Bonding device

Abstract

The bonding device may include: a stage on which a display panel and a data driving portion disposed on the display panel are arranged, and having a plane defined by a first direction and a second direction intersecting the first direction; a heating part disposed on the stage and including a pulse heater; and a pressing part directly arranged on the lower surface of the heating part.

Description

TECHNICAL FIELD

[0001] The present utility model relates to a bonding device and a manufacturing method of a display device using the same. BACKGROUND

[0002] Electronic devices (smartphones, digital cameras, notebook computers, navigation devices, and smart TVs, etc.) that provide images to users include display devices for displaying images. The display devices generate images and provide the images to users through display screens.

[0003] The display device includes a display panel that displays images. The display panel includes a plurality of gate lines, a plurality of data lines, and a plurality of pixels connected to the plurality of gate lines and the plurality of data lines.

[0004] The display panel can be connected with a data driving part that provides an electrical signal required for image display to the gate lines or the data lines. SUMMARY

[0005] The present utility model aims to provide a bonding device that prevents a light emitting element layer and an anti-reflection layer from being damaged by heat when a display panel and a circuit board are bonded.

[0006] The present utility model aims to provide a bonding device that shortens the time of a bonding process of a display panel and a circuit board.

[0007] The bonding device according to an embodiment of the present utility model can include a stage on which a display panel and a data driving part disposed on the display panel are disposed and which has a plane defined by a first direction and a second direction intersecting the first direction, a heating part disposed on the stage and including a pulse heater, and a pressing part directly disposed on a lower surface of the heating part.

[0008] The manufacturing method of a display device according to an embodiment of the present utility model includes a step of disposing a display panel, a data driving part disposed on the display panel, and a conductive adhesive disposed between the display panel and the data driving part on a stage, a step of driving a power source of a heating part disposed on the stage to increase a temperature of a pressing part directly disposed on a lower surface of the heating part to a set temperature, and a step of moving the pressing part toward the stage to pressurize the data driving part, wherein the pressing part is directly disposed on the lower surface of the heating part, the heating part includes aluminum nitride, and the pressing part can include at least any one of super-hard alloy or silicon carbide.

[0009] According to the embodiment of the present utility model, it is possible to prevent the temperature of each of a light emitting element layer and an anti-reflection layer spaced apart from the heating part including the pulse heater by a specified distance from being increased higher than the set temperature, thereby preventing the light emitting element layer and the anti-reflection layer from being damaged by heat.

[0010] According to embodiments of the present application, since the heating portion includes a pulse heater, the pressurizing portion disposed below the heating portion can be easily heated to a set temperature. Accordingly, the time of a bonding process of the display panel and the circuit board can be shortened. BRIEF DESCRIPTION OF DRAWINGS

[0011] Figure 1 is a perspective view of a bonding apparatus according to embodiments of the present application.

[0012] Figure 2a is Figure 1 a perspective view of a pressurizing portion shown in FIG. 1. Figure 2b and Figure 2c is a perspective view of a pressurizing portion according to another embodiment.

[0013] Figure 3 is a perspective view of a display apparatus including a display panel manufactured using Figure 1 the bonding apparatus shown in FIG. 1.

[0014] Figure 4a and Figure 4b is Figure 3 an exploded perspective view of a display apparatus shown in FIG. 1.

[0015] Figure 5 is Figure 4a a cross-sectional view of a display module shown in FIG. 1.

[0016] Figure 6 is Figure 5 a plan view of a display panel shown in FIG. 1.

[0017] Figure 7 is a perspective view showing a partial region of a second non-bending area NBA2 shown in FIG. 1. Figure 6

[0018] Figure 8a to 8c is a graph for describing a method of manufacturing a display apparatus using Figure 1 the bonding apparatus shown in FIG. 1. Figure 3

[0019] Figure 9 is a bonding apparatus according to a comparative embodiment.

[0020] Figure 10 is a graph for describing a temperature of a second conductive adhesive member varying with time.

[0021] Figure 11 is a graph for describing a temperature of a second conductive adhesive member when repeatedly operating a heating portion according to embodiments of the present application.

[0022] Figure 12 ​​is a graph for describing a temperature of a position spaced apart from the pressurizing portion by a specified distance.

[0023] Figure 13a and Figure 13b is a graph for describing a display panel and a data driving portion according to an embodiment of the present application.

[0024] Figure 14a and Figure 14b is a graph for describing a bonding apparatus according to an embodiment of the present application.

[0025] Explanation of Reference Numerals

[0026] BTA: Bonding Apparatus

[0027] HBP: Heating Portion

[0028] PP: Pressurizing Portion

[0029] STG: Stage

[0030] BS: Support Portion

[0031] CP: Cooling Portion

[0032] DC: Data Driving Portion

[0033] DP: Display Panel DETAILED DESCRIPTION

[0034] In the present specification, when a certain constituent element (or region, layer, part, etc.) is referred to as being "on", "connected to", or "joined to" another constituent element, it means that the constituent element can be directly disposed on, directly connected / joined to, or a third constituent element can be disposed therebetween.

[0035] The same reference numerals refer to the same constituent elements. In addition, in the drawings, the thickness, proportions, and sizes of the constituent elements are exaggerated for the purpose of effectively describing the technical content. "And / or" includes one or more combinations of the relevant constituent elements.

[0036] The first, second, and the like terms can be used to describe various constituent elements, but the above-described constituent elements should not be limited to the above-described terms. The above-described terms are used only for the purpose of distinguishing one constituent element from another constituent element. For example, a first constituent element can be named a second constituent element, and similarly, a second constituent element can be named a first constituent element, without departing from the scope of the present application. Unless explicitly described otherwise, the expression of the singular includes the expression of the plural.

[0037] Further, terms such as "below," "lower," "above," "upper" and the like are used to describe the relative relationship of the constituent elements shown in the drawings. The above terms are relative concepts, and are described based on the direction shown in the drawings.

[0038] It should be understood that the terms "comprising" or "having" and the like are intended to specify the presence of stated features, numbers, steps, operations, constituent elements, components, or combinations thereof, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, constituent elements, components, or combinations thereof.

[0039] Unless otherwise defined, all terms used in the present specification, including technical terms and scientific terms, have the same meaning as those generally understood by one of ordinary skill in the art to which the present application pertains. In addition, terms such as those defined in a generally used dictionary are to be interpreted to have meanings consistent with the meanings in the context of the relevant technology, and are not to be interpreted to have ideal or excessively formal meanings unless explicitly defined in the present specification.

[0040] Hereinafter, embodiments of the present application will be described with reference to the accompanying drawings.

[0041] Figure 1 is a perspective view of a joining device according to an embodiment of the present application. Figure 2a is Figure 1 is a perspective view of a pressing portion shown in FIG. 1. Figure 2b and Figure 2c is a perspective view of a pressing portion according to another embodiment.

[0042] Referring to FIG. 2, Figure 1 The joining device BTA can include a table STG, a support portion BS, a pressing portion PP, a heating portion HBP, and a cooling portion CP. The table STG can be a partial shape of a rectangular parallelepiped. When viewed from a planar surface, an upper surface of the table STG can be a rectangular shape having a long side extending in a first direction DR1 and a short side extending in a second direction DR2 intersecting the first direction DR1. However, the shape of the table STG is not limited thereto, but can have various shapes.

[0043] Hereinafter, a direction substantially perpendicularly intersecting a plane defined by the first direction DR1 and the second direction DR2 is defined as a third direction DR3. In the present specification, "when viewed from a planar surface" can mean a state of being observed from the third direction DR3.

[0044] The upper surface of the table STG can be defined with a plurality of adsorption holes VFH. The adsorption holes VFH can be arranged in the first direction DR1 and the second direction DR2.

[0045] Although not shown, the stage STG can be connected to a motor, so that the suction hole VFH can be switched to a vacuum state. As the suction hole VFH is switched to the vacuum state, the display panel DP to be described below can be fixed to the stage STG. Figure 8a

[0046] The heating part HBP can be disposed at an upper portion of the stage STG. Exemplarily, the heating part HBP is shown in a cuboid shape, but the shape of the heating part HBP is not limited thereto.

[0047] The heating part HBP can be a pulse heater. Although not shown, the inside of the heating part HBP can include a coil. Although not shown, when a current flows through the coil by an external power source, heat energy can be generated in the coil.

[0048] The outer surface of the heating part HBP can include aluminum nitride (AlN) having a relatively high heat transfer rate. The heat energy generated in the coil can be transferred to the pressurizing part PP through the outer surface of the heating part HBP including the aluminum nitride (AlN). The heating part HBP will be described in detail below.

[0049] The pressurizing part PP can be disposed below the heating part HBP. The pressurizing part PP can be directly disposed on the lower surface of the heating part HBP. The pressurizing part PP can be directly connected to the heating part HBP. In the present specification, "constituent A is directly disposed on constituent B" means that no additional layer is disposed between the constituent A and the constituent B. The pressurizing part PP can be disposed between the heating part HBP and the stage STG.

[0050] The pressurizing part PP can receive heat from the heating part HBP. Accordingly, the temperature of the pressurizing part PP can increase. The pressurizing part PP can transfer heat to the circuit board CB (refer to Figure 7 ) and the conductive adhesive member ACF (refer to Figure 7 ) to be described below. The pressurizing part PP can apply pressure to the conductive adhesive member ACF (refer to Figure 7 ).

[0051] The pressurizing part PP can include cemented carbides (WC) or silicon carbide (SiC). The thermal conductivity of the pressurizing part PP can be 100 W / mK to 120 W / mK. For example, the thermal conductivity of the pressurizing part PP can be 110 W / mK. The coefficient of thermal expansion of the pressurizing part PP can be 6 ppm / ℃ to 7 ppm / ℃. For example, the coefficient of thermal expansion of the pressurizing part PP can be 6.2 ppm / ℃. For example, the specific heat capacity of the pressurizing part PP can be 0.2 J / gK. Exemplarily, the hardness of the pressurizing part PP can be 68 HRC to 81.5 HRC. Exemplarily, the density of the pressurizing part PP can be 15 g / cm 2 .​

[0052] Referring to Figure 1 and Figure 2a The pressing portion PP can include a plate PT1 and a pressing tip PT2 arranged on a lower surface of the plate PT1. The plate PT1 can be arranged directly on a lower surface of the heating portion HBP. A first thickness TH1 defined by a length of the plate PT1 in the third direction DR3 can be constant.

[0053] The pressing tip PT2 can be arranged on the lower surface of the plate PT1. The pressing tip PT2 can be arranged adjacent to one of two sides of the plate PT1 opposite to each other in the first direction DR1. The one of the two sides of the plate PT1 opposite to each other in the first direction DR1 can be defined as a side adjacent to the stage STG. The pressing tip PT2 can extend in the third direction DR3 from the lower surface of the plate PT1. The pressing tip PT2 can be substantially integrally formed with the plate PT1.

[0054] The pressing tip PT2 can be parallel to a plane defined by the second direction DR2 and the third direction DR3 when viewed in the first direction DR1. The pressing tip PT2 can extend longer in the second direction DR2 than in the third direction DR3.

[0055] A length of the pressing tip PT2 in the second direction DR2 can be less than a length of the plate PT1 in the second direction DR2. A length of the pressing tip PT2 in the first direction DR1 can be less than a length of the plate PT1 in the first direction DR1.

[0056] A second thickness TH2 defined by a length of the pressing tip PT2 in the third direction DR3 can be the same as the first thickness TH1 defined by a length of the plate PT1 in the third direction DR3. Exemplarily, the first thickness TH1 and the second thickness TH2 can be 2 mm in size, respectively.

[0057] Referring to Figure 2b , a thickness of the plate PT1a can be variable. The thickness of the plate PT1a can be smaller as going from one side of the plate PT1a toward the other side of the plate PT1a. The thickness of the one side of the plate PT1a can be greater than the thickness of the other side of the plate PT1a. Hereinafter, a first thickness TH1a can be defined as the thickness of the one side of the plate PT1a. A third thickness TH3 can be defined as the thickness of the other side of the plate PT1a.

[0058] As the thickness of the first thickness TH1a increases, a rigidity of the one side of the plate PT1a can increase. Accordingly, the pressing portion PPa can not be deformed when a pressure is applied to the data driving portion DC (Referring to Figure 8b ).

[0059] The second thickness TH2a of the pressurizing tip PT2a can be less than the first thickness TH1a and the third thickness TH3 of the plate PT1a. Exemplarily, the first thickness TH1a can be 3mm, the second thickness TH2a can be 1mm, and the third thickness TH3 can be 2mm.

[0060] Referring to Figure 2c , the thickness of the plate PT1b can be constant. The first thickness TH1b of the plate PT1b can be greater than the second thickness TH2 of the pressurizing tip PT2. Exemplarily, the first thickness TH1b can be 5mm, and the second thickness TH2 can be 2mm.

[0061] As the thickness of the first thickness TH1b is increased compared to Figure 2a the first thickness TH1 of the plate PT1, the rigidity of the plate PT1b can be increased. Accordingly, the pressurizing portion PPb can not be deformed when pressure is applied to the data driving portion DC (refer to Figure 8b ).

[0062] Referring to Figure 1 , the cooling portion CP can be disposed on the stage STG. The cooling portion CP can cool heat generated from the heating portion HBP to prevent transmission to the upper portion.

[0063] The cooling portion CP can include a first cooling portion CP1, a second cooling portion CP2, and a third cooling portion CP3, which are sequentially stacked from the lower portion to the upper portion. The first cooling portion CP1 can be disposed on the upper surface of the heating portion HBP. Exemplarily, the first cooling portion CP1 can include a ceramic heat insulation material.

[0064] The second cooling portion CP2 can be disposed on the first cooling portion CP1. Although not shown, the second cooling portion CP2 can be connected to an external turbine to cool heat by air.

[0065] The third cooling portion CP3 can be disposed on the second cooling portion CP2. The lower portion of the third cooling portion CP3 can be defined with a plurality of grooves GR. The grooves GR can be arranged in the third direction DR3. Accordingly, the surface area outside the third cooling portion CP3 is increased, so that the amount of heat transmission caused by convection can be increased, and heat can be rapidly cooled.

[0066] The support portion BS can be disposed adjacent to one of the two sides of the stage STG opposite to each other in the first direction DR1. The one of the two sides of the stage STG opposite to each other in the first direction DR1 can be defined as the side adjacent to the pressurizing portion PP.

[0067] When the pressurizing portion PP applies pressure to the data driving portion DC (refer to Figure 8b ) and the display panel DP (refer to Figure 8b) when pressure is applied, the support portion BS may play a role in supporting the data driving portion DC and the lower portion of the display panel DP.

[0068] Although not shown, the bonding apparatus BTA may further include a driving unit. The driving unit may be arranged on the cooling unit CP to move the cooling unit CP, the heating unit HBP, and the pressurizing unit PP in the third direction DR3. The cooling unit CP prevents the driving unit from receiving heat from the heating unit HBP.

[0069] Figure 3 It is the use of Figure 1 A perspective view of a display device including a display panel manufactured by the bonding device shown. Figure 4a and Figure 4b yes Figure 3 An exploded perspective view of the display device shown.

[0070] Reference Figure 3 In this specification, a mobile phone terminal is exemplified as the display device DD. The display device DD according to the present invention can be applied to large electronic devices such as televisions and monitors, as well as small and medium-sized electronic devices such as tablets, car navigation systems, game consoles, and smart watches.

[0071] The display device DD may have a rectangular shape on a plane having long sides extending in the first direction DR1 and short sides extending in the second direction DR2 . However, the display device DD is not limited thereto and may have various shapes on a plane such as a circle or a polygon.

[0072] The display device DD may display an image IM through a display surface DD-IS. As an example of the image IM, an icon image is shown. The display surface DD-IS may be parallel to a surface defined by the first direction DR1 and the second direction DR2.

[0073] The display surface DD-IS may include a display area DD-DA that displays an image IM and a non-display area DD-NDA adjacent to the display area DD-DA. The non-display area DD-NDA may be an area where no image is displayed. However, the present invention is not limited thereto, and the non-display area DD-NDA may be adjacent to either side of the display area DD-DA or may be omitted.

[0074] Reference Figure 4a and Figure 4b , the display device DD may include a window WM, a display module DM, an anti-reflection layer POL, and a receiving member BC.

[0075] The window WM may be arranged on the upper portion of the display module DM and may transmit an image provided by the display module DM to the outside. The window WM may include a transmission area TA and a non-transmission area NTA. The transmission area TA may be aligned with the display module DM.Figure 3 The display region DD-DA is overlapped as illustrated, and has a shape corresponding to the display region DD-DA. Although not illustrated, the window WM can include a base layer and a functional layer disposed on the base layer. The functional layer can include a protective layer, an anti-fingerprint layer, and the like. The base layer of the window WM can be composed of glass, sapphire, or plastic, or the like. The base layer of the window WM can include an optically transparent insulating material. For example, the base layer of the window WM can include a glass or plastic film, or can include a glass substrate and a plastic film combined by an adhesive.

[0076] The non-transmissive region NTA can be overlapped with the display region DD-DA, and have a shape corresponding to the display region DD-DA. The non-transmissive region NTA can be a region having a relatively low light transmittance compared to the transmissive region TA. The non-transmissive region NTA can be defined in a portion of the base layer of the window WM by a bezel pattern, and a region not disposed with the bezel pattern can be defined as the transmissive region TA. However, it is not limited thereto, and the non-transmissive region NTA can also be omitted. Figure 3 The non-display region DD-NDA illustrated is overlapped, and has a shape corresponding to the non-display region DD-NDA. The non-transmissive region NTA can be a region having a relatively low light transmittance compared to the transmissive region TA. The non-transmissive region NTA can be defined in a portion of the base layer of the window WM by a bezel pattern, and a region not disposed with the bezel pattern can be defined as the transmissive region TA. However, it is not limited thereto, and the non-transmissive region NTA can also be omitted.

[0077] Although not illustrated, an anti-reflection layer can be disposed between the window WM and the display module DM. The anti-reflection layer can reduce the reflectance of external light incident from the outside of the display device DD. The anti-reflection layer can include a color filter. The color filter described above can have a specified arrangement. For example, the color filter described above can be arranged in consideration of the light emission color of the pixels included in the display panel DP which will be described below. In addition, the anti-reflection layer can further include a black matrix adjacent to the color filter described above.

[0078] According to an embodiment of the present disclosure, the display module DM can include a display panel DP and an input sensor ISU.

[0079] The display panel DP can be any one of a liquid crystal display panel, an electrophoretic display panel, a microelectromechanical system display panel, an electrowetting display panel, an organic light emitting display panel, an inorganic light emitting display panel, and a quantum dot light emitting display panel. However, it can not be particularly limited thereto. Hereinafter, the display panel DP is described as an organic light emitting display panel.

[0080] The input sensor ISU can include any one of a capacitive sensor, an optical sensor, an ultrasonic sensor, and an electromagnetic induction sensor. The input sensor ISU can be formed on the display panel DP through a continuous process, or can be attached to the upper side of the display panel DP through an adhesive layer after being separately manufactured, and is not limited by any embodiment.

[0081] The display module DM can include a circuit board CB. The circuit board CB can include a data driving part DC and a printed circuit board CF. Although Figure 4a Although an embodiment in which the data driving part DC is installed in the display panel DP is shown in FIG. 1, it is not limited thereto. The data driving part DC can generate a driving signal required for the operation of the display panel DP based on a control signal transmitted from the printed circuit board CF.

[0082] The display panel DP can include a bending area BA, and a first non-bending area NBA1 and a second non-bending area NBA2 which are spaced apart in a second direction DR2 with the bending area BA interposed therebetween.

[0083] The bending area BA can be defined as a region where the display panel DP bends along a virtual bending axis BX extending in the second direction DR2. The first non-bending area NBA1 can overlap the transmissive area TA, and the second non-bending area NBA2 can be defined as a region connected to the printed circuit board CF. When the bending area BA is bent about the bending axis BX, the printed circuit board CF and the data driver DC can bend toward the rear surface of the display panel DP to be arranged below the rear surface of the display panel DP. Although not shown, additional components can be provided to compensate for the step difference between the printed circuit board CB and the rear surface of the display panel DP caused by the bending area BA.

[0084] According to one embodiment, the width of the first non-bending area NBA1 in the second direction DR2 may be greater than the width of the bending area BA and the second non-bending area NBA2. However, the present invention is not limited thereto. The width of the bending area BA in the second direction DR2 may be configured to gradually narrow from the first non-bending area NBA1 to the second non-bending area NBA2, and is not limited by any one embodiment.

[0085] like Figure 4b As shown, as a portion of the display panel DP is bent, the printed circuit board CF electrically bonded to the display panel DP may be disposed on the rear surface of the display panel DP.

[0086] An anti-reflection layer POL may be disposed between the window WM and the display module DM. The anti-reflection layer POL may be disposed on the first non-bending area NBA1. The anti-reflection layer POL may not overlap with the bending area BA and the second non-bending area NBA2. The anti-reflection layer POL may reduce the reflectivity of external light incident from outside the display device DD.

[0087] The receiving member BC can accommodate the display module DM and be combined with the window WM. The printed circuit board CF can be arranged at one end of the display panel DP and can be electrically connected to the display module DM. Figure 5 Although not shown, the display device DD may further include a main board, an electronic module mounted on the main board, a camera module, a power module, and the like.

[0088] While the display device DD is described above as a mobile phone terminal, in this specification, the display device DD may include two or more electrically connected electronic components. Each of the display panel DP and the data driver DC mounted on the display panel DP corresponds to a different electronic component. The display device DD may also consist solely of the display panel DP and the data driver DC, and is not limited to any particular embodiment.

[0089] In an embodiment, the display device DD can also be configured only of the display panel DP and the printed circuit board CF connected to the display panel DP, and can also be configured only of the main board and the electronic module mounted on the main board. Hereinafter, the display device DD according to the present disclosure will be described focusing on the junction structure of the display panel DP and the data driving part DC mounted on the display panel DP.

[0090] Figure 5 is Figure 4a a cross-sectional view of the display module.

[0091] Referring to Figure 5 , the display module DM can include the input sensor ISU and the display panel DP. The display panel DP can include a base layer BL, a circuit element layer DP-CL disposed on the base layer BL, a display element layer DP-OLED, and an upper insulating layer TFL. The input sensor ISU can be disposed on the upper insulating layer TFL.

[0092] The display panel DP can include a display area DP-DA and a non-display area DP-NDA. The display area DP-DA of the display panel DP can correspond to Figure 3 the display area DD-DA illustrated in Figure 4a or the transmissive area TA, and the non-display area DP-NDA can correspond to Figure 3 the non-display area DD-NDA illustrated in Figure 4a or the non-transmissive area NTA.

[0093] The base layer BL can include at least one plastic film. The base layer BL can include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic composite material substrate, etc. as a flexible substrate.

[0094] The circuit element layer DP-CL can include at least one intermediate insulating layer and a circuit element layer. The intermediate insulating layer can include at least one intermediate inorganic layer and at least one intermediate organic layer. The circuit element can include a signal line, a pixel driving circuit, etc.

[0095] The display element layer DP-OLED can include a plurality of organic light emitting diodes. The display element layer DP-OLED can also include an organic layer such as a pixel definition film.

[0096] The upper insulating layer TFL can seal the display element layer DP-OLED. The upper insulating layer TFL can be disposed on the display element layer DP-OLED. The upper insulating layer TFL can overlap the display area DP-DA and the non-display area DP-NDA. The upper insulating layer TFL can overlap at least a portion of the non-display area DP-NDA. As an example, the upper insulating layer TFL can include a thin film encapsulation layer. The thin film encapsulation layer can include a stacked structure of an inorganic layer, an organic layer, and an inorganic layer. The upper insulating layer TFL can protect the display element layer DP-OLED from foreign substances such as moisture, oxygen, and dust particles. However, without being limited thereto, the upper insulating layer TFL can further include another insulating layer in addition to the thin film encapsulation layer. Hereinafter, it will be described that the upper insulating layer TFL is defined as a thin film encapsulation layer TFL.

[0097] In an embodiment of the present application, a package substrate can be provided instead of the upper insulating layer TFL. In this case, the package substrate faces the base layer BL, and the package substrate and the substrate can be disposed with the circuit element layer DP-CL and the display element layer DP-OLED therebetween.

[0098] The input sensor ISU can be directly disposed on the display panel DP. In the present embodiment, the input sensor ISU can be manufactured with the display panel DP through a continuous process. However, the technical idea of the present application is not limited thereto, and the input sensor ISU can be provided by a single panel, thereby being combined with the display panel DP through an adhesive layer. As an example, the input sensor ISU can be omitted.

[0099] Figure 6 is Figure 5 a plan view of the display panel.

[0100] Referring to Figure 6 , the display panel DP can include a plurality of pixels PX, a gate driver circuit GDC, a plurality of signal lines SGL, and a plurality of display pads SD.

[0101] The pixels PX can be disposed in the display area DP-DA. Each of the pixels PX can include an organic light emitting diode and a pixel driving circuit connected to the organic light emitting diode. The gate driver circuit GDC and the signal lines SGL can be included in the circuit element layer DP-CL as illustrated in Figure 5 .

[0102] The gate driver circuit GDC can sequentially output gate signals to a plurality of gate lines GL. The gate driver circuit GDC can include a plurality of thin film transistors formed through the same process as that of the driving circuit of the pixel PX, for example, an LTPS (low temperature polysilicon) process or an LTPO (low temperature polysilicon oxide) process. The display panel DP can further include another driving circuit that provides a light emission control signal to the pixel PX.

[0103] The signal lines SGL can include gate lines GL, data lines DL, power lines PL, and control signal lines CSL. Each of the gate lines GL can extend in the second direction DR2 to be connected to corresponding ones of the pixels PX, respectively, and each of the data lines DL can extend in the first direction DR1 to be connected to corresponding ones of the pixels PX. The power lines PL can extend in the first direction DR1 and the second direction DR2 to be connected to the pixels PX. The control signal lines CSL can provide control signals to the scan driving circuit.

[0104] The signal lines SGL can overlap the display area DP-DA and the non-display area DP-NDA. Each of the signal lines SGL can include a pad portion and a line portion. The line portion can overlap the display area DP-DA and the non-display area DP-NDA. The pad portion can be connected to an end of the line portion. The pad portion can overlap a pad area to be described below.

[0105] The display panel DP can include a plurality of display pads SD. Each of the plurality of display pads SD can be arranged to be spaced apart at a specified pitch. The plurality of display pads SD according to an embodiment can be arranged in a connection area CA in the second non-bending area NBA2. The connection area CA can be defined as an area in the second non-bending area NBA2 in which the display pads SD are arranged. The data driving portion DC (refer to Figure 4a ) and the printed circuit board CF (refer to Figure 4a ) can be attached to the connection area CA.

[0106] The display pads SD can include first pads DP-PD and second pads DP-CPD. The first pads DP-PD can be arranged to overlap the connection area CA. The data driving portion DC (refer to Figure 4a ) can be mounted on the second non-bending area NBA2. The first pads DP-PD can be electrically connected to the data driving portion DC to transfer an electrical signal received from the data driving portion DC to the signal lines SGL.

[0107] The first pads DP-PD can be arranged in the first direction DR1 and the second direction DR2. The first pads DP-PD can include first row pads DP-PD1 and second row pads DP-PD2 arranged in the second direction DR2 and spaced apart from the first row pads DP-PD1 in the first direction DR1. The second row pads DP-PD2 can be input pads that receive signals from the data driving portion DC, and the first row pads DP-PD1 can be output pads that output signals to the data driving portion DC.

[0108] However, the first pads DP-PD are not limited thereto, and can be arranged in one row in the second direction DR2, or can be arranged in three or more rows.

[0109] The second pad DP-CPD may be arranged to overlap the connected area CA. The first pad DP-PD and the second pad DP-CPD may be connected to each other through a bridge signal line S-CL.

[0110] The second pads DP-CPD may also be arranged along the second direction DR2 together with the first pads DP-PD. The second pads DP-CPD may be arranged spaced apart from each other in the second direction DR2.

[0111] The printed circuit board CF may include substrate bump electrodes CF-PD electrically connected to the display panel DP. The substrate bump electrodes CF-PD included in the printed circuit board CF may be arranged in a manner similar to the arrangement of the second pads DP-CPD. For example, when the second pads DP-CPD are arranged in the second direction DR2, the substrate bump electrodes CF-PD may be arranged in the second direction DR2. However, this is merely exemplary and is not limited thereto.

[0112] The second pad DP-CPD can be electrically connected to the substrate bump electrode CF-PD included in the printed circuit board CF, thereby transmitting the electrical signal received from the printed circuit board CF to the first pad DP-PD. The printed circuit board CF can be rigid or flexible. For example, when the printed circuit board CF is flexible, it can be configured as a flexible printed circuit board (FPC).

[0113] Although not shown, the printed circuit board CF may include a timing control circuit that controls the operation of the display panel DP. The timing control circuit may be mounted on the printed circuit board CF in the form of an integrated chip. In addition, although not shown, the printed circuit board CF may include an input detection circuit that controls the input sensor ISU.

[0114] Meanwhile, although the display panel DP of the present invention is described as including a Figure 4a The structure of the first pad DP-PD of the data driving part DC is shown, but it is not limited thereto. The data driving part DC may be mounted on the printed circuit board CF, in which case the first pad DP-PD may be omitted.

[0115] Figure 7 It shows Figure 6 A perspective view of a portion of the second non-bending area NBA2 is shown.

[0116] right Figure 7 Among the illustrated components, descriptions of components that are the same as those described above with reference to the drawings will be omitted or simplified.

[0117] For ease of description,Figure 7 is a diagram schematically showing a part of constituent elements arranged corresponding to the second non-bending area NBA2.

[0118] Referring to Figure 7 , the display device DD can include the circuit board CB, the conductive adhesive member ACF, and the display panel DP. For convenience of description, Figure 7 Although the display panel DP, the conductive adhesive member ACF, and the circuit board CB are separately exploded in the description, at least a part of the display panel DP can be in contact with the conductive adhesive member ACF and at least a part of the circuit board CB can be in contact with the conductive adhesive member ACF.

[0119] In the second non-bending area NBA2, an area to which the printed circuit board CF is bonded can be defined as the first connected area CA1, and an area to which the data driving part DC is bonded can be defined as the second connected area CA2.

[0120] The circuit board CB can include a plurality of bump electrodes LD. The plurality of bump electrodes LD can include a substrate bump electrode CF-PD mounted on the printed circuit board CF and a chip bump electrode DC-PD mounted on the data driving part DC.

[0121] The printed circuit board CF can include an upper surface CF-US and a lower surface CF-DS. The lower surface CF-DS of the printed circuit board CF can be defined as a surface facing the display panel DP. The substrate bump electrode CF-PD can be arranged on the lower surface CF-DS of the printed circuit board CF.

[0122] On the lower surface CF-DS of the printed circuit board CF, the substrate bump electrode CF-PD can be arranged in the second direction DR2. The substrate bump electrodes CF-PD can be arranged apart from each other in the second direction DR2. When viewed from a planar surface, the arrangement shape of the substrate bump electrodes CF-PD can be the same as the arrangement shape of the second pads PD-CPD arranged on the display panel DP.

[0123] Although not shown, the substrate bump electrode CF-PD can have a shape exposed to the outside from the lower surface CF-DS of the printed circuit board CF.

[0124] The data driving part DC can include an upper surface DC-US and a lower surface DC-DS. The lower surface DC-DS of the data driving part DC can be a surface facing the display panel DP. The chip bump electrode DC-PD can be arranged on the lower surface DC-DS of the data driving part DC.

[0125] The chip bump electrodes DC-PD can be arranged in a first direction DR1 and a second direction DR2. The chip bump electrodes DC-PD can include a first row of chip bump electrodes DC-PD1 arranged in the second direction DR2 and a second row of chip bump electrodes DC-PD2 spaced apart from the first row of chip bump electrodes DC-PD1 in the first direction DR1 and arranged in the second direction DR2. When viewed from a planar surface, the arrangement shape of the chip bump electrodes DC-PD can be the same as the arrangement shape of the first pads DP-PD arranged on the display panel DP.

[0126] Although not shown, the chip bump electrodes DC-PD can have a shape exposed to the outside from a lower surface DC-DS of the data driving portion DC.

[0127] The conductive adhesive member ACF can be arranged between the circuit board CB and the display panel DP. The conductive adhesive member ACF can be an anisotropic conductive film. For example, the conductive adhesive member ACF can include an adhesive resin and conductive balls dispersed in the adhesive resin. Alternatively, the conductive adhesive member ACF can be a non-conductive film. For example, the conductive adhesive member ACF can be an adhesive resin that does not include conductive balls. The conductive adhesive member ACF can include a thermosetting resin.

[0128] The conductive adhesive member ACF can include a first conductive adhesive member AF-C arranged between the printed circuit board CF and the display panel DP and a second conductive adhesive member AF-D arranged between the data driving portion DC and the display panel DP.

[0129] The first conductive adhesive member AF-C can join the printed circuit board CF to the first connection area CA1 of the display panel DP. The printed circuit board CF can be joined to the first connection area CA1 by the first conductive adhesive member AF-C. The printed circuit board CF and the display panel DP can be electrically connected to each other by the first conductive adhesive member AF-C. Figure 1 The illustrated bonding apparatus BTA is joined to each other.

[0130] By the first conductive adhesive member AF-C, each of the substrate bump electrodes CF-PD can be electrically connected to a corresponding one of the second pads DP-CPD. Accordingly, the printed circuit board CF can be electrically connected to the display panel DP.

[0131] The second conductive adhesive member AF-D can join the data driving portion DC to the second connection area CA2 of the display panel DP. The data driving portion DC can be joined to the second connection area CA2 by the second conductive adhesive member AF-D. The data driving portion DC and the display panel DP can be electrically connected to each other by the second conductive adhesive member AF-D.Figure 1 The bonding devices BTA shown are bonded to each other. The bonding of the data driving part DC and the display panel DP will be Figure 8a to 8c Detailed description is given in .

[0132] Each of the chip bump electrodes DC-PD may be electrically connected to a corresponding first pad DP-PD of the first pads DP-PD through the second conductive adhesive member AF-D. Thus, the data driving part DC may be electrically connected to the display panel DP.

[0133] Figure 8a to 8c Is used to describe the use of Figure 1 The bonding device shown is used to produce Figure 3 A diagram of a display apparatus and method.

[0134] For example, Figure 8a to 8c 1 and 2 are diagrams showing the bonding apparatus BTA viewed from the second direction DR2.

[0135] right Figure 8a to 8c Among the illustrated components, descriptions of components that are the same as those described above with reference to the drawings will be omitted or simplified.

[0136] Reference Figure 8a , display device DD (refer to Figure 3 The manufacturing method of the display panel DP may include the step of disposing the display module DM and the data driving part DC on the stage STG. The display module DM and the anti-reflection layer POL may be disposed on the stage STG. The first non-bending area NBA1 and the bending area BA of the display panel DP may overlap the stage STG. The input sensor ISU and the anti-reflection layer POL may be disposed so as to overlap the stage STG. The second non-bending area NBA2 of the display panel DP may be disposed on the support BS. The data driving part DC and the second conductive adhesive member AF-D disposed on the display panel DP may overlap the support BS.

[0137] Display device DD (refer to Figure 3 The manufacturing method of the present invention may include operating the heating unit HBP by connecting an external power source to the heating unit HBP. When current is applied to the heating unit HBP from the external power source, heat energy is generated, thereby increasing the temperature of the heating unit HBP. The temperature of the heating unit HBP may be 350°C to 400°C. For example, the temperature of the heating unit HBP may be 360°C.

[0138] If the temperature of the heating part HBP increases, the press part PP disposed on the lower surface of the heating part HBP may receive heat from the heating part HBP. By the heat, the temperature of the press part PP may increase.

[0139] Reference Figure 8b , manufacturing display device DD (refer toFigure 3 ) can include a step of moving the heating portion HBP and the pressing portion PP. The heating portion HBP and the pressing portion PP can move in the third direction DR3 toward the display panel DP and the data driving portion DC.

[0140] The pressing portion PP can be disposed on the data driving portion DC. The pressing portion PP can pressurize the data driving portion DC. The pressing portion PP can transfer heat to the data driving portion DC. The temperature of the data driving portion DC receiving the heat can increase.

[0141] The second conductive adhesive member AF-D disposed under the data driving portion DC can receive heat from the data driving portion DC. The temperature of the second conductive adhesive member AF-D receiving the heat can increase. Exemplarily, the temperature of the second conductive adhesive member AF-D can be 180℃.

[0142] Referring to Figure 8c , if the display panel DP and the data driving portion DC are engaged with each other, the pressing portion PP and the heating portion HBP can move in the third direction DR3 toward the upper portion.

[0143] Figure 9 is an engaging apparatus according to a comparative example.

[0144] For convenience of description, a stage STG (refer to Figure 1 ) and a support portion BS (refer to Figure 1 ) of the engaging apparatus BTA' according to the comparative example are omitted.

[0145] Referring to Figure 9 , the engaging apparatus BTA' according to the comparative example can include a pressing portion PP', an engaging head HH disposed on the pressing portion PP', and a heating bar HB. The pressing portion PP' can apply heat and pressure to the data driving portion DC of the display panel DP. Figure 8b

[0146] An opening portion OP can be defined to the engaging head HH. The opening portion OP can be defined to extend in the second direction DR2 from one side of the engaging head HH to another side opposite to the one side from each other. The opening portion OP can be defined to be adjacent to the upper portion of the engaging head HH. Exemplarily, the opening portion OP can have a circular shape when viewed in the second direction DR2.

[0147] The heating bar HB can be disposed within the opening portion OP. The heating bar HB can include one or more heat lines. The heating bar HB can generate heat. Exemplarily, the temperature of the heating bar HB can be 480℃.

[0148] ​The heat generated from the heating rod HB can be transferred to the bonding head HH and through the bonding head HH to the pressurizing portion PP'. The temperature of the bonding head HH and the pressurizing portion PP' receiving the heat can increase.

[0149] Referring to Figure 8b and Figure 9 , Figure 9 The pressurizing portion PP' can not be in direct contact with the heating rod HB. The pressurizing portion PP' can receive heat from the bonding head HH through heat conduction. Therefore, in order to increase the contact area with the bonding head HH, the volume of the pressurizing portion PP' can be increased.

[0150] In the embodiment of the present application, as the pressurizing portion PP is directly disposed on the lower surface of the heating portion HBP as a heat source, the amount of heat transfer caused by heat conduction can be increased. Therefore, compared to the case where the pressurizing portion PP is not in direct contact with the heating portion HBP, the pressurizing portion PP can receive relatively more heat. Therefore, the volume of the pressurizing portion PP can be reduced.

[0151] Although not shown, the pressurizing portion PP' can apply heat and pressure to the data driving portion DC shown in FIG. 1. The second conductive adhesive member AF-D (refer to FIG. 2) disposed below the data driving portion DC (refer to FIG. 1) can receive heat from the data driving portion DC. The temperature of the second conductive adhesive member AF-D receiving the heat can increase. The temperature of the second conductive adhesive member AF-D can exemplarily be 180°C. Figure 8b Figure 8b Figure 8b

[0152] The temperature of the heating rod HB can be greater than the temperature of the heating portion HBP. The temperature of the heating rod HB can be 480°C. The temperature of the heating portion HBP can be 350°C to 400°C. Since the heating portion HBP and the pressurizing portion PP are in direct contact with each other, even if the temperature of the heating portion HBP is lower than the temperature of the heating rod HB, the temperature of the second conductive adhesive member AF-D can be increased to 180°C.

[0153] Therefore, the amount of electricity required to increase the temperature of the heating portion HBP can be less than the amount of electricity required to increase the temperature of the heating rod HB. Therefore, the cost of the process of bonding the display panel DP and the data driving portion DC can be reduced.

[0154] Figure 10 is a graph for describing the temperature of the second conductive adhesive member AF-D changing over time.

[0155] Referring to Figure 8b , Figure 9 and Figure 10 ​​​In order to join the display panel DP and the data driving portion DC by the second conductive adhesive member AF-D, the second conductive adhesive member AF-D can be melted at 180°C.

[0156] In Figure 10 the graph, the x-axis can be defined as time, and the y-axis can be defined as the temperature of the second conductive adhesive member AF-D. The first curve G1 is a curve showing the temperature of the second conductive adhesive member AF-D changing with time when the heating portion HBP of Figure 8b is used. The second curve G2 is a curve showing the temperature of the second conductive adhesive member AF-D changing with time when the heating rod HB of Figure 9 is used.

[0157] In the first curve G1, a first time t1 can be taken for the second conductive adhesive member AF-D to reach 180°C from 35°C. Exemplarily, the first time t1 can be 2 seconds. In the second curve G2, a second time t2 can be taken for the second conductive adhesive member AF-D to reach 180°C from 45°C. The second time t2 can be greater than the first time t1. Therefore, the time taken to raise the temperature of the second conductive adhesive member AF-D can be reduced. Therefore, the time of the process of joining the display panel DP and the data driving portion DC can be shortened.

[0158] Figure 11 is a graph for describing the temperature of the second conductive adhesive member when repeatedly operating the heating portion according to the embodiment of the present application.

[0159] Referring to Figure 8a , Figure 8b and Figure 11 , Figure 11 the x-axis can be defined as time, and the y-axis can be defined as the temperature of the second conductive adhesive member AF-D. When the heating portion HBP is repeatedly operated or not operated, the time taken for the temperature of the second conductive adhesive member AF-D to rise from 35°C to 180°C can be unchanged. Exemplarily, the time taken for the temperature of the second conductive adhesive member AF-D to rise from 35°C to 180°C can be 2 seconds.

[0160] As shown in Figure 8a , during the process of arranging the display panel DP, the data driving portion DC and the second conductive adhesive member AF-D on the stage STG, the heating portion HBP can not be operated. After the display panel DP, the data driving portion DC and the second conductive adhesive member AF-D are arranged on the stage STG and the support portion BS, the heating portion HBP is operated, and the temperature of the second conductive adhesive member AF-D can be maintained at 180°C. Therefore, the operation time of the heating portion HBP can be reduced, thereby reducing the power consumption of the heating portion HBP.

[0161] Figure 12 This is a graph describing the temperature at a location a specified distance from the pressurizing portion.

[0162] Reference Figure 8b and Figure 9 , Figure 8b The first distance D shown may be defined as a distance from the pressing portion PP to the anti-reflection layer POL in the first direction DR1 .

[0163] The heating portion HBP and the heating rod HB can heat the anti-reflection layer POL and the display element layer DP-OLED of the display panel DP (refer to FIG. Figure 5 ) transfers heat. Therefore, the temperature of the anti-reflection layer POL and the display element layer DP-OLED (reference Figure 5 )'s temperature can be increased.

[0164] When the temperature of the anti-reflection layer POL reaches 130 degrees or above, the anti-reflection layer POL may be damaged due to heat. Figure 5 ) reaches 140 degrees or above, the display element layer DP-OLED (reference Figure 5 ) may be damaged by heat.

[0165] Reference Figure 8b 、 Figure 9 and Figure 12 , Figure 12 The x-axis of the graph may be defined as the size of the first distance D, and the y-axis may be defined as the temperature of the anti-reflection layer POL spaced apart from the pressurizing part PP and the pressurizing part PP' by the first distance D. The third curve G3 is a graph showing the use of Figure 8b The fourth curve G4 is a graph showing the temperature of the anti-reflection layer POL when the heating portion HBP is spaced apart from the pressurizing portion PP by a first distance D. Figure 9 A curve of the temperature of the anti-reflection layer POL when the heating rod HB is spaced apart from the pressurizing part PP' by a first distance D.

[0166]

[0167]

Table 1

[0168] Table 1 shows the results of the temperature of the anti-reflection layer POL according to the size of the first distance D. When the size of the first distance D is the same, the temperature of the anti-reflection layer POL according to the fourth curve G4 may be greater than the temperature of the anti-reflection layer POL according to the third curve G3.

[0169] Exemplarily, when the first distance D is 2.8 mm in size, the temperature of the antireflection layer POL according to the third curve G3 can be 101.7°C. The temperature of the antireflection layer POL according to the fourth curve G4 can be 103°C.

[0170] Exemplarily, when the first distance D is 2.4 mm in size, the temperature of the antireflection layer POL according to the third curve G3 can be 103.4°C. The temperature of the antireflection layer POL according to the fourth curve G4 can be 109.9°C.

[0171] Exemplarily, when the first distance D is 2.1 mm in size, the temperature of the antireflection layer POL according to the third curve G3 can be 112.8°C. The temperature of the antireflection layer POL according to the fourth curve G4 can be 118.2°C.

[0172] Exemplarily, when the first distance D is 1.4 mm in size, the temperature of the antireflection layer POL according to the third curve G3 can be 128°C. The temperature of the antireflection layer POL according to the fourth curve G4 can be 134°C.

[0173] In an embodiment of the present application, even if the first distance D is reduced, the temperature can be relatively low. Therefore, it is possible to prevent the antireflection layer POL from being damaged due to heat. Therefore, it is possible to reduce the distance between the antireflection layer POL and the data driving part DC, and to increase the area of the display area DP-DA (refer to Figure 3 ).

[0174] Although the display panel DP and the data driving part DC are joined by the second conductive adhesive member AF-D in Figure 8a to 11 , the same can also be applied to joining the display panel DP and the flexible printed circuit board CF by the first conductive adhesive member AF-C, and detailed description thereof will be omitted.

[0175] Figure 13a and Figure 13b are diagrams for describing a display panel and a data driving part according to an embodiment of the present application.

[0176] Figure 13a and Figure 13b The first gate driving circuit GDC1, the second gate driving circuit GDC2, the display pad SD, the data driving part DC, the printed circuit board CF', and the signal line SGL of Figure 6 are substantially the same as the gate driving circuit GDC, the display pad SD, the data driving part DC, the printed circuit board CF, and the signal line SGL of

[0177] Referring to Figure 13a and Figure 13bThe display panel DPa can be rectangular in shape when viewed from a planar surface, the rectangular shape having a short side extending in the first direction DR1 and a long side extending in the second direction DR2. The display panel DPa can extend longer in the second direction DR2 than in the first direction DR1.

[0178] The printed circuit board CF' can be parallel to a planar surface defined by the first direction DR1 and the second direction DR2 when viewed from the planar surface. The printed circuit board CF' can extend longer in the second direction DR2 than in the first direction DR1. A portion of the printed circuit board CF' can be disposed on an edge of the display panel DPa adjacent to the display pad SD. The printed circuit board CF' can be disposed on the second pad DP-CPD.

[0179] A plurality of data drive portions DC can be disposed between the printed circuit board CF and the display area DP-DA when viewed from a planar surface. The data drive portions DC can be arranged in the second direction DR2. The data drive portions DC can be disposed on the first pad DP-PD.

[0180] Although not shown, a conductive adhesive member ACF (refer to Figure 7 ) can be disposed between the data drive portions DC and the display panel DPa and between the printed circuit board CF and the display panel DPa. Figure 7 Through the conductive adhesive member ACF (refer to Figure 7 ), the data drive portions DC can be joined to the display panel DPa. Through the conductive adhesive member ACF (refer to Figure 7 ), the printed circuit board CF can be joined to the display panel DPa.

[0181] Figure 14a and Figure 14b are diagrams for describing a joining device according to an embodiment of the present application.

[0182] Descriptions of the constituent elements among the constituent elements shown in Figure 14a and Figure 14b that are the same as the constituent elements described in the foregoing with reference to the drawings will be omitted or simplified.

[0183] For ease of description, the display panel DPa of Figure 14a and Figure 14b is simply shown.

[0184] With reference to Figure 13a to 14a , the display panel DPa and the data drive portions DC can be joined by a joining device BTAa. The display panel DPa can be disposed on a stage STGa. The data drive portions DC and the second conductive adhesive member AF-D can be disposed on a support portion BSa.

[0185] The bonding apparatus BTAa can include a plurality of pressurizing portions PP, a plurality of heating portions HBP, and a plurality of cooling portions CP. The plurality of pressurizing portions PP, the plurality of heating portions HBP, and the plurality of cooling portions CP can be arranged in the second direction DR2, respectively. The plurality of pressurizing portions PP, the plurality of heating portions HBP, and the plurality of cooling portions CP can be disposed on the display panel DPa and the data driving portion DC.

[0186] Referring to Figure 14b , the plurality of pressurizing portions PP, the plurality of heating portions HBP, and the plurality of cooling portions CP can be moved in the third direction DR3. Each of the pressurizing portions PP can be disposed on a corresponding data driving portion DC in the data driving portion DC to transfer heat and pressure. The bonding process of the display panel DP and the data driving portion DC has been described in detail in Figure 8a to 8c , and can also be applied in Figure 14a to 14b , thus the description of the bonding process of the display panel DPa and the data driving portion DC will be omitted.

[0187] The above is described with reference to the embodiments, but those skilled in the art will understand that various modifications and changes can be made to the present application without departing from the spirit and scope of the present application as recited in the appended claims. In addition, the embodiments disclosed in the present application are not intended to limit the technical idea of the present application, but should be interpreted as all technical ideas within the scope of the appended claims and their equivalent scope being included in the scope of the present application.

Claims

1. A joining device characterized by comprising: comprising: a table having a plane defined by a first direction and a second direction intersecting the first direction; a heating portion arranged on the table and including a pulse heater; and a pressurizing portion arranged directly on a lower surface of the heating portion.

2. The bonding apparatus according to claim 1, wherein the pressurizing portion includes: a plate arranged on a lower surface of the heating portion; and a pressurizing tip arranged on a lower surface of the plate, wherein a width of the pressurizing tip in the first direction is smaller than a width of the plate in the first direction, and a width of the pressurizing tip in the second direction is smaller than a width of the plate in the second direction.

3. The bonding apparatus according to claim 2, wherein a thickness of the plate is greater than a thickness of the pressurizing tip.

4. The bonding apparatus according to claim 3, wherein the thickness of the plate is smaller the farther it is from the pressurizing tip.

5. The bonding apparatus according to claim 2, wherein a thickness of the plate is the same as a thickness of the pressurizing tip. further comprising:

6. The engagement device of claim 1, wherein a plurality of cooling portions arranged on the heating portion.

7. The bonding apparatus according to claim 6, wherein the cooling portion includes a first cooling portion, a second cooling portion, and a third cooling portion stacked from a lower portion to an upper portion, wherein the first cooling portion includes a heat insulating material, and at least any one of the second cooling portion and the third cooling portion is thermally insulated by air. the table is arranged with a display panel and a data driving portion arranged on the display panel.

8. The engagement device of claim 1, wherein, further comprising:

9. The engagement device of claim 8, wherein, a support portion arranged on a side of the table adjacent to the pressurizing portion among two sides of the table opposite to each other in the first direction, wherein the support portion overlaps the data driving portion.

10. The bonding apparatus according to claim 1, wherein the pressurizing portion and the heating portion are each provided as a plurality, and the pressurizing portions are arranged in the second direction. ​

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