Original silicon wafer suck-back feeding device and silicon wafer guide machine

Abstract

The utility model relates to the field of silicon wafer feeding, in particular to a suck-back original silicon wafer feeding device and a silicon wafer guiding machine, and aims to solve the technical problems of low wafer feeding efficiency and complex wafer feeding structure in the related technology. The device comprises a suck-back conveying mechanism and a splicing conveying mechanism, wherein the suck-back conveying mechanism comprises a first conveying belt and a plurality of suck-back assemblies; the first conveying belt extends in the horizontal direction. The multiple suck-back assemblies are linearly distributed at intervals from one end of the first conveying belt to the other end of the first conveying belt. The sucking-back assembly is provided with a sucking opening, the sucking opening faces downwards, and the sucking-back assembly is configured to suck the silicon wafer under the working condition that the sucking-back assembly is started so that the silicon wafer can be attached to the bottom face of the first conveying belt; and the splicing conveying mechanism is lower than the first conveying belt and is partially overlapped with the first conveying belt. According to the device, an existing transverse moving wafer taking and feeding scheme is broken through, the original silicon wafers are reversely hung, sucked and fed in a conveying belt and reverse suction mode, the number of operation actions is small, the wafer feeding rhythm is improved, and the mode is simple in structure, high in stability and correspondingly reduced in cost.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of silicon wafer loading, especially to a reverse suction original silicon wafer loading device and a silicon wafer guiding machine. BACKGROUND

[0002] At present, when loading silicon wafers, a loading machine is generally used. The existing loading machine comprises a double-drive module and a silicon wafer conveying runway, and three Bernoulli suction cups are arranged in each drive of the double-drive module to correspondingly suck half silicon wafers. In application, each drive takes wafers through the three Bernoulli suction cups respectively, and then the double-drive module synchronously moves the wafers on the left and right sides to place two half silicon wafers on the silicon wafer conveying runway for loading.

[0003] It is pointed out here that, due to the multiple operation actions of the double-drive module, the fastest loading beat is 0.9S / piece; in addition, the action requirements for taking and moving wafers are high, and the double-drive module structure is complex, which leads to great debugging difficulty and high cost. INVENTION CONTENTS

[0004] The utility model aims at providing a reverse suction original silicon wafer loading device and a silicon wafer guiding machine to alleviate the technical problems of low loading efficiency and complex loading structure in the related art.

[0005] In order to solve the above technical problems, the technical scheme provided by the utility model is as follows:

[0006] In the first aspect, the reverse suction original silicon wafer loading device comprises a reverse suction conveying mechanism and a wafer conveying mechanism, the reverse suction conveying mechanism comprises a first conveying belt and a plurality of reverse suction assemblies;

[0007] The first conveying belt extends along the horizontal direction;

[0008] The plurality of reverse suction assemblies are linearly and spacedly distributed from one end to the other end of the first conveying belt;

[0009] The reverse suction assembly has a suction port, the suction port faces downward and is configured to suck silicon wafers in the starting working condition of the reverse suction assembly, so that the silicon wafers are attached to the bottom surface of the first conveying belt;

[0010] The wafer conveying mechanism is lower than the first conveying belt and partially overlaps the first conveying belt.

[0011] Further, the first conveying belt is provided with two first conveying belts, and the two first conveying belts are symmetrically distributed;

[0012] The plurality of reverse suction assemblies are between the two first conveying belts;

[0013] The reverse suction conveying mechanism further comprises a first driving assembly, and the first driving assembly is drivingly connected with the two first conveying belts.

[0014] Further, the first driving assembly comprises a first mounting frame, a first driving roller, a first driven roller and a first rotary motor;

[0015] The first driving roller and the first driven roller are both arranged in parallel and are both rotationally connected to the first mounting frame so as to be rotatable around respective axes;

[0016] The two first conveying belts are sleeved and tensioned on the first driving roller and the first driven roller;

[0017] The first rotary motor is in transmission with the first driving roller.

[0018] Further, the reverse suction assembly comprises at least three micro suction cups, and the at least three micro suction cups are arranged in a spaced manner along the length direction of the first conveying belt.

[0019] Further, a transition suction cup is arranged between two adjacent reverse suction assemblies, and the suction port of the transition suction cup faces downward.

[0020] Further, the reverse suction conveying mechanism is arranged in two in parallel to form a reverse suction conveying unit.

[0021] The tab conveying mechanism is in one-to-one correspondence with the reverse suction conveying mechanism.

[0022] Further, the reverse suction conveying unit is arranged in at least two in the length direction of the first conveying belt.

[0023] The reverse suction original silicon wafer loading device further comprises a PL stack detection mechanism and a silicon wafer receiving mechanism, wherein the PL stack detection mechanism is arranged at the reverse suction conveying unit, and the silicon wafer receiving mechanism is arranged directly below the reverse suction conveying unit.

[0024] Further, the reverse suction original silicon wafer loading device further comprises a incoming material buffering mechanism, a silicon wafer lifting mechanism, a air knife blowing mechanism and an empty material box lifting mechanism.

[0025] The silicon wafer lifting mechanism and the air knife blowing mechanism are both arranged at a loading position of the reverse suction conveying unit.

[0026] The empty material box lifting mechanism is used for conveying an empty material box from an upper layer of the incoming material buffering mechanism to a lower layer.

[0027] Further, the tab conveying mechanism comprises a second conveying belt and a second driving assembly.

[0028] The second conveying belt is in one-to-one correspondence with the first conveying belt, also extends in a horizontal direction, and one end thereof is directly below the first conveying belt, and the other end extends away from the first conveying belt.

[0029] The second driving assembly is in driving connection with the second conveying belt.

[0030] In a second aspect, the utility model provides a kind of wafer guiding machine, comprising the inverted suction original wafer feeding device.

[0031] The inverted suction original wafer feeding device provided by the utility model can achieve the following technical effects:

[0032] In the inverted suction original wafer feeding device, multiple inverted suction assemblies are distributed along the extension direction of the first conveying belt. When the inverted suction assemblies are started, negative pressure is generated at the bottom of the first conveying belt, thereby generating suction force on the original wafer. Under the action of the suction force, the original wafer is attached to the bottom surface of the first conveying belt. With the rotation of the first conveying belt, the original wafer is conveyed to the wafer receiving and conveying mechanism. After reaching the preset position, the original wafer is lowered onto the wafer receiving and conveying mechanism and continuously conveyed backward by the wafer receiving and conveying mechanism.

[0033] It can be seen that, compared with the prior art, the inverted suction original wafer feeding device breaks the existing horizontal movement wafer picking and feeding scheme. The original wafer is hung and sucked for feeding by the conveying belt + inverted suction method, the operation action is less, the wafer feeding rhythm is improved, the structure of the method is simple, the stability is high, and the cost is correspondingly reduced.

[0034] The wafer guiding machine provided by the utility model has the following advantages:

[0035] The wafer guiding machine provided by the utility model comprises the inverted suction original wafer feeding device. Therefore, the technical advantages and effects achieved by the wafer guiding machine also include the technical advantages and effects achieved by the inverted suction original wafer feeding device, which will not be described here. BRIEF DESCRIPTION OF DRAWINGS

[0036] In order to more clearly illustrate the specific embodiments of the utility model or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings without creating any creative labor.

[0037] Figure 1 The connection diagram of part of the mechanism of the inverted suction original wafer feeding device provided by the embodiments of the utility model is shown in the figure.

[0038] Figure 2 The structure diagram of the inverted suction conveying mechanism provided by the embodiments of the utility model is shown in the figure.

[0039] Figure 3 The structure diagram of the inverted suction original wafer feeding device provided by the embodiments of the utility model is shown in the figure.

[0040] Figure 4 The structure schematic view of the upside-down suction original silicon wafer feeding device not containing a PL wafer stack detection mechanism is provided for the embodiments of the present application.

[0041] Figure 5 The installation schematic view of the upside-down suction original silicon wafer feeding device is provided for the embodiments of the present application.

[0042] Icon: 1-upside-down suction conveying mechanism; 11-first conveying belt; 12-upside-down suction assembly; 13-first driving assembly;

[0043] 2-tab conveying mechanism; 21-second conveying belt; 22-second driving assembly;

[0044] 3-PL wafer stack detection mechanism; 4-silicon wafer receiving mechanism; 5-raw material buffer mechanism; 6-silicon wafer lifting mechanism; 7-air knife wafer blowing mechanism; 8-empty box lifting mechanism. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0046] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application.

[0047] Some embodiments of the present application will be described in detail below in combination with the drawings. In the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

[0048] At present, in the existing feeding machine, due to the double driving module operation action, the wafer feeding beat is fastest 0.9S / wafer; in addition, due to the high action requirement of wafer taking and wafer moving, the double driving module structure is complex, which leads to large debugging difficulty and high cost.

[0049] In view of this, the utility model provides a reverse suction raw silicon wafer loading device, which includes a reverse suction conveying mechanism 1 and a wafer splicing conveying mechanism 2, the reverse suction conveying mechanism 1 includes a first conveyor belt 11 and a plurality of reverse suction components 12; the first conveyor belt 11 extends in a horizontal direction; the plurality of reverse suction components 12 are straight and spaced apart from one end of the first conveyor belt 11 to the other end; the reverse suction component 12 has a suction port, the suction port faces downward, and is configured to suck silicon wafers when the reverse suction component 12 is started, so that the silicon wafers are attached to the bottom surface of the first conveyor belt 11; the wafer splicing conveying mechanism 2 is lower than the first conveyor belt 11 and partially overlaps with the first conveyor belt 11.

[0050] In the reverse suction raw silicon wafer loading device, multiple reverse suction components 12 are distributed along the extension direction of the first conveyor belt 11. When the reverse suction component 12 is started, negative pressure is generated at the bottom of the first conveyor belt 11, thereby generating suction on the raw silicon wafer. Under the action of this suction, the raw silicon wafer is attached to the bottom surface of the first conveyor belt 11; as the first conveyor belt 11 rotates, the raw silicon wafer is conveyed to the wafer splicing conveying mechanism 2, and after reaching the preset position, it is lowered onto the wafer splicing conveying mechanism 2, and is continued to be conveyed backward by the wafer splicing conveying mechanism 2.

[0051] It can be seen that compared with the existing technology, the inverted suction raw silicon wafer loading device breaks the existing horizontal movement wafer loading scheme, and uses the conveyor belt + inverted suction method to perform inverted suction loading on the raw silicon wafer, which reduces the operating actions and improves the loading rhythm. In addition, this method has a simple structure, high stability, and correspondingly reduced costs.

[0052] The following combination Figures 1 to 5 The structure and shape of the inverted silicon wafer loading device provided in this embodiment are described in detail:

[0053] refer to Figures 1 to 5 Two reverse suction conveyor mechanisms 1 are arranged side by side, and the wafer splicing conveyor mechanism 2 corresponds to each reverse suction conveyor mechanism 1. The reverse suction raw silicon wafer loading device also includes an incoming material buffer mechanism 5, a silicon wafer lifting mechanism 6, an air knife blowing mechanism 7, an empty material box lifting mechanism 8, an in-position sensor, and a wafer removal sensor. The incoming material buffer mechanism 5 is divided into upper and lower layers, with the upper layer storing material boxes filled with silicon wafers and the lower layer storing empty material boxes. Both the silicon wafer lifting mechanism 6 and the air knife blowing mechanism 7 are located at the loading position of the first conveyor belt 11.

[0054] When in use, the original silicon wafer is placed in the upper box, and the original silicon wafer is lifted upward by the silicon wafer lifting mechanism 6, and the wafer is blown and separated by the air knife blowing mechanism 7; after the original silicon wafer is lifted, the empty box lifting mechanism 8 conveys the empty box to the lower layer for reuse; after the original silicon wafer is sensed by the in-place sensor, the silicon wafer lifting mechanism 6 stops lifting upward, and the suction component 12 sucks the original silicon wafer through the suction port; after the wafer is successfully taken by the wafer taking sensor, the first conveying belt 11 backwardly suction-conveys the original silicon wafer; after the original silicon wafer reaches the wafer receiving station, the suction component 12 places the wafer on the wafer receiving conveying mechanism 2, and the wafer receiving conveying mechanism 2 backwardly conveys the wafer, and the subsequent wafer feeding operation is sequentially and cyclically performed. Through actual test, the stable beat can reach 0.7S / wafer at the fastest.

[0055] It should be noted that the incoming material buffering mechanism 5, the silicon wafer lifting mechanism 6, the air knife blowing mechanism 7 and the empty box lifting mechanism 8 are all existing structures.

[0056] Further, referring to Figure 3 The two suction conveying mechanisms 1 arranged side by side form a suction conveying unit, and the suction conveying unit is provided with at least two in the length direction of the first conveying belt 11; the suction original silicon wafer feeding device further comprises a PL (photoluminescence) wafer stacking detection mechanism 3 and a wafer receiving mechanism 4, wherein the PL wafer stacking detection mechanism 3 is arranged at the joint of the two suction conveying units, and the wafer receiving mechanism 4 is arranged directly below the rear suction conveying unit.

[0057] For the original silicon wafer conveyed by the first conveying belt 11, the PL wafer stacking detection mechanism 3 detects whether wafer stacking occurs, and if so, the corresponding suction component 12 is closed, so that the overlapped original silicon wafer falls into the wafer receiving mechanism 4, and if not, the original silicon wafer is continuously conveyed to the wafer receiving conveying mechanism 2.

[0058] In this embodiment, referring to Figure 1 and Figure 2 In each suction conveying mechanism 1, two first conveying belts 11 are provided, the two first conveying belts 11 are symmetrically distributed and are driven by the same first driving assembly 13, and the rotation speeds are equal; and the plurality of suction components 12 are arranged between the two first conveying belts 11.

[0059] With the above design, when feeding the wafer, the original silicon wafer is simultaneously attached to the bottom surfaces of the two first conveying belts 11 under the suction of the suction component 12, so that the stability of conveying the original silicon wafer is ensured.

[0060] Optionally, referring to Figure 2, the first driving assembly 13 comprises a first mounting frame, a first driving roller, a first driven roller and a first rotary motor; the first driving roller and the first driven roller are parallel distributed and are both rotationally connected with the first mounting frame so as to be rotatable around their respective axes; the two first conveying belts 11 are sleeved and tensioned on the first driving roller and the first driven roller; the first rotary motor is in belt transmission with the first driving roller. When the first rotary motor is started, the first driving roller is rotated through the transmission belt and drives the two first conveying belts 11 to rotate correspondingly, and at the same time, the first driven roller is also rotated correspondingly under the driving of the first conveying belts 11.

[0061] With regard to the reverse suction assembly 12, continuing to refer to Figure 2 , the reverse suction assembly 12 comprises a plurality of micro suction cups, and the plurality of micro suction cups are spaced apart along the length direction of the first conveying belt 11. Optionally, in each reverse suction assembly 12, three micro suction cups are arranged. Further, a transition suction cup is arranged between two adjacent reverse suction assemblies 12, and the suction port of the transition suction cup faces downward.

[0062] Specifically, the micro suction cup and the transition suction cup are both micro Bernoulli suction cups, and each reverse suction assembly 12, i.e. three micro Bernoulli suction cups, sucks one original silicon wafer; the original silicon wafer sucked by the previous reverse suction assembly 12 is transmitted to the next reverse suction assembly 12 through the transition suction cup, so that the original silicon wafer can be prevented from falling due to loss of suction or insufficient suction.

[0063] It should be noted here that in the vertical direction, the suction port of the micro Bernoulli suction cup is between the upper and lower belts of the first conveying belt 11, so as to generate effective suction on the original silicon wafer and not to affect the conveying of the original silicon wafer on the first conveying belt 11.

[0064] In this embodiment, referring to Figure 1 , the tab conveying mechanism 2 comprises a second conveying belt 21 and a second driving assembly 22; the second conveying belt 21 corresponds to the first conveying belt 11 one by one, also extends along the horizontal direction, and one end thereof is directly below the first conveying belt 11 and the other end extends away from the first conveying belt 11.

[0065] As described above, the second driving assembly 22 comprises a second mounting frame, a second driving roller, a second driven roller and a second rotary motor; the second driving roller and the second driven roller are parallel distributed and are both rotationally connected with the second mounting frame so as to be rotatable around their respective axes; the second conveying belt 21 is sleeved and tensioned on the second driving roller and the second driven roller; the second rotary motor is in belt transmission with the second driving roller.

[0066] When the second rotary motor is started, the second driving roller rotates through the transmission belt, and drives the corresponding two second transmission belts 21 to rotate, and the second driven roller also rotates correspondingly under the drive of the second transmission belt 21. The first transmission belt 11 backwardly sucks and transports the original silicon wafer to the lower wafer receiving station, and then places the wafer on the corresponding two second transmission belts 21, and the second transmission belt 21 continues to transport the original silicon wafer backward under the drive of the second rotary motor.

[0067] The utility model further provides a kind of silicon wafer guiding device, and the silicon wafer guiding device includes suction original silicon wafer loading device, whereby, the technical advantages and effects reached by the silicon wafer guiding device also include the technical advantages and effects reached by the above-mentioned suction original silicon wafer loading device, which will not be repeated here.

[0068] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the utility model, and not to limit them; although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the utility model.

Claims

1. A device for loading inverted original silicon wafers, characterized in that, The utility model relates to a kind of original silicon wafer feeding devices, including: Suction transport mechanism (1) and tab transport mechanism (2), the suction transport mechanism (1) includes first conveyor belt (11) and multiple suction components (12); The first conveyor belt (11) extends along the horizontal direction; Multiple suction components (12) are linearly and spacedly distributed from one end to the other end of the first conveyor belt (11); The suction component (12) has a suction port, which faces downward and is configured to suck the silicon wafer in the working condition of the suction component (12) to make the silicon wafer adhere to the bottom surface of the first conveyor belt (11); The tab transport mechanism (2) is lower than the first conveyor belt (11) and partially overlaps the first conveyor belt (11).

2. The suctioning original silicon wafer loading device according to claim 1, wherein, The first conveyor belt (11) is provided with two, and the two first conveyor belts (11) are symmetrically distributed; Multiple suction components (12) are between the two first conveyor belts (11); The suction transport mechanism (1) further includes a first drive assembly (13), and the first drive assembly (13) is drivingly connected with the two first conveyor belts (11).

3. The suctioning original silicon wafer loading device according to claim 2, wherein, The first drive assembly (13) includes a first mounting frame, a first driving roller, a first driven roller and a first rotary motor; The first driving roller and the first driven roller are both parallelly distributed and are rotatably connected with the first mounting frame to be rotatable around their respective axes; The two first conveyor belts (11) are sleeved and tensioned on the first driving roller and the first driven roller; The first rotary motor is drivingly connected with the first driving roller.

4. The suctioning original silicon wafer loading device according to claim 2, wherein, The suction component (12) includes at least three micro-suction cups, and the at least three micro-suction cups are spacedly distributed along the length direction of the first conveyor belt (11).

5. The suctioning original silicon wafer loading device according to claim 4, wherein, A transition suction cup is provided between two adjacent suction components (12), and the suction port of the transition suction cup faces downward.

6. The inverted suctioning raw silicon wafer loading device according to any one of claims 1 to 5, characterized in that, The suction transport mechanism (1) is provided with two in parallel to form a suction conveying unit; The tab transport mechanism (2) corresponds to the suction transport mechanism (1) one by one.

7. The suctioning original silicon wafer loading device according to claim 6, wherein, In the length direction of the first conveyor belt (11), the suction conveying unit is provided with at least two; The suction original silicon wafer feeding device further includes a PL stack detection mechanism (3) and a silicon wafer receiving mechanism (4), wherein the PL stack detection mechanism (3) is arranged on the suction conveying unit, and the silicon wafer receiving mechanism (4) is arranged directly below the suction conveying unit.

8. The suctioning original silicon wafer loading device according to claim 7, wherein, The suction original silicon wafer feeding device further includes a incoming material buffer mechanism (5), a silicon wafer lifting mechanism (6), a air knife blowing mechanism (7) and an empty box lifting mechanism (8); The silicon wafer lifting mechanism (6) and the air knife blowing mechanism (7) are both arranged at the feeding position of the suction conveying unit; The empty box lifting mechanism (8) is used for conveying the empty box from the upper layer to the lower layer of the incoming material buffer mechanism (5).

9. The suctioning original silicon wafer loading device according to claim 1, wherein, The tab transport mechanism (2) includes a second conveyor belt (21) and a second drive assembly (22). The second conveying belt (21) corresponds to the first conveying belt (11) one by one, also extends in the horizontal direction, and one end thereof is directly below the first conveying belt (11), and the other end extends away from the first conveying belt (11); The second driving assembly (22) is in transmission connection with the second conveying belt (21).

10. A silicon wafer guiding device, characterized by The device comprises the suction of the original silicon wafer as claimed in any one of claims 1 to 9.

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