Conductive device and horizontal electroplating equipment

Abstract

The utility model provides a conductive device and horizontal electroplating equipment. The conductive device comprises a roller, an electroplating liquid adsorption layer, an isolation groove, a negative pressure assembly, a cathode brush and a driving assembly, electroplating liquid brought by an electroplated part can be absorbed through the electroplating liquid adsorption layer and is conveyed into the special tank body through the negative pressure assembly, and then the electroplating liquid can be recycled; the isolation groove can effectively prevent the electroplating liquid from being in contact with the roller and the cathode brush; the cathode brush is located on the side edge of the output end of the roller, and the electroplating liquid brought by the electroplating part is absorbed by the electroplating liquid adsorption layer, so that the contact amount of the cathode brush and the electroplating liquid on the surface of the electroplating part can be effectively reduced, the service life of the cathode brush is prolonged, and the productivity is improved. The utility model can provide an ideal indirect contact type roller which is suitable for horizontal electroplating of photovoltaic cells and the like.

Description

TECHNICAL FIELD

[0001] The utility model belongs to electroplating technical field relates to a kind of electrically conductive device and horizontal electroplating equipment. BACKGROUND

[0002] With the expansion and rapid development of photovoltaic industry, the competition of solar photovoltaic products in the market is more and more big, in the solar photovoltaic industry, the horizontal electroplating process of cell piece is more important.

[0003] Horizontal electroplating technology is a method of placing the workpiece to be plated into parallel to the electroplating liquid surface for electroplating, which has basically the same basic principle as ordinary electroplating, which includes cathode and anode, generally using cathode to contact the workpiece to be plated, and using anode to conduct electricity into electroplating liquid; in this way, after power on, electrode reaction will occur in electroplating liquid, under the action of electric field, metal ions in electroplating liquid migrate to the vicinity of cathode, forming a plating layer on the workpiece to be plated. Horizontal electroplating has the characteristics of convenient operation, wide range of workpiece size, easy large-scale automation and closed operation, etc., and has developed rapidly in recent years, and gradually develops towards mature technology with higher quality and higher reliability.

[0004] For example, Figure 1 A kind of horizontal electroplating equipment is shown, wherein 1 represents anode, 2 represents transmission roller, 3 represents cathode roller, 4 represents isolation groove, 5 represents cell piece, 6 represents groove body, 7 represents power supply, and all cathode rollers 3 are connected to the negative pole of power supply 7 using electric wire, and anode 1 is connected with the positive pole of power supply 7. Among them, the design of cathode roller 3 is particularly important, which is related to the electrical and mechanical properties of contact with the cell piece, such as resistance, uniformity of electrical conductivity, uniformity of electric field distribution, friction force and damage degree to the cell piece.

[0005] Therefore, it is necessary to provide an electrically conductive device and horizontal electroplating equipment. UTILITY MODEL CONTENT

[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the utility model is to provide an electrically conductive device and horizontal electroplating equipment for solving the application problem of cathode roller in the prior art.

[0007] To achieve the above-mentioned purpose and other related purposes, the utility model provides an electrically conductive device, which comprises:

[0008] Roller, the roller comprises through cavity and through hole, the through cavity extends from one end of the roller to the other end, and the through hole is arranged on the side wall of the roller and communicates with the through cavity;

[0009] An electroplating solution adsorption layer is arranged on the outer periphery of the roller and covers the through hole to carry the electroplated part and adsorb the electroplating solution on the surface of the electroplated part.

[0010] An isolation groove is formed by a partition plate and includes a first isolation groove and second isolation grooves on both sides of the first isolation groove, and the roller is located in the first isolation groove.

[0011] A negative pressure assembly is connected to the through cavity to generate a negative pressure in the through cavity to adsorb the electroplating solution brought from the electroplating tank on the electroplated part.

[0012] A cathode brush is electrically connected to the negative pole of a power supply and contacts the surface of the electroplated part, and the cathode brush is arranged on the partition plate and located on one side of the roller in the transmission direction.

[0013] A driving assembly is connected to the roller to drive the rotation of the roller.

[0014] Optionally, the electroplating solution adsorption layer includes one or a stack of a sponge layer or a hollow fiber ultrafiltration membrane.

[0015] Optionally, the roller includes a PE roller, a PP roller or a PVDF roller.

[0016] Optionally, the diameter of the through hole is 1-2 mm.

[0017] Optionally, the through holes are arranged at equal intervals.

[0018] Optionally, the negative pressure assembly includes one or a combination of a liquid suction machine, a pressure gauge, a flow meter, a pressure regulating valve and a throttle valve.

[0019] Optionally, a pressure roller is arranged above the roller and corresponds to the roller.

[0020] Optionally, the cathode brush includes a brush fixing part and a brush comb part connected to the brush fixing part, and the brush comb part has an inclined angle with the horizontal plane, and the inclined direction of the inclined angle is consistent with the running direction of the electroplated part.

[0021] Optionally, the inclined angle between the brush comb part and the horizontal plane ranges from 30° to 80°.

[0022] The utility model also provides a horizontal electroplating equipment, the horizontal electroplating equipment includes any one conductive device.

[0023] As described above, the conductive device and horizontal electroplating equipment of the present invention include a roller, a plating liquid adsorption layer, an isolation tank, a negative pressure component, a cathode brush and a drive component; the roller includes a connected through cavity and a through hole; the plating liquid adsorption layer is arranged on the periphery of the roller and covers the through hole, so as to carry the electroplated parts and absorb the plating liquid on the surface of the electroplated parts; the isolation tank includes a first isolation tank separated by a partition and a second isolation tank located on both sides of the first isolation tank, and the roller is located in the first isolation tank; the negative pressure component is connected to the through cavity, so that the through cavity presents a negative pressure to absorb the plating liquid brought from the electroplating tank to the electroplated parts; the cathode brush is electrically connected to the negative pole of the power supply, and the cathode brush contacts the surface of the electroplated parts, the cathode brush is arranged on the partition, and the cathode brush is located on the side of the output end of the roller; the drive component is connected to the roller to drive the roller to rotate.

[0024] The conductive device and horizontal electroplating equipment of the present invention can absorb the electroplating liquid brought onto the electroplated parts through the electroplating liquid adsorption layer, and transmit it to a special tank body through a negative pressure component, and then the electroplating liquid can be recycled; the isolation tank can effectively avoid the contact between the electroplating liquid and the roller and the cathode brush; the cathode brush is located on the side of the output end of the roller, and the electroplating liquid brought onto the electroplated parts is absorbed by the electroplating liquid adsorption layer, thereby effectively reducing the contact amount between the cathode brush and the electroplating liquid on the surface of the electroplated parts, extending the service life of the cathode brush, and improving production capacity.

[0025] The conductive device and horizontal electroplating equipment of the utility model can provide a relatively ideal indirect contact roller, which is suitable for horizontal electroplating of photovoltaic cells and the like. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 Shown is a structural schematic diagram of a horizontal electroplating equipment in the prior art.

[0027] Figure 2 Shown is a partial three-dimensional structural schematic diagram of the conductive device in an embodiment of the present utility model.

[0028] Figure 3 Display as Figure 2 Schematic diagram of the cross-sectional structure along the middle line A-A'.

[0029] Figure 4 It is a schematic diagram of the three-dimensional structure of the roller in the embodiment of the present utility model.

[0030] Figure 5 Display as Figure 4 Schematic diagram of the cross-sectional structure along the middle line B-B'.

[0031] Figure 6 Shown is a partial three-dimensional structural schematic diagram of the conductive device in an embodiment of the present utility model.

[0032] Figure 7 A structure schematic view of a cathode brush in the embodiment of the present application is shown.

[0033] Figure 8 A structure distribution schematic view of a conductive device in the embodiment of the present application is shown.

[0034] Explanation of reference signs

[0035] 1 anode

[0036] 2 transmission roller

[0037] 3 cathode roller

[0038] 4 isolation groove

[0039] 5 battery piece

[0040] 6 groove body

[0041] 7 power supply

[0042] 100 roller

[0043] 101 through cavity

[0044] 102 through hole

[0045] 200 electroplating liquid adsorption layer

[0046] 301 first side ring

[0047] 302 second side ring

[0048] 400 shaft support

[0049] 500 shaft ring

[0050] 600 joint

[0051] 700 bevel gear

[0052] 800 spur gear

[0053] 900 rotating shaft

[0054] 110 isolation groove

[0055] 111 first isolation groove

[0056] 112 second isolation groove

[0057] 120 isolation plate

[0058] 130 cathode brush

[0059] 131 brush fixing part

[0060] 132 brush comb part

[0061] 210 negative pressure assembly DETAILED DESCRIPTION

[0062] The present application also can be implemented or applied through other different specific embodiments, and each detail in the specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present application.

[0063] It is to be noted that the drawings provided in the present embodiment only schematically illustrate the basic concept of the present application, and thus the drawings only show the components related to the present application rather than being drawn according to the number, shape and size of the components in actual implementation, and the shape, number and proportion of each component in actual implementation can be arbitrarily changed, and the layout pattern of the components can be more complicated.

[0064] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0065] Referring to Figures 2 to 8 The present embodiment provides a conductive device, which comprises a roller 100, the roller 100 comprises a through cavity 101 and a through hole 102, the through cavity 101 extends from one end of the roller 100 to the other end, and the through hole 102 is arranged on the side wall of the roller 100 and communicates with the through cavity 101;

[0066] A plating solution adsorption layer 200 is arranged on the periphery of the roller 100, and the plating solution adsorption layer 200 covers the through hole 102, so as to carry a plating piece (not shown) and adsorb plating solution on the surface of the plating piece;

[0067] The isolation groove 110 comprises a first isolation groove 111 and a second isolation groove 112 located on both sides of the first isolation groove 111, which are separated by a partition 120, and the roller 100 is located in the first isolation groove 111;

[0068] A negative pressure assembly 210 is connected with the through cavity 101, so that the through cavity 101 presents a negative pressure, so as to adsorb plating solution brought by the plating piece from a plating tank (not shown);

[0069] A cathode brush 130 is electrically connected to a negative pole of a power supply (not shown) and contacts the surface of the electroplated piece. The cathode brush 130 is disposed on the partition plate 120 and is located at the side of the output end of the roller 100.

[0070] A driving assembly (not shown) is connected to the roller 100 to drive the roller 100 to rotate.

[0071] Specifically, referring to Figure 2 and Figure 3 Since the electroplating solution adsorption layer 200 is disposed on the periphery of the roller 100 and covers the through hole 102, the electroplating solution adsorption layer 200 with good adsorption performance can be used to absorb the electroplating solution brought from the side of the electroplating tank by the electroplated piece.

[0072] Referring to Figure 4 , Figure 5 and Figure 8 The roller 100 has the hollow through cavity 101 and the through hole 102 penetrating the side wall of the roller 100 to communicate with the through cavity 101. The electroplating solution adsorbed by the electroplated piece can flow into the through cavity 101 through the through hole 102 under the negative pressure provided by the negative pressure assembly 210, and then the part of the electroplating solution can be recycled and reused.

[0073] Referring to Figure 6 The isolation tank 100 includes the first isolation tank 111 and the second isolation tanks 112 disposed on both sides of the first isolation tank 111 and separated by the partition plate 120. The roller 100 is located in the first isolation tank 111, and the second isolation tanks 112 can be used to recover the overflowed electroplating solution from the electroplating tank. The first isolation tank 111 can effectively avoid the contact between the electroplating solution from the electroplating tank and the roller 100, thereby effectively avoiding the crosstalk problem of the electroplating solution through the isolation tank 110.

[0074] Referring to Figure 6 and Figure 7 When the electroplated piece is transmitted to the cathode brush 130 electrically connected to the negative pole of the power supply, since the cathode brush 130 is connected to the negative pole of the constant current source and the electroplating solution in the electroplating tank is connected to the positive pole of the constant current source, a conduction circuit can be formed to perform the electroplating process.

[0075] Since the cathode brush 130 is arranged at the side of the output end of the roller 100, the electroplating solution from the electroplating tank on the electroplated part is adsorbed by the electroplating solution adsorption layer 200, so that the probability of the contact of the cathode brush 130 with the electroplating solution is greatly reduced, the probability of the surface of the cathode brush 130 being electroplated is reduced, and the service life is prolonged.

[0076] As an example, the negative pressure assembly 210 can include one or a combination of a suction machine, a pressure gauge, a flow meter, a pressure regulating valve and a throttle valve.

[0077] Specifically, the through cavity 101 is in a negative pressure state by the negative pressure assembly 210 to recover the electroplating solution on the electroplating solution adsorption layer 200, wherein, when electrical elements such as a pressure gauge, a flow meter, a pressure regulating valve and a throttle valve are installed at the suction machine end, the related parameters can be controlled or detected, and real-time monitoring can be realized, and the specific structure of the negative pressure assembly 210 can be selected as required.

[0078] Wherein, referring to Figure 2 , Figure 3 and Figure 8 , the joint 600 connected with the through cavity 101 can connect the suction machine port in the negative pressure assembly 210 to suck the electroplating solution adsorbed by the electroplating solution adsorption layer 200 back into the through cavity 101, and then discharge or recycle the electroplating solution through a special tank.

[0079] As an example, the roller 100 can include a PE roller, a PP roller or a PVDF roller to avoid being electroplated, so that the process of deplating can be avoided, the service life is prolonged, the equipment maintenance time is reduced, and the production capacity of the equipment is ensured.

[0080] As an example, the electroplating solution adsorption layer 200 can include one or a stack of a sponge layer or a hollow fiber ultrafiltration membrane.

[0081] Specifically, when the electroplating solution adsorption layer 200 adopts the hollow fiber ultrafiltration membrane, the hollow fiber ultrafiltration membrane can be arranged in the through hole 102 or located at the periphery of the roller 100 and covering the through hole 102, so that gas can be prevented from passing through and only the electroplating solution is allowed to pass through, and bubbles can be avoided between the electroplated part and the roller 100; the electroplating solution adsorption layer 200 can also adopt a sponge layer, or a stack of a hollow fiber ultrafiltration membrane and a sponge layer.

[0082] In the embodiment, the through holes 102 on the roller 100 are preferably arranged at equal intervals to realize uniform back absorption of the electroplating solution on the electroplated part and improve the electroplating quality, but the distribution of the through holes 102 is not limited thereto.

[0083] Preferably, the diameter of the through hole 102 is 1mm-2mm, such as 1mm, 1.5mm, 2mm, etc., so as to facilitate the control of the air pressure in the through cavity 101.

[0084] In this embodiment, the roller 100 is a through type, i.e. the two ends of the roller 100 have open ports, so as to facilitate subsequent operations such as cleaning, etc. on the roller 100. The two ends of the roller 100 can be fixed by the first side ring 301 and the second side ring 302, which can be made of the same corrosion-resistant material as the roller 100, and the first side ring 301, the second side ring 302 and the roller 100 can be connected together by welding or interference fit, so that the roller 100 can meet the air pressure requirement. Figure 2 and Figure 3 In this embodiment, the roller 100 is a through type, i.e. the two ends of the roller 100 have open ports, so as to facilitate subsequent operations such as cleaning, etc. on the roller 100. The two ends of the roller 100 can be fixed by the first side ring 301 and the second side ring 302, which can be made of the same corrosion-resistant material as the roller 100, and the first side ring 301, the second side ring 302 and the roller 100 can be connected together by welding or interference fit, so that the roller 100 can meet the air pressure requirement.

[0085] As an example, a pressure roller (not shown) can also be provided above the roller 100 and correspondingly arranged with the roller 100.

[0086] Specifically, when the pressure roller is provided, the pressure roller can make the electroplated piece fully contact with the electroplating liquid adsorption layer 200 when the electroplated piece passes through the roller 100, so as to improve the electroplating liquid adsorption effect.

[0087] In this embodiment, the driving assembly adopts bearing transmission, but the driving assembly is not limited thereto, i.e. the driving assembly can include a bevel gear 700, a spur gear 800 and a rotating shaft 900 connected with the bevel gear 700 and the spur gear 800. The rotating shaft 900 can be fixed by a shaft support 400, and the shaft support 400 can be fixed on the equipment. The rotating shaft 900 can rotate in the shaft support 400. One end of the rotating shaft 900 can be fixed with the second side ring 302 by welding, etc. The other end of the rotating shaft 900 is connected with the bevel gear 700 and the spur gear 800. Therefore, when the power piece such as a motor rotates the bevel gear 700 and the spur gear 800, it can synchronously rotate the rotating shaft 900 to drive the roller 100 to rotate, and the pressure roller can be driven to operate by the bevel gear 700, but the type of the driving assembly is not limited thereto.

[0088] In this embodiment, when the joint 600 is installed, it is fixed by the first side ring 301 and a shaft ring 500, i.e. the joint 600 can be fixed by the first side ring 301, and the shaft ring 500 can be installed on the equipment. The joint 600 can rotate in the shaft ring 500, and the joint 600 can be fixed with the first side ring 301 by welding or interference fit, etc.

[0089] As an example, the cathode brush 130 comprises a brush fixing part 131 and a brush comb part 132 connected with the brush fixing part 131, and the brush comb part 132 has an inclined angle with the horizontal plane, and the inclined direction of the inclined angle is consistent with the running direction of the electroplated piece.

[0090] Specifically, referring to Figure 6 , the running direction of the electroplated piece can be regarded as from right to left, and the inclined direction of the brush comb part 132 is set to be inclined to the left, so that when the electroplated piece contacts the brush comb part 132, a good buffer can be formed, and the damage probability of the electroplated piece and / or the brush comb part 132 is reduced. The range of the inclined angle between the brush comb part 132 and the horizontal plane can be 30°, 60°, 70°, 80°, etc.

[0091] The embodiment also provides a horizontal electroplating equipment, which comprises the above-mentioned conductive device, so that the structure of the conductive device is not described here, and the conductive device can provide a very ideal indirect contact cathode, which is suitable for the horizontal electroplating equipment for electroplating, such as photovoltaic cell pieces. The specific type of the horizontal electroplating equipment is not limited here.

[0092] In summary, the conductive device and the horizontal electroplating equipment of the utility model, including roller, electroplating liquid adsorption layer, isolation groove, negative pressure assembly, cathode brush and drive assembly, roller includes through cavity and through hole that communicate, electroplating liquid adsorption layer sets up at the periphery of roller, and covers through hole, for carrying electroplated piece and absorbing the electroplating liquid on the surface of electroplated piece, isolation groove includes first isolation groove and second isolation groove on both sides of first isolation groove that are separated by partition, and roller is located in first isolation groove, negative pressure assembly is connected with through cavity, so that through cavity presents negative pressure, to absorb the electroplating liquid brought from electroplating tank on electroplated piece, cathode brush is electrically connected with power supply negative pole, and cathode brush contacts the surface of electroplated piece, cathode brush sets up on partition, and cathode brush is located in the side of the output end of roller, drive assembly is connected with roller, for driving roller rotation.

[0093] The conductive device and the horizontal electroplating equipment of the utility model, through the electroplating liquid adsorption layer can absorb the electroplating liquid brought on the electroplated piece, and be transmitted to the special tank body through the negative pressure assembly, and then the recycling of the electroplating liquid can be carried out; the isolation groove can effectively avoid the contact of the electroplating liquid with the roller and the cathode brush; the cathode brush is located in the side of the output end of the roller, and the electroplating liquid brought on the electroplated piece is absorbed by the electroplating liquid adsorption layer, so that the contact amount of the cathode brush and the electroplating liquid on the surface of the electroplated piece can be effectively reduced, the service life of the cathode brush is prolonged, and the production capacity is improved.

[0094] The conductive device and the horizontal electroplating equipment can provide a relatively ideal indirect contact type roller, and are suitable for horizontal electroplating of photovoltaic cell pieces and the like.

[0095] The above embodiment only illustrates the principle and effect of the utility model, and is not used for limiting the utility model. Any person skilled in the art can modify or change the above embodiment without departing from the spirit and category of the utility model. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the utility model should be covered by the claims of the utility model.

Claims

1. An electrically conductive device, characterized by The conductive device comprises: a roller, which comprises a through cavity extending from one end to the other end of the roller and a through hole arranged on the side wall of the roller and communicating with the through cavity; a plating solution adsorption layer arranged on the periphery of the roller and covering the through hole, used for carrying the plating piece and adsorbing the plating solution on the surface of the plating piece; an isolation groove, which comprises a first isolation groove isolated by a partition plate and second isolation grooves located on both sides of the first isolation groove, and the roller is located in the first isolation groove; a negative pressure assembly connected with the through cavity, so that the through cavity presents a negative pressure to absorb the plating solution brought from the plating tank on the plating piece; a cathode brush electrically connected with the negative electrode of a power supply and in contact with the surface of the plating piece, arranged on the partition plate and located on the side of the output end of the roller; a driving assembly connected with the roller to drive the rotation of the roller.

2. The electrically conductive device of claim 1, wherein: The plating solution adsorption layer comprises one or a stack of sponge layers or hollow fiber ultrafiltration membranes.

3. The electrically conductive device of claim 1, wherein: The roller comprises a PE roller, a PP roller or a PVDF roller.

4. The electrically conductive device of claim 1, wherein: The diameter of the through hole is 1-2 mm.

5. The electrically conductive device of claim 1, wherein: The through holes are arranged at equal intervals.

6. The electrically conductive device of claim 1, wherein: The negative pressure assembly comprises one or a combination of a liquid suction machine, a pressure gauge, a flow meter, a pressure regulating valve and a throttle valve.

7. The electrically conductive device of claim 1, wherein: A compression roller is further arranged above the roller and corresponds to the roller.

8. The electrically conductive device of claim 1, wherein: The cathode brush comprises a brush fixing part and a brush comb part connected with the brush fixing part, and the brush comb part has an inclined angle with the horizontal plane, and the inclined direction of the inclined angle is consistent with the running direction of the plating piece.

9. The electrically conductive device of claim 8, wherein: The inclined angle between the brush comb part and the horizontal plane ranges from 30° to 80°.

10. A horizontal electroplating apparatus characterized by comprising: The horizontal plating equipment comprises the conductive device of any one of claims 1-9.

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