Conductive device and horizontal electroplating equipment

Abstract

The utility model provides a conductive device and horizontal electroplating equipment, which comprises a roller, a liquid supply component, a power supply component, a gas supply component, an electroplating liquid adsorption layer and a driving component, and further comprises a pinch roller and an isolation groove. According to the conductive device and the horizontal electroplating equipment disclosed by the utility model, the liquid supply component, the power supply component and the gas supply component are arranged, so that electrified electroplating liquid can seep from the electroplating liquid adsorption layer along the through hole, and the problem of crystallization of the roller caused by volatilization of the electroplating liquid can be avoided; the deplating process is not needed, the roller does not need to be replaced, the service life can be prolonged, the maintenance time of equipment is shortened, and the productivity of the equipment is ensured; charged electroplating liquid is used as a cathode, so that the stability of a plating layer can be ensured; the electroplating liquid has outward pressure, so that the electroplating liquid can be in full contact with a grid line in a battery piece, and the stability of a plating layer is ensured; the ideal indirect contact type liquid-carrying roller can be provided, and is suitable for horizontal electroplating of photovoltaic cells and the like.

Description

TECHNICAL FIELD

[0001] The utility model belongs to electroplating technical field relates to a kind of electrically conductive device and horizontal electroplating equipment. BACKGROUND

[0002] With the expansion and rapid development of photovoltaic industry, the competition of solar photovoltaic products in the market is more and more big, in the solar photovoltaic industry, the horizontal electroplating process of cell piece is more important.

[0003] Horizontal electroplating technology is a method of placing the workpiece to be plated into the parallel electroplating solution to carry out electroplating, which is basically the same as the basic principle of ordinary electroplating, which includes cathode and anode, generally using cathode to contact the workpiece to be plated, and using anode to conduct electricity into electroplating solution; in this way, after power on, electrode reaction will occur in electroplating solution, under the action of electric field, metal ions in electroplating solution migrate to the vicinity of cathode, forming a plating layer on the workpiece to be plated. Horizontal electroplating has the characteristics of convenient operation, wide range of workpiece size, easy large-scale automation and closed operation, etc., and has developed rapidly in recent years, and gradually develops towards mature technology with higher quality and higher reliability.

[0004] For example, Figure 1 A kind of horizontal electroplating equipment is shown, wherein 1 represents anode, 2 represents transmission roller, 3 represents cathode roller, 4 represents isolation groove, 5 represents cell piece, 6 represents groove body, 7 represents power supply, and all cathode rollers 3 are connected to the negative electrode of power supply 7 using electric wire, and anode 1 is connected with the positive electrode of power supply 7. Among them, the design of cathode roller 3 is particularly important, which is related to the electrical and mechanical properties of contact with the cell piece, such as resistance, uniformity of electrical conductivity, uniformity of electric field distribution, friction force and damage degree to the cell piece.

[0005] Therefore, it is necessary to provide an electrically conductive device and horizontal electroplating equipment. UTILITY MODEL CONTENTS

[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the utility model is to provide an electrically conductive device and horizontal electroplating equipment to solve the problem of the application of cathode roller in the prior art.

[0007] To achieve the above-mentioned purpose and other related purposes, the utility model provides an electrically conductive device, which comprises:

[0008] Roller, the roller comprises through cavity and through hole, the through cavity extends from one end of the roller to the other end, and the through hole is arranged on the side wall of the roller and communicates with the through cavity;

[0009] Liquid supply assembly, the liquid supply assembly is connected with the through cavity, and is used to introduce electroplating solution into the through cavity;

[0010] a power supply assembly, a negative electrode of the power supply assembly being connected with the electroplating solution, to supply power to the electroplating solution;

[0011] a gas supply assembly, the gas supply assembly being connected with the through cavity, to introduce gas into the through cavity to cause the electroplating solution to overflow from the through hole;

[0012] an electroplating solution adsorption layer, the electroplating solution adsorption layer being arranged on the periphery of the roller, and the electroplating solution adsorption layer covering the through hole, to absorb the electroplating solution overflowing from the through hole, so that the electroplating solution contacts the piece to be electroplated to serve as a cathode;

[0013] a driving assembly, the driving assembly being connected with the roller, to drive the roller to rotate.

[0014] Optionally, the electroplating solution adsorption layer comprises one or a stack of a sponge layer or a hollow fiber ultrafiltration membrane.

[0015] Optionally, the roller comprises a PE roller, a PP roller or a PVDF roller.

[0016] Optionally, the diameter of the through hole comprises 1mm-2mm.

[0017] Optionally, the through holes are arranged at equal intervals.

[0018] Optionally, the gas supply assembly comprises one or a combination of a gas compressor, a pressure gauge, a flow meter, a pressure regulating valve and a throttle valve.

[0019] Optionally, the liquid supply assembly comprises one or a combination of a pump, a pressure gauge, a flow meter and a pressure regulating valve.

[0020] Optionally, further comprising a compression roller arranged above the roller and corresponding to the roller.

[0021] Optionally, further comprising an isolation groove arranged corresponding to the roller, the isolation groove comprising a first electroplating solution return groove and second electroplating solution return grooves located on both sides of the first electroplating solution return groove, and the roller being located in the first electroplating solution return groove, the electroplating solution seeping from the electroplating solution adsorption layer being recovered through the first electroplating solution return groove.

[0022] The utility model further provides a horizontal electroplating equipment, the horizontal electroplating equipment includes: any one of the above conductive device.

[0023] As described above, the conductive device and the horizontal electroplating equipment, including roller, liquid supply assembly, power supply assembly, gas supply assembly, electroplating liquid adsorption layer and driving assembly, wherein, the roller includes through cavity and through hole; the liquid supply assembly is connected with the through cavity, and is used for introducing the electroplating liquid into the through cavity; the negative electrode of the power supply assembly is connected with the electroplating liquid, and is used for supplying power to the electroplating liquid; the gas supply assembly is connected with the through cavity, and is used for introducing the gas into the through cavity to make the electroplating liquid overflow from the through hole; the electroplating liquid adsorption layer is arranged on the periphery of the roller, and the electroplating liquid adsorption layer covers the through hole, so as to absorb the electroplating liquid overflowing from the through hole, so that the electroplating liquid contacts the electroplated piece to serve as the cathode; the driving assembly is connected with the roller, and is used for driving the roller to rotate.

[0024] The conductive device and the horizontal electroplating equipment, because of the liquid supply assembly, the power supply assembly and the gas supply assembly, the electrified electroplating liquid can seep from the electroplating liquid adsorption layer along the through hole, and the crystallization problem caused by the volatilization of the electroplating liquid can be avoided; the process of stripping is not needed, the roller does not need to be replaced, the service life can be prolonged, the equipment maintenance time is reduced, the production capacity of the equipment can be ensured; the stability of the plating layer can be ensured by using the electrified electroplating liquid as the cathode; because the electroplating liquid has outward pressure, the grid lines located in the battery piece can be fully contacted, and the stability of the plating layer is ensured; an ideal indirect contact type liquid roller can be provided, and the horizontal electroplating of the photovoltaic battery piece and the like is suitable. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 A structure schematic view of a horizontal electroplating equipment in the prior art is shown.

[0026] Figure 2 A partial three-dimensional structure schematic view of the conductive device in the embodiment of the utility model is shown.

[0027] Figure 3 A three-dimensional structure schematic view of the roller in the embodiment of the utility model is shown. Figure 2 A cross-sectional structure schematic view along A-A' in the embodiment of the utility model is shown.

[0028] Figure 4 A three-dimensional structure schematic view of the roller in the embodiment of the utility model is shown.

[0029] Figure 5 A three-dimensional structure schematic view of the roller in the embodiment of the utility model is shown. Figure 4 A cross-sectional structure schematic view along B-B' in the embodiment of the utility model is shown.

[0030] Figure 6 A partial three-dimensional structure schematic view of the conductive device in the embodiment of the utility model is shown.

[0031] Figure 7 A structure distribution schematic view of the conductive device in the embodiment of the utility model is shown.

[0032] Reference Signs List

[0033] 1 anode

[0034] 2 transmission roller

[0035] 3 cathode roller

[0036] 4 isolation groove

[0037] 5 battery piece

[0038] 6 groove body

[0039] 7 power supply

[0040] 100 roller

[0041] 101 through cavity

[0042] 102 through hole

[0043] 200 electroplating liquid adsorption layer

[0044] 301 first side ring

[0045] 302 second side ring

[0046] 400 shaft support

[0047] 500 shaft ring

[0048] 600 joint

[0049] 700 bevel gear

[0050] 800 spur gear

[0051] 900 rotating shaft

[0052] 110 isolation groove

[0053] 111 first electroplating liquid reflux groove

[0054] 112 second electroplating liquid reflux groove

[0055] 210 liquid supply assembly

[0056] 220 power supply assembly

[0057] 230 gas supply assembly DETAILED DESCRIPTION

[0058] The embodiments of the present application will be described in detail with specific examples. Other advantages and effects of the present application can be easily understood by those skilled in the art from the description of the present application. The present application can also be implemented or applied in other different embodiments, and various modifications or changes can be made to the details in the description without departing from the spirit of the present application.

[0059] It should be noted that the diagrams provided in the embodiments only schematically illustrate the basic concepts of the present application, and only the components related to the present application are shown in the diagrams, not the number, shape and size of the components in actual implementation. The shapes, number and proportions of the components in actual implementation can be changed at will, and the layout of the components can be more complex.

[0060] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0061] Referring to Figures 2 to 7 The conductive device provided in the embodiments includes a roller 100, the roller 100 includes a through cavity 101 and a through hole 102, the through cavity 101 extends from one end of the roller 100 to the other end, and the through hole 102 is arranged on the side wall of the roller 100 and communicates with the through cavity 101;

[0062] A liquid supply assembly 210 is connected with the through cavity 101, and is used for introducing electroplating liquid into the through cavity 101;

[0063] A power supply assembly 220 is connected with the electroplating liquid, and is used for supplying power to the electroplating liquid;

[0064] A gas supply assembly 230 is connected with the through cavity 101, and is used for introducing gas into the through cavity 101 to cause the electroplating liquid to overflow from the through hole 102;

[0065] An electroplating liquid adsorption layer 200 is arranged on the periphery of the roller 100, and the electroplating liquid adsorption layer 200 covers the through hole 102, and is used for absorbing the electroplating liquid overflowing from the through hole 102, so that the electroplating liquid contacts the electroplated piece to serve as a cathode;

[0066] A driving assembly (not shown) is connected to the roller 100 to drive the roller 100 to rotate.

[0067] Specifically, referring to Figure 4 and Figure 5 , the roller 100 has the hollow through cavity 101, and the through hole 102 penetrating the side wall of the roller 100 to communicate with the through cavity 101 is provided on the surface of the roller 100. The electroplating solution in the through cavity 101 can flow out through the through hole 102.

[0068] As an example, the gas supply assembly 230 can include one or a combination of a gas compressor, a pressure gauge, a flow meter, a pressure regulating valve, and a throttle valve.

[0069] Specifically, compressed air can be supplied into the through cavity 101 through the gas supply assembly 230. When electrical elements such as a pressure gauge, a flow meter, a pressure regulating valve, and a throttle valve are installed at the end of the gas compressor, the related parameters can be controlled or detected, and real-time monitoring can be achieved. The specific configuration of the gas supply assembly 230 can be selected as needed.

[0070] As an example, the liquid supply assembly 210 includes one or a combination of a pump, a pressure gauge, a flow meter, and a pressure regulating valve.

[0071] Specifically, the electroplating solution can be supplied into the through cavity 101 through the liquid supply assembly 210. When electrical elements such as a pressure gauge, a flow meter, and a pressure regulating valve are installed at the end of the pump, the related data can be monitored and adjusted in real time. The specific configuration of the liquid supply assembly 210 can be selected as needed.

[0072] The way in which the power supply assembly supplies power to the electroplating solution is not limited here, so that the electroplating solution is connected to the negative pole of the power supply to be charged.

[0073] Referring to Figure 2 and Figure 3 , since the electroplating solution adsorption layer 200 is arranged on the periphery of the roller 100, and the electroplating solution adsorption layer 200 covers the through hole 102, the electroplating solution adsorption layer 200 with good adsorption performance can be used to absorb the electroplating solution overflowing from the through hole 102 to contact the subsequent electroplated products such as battery pieces. When the electroplating solution is connected to the negative pole of the power supply through the power supply assembly 220, the electroplating solution is negatively charged, so that the electroplating solution in the electroplating solution adsorption layer 200 is also negatively charged. Since the electroplating solution in the electroplating tank is positively charged, when the battery piece passes, a current loop is formed to perform the electroplating process.

[0074] Wherein, refer to Figure 2 And Figure 3 The joint 600 connected with the through cavity 101 can be connected with a three-way valve (not shown), one end of the three-way valve can be connected with the pump outlet of the liquid supply assembly 210, one end can be connected with the compressed air in the air supply assembly 230, and the pump can pump a proper amount of the electroplating solution into the through cavity 101, and then the electroplating solution is filled to the position of the electroplating solution adsorption layer 200 through the through hole 102 by the compressed air, and at the same time, the electroplating solution in the through cavity 101 and the electroplating solution adsorption layer 200 is negatively charged by the negative electrode of the constant current source in the power supply assembly 220.

[0075] As an example, the roller 100 can include a PE roller, a PP roller or a PVDF roller to avoid being electroplated, thereby avoiding the process of deplating, prolonging the service life, reducing the equipment maintenance time and ensuring the production capacity of the equipment.

[0076] As an example, the electroplating solution adsorption layer 200 can include one or a stack of a sponge layer or a hollow fiber ultrafiltration membrane.

[0077] Specifically, when the electroplating solution adsorption layer 200 adopts the hollow fiber ultrafiltration membrane, the hollow fiber ultrafiltration membrane can be arranged in the through hole 102 or located at the periphery of the roller 100 and covering the through hole 102, so as to prevent gas from passing through and only allow the electroplating solution to pass through, thereby avoiding pressure relief of the compressed air and bubbles generated between the battery piece and the roller 100; the electroplating solution adsorption layer 200 can also adopt a sponge layer, or a stack of a hollow fiber ultrafiltration membrane and a sponge layer.

[0078] In the embodiment, the through holes 102 on the roller 100 are preferably arranged at equal intervals to improve the uniformity of the distribution of the electroplating solution and improve the electroplating quality, but the distribution of the through holes 102 is not limited thereto.

[0079] Preferably, the diameter of the through hole 102 is 1mm-2mm, such as 1mm, 1.5mm or 2mm, so as to control the air pressure in the through cavity 101.

[0080] In the embodiment, the roller 100 is a through type roller, i.e., the two ends of the roller 100 have open ports to facilitate subsequent operations such as cleaning on the roller 100, wherein the two ends of the roller 100 can be connected with the through cavity 101 by, for example, Figure 2 And Figure 3The first side ring 301 and the second side ring 302 in the embodiment are fixed, and the first side ring 301 and the second side ring 302 can be made of the same corrosion-resistant material as the roller 100. The first side ring 301, the second side ring 302 and the roller 100 can be connected together by welding or interference fit, so that the roller 100 can meet the subsequent air pressure requirements.

[0081] As an example, a pinch roller (not shown) above the roller 100 and corresponding to the roller 100 can also be included.

[0082] Specifically, when the pinch roller is provided, the pinch roller can make the battery sheet fully contact with the electroplating liquid adsorption layer 200 when the battery sheet passes through the roller 100, so as to improve the electroplating effect.

[0083] In the embodiment, the driving assembly adopts bearing transmission, but the driving assembly is not limited thereto. That is, the driving assembly can include a bevel gear 700, a spur gear 800 and a rotating shaft 900 connected with the bevel gear 700 and the spur gear 800. The rotating shaft 900 can be fixed by a shaft support 400, and the shaft support 400 can be fixed on equipment. The rotating shaft 900 can rotate in the shaft support 400. One end of the rotating shaft 900 can be fixed with the second side ring 302 by welding or the like. The other end of the rotating shaft 900 is connected with the bevel gear 700 and the spur gear 800. When the power member such as a motor drives the bevel gear 700 and the spur gear 800 to rotate, the rotating shaft 900 can be synchronously driven to rotate, so as to drive the roller 100 to rotate. The pinch roller can be driven by the bevel gear 700, but the type of the driving assembly is not limited thereto.

[0084] In the embodiment, when the joint 600 is installed, the joint 600 can be fixed by the first side ring 301 and a shaft ring 500. That is, the joint 600 can be fixed by the first side ring 301. The shaft ring 500 can be installed on equipment. The joint 600 can rotate in the shaft ring 500. The joint 600 can be fixed with the first side ring 301 by welding or interference fit or the like.

[0085] As an example, refer to Figure 6 An isolation groove 110 corresponding to the roller 100 can also be included. The isolation groove 110 includes a first electroplating liquid reflux groove 111 and second electroplating liquid reflux grooves 112 located on both sides of the first electroplating liquid reflux groove 111. The roller 100 is located in the first electroplating liquid reflux groove 111, and the electroplating liquid seeping from the electroplating liquid adsorption layer 200 is recovered by the first electroplating liquid reflux groove 111.

[0086] Specifically, the first electroplating solution reflux tank 111 can be used to collect the electroplating solution seeping from the electroplating solution adsorption layer 200, and can be discharged through a liquid collecting port into a dedicated collection tank body, which can be connected to a pump in the liquid supply assembly 210, and then the collected electroplating solution can be pumped into the through cavity 101, so that the electroplating solution can be recycled. The second electroplating solution reflux tank 112, which is isolated from the first electroplating solution reflux tank 111, can realize the collection and recycling of the electroplating solution in the electroplating tank, so that the cross-talk problem of the electroplating solution can be effectively avoided through the isolation tank 110.

[0087] The embodiment also provides a horizontal electroplating device, which comprises the conductive device, and thus the structure of the conductive device is not described herein again. The conductive device can provide a very ideal indirect contact cathode, and is suitable for the horizontal electroplating device for electroplating photovoltaic cells and the like. The specific type of the horizontal electroplating device is not limited herein.

[0088] In summary, the conductive device and the horizontal electroplating device, which comprise a roller, a liquid supply assembly, a power supply assembly, a gas supply assembly, an electroplating solution adsorption layer and a driving assembly, wherein the roller comprises a through cavity and a through hole; the liquid supply assembly is connected with the through cavity, and is used to introduce the electroplating solution into the through cavity; the negative electrode of the power supply assembly is connected with the electroplating solution, and is used to supply power to the electroplating solution; the gas supply assembly is connected with the through cavity, and is used to introduce the gas into the through cavity to make the electroplating solution overflow from the through hole; the electroplating solution adsorption layer is arranged on the periphery of the roller, and covers the through hole, and is used to absorb the electroplating solution overflowing from the through hole, so that the electroplating solution contacts the piece to be electroplated to serve as a cathode; and the driving assembly is connected with the roller, and is used to drive the roller to rotate. Further, the conductive device also comprises a press roller arranged correspondingly with the roller and an isolation tank arranged correspondingly with the roller.

[0089] The conductive device and the horizontal electroplating device can make the electrified electroplating solution seep from the electroplating solution adsorption layer along the through hole, can avoid the crystallization problem of the roller caused by the volatilization of the electroplating solution, do not need to perform a deplating process, do not need to replace the roller, can prolong the service life, reduce the equipment maintenance time, can guarantee the production capacity of the equipment, can guarantee the stability of the plating layer by taking the electrified electroplating solution as a cathode, can ensure the stability of the plating layer due to the outward pressure of the electroplating solution, can fully contact the grid lines located in the battery piece, can provide a relatively ideal indirect contact type liquid roller, and is suitable for the horizontal electroplating of photovoltaic cells and the like.

[0090] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not used to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the present application should be covered by the claims of the present application.

Claims

1. An electrically conductive device, characterized by The conductive device comprises: a roller comprising a through cavity extending from one end to the other end of the roller and a through hole arranged on the side wall of the roller and communicating with the through cavity; a liquid supply assembly connected with the through cavity for supplying electroplating liquid into the through cavity; a power supply assembly with a negative electrode connected with the electroplating liquid for supplying power to the electroplating liquid; a gas supply assembly connected with the through cavity for supplying gas into the through cavity to overflow the electroplating liquid from the through hole; an electroplating liquid adsorption layer arranged on the periphery of the roller and covering the through hole for absorbing the electroplating liquid overflowing from the through hole so that the electroplating liquid contacts the parts to be electroplated as cathode; a driving assembly connected with the roller for driving the roller to rotate.

2. The electrically conductive device of claim 1, wherein: The electroplating liquid adsorption layer comprises one or a stack of sponge layer or hollow fiber ultrafiltration membrane.

3. The electrically conductive device of claim 1, wherein: The roller comprises a PE roller, a PP roller or a PVDF roller.

4. The electrically conductive device of claim 1, wherein: The diameter of the through hole is 1-2 mm.

5. The electrically conductive device of claim 1, wherein: The through holes are arranged at equal intervals.

6. The electrically conductive device of claim 1, wherein: The gas supply assembly comprises a gas compressor and further comprises one or a combination of pressure gauge, flow meter, pressure regulating valve and throttle valve to form the gas supply assembly in combination with the gas compressor.

7. The electrically conductive device of claim 1, wherein: The liquid supply assembly comprises a pump and further comprises one or a combination of pressure gauge, flow meter, pressure regulating valve to form the liquid supply assembly in combination with the pump.

8. The electrically conductive device of claim 1, wherein: A compression roller is further arranged above the roller and corresponding to the roller.

9. The electrically conductive device of claim 1, wherein: An isolation groove corresponding to the roller is further arranged, which comprises a first electroplating liquid return groove and second electroplating liquid return grooves on both sides of the first electroplating liquid return groove, and the roller is located in the first electroplating liquid return groove, and the electroplating liquid seeping from the electroplating liquid adsorption layer is recovered through the first electroplating liquid return groove.

10. A horizontal electroplating apparatus characterized by comprising: The horizontal electroplating equipment comprises the conductive device of any one of claims 1-9.

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