COF binding structure for display module
By designing COF test pins and conduction lines on the COF module, the problem of poor pin alignment in the COF bonding structure was solved, enabling effective connection detection between the COF module and the LCD module and FPC module, and improving the reliability and detection efficiency of the bonding structure.
Patent Information
- Application Number
- CN202422807935.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-18
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2034-11-18
AI Technical Summary
In full-screen display technology, the PIN pins of the COF binding structure are difficult to align accurately, resulting in poor binding. Existing technologies make it difficult to effectively detect the connection and conductivity between the COF module, LCD module, and FPC module.
Design a COF test pin on the COF module and corresponding test components on the LCD module and FPC module to connect the COF test pin with the upper and lower binding bits. Connect the pins of the LCD and FPC through the conductive lines to realize continuity detection.
Continuity testing ensures the connection status of the COF module with the LCD and FPC modules, preventing defective products from flowing into the next process and improving the reliability of the bonding structure and testing efficiency.
Smart Images
Figure CN223461760U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to COF technical field especially relates to a COF binding structure for display module. BACKGROUND
[0002] With the progress of display technology, the full screen has become the hot spot of market pursuit. Limited by the current technology, the full screen refers to the screen ratio that can reach more than 90%, and the display panel with ultra-narrow frame design. The hard OLED full screen requires the panel lower frame size design to be smaller and smaller (i.e. OLB width decreases). OLB refers to the area of liquid crystal display panel used to joint drive (Drive) IC and FPC, in order to realize larger screen ratio, the joint width of OLB needs to be reduced, and COF process can meet this design requirement.
[0003] Among them, COF is CHIP ON FILM, which is to place the drive chip on the film. Generally, one end of COF is first bound to the ITO glass in the LCD, and the other end of COF is bound to the FPC. However, due to the very small COF pitch, it is necessary to prevent the normal alignment between the PIN pins after binding expansion. In addition, this structure requires COF to complete two bindings, because it is easy to cause the binding to be out of position. Therefore, how to detect the bound COF is a technical problem to be solved by those skilled in the art. Therefore, the present application provides a COF binding structure for display module. UTILITY MODEL CONTENT
[0004] Therefore, it is necessary to solve the above technical problems, provide a COF binding structure for display module, design COF test PIN on COF module, and design corresponding test components on LCD module and FPC module respectively. In this way, conduction test can be carried out after COF module binding is completed.
[0005] In order to solve the above technical problems, the utility model adopts the following technical scheme:
[0006] A COF binding structure for display module, comprising:
[0007] COF module, the top and bottom of the COF module are respectively provided with upper binding position and lower binding position;
[0008] LCD module, which has an LCD binding end, the LCD module is bound and connected with the upper binding position of the COF module through the LCD binding end;
[0009] FPC module, which has an FPC binding end, the FPC module is bound and connected with the lower binding position of the COF module through the FPC binding end;
[0010] COF test PINs distributed on the COF module and in communication with the upper and lower binding positions;
[0011] LCD lead-out PINs provided in the LCD binding end and in communication with the COF test PINs on the upper binding position;
[0012] FPC lead-out PINs provided in the FPC binding end and in communication with the COF test PINs on the lower binding position.
[0013] Further, the LCD lead-out PINs have left and right groups, and each group of the LCD lead-out PINs specifically includes two parallel LCD PINs, and the two adjacent LCD PINs are in communication through an upper wire on the LCD module.
[0014] Further, the left and right groups of the LCD lead-out PINs are distributed on the two sides of the LCD binding end.
[0015] Further, the COF test PINs have left and right groups, and each group of the COF test PINs includes two adjacent communication lines.
[0016] Further, the two ends of the communication lines are connected to the corresponding pins of the upper and lower binding positions.
[0017] The pins in the upper binding position connected to the communication lines correspond to the positions of the LCD PINs in the LCD module.
[0018] Further, the FPC lead-out PINs have left and right groups, and each group of the FPC lead-out PINs specifically includes two parallel FPC PINs.
[0019] Further, the pins in the lower binding position connected to the communication lines are arranged correspondingly to the FPC PINs.
[0020] Further, the four FPC PINs are connected to lower wires.
[0021] Further, the four lower wires extend away from the FPC binding end and form test inflection points.
[0022] Further, the four test inflection points are respectively formed with a first test point, a second test point, a third test point and a fourth test point.
[0023] Compared with the prior art, the present application has the following advantages:
[0024] The COF binding structure for the display module provided by the utility model carries out the design of COF measuring PIN foot on the COF module, makes it connect with the upper binding position and the lower binding position of two ends, so in the process of connecting with LCD module and FPC module respectively, can carry out corresponding connection with the corresponding LCD leading PIN foot and FPC leading PIN foot, thereby can carry out detection on FPC leading PIN foot, if the on-off condition is completed in the detection process, then can determine that the COF module is connected with the on-off of LCD module and FPC module. BRIEF DESCRIPTION OF DRAWINGS
[0025] Figure 1 The structural schematic diagram of the COF binding structure for the display module provided by the utility model is provided.
[0026] Figure 2 The structural schematic diagram of the LCD module of the COF binding structure for the display module provided by the utility model is provided.
[0027] Figure 3 The structural schematic diagram of the COF binding structure for the display module provided by the utility model is provided. Figure 2 The enlarged structural schematic diagram of A in the utility model is provided.
[0028] Figure 4 The structural schematic diagram of the COF module of the COF binding structure for the display module provided by the utility model is provided.
[0029] Figure 5 The structural schematic diagram of the FPC module of the COF binding structure for the display module provided by the utility model is provided.
[0030] Figure 6 The structural schematic diagram of the FPC PIN of the COF binding structure for the display module provided by the utility model is provided.
[0031] Figure 7 The enlarged structural schematic diagram of B in the utility model is provided. Figure 1 The enlarged structural schematic diagram of C in the utility model is provided.
[0032] Figure 8 The enlarged structural schematic diagram of C in the utility model is provided. Figure 1
[0033] The mark in the drawing is as follows:
[0034] COF module 1, upper binding position 11, lower binding position 12, COF test PIN foot 13;
[0035] On-off circuit 130;
[0036] LCD module 2, LCD binding end 21, LCD lead PIN 22;
[0037] LCD PIN 220, upper line body 221;
[0038] FPC module 3, FPC binding end 31, FPC lead PIN 32;
[0039] FPC PIN 320, lower line body 321, test inflection point 322, first test point 323, second test point 324, third test point 325, fourth test point 326. DETAILED DESCRIPTION
[0040] In order to make the person skilled in the art better understand the utility model scheme, the technical scheme in the utility model embodiments will be clearly and completely described below in conjunction with the drawings in the utility model embodiments. Obviously, the described embodiments are only a part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor should belong to the protection scope of the utility model.
[0041] As described in the background, wherein COF, CHIP ON FILM, is to place the driving chip on the film, generally one end of COF is first bound on the ITO glass in the LCD, and the other end of COF is bound on the FPC, but because the COF pitch is very small, it is necessary to prevent whether the PIN between the binding expansion is normal, in addition, this structure COF needs to complete two bindings, it is necessary to detect whether the binding is conducted before completing the module electrical measurement assembly, so as to prevent the defective products from flowing into the next post.
[0042] In order to solve this technical problem, the utility model provides a COF binding structure for display module, which is applied to COF.
[0043] Specifically, please refer to Figures 1-8 The COF binding structure for display module specifically comprises:
[0044] COF module 1, which is provided with upper binding position 11 and lower binding position 12 on the top and bottom of the COF module 1 respectively;
[0045] LCD module 2, which is provided with LCD binding end 21, the LCD module 2 is bound and connected with the upper binding position 11 of the COF module 1 through the LCD binding end 21;
[0046] FPC module 3, having FPC binding end 31 on it, the FPC module 3 is connected with the lower binding position 12 of the COF module 1 through the FPC binding end 31;
[0047] COF test PIN 13, which is distributed on the COF module 1 and is in communication with the upper binding position 11 and the lower binding position 12;
[0048] LCD lead-out PIN 22, which is arranged in the LCD binding end 21 and is in communication with the COF test PIN 13 on the upper binding position 11;
[0049] FPC lead-out PIN 32, which is arranged in the FPC binding end 31 and is in communication with the COF test PIN 13 on the lower binding position 12.
[0050] The COF binding structure for display module provided by the utility model, the design of COF test PIN 13 on COF module 1 makes it connected with the upper binding position 11 and the lower binding position 12 at both ends, so that in the process of being connected with LCD module 2 and FPC module 3 respectively, it can be connected with the corresponding LCD lead-out PIN 22 and FPC lead-out PIN 32 on it, so that it can be detected on FPC lead-out PIN 32, if the communication is completed in the detection process, then it can be determined that COF module 1 is connected with LCD module 2 and FPC module 3 and communicated.
[0051] In order to enable the personnel in the technical field to better understand the utility model scheme, the technical scheme in the embodiment of the utility model will be clearly and completely described below in combination with the drawings.
[0052] It should be noted that the embodiments in the utility model and the features and technical schemes in the embodiments can be combined with each other without conflict.
[0053] It should be noted that: similar signs and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.
[0054] Please refer to Figures 1-8 As shown in the figure, a COF binding structure for display module, comprising: COF module 1, the upper binding position 11 and the lower binding position 12 are arranged on the top and bottom of the COF module 1 respectively;
[0055] LCD module 2, having LCD binding end 21 on it, the LCD module 2 is connected with the upper binding position 11 of the COF module 1 through the LCD binding end 21;
[0056] FPC module 3, having FPC binding end 31 on it, the FPC module 3 is connected with the lower binding position 12 of the COF module 1 through the FPC binding end 31;
[0057] COF test PIN 13, distributed on the COF module 1 and in communication with the upper binding position 11 and the lower binding position 12;
[0058] LCD lead-out PIN 22, provided in the LCD binding end 21 and in communication with the COF test PIN 13 on the upper binding position 11;
[0059] FPC lead-out PIN 32, provided in the FPC binding end 31 and in communication with the COF test PIN 13 on the lower binding position 12.
[0060] The COF binding structure for display module provided in embodiment 1 is further optimized, specifically, as shown in the figure, Figure 4 the LCD lead-out PIN 22 has two groups of left and right, and each group of the LCD lead-out PIN 22 specifically includes two parallel LCD PINs 220, and the two adjacent LCD PINs 220 are connected in communication through an upper line body 221 on the LCD module 2, and the upper line body 221 is in communication with the glass surface in the LCD module 2, and does not affect the subsequent connection of the LCD PIN 220 with the COF module 1;
[0061] The two groups of the LCD lead-out PIN 22 are distributed on the two sides of the LCD binding end 21, and by arranging the LCD lead-out PIN 22 on the two sides of the LCD binding end 21, the binding connection of the LCD binding end 21 of the LCD module 2 itself with the COF module 1 below can not be affected, and at the same time, the outermost side can be detected in the subsequent detection process, so that if the outermost side is detected without problem, the PIN inside can also be determined to be connected in communication;
[0062] The COF test PIN 13 has two groups of left and right, and each group of the COF test PIN 13 includes two adjacent communication lines 130;
[0063] The two ends of the communication line 130 are respectively connected in communication with the corresponding pins of the upper binding position 11 and the lower binding position 12, and the pins connected with the upper binding position 11 and the lower binding position 12 are also arranged on the two sides of the upper binding position 11 and the lower binding position 12, so that the LCD lead-out PIN 22 in the corresponding LCD module and the FPC lead-out PIN 32 in the FPC module 3 are corresponded, and the pins in the upper binding position 11 connected with the communication line 130 are corresponded with the positions of the LCD PIN 220 in the LCD module 2;
[0064] The FPC leading PIN 32 has two groups, and each group of the FPC leading PIN 32 specifically includes two FPC PINs 320 arranged in parallel;
[0065] The pin connected with the conduction circuit 130 in the lower binding position 12 is arranged correspondingly with the FPC PIN 320;
[0066] The four FPC PINs 320 are connected with lower line bodies 321, and the state of the COF module 1 connected with the LCD module 2 and the FPC module 3 can be directly tested through the lower line bodies 321;
[0067] The four lower line bodies 321 extend in a direction away from the FPC binding end 31 and are formed with test inflection points 322, through the design of the test inflection points 322, a plurality of test points can be extended in different directions, and the plurality of test points are arranged in different positions with a certain spacing, so that the plurality of test points are prevented from being in series during subsequent testing, and the accuracy of the test is ensured.
[0068] The COF binding structure for the display module provided in Embodiments 1 or 2 is further optimized, as shown in Figures 1-3 The ends of the four test inflection points 322 are respectively formed with a first test point 323, a second test point 324, a third test point 325 and a fourth test point 326, the COF module 1 and the LCD module 2 and the FPC module 3 are connected in conduction through ACF, and as long as whether the first test point 323, the second test point 324, the third test point 325 and the fourth test point 326 are short-circuited is detected, it can be determined whether the COF module 1 is completely connected in conduction with the LCD module 2 and the FPC module 3;
[0069] And since the LCD PIN 220, the conduction circuit 130 and the FPC PIN 320 in the embodiment are all expanded and bound outside the original binding PIN, the purpose of such arrangement is that if the PINs connected in the test are completely connected in conduction, it can be determined that the COF module 1 is also completely connected in conduction with the LCD module 2 and the FPC module 3.
[0070] In the present application, unless otherwise clearly defined and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected or in communication with each other; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements, unless otherwise clearly defined. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0071] Obviously, the above-described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The preferred embodiments of the present application are shown in the drawings, but do not limit the patent scope of the present application. The present application can be realized in many different forms, and conversely, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing specific embodiments, or equivalently replace some of the technical features. Any equivalent structure made by using the content of the present application specification and drawings, directly or indirectly used in other related technical fields, is also within the patent protection scope of the present application.
Claims
1. A COF binding structure for a display module, characterized in that: It includes: The COF module (1) is provided with an upper binding position (11) and a lower binding position (12) at the top and bottom of the COF module (1) respectively; The LCD module (2) has an LCD binding end (21) thereon, and the LCD module (2) is connected with the upper binding position (11) of the COF module (1) through the LCD binding end (21); The FPC module (3) has an FPC binding end (31) thereon, and the FPC module (3) is connected with the lower binding position (12) of the COF module (1) through the FPC binding end (31); The COF test PIN (13) is distributed on the COF module (1) and communicates with the upper binding position (11) and the lower binding position (12); The LCD lead-out PIN (22) is arranged in the LCD binding end (21) and is in communication with the COF test PIN (13) on the upper binding position (11); The FPC lead-out PIN (32) is arranged in the FPC binding end (31) and is in communication with the COF test PIN (13) on the lower binding position (12). 2.The COF bonding structure for a display module according to claim 1, wherein, The LCD lead-out PIN (22) has left and right groups, and each group of the LCD lead-out PIN (22) specifically includes two parallel LCD PINs (220). 3.The COF bonding structure for a display module according to claim 2, wherein, The left and right groups of the LCD lead-out PIN (22) are distributed on the two sides of the LCD binding end (21). 4.The COF bonding structure for a display module according to claim 1, wherein, The COF test PIN (13) has left and right groups, and each group of the COF test PIN (13) includes two adjacent design communication lines (130). 5.The COF bonding structure for a display module according to claim 4, wherein, The two ends of the communication line (130) are respectively connected with the pins of the corresponding upper binding position (11) and lower binding position (12) in communication; The pin in the upper binding position (11) connected with the communication line (130) corresponds to the position of the LCD PIN (220) in the LCD module (2). 6.The COF bonding structure for a display module according to claim 5, wherein, The FPC lead-out PIN (32) has left and right groups, and each group of the FPC lead-out PIN (32) specifically includes two parallel FPC PINs (320). 7.The COF bonding structure for a display module according to claim 6, wherein, The pin in the lower binding position (12) connected with the communication line (130) is correspondingly arranged with the FPC PIN (320). 8.The COF bonding structure for a display module according to claim 7, wherein, Four FPC PINs (320) are connected with lower lines (321). 9.The COF bonding structure for a display module according to claim 8, wherein, Four lower lines (321) extend away from the FPC binding end (31) and form test inflection points (322). 10.The COF bonding structure for a display module according to claim 9, wherein, The ends of the four test inflection points (322) respectively form a first test point (323), a second test point (324), a third test point (325) and a fourth test point (326).