Electron beam welding device for semiconductor sputtering ring

Abstract

An electron beam welding apparatus of a ring for semiconductor sputtering includes a chassis supporting and loading equipment; six groups of cushion blocks are uniformly distributed at the edge of the top of the chassis, a welding ring is supported at the tops of the cushion blocks, the outer wall of the welding ring is in pushing contact with a welding piece, the welding piece is sleeved at the front end of a compression special-shaped block, and seven groups of compression special-shaped blocks are distributed at the edge of the chassis; a wedge-shaped mechanism supporting disc is installed in the center of the upper end face of the chassis, six sets of wedge-shaped mechanism fan ribs are horizontally and movably installed on the side edge of the wedge-shaped mechanism supporting disc, and the wedge-shaped mechanism fan ribs are in supporting contact with the inner wall of the welding ring along bottom guiding sliding blocks. According to the utility model, a telescopic hold-down ring main body is adopted, meanwhile, a structure of a part needing to be welded on the outer side of the ring is fixed, and the telescopic hold-down ring mainly comprises a chassis, a shaft, a telescopic hold-down mechanism, an outer hold-down mechanism and the like. By means of the structure, undifferentiated pressing of rings with different roundness and diameter errors can be achieved; after welding is completed, the inner diameter of the device is reduced by changing the wedge-shaped structure, and the product can be taken down conveniently.

Description

TECHNICAL FIELD

[0001] The utility model belongs to advanced manufacturing and automation technical field, concretely relates to a kind of electron beam welding device for semiconductor sputtering ring. BACKGROUND

[0002] In actual production, semiconductor sputtering ring belongs to elastomer, roundness is uneven, and size will have error, the structure realizes that electronic welding is pressed tightly without difference, and it is convenient to assemble and disassemble.In electron beam welding, there is extremely high application value.

[0003] If manual welding or single-point separate support equipment welding is used, since semiconductor sputtering ring belongs to elastomer, it is difficult to support ring body to keep fixed welding structure, to cause technical problems such as virtual welding or unstable welding of welding point.

[0004] Therefore, the utility model provides a structure that can be telescopic and press tightly ring main body, and simultaneously fix the parts that need to be welded outside ring, mainly by bottom disc, shaft, telescopic pressing mechanism, outside pressing mechanism etc.It can realize that the ring of different roundness and diameter has error is pressed tightly without difference;After welding is completed, the inner diameter can be reduced by changing wedge-shaped structure, so that the product can be conveniently taken down. SUMMARY

[0005] To achieve the above object, the technical scheme of the utility model is as follows:

[0006] An electron beam welding device for semiconductor sputtering ring, comprising a bottom disc supporting and loading equipment;The top edge of the bottom disc is uniformly distributed with six groups of pads, and the top of the pad is provided with a welding ring, the outer wall of the welding ring is in contact with the pushing top of the welding part, the welding part is sleeved in front of the pressing special-shaped block, and seven groups of pressing special-shaped blocks are distributed at the edge of the bottom disc.

[0007] The wedge-shaped mechanism support disc is horizontally movably installed with six groups of wedge-shaped mechanism fan bones on the side edge, and the wedge-shaped mechanism fan bone is in supporting contact with the inner wall of the welding ring along the bottom guide sliding block.

[0008] Further, the wedge-shaped mechanism support disc is vertically installed with a wedge-shaped mechanism tension bolt in the center, the wedge-shaped mechanism tension bolt is in synchronous motion connection relationship with the wedge-shaped mechanism support disc in up and down, and the wedge-shaped mechanism support disc is in translational extrusion contact with the inclined surface of the root of wedge-shaped mechanism fan bone through wedge-shaped inclined surface,

[0009] Further, three groups of wedge-shaped mechanism guide columns are vertically inserted into the wedge-shaped mechanism support disc along the outside of the wedge-shaped mechanism tension bolt, and the wedge-shaped mechanism guide column is in uniform distribution structure.

[0010] The top end of the wedge-shaped mechanism fan bone is provided with a fan bone supporting part.

[0011] The bottom end of the compression profiled block is in contact with the pushing end of the base, and the top end of the compression profiled block is horizontally butted with a welded cap through a bolt, and the front end of the welded cap is sleeved with a welding piece.

[0012] The base is provided with a shaft.

[0013] The semiconductor sputtering ring electronic beam welding device has the advantages that:

[0014] Compared with the prior art, the semiconductor sputtering ring electronic beam welding device adopts a telescopic compression ring main body, and simultaneously fixes parts needing welding outside the ring, and mainly comprises a base, a shaft, a telescopic compression mechanism, an outside compression mechanism and the like. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a structural schematic view of the semiconductor sputtering ring electronic beam welding device.

[0016] Figure 2 It is a top view of the semiconductor sputtering ring electronic beam welding device.

[0017] Figure 3 It is a front view of the semiconductor sputtering ring electronic beam welding device.

[0018] Figure 4 It is a sectional view of the wedge mechanism support disc of the semiconductor sputtering ring electronic beam welding device.

[0019] LIST OF FIGURES

[0020] 1 is a compression profiled block, 2 is a welded cap, 3 is a welding piece, 4 is a pad, 5 is a base, 6 is a shaft, 7 is a wedge mechanism support disc, 8 is a wedge mechanism guide column, 9 is a wedge mechanism tension bolt, 10 is a wedge mechanism fan bone, 11 is a fan bone support piece, 12 is a guide sliding block, and 13 is a welded ring. DETAILED DESCRIPTION

[0021] The semiconductor sputtering ring electronic beam welding device will be further illustrated in combination with the drawings and the specific embodiments, and it should be understood that the following specific embodiments are only used for illustrating the semiconductor sputtering ring electronic beam welding device and are not used for limiting the scope of the semiconductor sputtering ring electronic beam welding device.

[0022] As Figure 1 , Figure 2 and Figure 3As shown in the figure, an electron beam welding device for a semiconductor sputtering ring includes a chassis 5 supporting and loading the device; six groups of pads 4 are evenly distributed at the top edge of the chassis 5, and a welding ring 13 is supported on top of the pads 4, the outer wall of the welding ring 13 is in contact with a welding part 3, the welding part 3 is sleeved on the front end of a compression irregular block 1, and seven groups of compression irregular blocks 1 are distributed at the edge of the chassis 5; wherein the chassis 5 serves as the bottom lifting structure of the device, the pads 4 are evenly distributed at the edge end of the chassis 5, and the upper end surface of the pads 4 can support and limit the welding ring 13. The welding ring 13 can assist in completing the welding process in cooperation with multiple groups of components to be welded. The compression irregular block 1 serves as a limiting welding part 3 and has a compression operation structure, which can effectively fix the welding part 3 and make the welding process more stable.

[0023] A wedge mechanism support disc 7 is installed at the center of the upper end surface of the chassis 5, six groups of wedge mechanism fan bones 10 are horizontally movably installed at the side edges of the wedge mechanism support disc 7, and the wedge mechanism fan bones 10 are in supporting contact with the inner wall of the welding ring 13 along the bottom guide sliding block 12. Among them, the wedge mechanism fan bones 10 are scatteredly distributed around the chassis 5. The wedge mechanism fan bones 10 are in supporting contact with the welding ring 13 through the guide sliding block 12. The guide sliding block 12 serves as a motion guide for the wedge mechanism fan bones 10.

[0024] As shown in Figure 1 , Figure 2 and Figure 3 , a wedge mechanism tension bolt 9 is vertically installed at the center of the wedge mechanism support disc 7, the wedge mechanism tension bolt 9 is in synchronous motion connection relationship with the wedge mechanism support disc 7 in an up-down manner, and the wedge mechanism support disc 7 is in translational extrusion contact with the inclined surface at the root of the wedge mechanism fan bone 10 through a wedge inclined surface. Three groups of wedge mechanism guide columns 8 are vertically inserted into the wedge mechanism support disc 7 along the outside of the wedge mechanism tension bolt 9, and the wedge mechanism guide columns 8 are in an evenly distributed structure; a fan bone supporting part 11 is installed at the top end of the wedge mechanism fan bone 10. Among them, the wedge mechanism tension bolt 9 is in synchronous motion relationship with the wedge mechanism support disc 7 in an up-down manner. Therefore, driving the wedge mechanism support disc 7 to cooperate with the wedge mechanism tension bolt 9 to move synchronously up and down. And the side slope surface of the driving wedge mechanism support disc 7 can be further matched with the wedge mechanism fan bone 10, thereby fixing the horizontal installation position of the wedge mechanism fan bone 10, and further limiting the position of the welding process.

[0025] As shown in Figure 1 , Figure 2 and Figure 3 , the bottom end of the compression irregular block 1 is in contact with the chassis 5, the top end of the compression irregular block 1 is horizontally butt-jointed with a welding cap 2 through a bolt, and the welding part 3 is sleeved on the front end of the welding cap 2. Among them, the compression irregular block 1 provides extrusion force from the outside and fixes the wedge mechanism fan bone 10.

[0026] As Figure 1 , Figure 2 and Figure 3 shown, the chassis 5 is mounted with a shaft 6. Wherein, the shaft 6 is responsible for matching the external driving device driving shaft 6 drive and lift wedge mechanism support disc 7.

[0027] In summary, loosen the tension bolt, put the ring into, using a certain amount of force to tighten the tension bolt, so that the support disc is lowered, the umbrella ribs are pushed outwards by the wedge structure, and the product ring is supported. The welded parts are installed, the stainless steel cap is put on, and the parts are pressed on the ring by the pressing mechanism. The device, ring and welded parts are loaded into the electron beam welding equipment for spot welding. After spot welding is completed, the pressing mechanism and cap are removed, and the device main body, ring and parts are reloaded into the electron beam welding equipment for complete electron beam welding. After welding is completed, loosen the tension bolt, and take down the welded ring.

[0028] It should be noted that the above content only illustrates the technical idea of the present application, and cannot limit the protection scope of the present application. For ordinary skilled persons in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, which fall within the scope of protection of the claims of the present application.

Claims

1. An electron beam welding device for the rings used in semiconductor sputtering, comprising a base plate (5) that supports and loads the equipment, characterized by: The bottom plate (5) is evenly distributed with six groups of cushion blocks (4) at the top edge, the top of the cushion block (4) is loaded with a welding ring (13), the outer wall of the welding ring (13) is in contact with the welding part (3), the welding part (3) is sleeved on the front end of the compression special-shaped block (1), and seven groups of compression special-shaped blocks (1) are distributed at the edge of the bottom plate (5); The wedge mechanism support disc (7) is horizontally movably installed on the side edge of the wedge mechanism support disc (7), and the wedge mechanism support disc (7) is in supporting contact with the inner wall of the welding ring (13) along the bottom guide sliding block (12).

2. The electron beam welding apparatus for a semiconductor sputtering ring according to claim 1, characterized by: The wedge mechanism support disc (7) is vertically installed at the center of the wedge mechanism support disc (7), and the wedge mechanism support disc (7) is in synchronous motion connection relationship with the wedge mechanism support disc (7) in an up-down direction, and the wedge mechanism support disc (7) is in translational extrusion contact with the inclined surface at the root of the wedge mechanism fan bone (10) through the wedge inclined surface.

3. The electron beam welding apparatus for a semiconductor sputtering ring according to claim 2, characterized by: The wedge mechanism support disc (7) is vertically inserted with three groups of wedge mechanism guide columns (8) along the outside of the wedge mechanism tension bolt (9), and the wedge mechanism guide column (8) is in a uniform distribution structure; The wedge mechanism fan bone (10) is installed with a fan bone support (11) at the top end.

4. The electron beam welding apparatus for a semiconductor sputtering ring according to claim 1, characterized by: The bottom end of the compression special-shaped block (1) is in contact with the bottom plate (5), the top end of the compression special-shaped block (1) is horizontally butt-jointed with a welding cap (2) through a bolt, and the welding cap (2) is sleeved with a welding part (3) at the front end.

5. The electron beam welding apparatus for a semiconductor sputtering ring according to claim 1, characterized by: The bottom plate (5) is installed with a shaft (6).

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