Drying agent attaching device for wafer packaging box

Abstract

The utility model belongs to the technical field of wafer packaging box packaging, and particularly relates to a wafer packaging box desiccant attaching device which attaches desiccant to a wafer packaging box sleeved with an inner bag, and the inner bag comprises an inner bag body used for sleeving the wafer packaging box and an edge folding section located on the outer side of a heat sealing position. The drying agent attaching device comprises an attaching workbench, a rubberizing position arranged on the attaching workbench, a feeding and carrying device for carrying a wafer packaging box to the rubberizing position, a first attaching device arranged on the attaching workbench and used for attaching an opening of an inner bag to one side of the inner bag, and a second attaching device for attaching a drying agent to the inner bag. The structure of the drying agent attaching device is limited, the feeding carrying device is matched with the first attaching device and the second attaching device, the folded edge section of the inner bag is stored and fixed, then the drying agent is attached and fixed to the top face of the inner bag, the whole process is high in automation degree, the labor cost can be greatly reduced, and the production efficiency is improved. And the drying agent attaching efficiency is greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to wafer packing box packing technical field, concretely relates to a kind of wafer packing box desiccant attaching device. BACKGROUND

[0002] Wafer needs to be chamfered and polished and cleaned before photoetch, and after the above process, wafer is packed into clean wafer packing box, and double aluminum foil bag is used to store and transport in vacuum state.Wafer packing box aluminum foil bag vacuum packaging process is very important, which can effectively protect wafer packing box from damage and isolate particle contamination, to ensure the yield of wafer photoetch process.Wafer packing box aluminum foil bag vacuum packaging is still manually operated by manual operation, such as bagging, bag folding, vacuumizing, tape sealing, information labeling and desiccant attaching, which is low in efficiency, requires a large number of manpower, has high labor cost, and is difficult to ensure cleanliness, and needs to be improved. SUMMARY

[0003] The utility model aims at overcoming the shortcomings of prior art, and provides a kind of wafer packing box desiccant attaching device.

[0004] The utility model adopts the following technical scheme:

[0005] A wafer packing box desiccant attaching device is used to attach desiccant to a wafer packing box with an inner bag, the inner bag includes an inner bag body for sleeving the wafer packing box and a folded edge segment located outside the heat sealing position, and the device includes an attaching workbench, a tape attaching position arranged on the attaching workbench, a feeding and conveying device for conveying the wafer packing box to the tape attaching position, a first attaching device arranged on the attaching workbench for adhering the inner bag opening to one side of the inner bag, and a second attaching device arranged on the attaching workbench for attaching the desiccant to the inner bag.

[0006] The first attaching device includes a first tape positioning assembly arranged on the attaching workbench at one side of the tape attaching position, a push flat frame arranged on the attaching workbench opposite to the first tape positioning assembly, a push flat roller rotatably arranged on the upper end of the push flat frame, a folded edge assembly arranged on the push flat frame for folding the end of the folded edge segment downward, and a first tape attaching assembly arranged on the attaching workbench, when the feeding and conveying device drives the wafer packing box with the inner bag to move downward to the tape attaching position, the push flat roller pushes the folded edge segment upward to make part of the folded edge segment stored on the opposite surface of the inner bag, and the rest of the folded edge segment is folded downward to the top surface of the inner bag by the work of the folded edge assembly, and the first tape attaching assembly attaches the tape between the top surface of the inner bag and the end of the folded edge segment.

[0007] Preferably, the folding assembly comprises a folding plate arranged on the pushing flat frame and movable towards the first adhesive positioning assembly, a folding cylinder arranged on the pushing flat frame and connected to drive the folding plate to move, a plurality of adhesive allowing areas for the first adhesive assembly to adhere adhesive are arranged on the folding plate, after the folding section is pushed up by the pushing roller and accommodated on the opposite side of the inner bag, the remaining part of the folding section is folded on the folding plate, the folding cylinder controls the folding plate to move towards the first adhesive positioning assembly so that the remaining part of the folding section is driven by the folding plate to be folded down to the top surface of the inner bag.

[0008] Preferably, the first adhesive assembly comprises a first adhesive frame for placing an adhesive roll, a first adhesive pressing assembly arranged on the first adhesive frame for pressing the adhesive, a first adhesive pulling pneumatic clamp movable relative to the first adhesive pressing assembly, a first cutting assembly arranged on the first adhesive frame and located outside the first adhesive pressing assembly for cutting the adhesive, a first adhesive pulling cylinder arranged on the first adhesive frame and driving the first adhesive pulling pneumatic clamp to move, and a first suction assembly arranged on the first adhesive frame for suctioning the adhesive, the first adhesive pulling cylinder controls the first adhesive pulling pneumatic clamp to pull the adhesive to move outward to the outside of the first suction assembly, the first suction assembly can suction and fix the relative adhesive so that the first cutting assembly cuts the pulled adhesive.

[0009] Preferably, the first adhesive pressing assembly comprises a lower adhesive pressing block arranged on the first adhesive frame, an upper adhesive pressing block movable relative to the lower adhesive pressing block, a first adhesive pressing cylinder arranged on the first adhesive frame and connected to drive the upper adhesive pressing block to move up and down, and a first guide roller arranged on the first adhesive frame and located inside the lower adhesive pressing block, one end of the adhesive roll passes through the lower end of the first guide roller and then passes through the space between the upper adhesive pressing block and the lower adhesive pressing block to be pressed.

[0010] Preferably, the first suction assembly comprises a first fixed frame arranged on the first adhesive frame, a suction seat arranged on the first fixed frame and movable up and down, an adhesive suction head arranged on the suction seat for suctioning the adhesive, and a first suction cylinder arranged on the first fixed frame and connected to drive the suction seat to move up and down.

[0011] Preferably, the first adhesive assembly further comprises a moving seat arranged on the first adhesive frame, a first moving module connected to drive the moving seat to move towards the first adhesive positioning assembly, and a second moving module arranged on the adhesive workbench and driving the first moving module to move, the moving direction of the second moving module is perpendicular to the moving direction of the first moving module.

[0012] Preferably, the wafer packaging box at the adhesive position is moved to the second adhesive device by an adhesive conveying device, the adhesive conveying device comprises a receiving table arranged on the adhesive workbench and movable up and down for receiving the wafer packaging box, a lifting driving assembly connected with and driving the receiving table to move up and down, and a conveying module conveying the lifting driving assembly and the receiving table from the first adhesive positioning assembly to the second adhesive device, and the lifting driving assembly comprises a mounting seat arranged on the conveying module and a lifting cylinder arranged on the mounting seat and connected with the receiving table.

[0013] Preferably, the second adhesive device comprises an adhesive manipulator arranged on the adhesive workbench, an adhesive frame arranged at the front end of the adhesive manipulator, a second adhesive positioning assembly arranged on the adhesive workbench and opposite to the adhesive manipulator, a desiccant storage bin arranged on the adhesive workbench and at one side of the second adhesive positioning assembly, a tape supply mechanism arranged on the adhesive workbench and supplying the adhesive tape, and a detection camera, an adhesive tape suction assembly and a desiccant suction assembly arranged at intervals on the outer periphery of the adhesive frame, the adhesive manipulator controls the desiccant suction assembly to suction the desiccant to the inner bag surface, and then controls the adhesive tape suction assembly to suction the adhesive tape from the tape supply mechanism to adhere and fix the desiccant at the wafer packaging box.

[0014] Preferably, the desiccant storage bin comprises a storage frame arranged on the adhesive workbench, a storage bin arranged in the storage frame for storing the desiccant, a receiving plate arranged in the storage bin and movable up and down, and a vertical movement module arranged on the storage frame and connected with and driving the receiving plate to move up and down.

[0015] Preferably, the first adhesive positioning assembly comprises a first positioning frame arranged on the adhesive workbench and opposite to the flattening frame, a first positioning plate movable in the direction close to the flattening frame, and a first positioning cylinder arranged on the first positioning frame and driving the first positioning plate to move.

[0016] From the above description of the present application, compared with the prior art, the beneficial effects of the present application are: by limiting the structure of the desiccant adhesive device, by cooperating the feeding and conveying device with the first adhesive device and the second adhesive device, the inner bag folded edge section is fixed and received, and then the desiccant is adhered and fixed on the top surface of the inner bag, the whole process has high automation degree, the labor cost can be greatly reduced, and the desiccant adhering efficiency is greatly improved; wherein, the structure of the first adhesive device is specifically limited, when the wafer packaging box is moved downward to the adhesive position by the feeding and conveying device, the flattened roller pushes the folded edge section upward to make part of it received on the opposite surface of the inner bag, and the remaining part is clamped on the folded edge assembly, and then the folded edge assembly works to make the remaining part of the folded edge section fold downward to the top surface of the inner bag; at this time, the first adhesive tape adhesive assembly can adhere the adhesive tape between the top surface of the inner bag and the end of the folded edge section, and the folded edge section of the inner bag is fixed and received. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 Structure diagram of the desiccant attaching device;

[0018] Figure 2 Structure diagram of the desiccant attaching device Figure One ;

[0019] Figure 3 Structure diagram of the desiccant attaching device Figure Two ;

[0020] Figure 4 Structure diagram of the second attaching device;

[0021] Figure 5 Structure diagram of the folding assembly;

[0022] Figure 6 Structure diagram of the first adhesive tape attaching assembly;

[0023] Figure 7 Structure diagram of the first adhesive tape attaching assembly;

[0024] Figure 8 Structure diagram of the desiccant storage bin;

[0025] Figure 9 Structure diagram of the attaching conveying device;

[0026] Figure 10 Structure diagram of the inner bag;

[0027] In the figure, 1, attaching workbench; 2, glue attaching position; 3, feeding and carrying device; 4, first attaching device; 5, second attaching device; 6, attaching conveying device; 7, inner bag; 41, first glue attaching positioning assembly; 411, first positioning frame; 412, first positioning plate; 413, first positioning cylinder; 42, flattening frame; 43, flattening roller; 44, edge folding assembly; 441, edge folding plate; 442, edge folding cylinder; 443, glue attaching allowance area; 45, first glue tape attaching assembly; 451, first glue tape frame; 452, first glue pressing assembly; 4521, lower glue pressing block; 4522, upper glue pressing block; 4523, first glue pressing cylinder; 4524, first guide roller; 453, first glue pulling pneumatic clamping jaw; 454, first cutting assembly; 4541, first cutting knife; 4542, first cutting cylinder; 455, first glue pulling cylinder; 456, first suction assembly; 4561, first fixing frame; 4562, suction seat; 4563, glue tape suction head; 4564, first suction cylinder; 4565, second suction cylinder; 457, moving seat; 458, first moving and carrying module; 459, second moving and carrying module; 51, attaching manipulator; 52, attaching frame; 53, second glue attaching positioning assembly; 531, second fixing frame; 532, second positioning frame; 533, second positioning plate; 534, second positioning cylinder; 54, desiccant storage bin; 541, storage frame; 542, storage bin; 543, material receiving plate; 544, vertical moving module; 55, glue tape supply mechanism; 56, detection camera; 57, glue tape suction assembly; 571, fixed suction head; 572, floating suction head; 58, desiccant suction assembly; 61, receiving table; 62, lifting driving assembly; 63, conveying module; 71, inner bag body; 72, edge folding section. DETAILED DESCRIPTION

[0028] The utility model will be further described below through specific implementation.

[0029] Referring to Figures 1 to 10 As shown in the figure, a wafer packaging box desiccant attaching device is used for attaching desiccant to a wafer packaging box sleeved with an inner bag 7, and comprises an attaching workbench 1, a glue attaching position 2 arranged on the attaching workbench 1, a feeding and carrying device 3 used for carrying the wafer packaging box to the glue attaching position 2, a first attaching device 4 arranged on the attaching workbench 1 and used for adhering the bag opening of the inner bag 7 to one side of the inner bag 7, a second attaching device 5 used for attaching the desiccant to the inner bag 7, and an attaching conveying device 6 used for moving the wafer packaging box on the glue attaching position 2 to the second attaching device 5; wherein the inner bag 7 comprises an inner bag body 71 used for sleeving the wafer packaging box and an edge folding section 72 located on the outer side of the heat sealing position.

[0030] The loading carrying device 3 adopts a multi-axis moving module with loading pneumatic clamping jaws to realize multi-axis movement, and carries the wafer packaging box to the rubberizing position 2. The structure of the pneumatic clamping jaws cooperating with the multi-axis moving module to clamp and move the article is a mature technology in the mechanical field, and the specific structure and working principle thereof will not be described further.

[0031] The first attaching device 4 comprises a first rubberizing positioning assembly 41 arranged on the attaching workbench 1 at one side of the rubberizing position 2, a push flat frame 42 arranged on the attaching workbench 1 opposite to the first rubberizing positioning assembly 41, a push flat roller 43 rotatably arranged on the upper end of the push flat frame 42, a folding edge assembly 44 arranged on the push flat frame 42 to fold the end portion of the folding edge segment 72 downward, and a first rubber band attaching assembly 45 arranged on the attaching workbench 1. In operation, when the loading carrying device 3 drives the wafer packaging box with the inner bag 7 to move downward to the rubberizing position 2, the push flat roller 43 pushes the folding edge segment 72 upward to make part of the folding edge segment 72 be accommodated on the opposite side of the inner bag 7, and the rest of the folding edge segment 72 is folded downward to the top surface of the inner bag 7 by the folding edge assembly 44, and the first rubber band attaching assembly 45 attaches the rubber band between the top surface of the inner bag 7 and the end portion of the folding edge segment 72.

[0032] The first rubberizing positioning assembly 41 comprises a first positioning frame 411 arranged on the attaching workbench 1 opposite to the push flat frame 42, a first positioning plate 412 movable in the direction close to the push flat frame 42, and a first positioning cylinder 413 arranged on the first positioning frame 411 to drive the first positioning plate 412 to move. When the loading carrying device 3 moves the wafer packaging box with the inner bag 7 to the rubberizing position 2, the first positioning cylinder 413 drives the first positioning plate 412 to move close to the wafer packaging box to position the wafer packaging box between the first positioning plate 412 and the push flat frame 42, thereby ensuring the operation of the first rubber band attaching assembly 45.

[0033] The folding edge assembly 44 comprises a folding edge plate 441 arranged on the push flat frame 42 and movable in the direction close to the first rubberizing positioning assembly 41, and a folding edge cylinder 442 arranged on the push flat frame 42 to connect and drive the folding edge plate 441 to move. The folding edge plate 441 is provided with a plurality of rubberizing accommodation areas 443 for the first rubber band attaching assembly 45 to attach the rubber band. In operation, after part of the folding edge segment 72 is pushed upward by the push flat roller 43 to be accommodated on the opposite side of the inner bag 7, the rest of the folding edge segment 72 is folded downward to the top surface of the inner bag 7 by the folding edge plate 441 driven by the folding edge cylinder 442.

[0034] The first adhesive tape attaching assembly 45 comprises a first adhesive tape rack 451 for placing an adhesive tape roll, a first adhesive pressing assembly 452 arranged on the first adhesive tape rack 451 for pressing the adhesive tape, a first adhesive pulling pneumatic clamp jaw 453 movable relative to the first adhesive pressing assembly 452, a first cutting assembly 454 arranged on the first adhesive tape rack 451 outside the first adhesive pressing assembly 452 for cutting the adhesive tape, a first adhesive pulling pneumatic cylinder 455 arranged on the first adhesive tape rack 451 for driving the first adhesive pulling pneumatic clamp jaw 453 to move, a first suction assembly 456 arranged on the first adhesive tape rack 451 for suctioning the adhesive tape, a moving seat 457 for mounting the first adhesive tape rack 451, a first moving module 458 connected to and driving the moving seat 457 to move close to the first adhesive tape attaching positioning assembly 41, and a second moving module 459 arranged on the attaching workbench 1 for driving the first moving module 458 to move. The first adhesive pulling pneumatic cylinder 455 controls the first adhesive pulling pneumatic clamp jaw 453 to pull the adhesive tape to move outward to the outside of the first suction assembly 456. The first suction assembly 456 can suction and fix the relative adhesive tape so that the first cutting assembly 454 cuts the pulled adhesive tape. The first moving module 458 and the second moving module 459 work respectively so that the cut adhesive tape can be moved to the top surface of the wafer packaging box to fix the end of the edge folding section 72 to the top surface of the inner bag 7. Specifically, the moving direction of the second moving module 459 is perpendicular to the moving direction of the first moving module 458. Both the first moving module 458 and the second moving module 459 can adopt a linear moving module, which is a mature technology in the mechanical field. The specific structure and working principle of the edge folding will not be described further.

[0035] The first adhesive pressing assembly 452 comprises a lower adhesive pressing block 4521 arranged on the first adhesive tape rack 451, an upper adhesive pressing block 4522 movable relative to the lower adhesive pressing block 4521, a first adhesive pressing pneumatic cylinder 4523 arranged on the first adhesive tape rack 451 and connected to and driving the upper adhesive pressing block 4522 to move up and down, and a first guide roller 4524 arranged on the first adhesive tape rack 451 inside the lower adhesive pressing block 4521. One end of the adhesive tape roll passes through the lower end of the first guide roller 4524 and then passes through the space between the upper adhesive pressing block 4522 and the lower adhesive pressing block 4521 to be pressed.

[0036] The first cutting assembly 454 comprises a first cutting knife 4541 movably arranged on the first adhesive tape rack 451 and a first cutting pneumatic cylinder 4542 arranged on the first adhesive tape rack 451 and connected to and driving the first cutting knife 4541 to move up and down. The first cutting knife 4541 is located between the first adhesive pressing assembly 452 and the first suction assembly 456.

[0037] The first adsorption assembly 456 comprises a first fixing frame 4561 arranged on the first adhesive tape frame 451, an adsorption seat 4562 arranged on the first fixing frame 4561 and movable up and down, an adhesive tape adsorption head 4563 arranged on the adsorption seat 4562 and used for adsorbing the adhesive tape, a first adsorption air cylinder 4564 arranged on the first fixing frame 4561 and connected with the adsorption seat 4562 and used for driving the adsorption seat 4562 to move up and down, and a second adsorption air cylinder 4565 arranged on the adsorption seat 4562 and connected with the adhesive tape adsorption head 4563 and used for driving the adhesive tape adsorption head 4563 to move up and down.

[0038] The second adhesive tape attaching device 5 comprises an attaching manipulator 51 arranged on the attaching workbench 1, an attaching frame 52 arranged at the front end of the attaching manipulator 51, a second adhesive tape positioning assembly 53 arranged on the attaching workbench 1 and opposite to the attaching manipulator 51, a desiccant storage bin 54 arranged on the attaching workbench 1 and located at one side of the second adhesive tape positioning assembly 53, an adhesive tape supply mechanism 55 arranged on the attaching workbench 1 and used for supplying the adhesive tape, and a detection camera 56, an adhesive tape adsorption assembly 57 and a desiccant adsorption assembly 58 arranged at intervals on the outer periphery of the attaching frame 52, the attaching manipulator 51 controls the desiccant adsorption assembly 58 to adsorb the desiccant to the surface of the inner bag 7, and then controls the adhesive tape adsorption assembly 57 to adsorb the adhesive tape from the adhesive tape supply mechanism 55 to the desiccant on the wafer packaging box to adhere and fix the desiccant; wherein the adhesive tape supply mechanism 55 is basically the same as the first adhesive tape attaching assembly 45, and the difference lies in that the first adsorption assembly 456, the moving seat 457, the first moving module 458 and the second moving module 459 are not arranged; because the adhesive tape adsorption assembly 57 is arranged on the attaching frame 52 and moves with the attaching manipulator 51, the first adsorption assembly 456, the moving seat 457, the first moving module 458 and the second moving module 459 are not arranged.

[0039] The second adhesive tape positioning assembly 53 comprises a second fixing frame 531 arranged on the attaching workbench 1, a second positioning frame 532 arranged on the attaching workbench 1 and opposite to the second fixing frame 531, a second positioning plate 533 movable in the direction close to the second fixing frame 531, and a second positioning air cylinder 534 arranged on the second positioning frame 532 and used for driving the second positioning plate 533 to move, the wafer packaging box is fixed through the cooperation of the second positioning plate 533 and the second fixing frame 531, so as to facilitate the placement of the desiccant and the attachment of the adhesive tape.

[0040] The desiccant storage bin 54 comprises a storage frame 541 arranged on the attaching workbench 1, a storage bin 542 arranged in the storage frame 541 and used for storing the desiccant, a material receiving plate 543 arranged in the storage bin 542 and movable up and down, and a vertical moving module 544 arranged on the storage frame 541 and connected with the material receiving plate 543 and used for driving the material receiving plate 543 to move up and down; specifically, the vertical moving module 544 adopts a linear moving module which can realize the up-and-down movement of the material receiving plate 543.

[0041] The tape adsorption assembly 57 includes a fixed adsorption head 571 arranged on the attaching frame 52 and two floating adsorption heads 572 arranged on the attaching frame 52 at both sides of the fixed adsorption head 571, and the two floating adsorption heads 572 are connected with the two ends of the tape respectively. When the desiccant is fixed, the fixed adsorption head 571 presses the adsorbed part of the tape on the upper surface of the desiccant, and the two floating adsorption heads 572 press the two ends of the tape on the surface of the inner bag 7, so as to realize the fixation of the desiccant.

[0042] The attaching conveying device 6 includes a receiving table 61 arranged on the attaching workbench 1 and movable up and down for receiving the wafer packaging box, a lifting driving assembly 62 connected with and driving the receiving table 61 to move up and down, and a conveying module 63 conveying the lifting driving assembly 62 and the receiving table 61 from the first tape attaching positioning assembly 41 to the second attaching device 5, wherein the lifting driving assembly 62 can adopt a pneumatic cylinder; and the conveying module 63 adopts a linear movement module.

[0043] The work flow of the present application is as follows:

[0044] In step one, the wafer packaging box with the sleeved inner bag 7 is carried to the tape attaching position 2 by the loading and carrying device 3. During the carrying process, the loading and carrying device 3 moves the wafer packaging box to above the tape attaching position 2, and then slowly lowers the wafer packaging box to the tape attaching position 2. During the lowering process, part of the inner bag folded edge 72 is pushed flat by the flattening roller 43 and is stored on the opposite side surface of the inner bag 7, and the remaining part is placed on the folded edge plate 441.

[0045] In step two, the wafer packaging box is fixed between the first positioning plate 412 and the opposite flattening frame 42 by the first tape attaching positioning assembly 41, and then the folded edge plate 441 is moved close to the first tape attaching positioning assembly 41 by the folded edge cylinder 442, so that the remaining part of the folded edge 72 is folded downward to the top surface of the inner bag 7 by the folded edge plate 441.

[0046] In step three, the first tape pulling cylinder 455 controls the first tape pulling pneumatic clamp jaw 453 to pull the tape outward to the outside of the first adsorption assembly 456, the first adsorption assembly 456 can adsorb and fix the opposite tape, so that the first cutting assembly 454 cuts the pulled tape, and then the first transfer module 458 and the second transfer module 459 work respectively to move the cut tape to the top surface of the wafer packaging box to fix the end of the folded edge 72 on the top surface of the inner bag 7.

[0047] Step four, the attaching conveying device 6 moves the wafer packaging box at the adhesive attaching position 2 to the second adhesive attaching positioning assembly 53, and the wafer packaging box is positioned through cooperation of the second positioning plate 533 and the second fixing frame 531, the adhesive attaching manipulator 51 controls the desiccant adsorption assembly 58 to adsorb and transfer the desiccant in the desiccant storage bin 54 to the top surface of the inner bag 7, then continues to control the adhesive tape adsorption assembly 57 to obtain the adhesive tape from the adhesive tape supply mechanism 55, and the desiccant is fixed on the surface of the inner bag 7 through cooperation of the fixed adsorption head 571 and the floating adsorption head 572, so as to complete the attaching of the desiccant, and the attaching conveying device 6 continues to work to convey the wafer packaging box with the attached desiccant to the next equipment.

[0048] The application realizes the storage and fixation of the inner bag folded edge segment 72 through cooperation of the feeding and carrying device 3 and the first attaching device 4 and the second attaching device 5, and then the desiccant is attached and fixed on the top surface of the inner bag 7, the whole process has high automation degree, the labor cost can be greatly reduced, and the attaching efficiency of the desiccant is greatly improved, wherein the structure of the first attaching device 4 is specifically limited, when the wafer packaging box is moved downward to the adhesive attaching position 2 by the feeding and carrying device 3, the pusher roller 43 pushes the folded edge segment 72 upward to make part of the folded edge segment 72 stored on the opposite surface of the inner bag 7, and the rest of the folded edge segment 72 is folded on the folded edge assembly 44, and the folded edge assembly 44 works to make the rest of the folded edge segment 72 folded downward to the top surface of the inner bag 7, at this time, the first adhesive tape attaching assembly 45 can attach the adhesive tape between the top surface of the inner bag 7 and the end portion of the folded edge segment 72, and the storage and fixation of the inner bag folded edge segment 72 are completed.

[0049] The above is only a preferred embodiment of the application, and therefore cannot limit the range of the application, that is, equivalent changes and modifications made according to the patent application range and the content of the specification should still be within the scope of the application.

Claims

1. A wafer packaging box desiccant attachment device for attaching desiccant to a wafer packaging box enclosed in an inner bag, wherein the inner bag comprises an inner bag body for enclosing the wafer packaging box and a folded edge section located outside a heat seal, characterized in that: The application relates to a wafer packaging box attaching device, which comprises an attaching workbench, a rubber attaching position arranged on the attaching workbench, a feeding and carrying device for carrying a wafer packaging box to the rubber attaching position, a first attaching device arranged on the attaching workbench and used for attaching an inner bag opening to one side of the inner bag, and a second attaching device arranged on the attaching workbench and used for attaching a drying agent to the inner bag. The first attaching device comprises a first rubber attaching positioning assembly arranged on the attaching workbench and located on one side of the rubber attaching position, a push-flat frame arranged on the attaching workbench and opposite to the first rubber attaching positioning assembly, a push-flat roller rotatably arranged on the upper end of the push-flat frame, a folding edge assembly arranged on the push-flat frame and used for folding the end of the folding edge segment downward, and a first rubber tape attaching assembly arranged on the attaching workbench.

2. The wafer packaging box desiccant attaching apparatus according to claim 1, wherein: The folding edge assembly comprises a folding edge plate arranged on the push-flat frame and movable towards the first rubber attaching positioning assembly, and a folding edge cylinder arranged on the push-flat frame and connected to and used for driving the folding edge plate to move.

3. The desiccant attaching apparatus for wafer packaging boxes according to claim 1, wherein: The first rubber tape attaching assembly comprises a first rubber tape frame used for placing a rubber tape roll, a first rubber pressing assembly arranged on the first rubber tape frame and used for pressing the rubber tape, a first rubber pulling pneumatic clamp movable back and forth relative to the first rubber pressing assembly, a first cutting assembly arranged on the first rubber tape frame and located on the outer side of the first rubber pressing assembly and used for cutting the rubber tape, a first rubber pulling cylinder arranged on the first rubber tape frame and used for driving the first rubber pulling pneumatic clamp to move, and a first suction assembly arranged on the first rubber tape frame and used for sucking the rubber tape.

4. The desiccant attaching apparatus for wafer packaging boxes according to claim 3, wherein: The first rubber pressing assembly comprises a lower rubber pressing block arranged on the first rubber tape frame, an upper rubber pressing block movable back and forth relative to the lower rubber pressing block, a first rubber pressing cylinder arranged on the first rubber tape frame and connected to and used for driving the upper rubber pressing block to move up and down, and a first guide roller arranged on the first rubber tape frame and located on the inner side of the lower rubber pressing block.

5. The desiccant attaching apparatus for wafer packaging boxes according to claim 3, wherein: The first suction assembly comprises a first fixing frame arranged on the first rubber tape frame, a suction seat movably arranged on the first fixing frame, a rubber tape suction head arranged on the suction seat and used for sucking the rubber tape, and a first suction cylinder arranged on the first fixing frame and connected to and used for driving the suction seat to move up and down.

6. The desiccant attaching apparatus for wafer packaging boxes according to claim 3, wherein: The first adhesive tape attaching assembly further comprises a moving seat installed on the first adhesive tape frame, a first moving module connected to and driving the moving seat to move close to the first adhesive tape positioning assembly, and a second moving module arranged on the attaching workbench to drive the first moving module to move.

7. The desiccant attaching apparatus for wafer packaging boxes according to claim 1, wherein: The attaching conveying device is further arranged to move the wafer packaging box with the adhesive tape to the second attaching device, and comprises a receiving table arranged on the attaching workbench to receive the wafer packaging box and movable up and down, a lifting driving assembly connected to and driving the receiving table to move up and down, and a conveying module conveying the lifting driving assembly and the receiving table from the first adhesive tape positioning assembly to the second attaching device.

8. The desiccant attaching apparatus for wafer packaging boxes according to claim 7, wherein: The second attaching device comprises an attaching robot arranged on the attaching workbench, an attaching frame arranged at the front end of the attaching robot, a second adhesive tape positioning assembly arranged on the attaching workbench and opposite to the attaching robot, a desiccant storage arranged on the attaching workbench and at one side of the second adhesive tape positioning assembly, an adhesive tape supply mechanism arranged on the attaching workbench to supply the adhesive tape, and a detection camera, an adhesive tape suction assembly and a desiccant suction assembly arranged at intervals on the outer periphery of the attaching frame.

9. The desiccant attaching apparatus for wafer packaging boxes according to claim 8, wherein: The desiccant storage comprises a storage frame arranged on the attaching workbench, a storage bin arranged in the storage frame to store the desiccant, a receiving plate arranged in the storage bin and movable up and down, and a vertical moving module arranged on the storage frame and connected to and driving the receiving plate to move up and down.

10. The desiccant attaching apparatus for wafer packaging boxes according to claim 1, wherein: The first adhesive tape positioning assembly comprises a first positioning frame arranged on the attaching workbench and opposite to the flattening frame, a first positioning plate movable in the direction close to the flattening frame, and a first positioning cylinder arranged on the first positioning frame and driving the first positioning plate to move.

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