Mechanical arm for taking and placing wafer

Abstract

The utility model provides a mechanical arm used for taking and placing a wafer, the mechanical arm used for taking and placing the wafer comprises a middle arm and a bearing part, the bearing part is connected with the middle arm, the bottom surfaces of the middle arm and the bearing part are provided with vacuum channel grooves which are recessed inwards, the bearing part is provided with a first through hole and a second through hole which are communicated with the vacuum channel grooves, and the first through hole and the second through hole are communicated with the vacuum channel grooves. A first silica gel ring higher than the inner side wall is fixed to the inner side wall of the first through hole, a second silica gel ring higher than the inner side wall is fixed to the inner side wall of the second through hole, and a vacuum channel hose is embedded in the vacuum channel groove. A first vacuum suction port located at the bottom of the first through hole and a second vacuum suction port located at the bottom of the second through hole are formed in the upper surface of the vacuum channel hose, and the first through hole and the second through hole are symmetrically distributed on the two sides of the central axis of the bearing part. The mechanical arm for taking and placing the wafer solves the problem of unstable wafer suction caused by a warped wafer iron ring, and improves the shipment quantity of products.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor integrated circuit manufacturing, and relates to a mechanical arm for taking and placing wafers. BACKGROUND

[0002] Wafer iron rings are key auxiliary tools for fixing and protecting wafers in semiconductor production, and ensure the stability of wafers in key links such as processing, detection, carrying and cutting of wafers, and prevent wafers from being damaged due to movement or vibration, and the wafer iron ring is pasted to the center position of the iron ring through a specific thin ring.

[0003] At present, the mechanical arm sucks the wafer through the thin ring between the wafer iron ring and the wafer. However, the wafer iron ring will be warped after long-term circulation, and the warped wafer iron ring will affect the adsorption of the thin ring by the mechanical arm, resulting in a decrease in the success rate of wafer suction, and frequent alarms of the instrument, thereby increasing the workload of the on-duty engineer in handling exceptions and reducing the product shipment volume.

[0004] Therefore, how to provide a mechanical arm for taking and placing wafers to solve the problem of unstable wafer suction caused by warped wafer iron rings and reduce instrument alarms has become an important problem to be solved by the technical personnel in the field.

[0005] It should be noted that the above introduction to the technical background is only for the convenience of clearly and completely describing the technical scheme of the present application and facilitating the understanding of the technical personnel in the field. The above technical scheme cannot be considered as known to the technical personnel in the field only because it is described in the background section of the present application. CONTENT OF THE UTILITY MODEL

[0006] In view of the above-mentioned defects of the prior art, the purpose of the present utility model is to provide a mechanical arm for taking and placing wafers to solve the problem of unstable wafer suction caused by warped wafer iron rings in the prior art.

[0007] To achieve the above-mentioned purpose and other related purposes, the present utility model provides a mechanical arm for taking and placing wafers, which comprises:

[0008] An intermediate arm and a bearing part, the bearing part is connected with the intermediate arm, and the bottom surface of the intermediate arm and the bearing part is provided with a vacuum passage groove recessed inward;

[0009] A first through hole and a second through hole, the first through hole and the second through hole are located in the bearing part and communicate with the vacuum passage groove, and the first through hole and the second through hole are symmetrically distributed on both sides of the central axis of the bearing part;

[0010] A first silica gel ring is fixed on the inner side wall of the first through hole, and the height difference between the first silica gel ring and the inner side wall of the first through hole ranges from 0.2mm to 0.4mm; and a second silica gel ring is fixed on the inner side wall of the second through hole, and the height difference between the second silica gel ring and the inner side wall of the second through hole ranges from 0.2mm to 0.4mm.

[0011] A vacuum passage hose is embedded in the vacuum passage groove.

[0012] A first vacuum suction port is arranged on the upper surface of the vacuum passage hose at the bottom of the first through hole, and a second vacuum suction port is arranged on the upper surface of the vacuum passage hose at the bottom of the second through hole.

[0013] Optionally, the cross section of the first through hole is rectangular, elliptical or capsule-shaped, and the cross section of the second through hole is rectangular, elliptical or capsule-shaped.

[0014] Optionally, the cross section of the first through hole is rectangular, the length of the first through hole is not greater than 15mm, and the width of the first through hole is not greater than 0.2mm; and the cross section of the second through hole is rectangular, the length of the second through hole is not greater than 15mm, and the width of the second through hole is not greater than 0.2mm.

[0015] Optionally, the distance between the first through hole and the second through hole is greater than the diameter of the wafer.

[0016] Optionally, the distance between the first through hole and the second through hole is less than the inner diameter of the wafer iron ring.

[0017] Optionally, the upper surface of the bearing part is lower than the upper surface of the intermediate arm.

[0018] Optionally, the number of the first through hole is one or more, and the number of the second through hole is the same as that of the first through hole.

[0019] Optionally, the number of the first vacuum suction port is one or more, and the number of the second vacuum suction port is one or more.

[0020] Optionally, an arm mounting hole is further arranged in the intermediate arm.

[0021] Optionally, a buffer pad is arranged on the upper surface of the bearing part.

[0022] As described above, the robotic arm for taking and placing wafers of the present invention includes an intermediate arm, a carrying part, a first through hole, a second through hole, a first silicone ring, a second silicone ring, a vacuum channel hose, a first vacuum suction port and a second vacuum suction port, wherein the carrying part is connected to the intermediate arm, and the bottom surfaces of the intermediate arm and the carrying part are provided with an inwardly recessed vacuum channel groove, the first through hole and the second through hole are located in the carrying part and connected to the vacuum channel groove, and are symmetrically distributed on both sides of the axis of the carrying part, the first silicone ring is fixed on the inner side wall of the first through hole, and the height difference between the first silicone ring and the inner side wall of the first through hole ranges from 0.2mm to 0.4mm, the second silicone ring is fixed on the inner side wall of the second through hole, and the height difference between the second silicone ring and the inner side wall of the second through hole ranges from 0.2mm to 0.4mm, the vacuum channel hose is embedded in the vacuum channel groove, the first vacuum suction port is opened on the upper surface of the vacuum channel hose at the bottom of the first through hole, and the second vacuum suction port is opened on the upper surface of the vacuum channel hose at the bottom of the second through hole. The utility model discloses a mechanical arm for taking and placing wafers, solves the problem of unstable wafer suction caused by a warped wafer iron ring, reduces the number of alarms of the instrument, and thus increases the shipment volume of products. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 Shown is a top view of the structure of a robotic arm for taking and placing wafers according to the present invention.

[0024] Figure 2 Shown is a bottom view of the structure of the robotic arm for taking and placing wafers according to the present invention.

[0025] Figure 3 Shown is a structural side view of a robotic arm for taking and placing wafers according to the present invention.

[0026] Figure 4 Shown is a schematic diagram of the working state of the robotic arm for taking and placing wafers according to the present invention.

[0027] Figure 5 Shown is a line graph of the alarm frequency of wafer pickup by three types of robotic arms for taking and placing wafers according to the present invention.

[0028] Figure 6 A bar chart showing the number of wafer pickup failures for the two tools.

[0029] Figure 7 Displays a bar chart of the output of one machine.

[0030] Description of Reference Numerals

[0031] 1 Intermediate arm

[0032] 2 load-bearing part

[0033] 3 First through hole

[0034] 4 second through hole

[0035] 5 first silica gel ring

[0036] 6 second silica gel ring

[0037] 7 vacuum passage groove

[0038] 8 vacuum passage hose

[0039] 9 first vacuum suction port

[0040] 10 second vacuum suction port

[0041] 11 wafer iron ring

[0042] 12 film

[0043] 13 wafer

[0044] 14 arm mounting hole

[0045] L1 length of first through hole

[0046] L2 width of first through hole

[0047] L3 length of second through hole

[0048] L4 width of second through hole

[0049] L5 height difference between first silica gel ring and inner side wall of first through hole

[0050] D1 diameter of wafer

[0051] D2 distance between first through hole and second through hole

[0052] D3 inner diameter of wafer iron ring

[0053] P central axis of bearing portion DETAILED DESCRIPTION

[0054] The embodiments of the present application will be described in detail with specific reference felt to figures. The advantages and effects of the present application can be easily understood by those skilled in the art from the description of the present application. The present application can also be implemented or applied in different embodiments, and the details in the description can be modified or changed based on different viewpoints and applications without departing from the spirit of the present application.

[0055] It should be emphasized that the terms "comprises / comprising" when used in this specification are taken to specify the presence of stated features, integers, steps or components but do not preclude the presence or addition of one or more other features, integers, steps, components or groups thereof.

[0056] Features described and / or illustrated with respect to one implementation can be used in one or more other implementations in the same or similar manner, in combination with or in place of features of the other implementations, or in combination with or in place of features of the other implementations.

[0057] As described in the detailed description of the embodiments of the present application, the schematic diagram showing the structure of the device will be partially enlarged without the general proportion for the convenience of description, and the schematic diagram is only an example, which should not limit the scope of protection of the present application. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in the actual manufacture.

[0058] For the convenience of description, spatial relationship words such as "under", "below", "lower", "under", "above", "upper" and the like can be used to describe the relationship of one element or feature shown in the drawings with other elements or features. It will be understood that these spatial relationship words are intended to include other directions of the device in use or operation in addition to the directions depicted in the drawings. In addition, when a layer is referred to as "between" two layers, it can be the only layer between the two layers, or one or more intervening layers can also be present.

[0059] In the context of the present application, the structure described with the first feature "on" the second feature can include an embodiment in which the first and second features form direct contact, and can also include an embodiment in which another feature is formed between the first and second features, so that the first and second features can not be in direct contact.

[0060] It should be noted that the diagrams provided in the present embodiment only schematically illustrate the basic concept of the present application, and only show the components related to the present application in the diagrams, not drawn according to the number, shape and size of the components in actual implementation. The actual implementation of each component can be randomly changed in shape, number and proportion, and the component layout pattern can also be more complex.

[0061] Please refer to Figure 1, show as the structure of the utility model for taking and placing wafer mechanical arm plan view, this embodiment provides a kind of for taking and placing wafer mechanical arm, the mechanical arm for taking and placing wafer includes: intermediate arm 1, bearing part 2, first through-hole 3, second through-hole 4, first silica gel ring 5, second silica gel ring 6, vacuum passage hose 8, first vacuum suction port 9 and second vacuum suction port 10, wherein, the bearing part 2 is connected with the intermediate arm 1, the bottom surface of the intermediate arm 1 and the bearing part 2 is provided with the vacuum passage groove 7 recessed inward, the first through-hole 3 and the second through-hole 4 are located in the bearing part 2 and communicate the vacuum passage groove 7, and the first through-hole 3 and the second through-hole 4 are symmetrically distributed on the two sides of the central axis P of the bearing part 2, the first silica gel ring 5 is fixed on the inner side wall of the first through-hole 3, the second silica gel ring 6 is fixed on the inner side wall of the second through-hole 4, please refer to Figure 2 , show as the structure of the utility model for taking and placing wafer mechanical arm plan view, the vacuum passage hose 8 is embedded in the vacuum passage groove 7, the first vacuum suction port 9 is provided on the upper surface of the vacuum passage hose 8 at the bottom of the first through-hole 3, and the second vacuum suction port 10 is provided on the upper surface of the vacuum passage hose 8 at the bottom of the second through-hole 4.

[0062] Specifically, please refer to Figure 3 , show as the structure of the utility model for taking and placing wafer mechanical arm plan view, the first silica gel ring 5 and the height difference L5 of the inner side wall of the first through-hole 3 are 0.2mm~0.4mm, the height difference of the second silica gel ring 6 and the inner side wall of the second through-hole 4 is 0.2mm~0.4mm, so that the stability of wafer suction on the warped wafer iron ring is improved, the number of instrument alarms is reduced, and the product yield is increased.

[0063] Please refer to Figure 5 , show as the structure of the utility model for taking and placing wafer mechanical arm plan view, the first silica gel ring 5 and the second silica gel ring 6) and the height difference of the through hole (the first through-hole 3 and the second through-hole 4) are 0mm, 0.2mm, 0.3mm and 0.4mm, by adjusting the height difference of the silica gel ring and the through hole, the stability of wafer suction on the warped wafer iron ring of the mechanical arm for taking and placing wafer can be improved, when the height difference of the silica gel ring and the through hole is 0.2mm~0.4mm, the number of instrument alarms is lower.

[0064] As an example, the cross section of the first through-hole 3 is rectangular, oval or capsule-shaped, and the cross section of the second through-hole 4 is rectangular, oval or capsule-shaped.

[0065] As an example, the cross section of the first through hole 3 is rectangular, the length L1 of the first through hole 3 is not greater than 15mm, the width L2 of the first through hole 3 is not greater than 0.2mm, the cross section of the second through hole 4 is rectangular, the length L3 of the second through hole 4 is not greater than 15mm, the width L4 of the second through hole 4 is not greater than 0.2mm, please refer to Figure 4 , which is a working state schematic diagram of the mechanical arm for taking and placing wafers of the utility model, so that the contact area of the first through hole 3 and the second through hole 4 with the film 12 is small, and the deformation of the film 12 due to the suction force of the first through hole 3 and the second through hole 4 is slowed down.

[0066] As an example, please refer to Figure 4 , the distance D2 between the first through hole 3 and the second through hole 4 is greater than the diameter D1 of the wafer 13.

[0067] As an example, please refer to Figure 4 , the distance D2 between the first through hole 3 and the second through hole 4 is less than the inner diameter D3 of the wafer iron ring 11.

[0068] As an example, the upper surface of the bearing part 2 is lower than the upper surface of the intermediate arm 1, which facilitates the grabbing of the wafer 13.

[0069] As an example, the number of the first through hole 3 is one or more, and the number of the second through hole 4 is the same as the number of the first through hole 3, for example, the number of the first through hole 3 can be 2, 4 or 6, and the number of the second through hole 4 can be 2, 4 or 6.

[0070] As an example, the number of the first vacuum suction port 9 is one or more, and the number of the second vacuum suction port 10 is one or more, for example, the number of the first vacuum suction port 9 can be 3, 5 or 7, and the number of the second vacuum suction port 10 can be 3, 5 or 7.

[0071] As an example, the intermediate arm 1 is further provided with an arm mounting hole 14 for mounting the mechanical arm for taking and placing wafers of the utility model.

[0072] As an example, the upper surface of the bearing part 2 is provided with a buffer pad, which further protects the wafer 13 from being damaged by the bearing part 2.

[0073] Please refer to Figure 6, which is a fault frequency bar chart of two machines, the left side is a fault frequency bar chart of machine one, and the right side is a fault frequency bar chart of machine two, and the number of wafer pieces grabbed by the two machines before and after the mechanical arm for taking and placing wafers of the utility model is shown, and it can be seen that the mechanical arm for taking and placing wafers of the utility model obviously reduces the number of wafer pieces grabbed by the two machines.

[0074] Please refer to Figure 7 , which is a yield bar chart of one machine, and the chart is a parameter bar chart of machine two, and the number of wafer pieces successfully grabbed by machine two after the mechanical arm for taking and placing wafers of the utility model is higher, and it can be seen that the mechanical arm for taking and placing wafers of the utility model obviously improves the work efficiency of machine two.

[0075] In summary, the mechanical arm for taking and placing wafers of the utility model comprises an intermediate arm, a bearing part, a first through hole, a second through hole, a first silica gel ring, a second silica gel ring, a vacuum channel hose, a first vacuum suction port and a second vacuum suction port, wherein the bearing part is connected with the intermediate arm, the bottom surface of the intermediate arm and the bearing part is provided with a vacuum channel groove recessed inward, the first through hole and the second through hole are located in the bearing part and communicate with the vacuum channel groove, and are symmetrically distributed on both sides of the axis of the bearing part, the first silica gel ring is fixed on the inner side wall of the first through hole, the height difference between the first silica gel ring and the inner side wall of the first through hole is in the range of 0.2mm-0.4mm, the second silica gel ring is fixed on the inner side wall of the second through hole, the height difference between the second silica gel ring and the inner side wall of the second through hole is in the range of 0.2mm-0.4mm, the vacuum channel hose is embedded in the vacuum channel groove, the first vacuum suction port is provided on the upper surface of the vacuum channel hose at the bottom of the first through hole, and the second vacuum suction port is provided on the upper surface of the vacuum channel hose at the bottom of the second through hole. The mechanical arm for taking and placing wafers of the utility model solves the problem of unstable wafer suction caused by the warping wafer iron ring, reduces the number of instrument alarms, and thus improves the product shipment quantity. Therefore, the utility model effectively overcomes the various shortcomings in the prior art and has high industrial utilization value.

[0076] The above embodiments only exemplarily illustrate the principle and effect of the utility model, and are not used to limit the utility model. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the utility model. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the utility model should be covered by the claims of the utility model.

Claims

1. A robot for picking and placing wafers, characterized by The utility model relates to a wafer carrier, which comprises: a middle arm and a carrier connected with the middle arm, and a vacuum channel groove recessed inwardly formed in the bottom surface of the middle arm and the carrier; a first through hole and a second through hole located in the carrier and communicating with the vacuum channel groove, and the first through hole and the second through hole are symmetrically distributed on both sides of the central axis of the carrier; a first silica gel ring fixed on the inner side wall of the first through hole, and the height difference between the first silica gel ring and the inner side wall of the first through hole ranges from 0.2mm to 0.4mm, and a second silica gel ring fixed on the inner side wall of the second through hole, and the height difference between the second silica gel ring and the inner side wall of the second through hole ranges from 0.2mm to 0.4mm; a vacuum channel hose embedded in the vacuum channel groove; a first vacuum suction port and a second vacuum suction port, the first vacuum suction port is formed in the upper surface of the vacuum channel hose at the bottom of the first through hole, and the second vacuum suction port is formed in the upper surface of the vacuum channel hose at the bottom of the second through hole.

2. The robot for picking and placing wafers according to claim 1, wherein: The cross section of the first through hole is rectangular, oval or capsule-shaped, and the cross section of the second through hole is rectangular, oval or capsule-shaped.

3. The robot arm for picking and placing wafers according to claim 2, wherein: The cross section of the first through hole is rectangular, the length of the first through hole is not greater than 15mm, and the width of the first through hole is not greater than 0.2mm; the cross section of the second through hole is rectangular, the length of the second through hole is not greater than 15mm, and the width of the second through hole is not greater than 0.2mm.

4. The robot for picking and placing wafers according to claim 1, wherein: The distance between the first through hole and the second through hole is greater than the diameter of the wafer.

5. The robot arm for picking and placing wafers of claim 1, wherein: The distance between the first through hole and the second through hole is less than the inner diameter of the wafer iron ring.

6. The robot for picking and placing wafers according to claim 1, wherein: The upper surface of the carrier is lower than the upper surface of the middle arm.

7. The robot for picking and placing wafers according to claim 1, wherein: The number of the first through hole is one or more, and the number of the second through hole is the same as that of the first through hole.

8. The robot for picking and placing wafers according to claim 1, wherein: The number of the first vacuum suction port is one or more, and the number of the second vacuum suction port is one or more.

9. The robot for picking and placing wafers according to claim 1, wherein: The middle arm is further provided with an arm mounting hole.

10. The robot for picking and placing a wafer according to claim 1, wherein: The upper surface of the carrier is provided with a buffer pad.

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