conductor 130, and the structure involved corresponds to the second high-voltage isolation gate. The above withstand voltage paths need to satisfy the following physical distances:

[0065] As shown in Figure 3 the first withstand voltage path in the horizontal direction, its isolation withstand voltage value = X1×Y1≥ the isolation withstand voltage value of the packaging structure. Wherein X1 is the minimum distance between the electrical signal conductor 120 and the heat conductor 130, and Y1 is the dielectric strength of the plastic packaging material filled between the electrical signal conductor 120 and the heat conductor 130. To achieve the target isolation withstand voltage value of 2500V of the packaging structure, X1≥200μm can be set. That is, when the minimum distance between the electrical signal conductor 120 and the heat conductor 130 is set to be greater than or equal to 200μm, the isolation withstand voltage value of the first withstand voltage path can be greater than the target isolation withstand voltage value of the packaging structure.

[0066] As shown in Figure 4 the second withstand voltage path, since in the vertical direction, the dielectric strength of the aluminum nitride material is greater than the dielectric strength of the plastic packaging material, the withstand voltage value in the vertical direction of the second withstand voltage path depends on the withstand voltage path along the plastic packaging material, and its isolation withstand voltage value = T1×Y1≥ the isolation withstand voltage value of the packaging structure. Wherein T1 is the thickness of the isolation substrate, that is, the minimum distance from the temperature sensing element to the heat conductor 130, and Y1 is the dielectric strength of the plastic packaging material filled between the temperature sensing element and the heat conductor 130. To achieve the target isolation withstand voltage value of 2500V of the packaging structure, T1≥200μm. That is, when the minimum distance between the temperature sensing element and the heat conductor 130 is set to be greater than or equal to 200μm, that is, the thickness of the isolation substrate of the isolation type temperature sensor core 110 should be greater than or equal to 200μm, the isolation withstand voltage value of the second withstand voltage path can be greater than the target isolation withstand voltage value of the packaging structure.

[0067] In summary, in the present embodiment, only when the first voltage-withstanding path and the second voltage-withstanding path simultaneously satisfy X1≥200μm and T1≥200μm, the high-voltage isolation type temperature sensor packaging structure 100 with the isolation substrate material being aluminum nitride can achieve the target isolation voltage-withstanding value of 2500V.

[0068] It can be understood that the above embodiments are only exemplary embodiments adopted for illustrating the principles of the embodiments of the present disclosure, and the embodiments of the present disclosure are not limited thereto. Various modifications and improvements can be made by those of ordinary skill in the art without departing from the spirit and essence of the embodiments of the present disclosure, and these modifications and improvements are also considered as the protection scope of the embodiments of the present disclosure.

Claims

1. A high-voltage isolated temperature sensor package structure, characterized by, The package structure comprises at least one isolated temperature sensor core, at least one electric signal conducting element group, at least one heat conducting element and a plastic package body. Each of the isolated temperature sensor cores is arranged on the heat conducting element and electrically connected with one of the electric signal conducting element groups. Each of the electric signal conducting element groups comprises at least two electric signal conducting elements. The electric signal conducting elements are arranged apart from the heat conducting elements. The plastic package body wraps the isolated temperature sensor cores, part of the electric signal conducting elements and part of the heat conducting elements. First high-voltage isolation barriers are formed between the electric signal conducting elements and the heat conducting elements, and second high-voltage isolation barriers are formed between the isolated temperature sensor cores and the heat conducting elements, so as to isolate the high-voltage electrical environment on the side of the heat conducting elements. The package structure further comprises a heat-conducting adhesive layer, and the isolated temperature sensor cores are fixed on the heat conducting elements through the heat-conducting adhesive layer.

2. The package structure of claim 1, wherein, The isolated temperature sensor cores comprise an isolation substrate and a temperature sensing element arranged on the isolation substrate.

3. The package structure of claim 1, wherein, The electric signal conducting elements and the heat conducting elements are respectively arranged on opposite sides of the package structure.

4. The package structure of claim 2, wherein, The isolated temperature sensor cores further comprise a metal pad arranged on the temperature sensing element. The temperature sensing element is electrically connected with the electric signal conducting elements through the metal pad.

5. The package structure of any one of claims 1 to 4, wherein, The package structure further comprises an electric connector, a first end of the electric connector is electrically connected with the isolated temperature sensor cores, and a second end of the electric connector is electrically connected with the electric signal conducting elements.

6. The package structure of any one of claims 1 to 4, wherein, The heat conducting element comprises a bearing portion, a first lead-out portion extending from the bearing portion and away from the isolated temperature sensor cores, and a first support portion extending horizontally from the first lead-out portion. The bearing portion is arranged with the isolated temperature sensor cores, and the first lead-out portion and the first support portion both extend out of the plastic package body.

7. The package structure of claim 6, wherein, The package structure comprises two or more heat conducting elements, and the bearing portions of at least two of the heat conducting elements are integrated.

8. The package structure of any one of claims 1 to 4, wherein, The electric signal conducting element comprises an electric connection portion, a second lead-out portion extending from the electric connection portion and away from the isolated temperature sensor cores, and a second support portion extending horizontally from the second lead-out portion. The electric connection portion is electrically connected with the isolated temperature sensor cores, and the second lead-out portion and the second support portion both extend out of the plastic package body.

9. The package structure of any one of claims 1 to 4, wherein, The material of the heat-conducting adhesive layer is one of conductive glue, sintered silver material or insulating glue.

Images