Electromagnetic shielding packaging structure
By providing a ground pin on the package substrate that extends to the side and connects to the electromagnetic shielding layer, the problems of package structure complexity and manufacturing difficulty are solved, and the effect of simplified design and cost reduction is achieved.
Patent Information
- Application Number
- CN202422656999.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2034-10-31
AI Technical Summary
In the prior art, traditional metal packaging covers and fences lead to complex packaging structures, increasing the occupied area and height. At the same time, the internal design and manufacturing of the packaging structure are difficult, and the grounding treatment of the shielding layer increases the difficulty of packaging.
The ground pin of the package substrate is extended to the side to connect to the electromagnetic shielding layer. The conductive pin and the shielding layer are isolated by the solder mask layer. The electromagnetic shielding layer is formed by the sputtering process, which simplifies the design of the inner metal lead of the package substrate.
It achieves good conduction effect, reduces the production cost of the packaging substrate, and improves design efficiency and product development cycle.
Smart Images
Figure CN223462228U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of semiconductor package, concretely relates to an electromagnetic shielding package structure. BACKGROUND
[0002] SIP package (System In a Package) plays an important role in thin, integrated more functions of device, but this also leads to the increase of internal circuit of package, and the complex package structure usually causes EMI (Electromagnetic interference) problem, in order to effectively suppress EMI, shielding needs to be used as a solution. Traditional metal package cover and metal fence, cavity shielding etc. due to the need of specific area connection, usually will cause greater area and height, adopt sputter coating process to form shielding layer, have the advantages such as film layer thickness controllable. The existing scheme of grounding treatment to shielding layer, usually from the inside design of package structure guide line is exposed to product side and shielding layer contact, the above scheme increases the design and manufacturing difficulty of package structure. UTILITARY MODEL CONTENT
[0003] The utility model provides an electromagnetic shielding package structure in view of the deficiency of prior art.
[0004] In order to realize above-mentioned purpose, the technical scheme of the utility model is as follows:
[0005] An electromagnetic shielding package structure includes a package substrate, a chip module, a plastic package body and an electromagnetic shielding layer,
[0006] The package substrate is provided with a rewiring structure, the chip module and the plastic package body are arranged on the front surface of the package substrate, the chip module is connected with the rewiring structure, and the plastic package body covers the chip module.
[0007] The electromagnetic shielding layer is arranged on the surface of the plastic package body and the side surface of the package substrate.
[0008] The back surface of the package substrate is provided with a solder resist layer and a plurality of pins, the pins include ground pins and conductive pins, wherein the conductive pins and the electromagnetic shielding layer are separated by the solder resist layer, and the end of the ground pin extends to the back surface of the package substrate and is connected with the electromagnetic shielding layer.
[0009] Optionally, the distance between the conductive pin and the electromagnetic shielding layer is greater than 25 μm.
[0010] Optionally, the pins are embedded in the solder resist layer, and at least part of the surface of each pin is exposed on the back surface of the packaging substrate, wherein the end of the grounding pin is exposed on the side surface of the packaging substrate.
[0011] Optionally, the surface of the pin is flush with or recessed relative to the surface of the solder resist layer.
[0012] Optionally, the grounding pin extends along the back surface of the packaging substrate to the side surface, and the end of the side surface is exposed on the side surface of the packaging substrate close to the back surface.
[0013] Optionally, part of the surface of the grounding pin is covered with the solder resist layer to form at least two back-exposed areas, wherein the end of at least one back-exposed area is exposed on the side surface of the packaging substrate close to the back surface.
[0014] Optionally, the electromagnetic shielding layer is a sputtered metal layer with a thickness of 0.1-10 μm.
[0015] Optionally, the electromagnetic shielding layer is a stainless steel / copper / stainless steel stack or a copper / stainless steel stack.
[0016] Optionally, the chip module includes a plurality of chips, the front surface of the packaging substrate is provided with a pad of the re-distribution structure, and the chips are electrically connected to the pad by wire bonding or stud bumping.
[0017] Optionally, the thickness of the pin is 0.5-5 μm.
[0018] The electromagnetic shielding packaging structure has the following advantages:
[0019] The grounding pin is arranged on the back surface of the packaging substrate and connected to the electromagnetic shielding layer, thereby achieving good conduction effect, simplifying the design of the inner-layer metal lead of the packaging substrate, reducing the manufacturing cost of the packaging substrate, and improving the design efficiency and product development cycle. BRIEF DESCRIPTION OF DRAWINGS
[0020] Figure 1 FIG. 4 is a side view of an electromagnetic shielding packaging structure according to an embodiment;
[0021] Figure 2 FIG. 5 is a bottom view of the electromagnetic shielding packaging structure according to the embodiment;
[0022] Figure 3 FIG. 6 is a side view of an electromagnetic shielding packaging structure according to another embodiment;
[0023] Figure 4 FIG. 7 is a bottom view of the electromagnetic shielding packaging structure according to the other embodiment;
[0024] Figure 5A side view of an electromagnetic shielding package structure of another embodiment. DETAILED DESCRIPTION
[0025] The utility model will be further explained below in connection with the drawings and specific embodiments. The drawings of the utility model are only schematic and are non-preferential for illustrating the utility model. The specific proportions can be adjusted according to the design requirements. The relative position of the components in the figures described in the specification and the definition of the front / back, which should be understood by those skilled in the art, refer to the relative position of the components, so they can be reversed to show the same components, which should be included in the scope disclosed in the specification.
[0026] Reference Figure 1 And Figure 2 The electromagnetic shielding package structure of the embodiment includes a package substrate 1, a chip module 2, a plastic package body 3 and an electromagnetic shielding layer 4. The package substrate 1 is internally provided with a rewiring structure 11, the front surface is provided with a plurality of pads 12 connected to the rewiring structure 11, and the back surface is provided with a solder resist layer 14 and a plurality of pins 13 connected to the rewiring structure 11. The chip module 2 is arranged on the front surface of the package substrate 1, and the chip module 2 includes a plurality of chips, for example, chips 2a, 2b and 2c, which are respectively electrically connected to the pads 12. The plastic package body 3 covers the chip module 2 and covers the front surface of the package substrate 1, and the electromagnetic shielding layer 4 is arranged on the surface of the plastic package body 3 and the side surface of the package substrate 1. The pins 13 include ground pins 131 and conductive pins 132, wherein the conductive pins 132 are separated from the electromagnetic shielding layer 4 by the solder resist layer 14, and the ends of the ground pins 131 extend to the back surface of the package substrate 1 and are electrically connected to the peripheral electromagnetic shielding layer 4.
[0027] The material of the packaging substrate 1 mainly includes copper metal, BT resin, ABF material, nickel gold, etc. The rewiring structure 11 is a metal wire formed by spacing the insulating base material of the packaging substrate to form a wire. The solder resist layer 14 is an insulating material, such as epoxy resin, build-up film, etc., which can be the same as or different from the insulating base material of the packaging substrate. In an embodiment, the back surface of the packaging substrate 1 is a plane, and the different pins 13 are spaced by the solder resist layer 14 and have a flush surface, i.e., the pins 13 can be considered to be embedded in the solder resist layer 14 and exposed on the back surface. The ground pin 131 extends along the back surface to the end exposed on the side of the packaging substrate 1 near the back surface, and the conductive pin 132 is surrounded by the solder resist layer 14. The electromagnetic shielding layer 4 is a metal layer formed by a sputtering process, and its material is, for example, a metal material such as a stainless steel / copper / stainless steel stack or a copper / stainless steel stack, etc., with a thickness of 0.1-10 μm, sputtered on the surface of the plastic package 3 and the side of the packaging substrate 1 to achieve electromagnetic shielding. On the side of the packaging substrate 1, the electromagnetic shielding layer 4 is sputtered on the surface of the end of the ground pin 131 exposed on the side of the packaging substrate 1 near the back surface to achieve grounding. In addition, it is sputtered on the surface of the insulating base material of the packaging substrate and the solder resist layer 14, i.e., the rewiring structure 11 inside the packaging substrate 1 is spaced by the insulating base material from the electromagnetic shielding layer 4, and the conductive pin 132 is isolated from the electromagnetic shielding layer 4 by the solder resist layer 14 to prevent metal overflow short circuit. To achieve better isolation effect, the distance between the edge of the conductive pin 132 and the electromagnetic shielding layer 4 is preferably greater than 25 μm.
[0028] The pin 13 is a patterned metal layer embedded in the solder resist layer 14, such as copper nickel palladium gold, copper palladium gold metal, with a thickness of 0.5-5 μm. In an embodiment, the thickness of the patterned metal layer is the same as the thickness of the solder resist layer 14 to form a flat structure. Thus, on the side of the packaging substrate 1, the metal layer with a thickness of 0.5-5 μm is electrically connected with the electromagnetic shielding layer 4 to achieve good grounding effect.
[0029] Reference Figure 3 and Figure 4 In another embodiment, the surface of the ground pin 133 in a partial region is provided with a solder resist layer 14. For ease of description, the solder resist layer 14 covering the surface of the ground pin 133 is referred to as the solder resist portion 14a. When the back surface of the packaging substrate 1 is preferably a plane, the ground pin 133 has a first back surface exposed region 133a and a second back surface exposed region 133b separated by the solder resist portion 14a. The end side of the second back surface exposed region 133b is electrically connected with the electromagnetic shielding layer 4, and the connection region between the first back surface exposed region 133a and the second back surface exposed region 133b is buried inside the packaging substrate 1 through the solder resist portion 14a to satisfy the separate connection of the independent terminals on the terminal mainboard and also to reduce the soldering area to reduce the risk of solder overflow, with flexible design.
[0030] Reference Figure 5 In yet another embodiment, the height of the solder resist layer 14 is greater than the height of the pins 13, that is, on the back surface of the packaging substrate 1, the surface of the pins 13 is recessed relative to the surface of the solder resist layer 14, the ground pin 134 is a horizontally extending structure, and the surface is provided with a solder resist part 15 formed of solder resist material to form at least two back surface exposed areas, and the height of the solder resist part 15 can be the same as the height of the solder resist layer 14 protruding relative to the ground pin 134. In this embodiment, the recessed structure can effectively isolate the pins, further ensure the separate connection of the pins and the terminal main independent terminal, and prevent the overflow of solder during welding.
[0031] In the packaging process, the chip module 2 is first bonded to the front surface of the packaging substrate 1, and the pads 12 can include wire pads, die pads, bump pads, etc., and the corresponding bonding connection mode is adopted according to the chip structure. For example, the chip 2a is connected to the wire pad by the wire 5, the chip 2b and the chip 2c are connected by the bump pad, wherein the chip 2b is a WLP chip, the chip 2c is a stacked structure based on TSV, etc., in addition, other conventional chip structures can also realize corresponding connection. After the bonding of the chip module 2 is completed, the plastic encapsulation material is wrapped to form a plastic encapsulation body 3, and then the surface is sputtered to form an electromagnetic shielding layer 4, which is connected with the ground pins 131, 133 and 134 to realize grounding and has good conduction effect. As a comparative example, when the packaging substrate 1 is not provided with the ground pin extending to the edge from the back surface, the metal layer lead of the redistribution structure inside the packaging substrate needs to be exposed or the upper and lower metal layers of the side surface metal through hole are connected in series, which has great process difficulty.
[0032] The above embodiments are only used to further illustrate the electromagnetic shielding packaging structure of the present application, but the present application is not limited to the embodiments, and any simple modification, equivalent change and modification according to the technical essence of the present application to the above embodiments all fall within the protection scope of the technical scheme of the present application.
Claims
1. An electromagnetic shielding packaging structure, comprising a packaging substrate, a chip module, a plastic package and an electromagnetic shielding layer, characterized in that: the packaging substrate is provided with a redistribution structure, the chip module and the plastic package are arranged on the front surface of the packaging substrate, the chip module is connected with the redistribution structure, and the plastic package covers the chip module; the electromagnetic shielding layer is arranged on the surface of the plastic package and the side surface of the packaging substrate; the back surface of the packaging substrate is provided with a solder resist layer and a plurality of pins, the pins include ground pins and conductive pins, wherein the conductive pins and the electromagnetic shielding layer are separated by the solder resist layer, and the ends of the ground pins extend to the side surface of the packaging substrate to connect with the electromagnetic shielding layer; the distance between the conductive pins and the electromagnetic shielding layer is greater than 25 μm; the pins are embedded in the solder resist layer, and at least part of the surface of each pin is exposed on the back surface of the packaging substrate, wherein the ends of the ground pins are exposed on the side surface of the packaging substrate; the surface of the pins is flush with or concave relative to the surface of the solder resist layer; the ground pins extend along the back surface of the packaging substrate to the side surface, and the ends of the ground pins exposed on the side surface are close to the side of the back surface of the packaging substrate; part of the surface of the ground pins is covered with the solder resist layer to form at least two back-exposed areas, wherein the ends of at least one back-exposed area exposed on the side surface are close to the side of the back surface of the packaging substrate; the electromagnetic shielding layer is a sputtered metal layer with a thickness of 0.1-10 μm; the electromagnetic shielding layer is a stainless steel / copper / stainless steel stack or a copper / stainless steel stack; the chip module includes a plurality of chips, the front surface of the packaging substrate is provided with pads of the redistribution structure, and the chips are electrically connected with the pads by wire bonding or stud bumping; and the thickness of the pins is 0.5-5 μm. 2. The electromagnetic shield package structure of claim 1, wherein: 3. The electromagnetic shield package structure of claim 1, wherein: 4. The electromagnetic shield package structure of claim 3, wherein: 5. The electromagnetic shield package structure of claim 3, wherein: 6. The electromagnetic shield package structure of claim 3, wherein: 7. The electromagnetic shield package structure of claim 1, wherein: 8. The electromagnetic shield package structure of claim 7, wherein: 9. The electromagnetic shield package structure of claim 1, wherein: 10. The electromagnetic shield package structure of claim 1, wherein:
Citation Information
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