Liquid cooling device

By employing multiple heat-conducting surfaces arranged at an angle and a detachable connecting pipe in the liquid cooling device, the heat dissipation problem of large-area light source boards is solved, achieving efficient heat dissipation and convenient maintenance, and is suitable for the heat dissipation needs of high-power LED lamps.

CN223470156UActive Publication Date: 2025-10-24GODOX PHOTO EQUIPMENT CO LTD
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Patent Information

Application Number
CN202423255325.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-25
Publication Date
2025-10-24
Estimated Expiration
2034-12-25

AI Technical Summary

Technical Problem

Existing liquid cooling devices are costly and difficult to maintain on large-area light source boards, and cannot effectively dissipate heat, leading to maintenance difficulties and increased costs.

Method used

A liquid cooling device was designed, which uses a liquid cooling box with multiple heat-conducting surfaces arranged at an angle. The coolant carries away heat through flow and allows for individual replacement of the fault light board. It adopts a detachable connecting pipe connection method and combines with an external liquid cooling box to provide circulating coolant.

Benefits of technology

It improves heat dissipation, reduces maintenance costs and difficulty, meets the heat dissipation requirements of high-power LED lights, and is compatible with small-diameter optical components to improve optical performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a liquid cooling device which comprises a liquid cooling box, at least one liquid cooling cavity used for circulation of cooling liquid is arranged in the liquid cooling box, the liquid cooling box is further provided with a liquid inlet and a liquid outlet which are communicated with the liquid cooling cavity, the liquid cooling box is provided with a plurality of heat conduction surfaces used for installation of light sources, included angles are formed between the heat conduction surfaces, and the light sources are assembled on at least two heat conduction surfaces. Cooling liquid enters the liquid cooling cavity through the liquid inlet and is discharged from the liquid outlet. The liquid cooling device is light in weight and good in heat dissipation effect.
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Description

TECHNICAL FIELD

[0001] The utility model relates to photographic equipment field especially, relate to a liquid cooling device. BACKGROUND

[0002] At present, the light source of photographic lamp can be divided into LED lamp and thermal light source lamp generally. Among them, thermal light source lamp can be, incandescent lamp, halogen lamp etc. Because LED lamp has the advantages such as small volume, fast response, LED lamp gradually replaces traditional thermal light source lamp.

[0003] Among them, LED lamp is usually integrated with multiple LED chips on a circuit board, forms a light source board. The power of LED lamp is often limited by the number of LED. For the LED lamp with larger power, for example, the LED photographic lamp with thousands of watts power, it increases more LED chips, which leads to the larger area of light source board. The heat dissipation of the light source board with larger area is usually carried out by liquid cooling mode.

[0004] But for the liquid cooling heat dissipation of larger area, it needs larger area of liquid cooling pipeline and more complex liquid cooling device. When the local liquid cooling pipeline needs to be repaired, the whole liquid cooling system needs to be replaced, which increases the maintenance cost and difficulty. INVENTION CONTENTS

[0005] The utility model wants to overcome the insufficient of prior art, and provides a liquid cooling device with better heat dissipation effect.

[0006] A liquid cooling device, comprising:

[0007] A liquid cooling box is internally provided with at least one liquid cooling cavity for circulating cooling liquid, and the liquid cooling box is further provided with an inlet and an outlet in communication with the liquid cooling cavity, and the liquid cooling box is provided with a plurality of heat-conducting surfaces for mounting light sources, the plurality of heat-conducting surfaces are arranged at an angle, at least two heat-conducting surfaces are assembled with the light sources, and the cooling liquid enters the liquid cooling cavity through the inlet and is discharged from the outlet.

[0008] In one embodiment, the liquid cooling box is internally provided with a plurality of sub-liquid cooling cavities, and the plurality of sub-liquid cooling cavities are in communication with each other.

[0009] In one embodiment, the liquid cooling box comprises a plurality of sub-liquid cooling boxes, each of the sub-liquid cooling boxes is provided with a sub-liquid cooling cavity, the plurality of sub-liquid cooling boxes are mutually inclined and spliced, the sub-liquid cooling box comprises oppositely arranged first and second mounting plates, the outer side surface of the first mounting plate is the heat-conducting surface, and the second mounting plate is provided with a first communication pipe in communication with the inlet and a second communication pipe in communication with the outlet.

[0010] In one of the embodiments, a liquid inlet and a liquid outlet are arranged on the liquid confluence box, and a liquid confluence cavity is arranged in the liquid confluence box and communicates with the liquid cooling cavity.

[0011] In one of the embodiments, a surface of the liquid confluence box is provided with a first connector for connecting the first communication pipe and a second connector for connecting the second communication pipe, the first communication pipe and the second communication pipe are hard pipes, and the liquid cooling box is positioned on the liquid confluence box through the first communication pipe and the second communication pipe.

[0012] In one of the embodiments, the first communication pipe is detachably connected with the first connector, and the first communication pipe is detachably connected with the second connector.

[0013] In one of the embodiments, a mounting rack is further arranged, the mounting rack is provided with a plurality of mounting surfaces arranged at an inclination to each other, and the second mounting plate of the sub-liquid cooling box is mounted on the mounting surfaces.

[0014] In one of the embodiments, the second mounting plate of the sub-liquid cooling box is further provided with a circuit pipeline for passing through a cable of the light source, and the mounting surface is provided with a first through hole, a second through hole and a third through hole, the first through hole is used for passing through the first communication pipe, the second through hole is used for passing through the second communication pipe, and the third through hole is used for passing through the circuit pipeline.

[0015] In one of the embodiments, the liquid cooling box is in a polyhedral shape, and the liquid inlet and the liquid outlet are located on the same side of the liquid cooling box.

[0016] In one of the embodiments, the liquid cooling box is an integral structure.

[0017] In one of the embodiments, a plurality of liquid cooling boxes are arranged, and the plurality of liquid cooling boxes are spliced with each other.

[0018] In one of the embodiments, a liquid cooling tank is further arranged, the liquid cooling tank comprises a pressure pump, a liquid inlet pipe and a liquid outlet pipe, the liquid inlet pipe communicates with the liquid inlet, the liquid outlet pipe communicates with the liquid outlet, the pressure pump, the liquid inlet pipe, the liquid cooling cavity and the liquid outlet pipe form a closed circulation loop of the cooling liquid, and the liquid cooling tank is used for providing circulating cooling liquid for the liquid cooling device.

[0019] Compared with the prior art, the liquid cooling device has at least the following advantages:

[0020] In the liquid cooling device provided by the embodiments, the heat of the lamp plate is taken away by the flowing cooling liquid, the heat at each position of the lamp plate can be timely dissipated, and the heat dissipation effect of the liquid cooling device is improved.

[0021] And the liquid cooling device is provided with a plurality of heat-conducting surfaces, and the plurality of heat-conducting surfaces are arranged at an angle. The plurality of heat-conducting surfaces are respectively used for mounting the lamp panels, so that the area of each lamp panel can be relatively reduced, thereby facilitating the heat dissipation of each lamp panel, and further improving the heat dissipation effect of the liquid cooling device.

[0022] Again, the liquid cooling device can not only realize high working power, but also has a plurality of angle light-emitting surfaces by arranging the plurality of lamp panels at an angle, so as to form a three-dimensional light-emitting surface. The three-dimensional light-emitting surface of the liquid cooling device is relative to the traditional planar light-emitting surface, and the diameter of the liquid cooling device is relatively small, so that the caliber of the optical accessory matched with the liquid cooling device is also relatively small. On the one hand, the optical accessory with a small caliber has a small volume and is convenient to install; on the other hand, the optical accessory with a small caliber has a high light conversion efficiency on the liquid cooling device, thereby improving the optical effect of the optical accessory. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 is a three-dimensional view of a liquid cooling device according to an embodiment;

[0024] Figure 2 is an exploded view of the liquid cooling device shown in Figure 1

[0025] Figure 3 is an internal schematic view of a liquid cooling cavity of the liquid cooling box shown in Figure 2

[0026] Figure 4 is a sectional view of the liquid cooling box along the A-A direction shown in Figure 3

[0027] Figure 5 is a three-dimensional view of a liquid cooling device according to another embodiment;

[0028] Figure 6 is an exploded view of the liquid cooling device shown in Figure 5

[0029] Figure 7 is an exploded view of a liquid cooling device according to another embodiment.

[0030] In the drawings, the reference signs are explained as follows:

[0031] 10, liquid cooling box; 101, liquid cooling cavity; 102, liquid inlet; 103, liquid outlet; 104, heat-conducting surface; 105, first heat-conducting surface; 106, second heat-conducting surface; 107, third heat-conducting surface; 108, fourth heat-conducting surface; 109, fifth heat-conducting surface; 114, first cooling cavity; 115, second cooling cavity; 116, cooling channel; 117, fin; 118, high-temperature backflow cavity; 119, flow baffle;

[0032] ​​​​12, sub-liquid cooling box; 121, first mounting plate; 122, second mounting plate; 120, temperature sensor; 123, first communication pipe; 124, second communication pipe; 125, circuit pipe;

[0033] 13, confluence box; 131, first joint; 132, second joint;

[0034] 143, liquid inlet pipe; 144, liquid outlet pipe; 145, cable;

[0035] 15, mounting frame; 150, mounting surface; 151, first via hole; 152, second via hole; 153, third via hole;

[0036] 2, lamp plate; 21, cable. DETAILED DESCRIPTION

[0037] While the present application can be susceptible to embodiment in different forms, there are shown in the drawings, and will be described herein in detail, specific embodiments with the understanding that the present disclosure is to be considered an exemplification of the principles of the application, and is not intended to limit the application to that as illustrated.

[0038] It is therefore contemplated that an element recited in the singular and preceded with the word "a" or "an" should be understood as not excluding plural elements, unless explicitly stated otherwise. It will be further understood that any of the elements of the application, whether recited individually or collectively, can be substituted, deleted or added.

[0039] In the embodiments shown in the drawings, the indications of direction, such as up, down, left, right, front and rear, are used to explain the structure and movement of various elements of the present application are not absolute but relative. These indications are appropriate when the elements are in the position shown in the drawings. If the position of the elements changes, the indications of direction will change accordingly.

[0040] For the high-power LED light source of the photographic lamp, when its luminous power reaches thousands of watts or tens of thousands of watts, the number of LED chips will be more. If all the LED chips are arranged on the same plane, the layout area of the LED chips will increase a lot. For the heat dissipation of the LED light source with a large layout area, the liquid cooling heat dissipation effect is more effective compared with the air cooling heat dissipation mode. However, for the liquid cooling heat dissipation system, since the liquid cooling passage, the liquid cooling water tank, the heat dissipation fan and the like need to be arranged, the weight of the whole heat dissipation system is large, and the volume is also large. When the photographic lamp with the heat dissipation device with a large weight is fixed and installed, the installation is difficult, which is not conducive to the application of the LED lamp.

[0041] Please refer to Figure 1 and Figure 2 The embodiment provides a liquid cooling device. The liquid cooling device comprises a liquid cooling box 10.

[0042] The liquid cooling box 10 is provided with at least one liquid cooling cavity 101 for circulating cooling liquid. The liquid cooling box 10 is also provided with a liquid inlet 102 and a liquid outlet 103 which are in communication with the liquid cooling cavity 101. The cooling liquid enters the liquid cooling cavity 101 through the liquid inlet 102 and is discharged from the liquid outlet 103.

[0043] The liquid cooling box 10 is provided with a plurality of heat-conducting surfaces 104 for mounting light sources, and the plurality of heat-conducting surfaces 104 are arranged at an angle. At least two heat-conducting surfaces 104 are used to assemble a lamp panel 2.

[0044] The liquid cooling device has a three-dimensional shape. The lamp panel 2 is mounted on the heat-conducting surface 104, so that the heat on the lamp panel 2 can be transmitted through the heat-conducting surface 104.

[0045] The side surface of the liquid cooling device can be set as a heat-conducting surface 104. Each heat-conducting surface 104 corresponds to a light-emitting surface. A plurality of lamp panels 2 can be assembled on the liquid cooling device to form the three-dimensional light source. The liquid cooling device can be a cube, a polyhedron, an irregular shape or the like.

[0046] The lamp panel 2 can be detachably arranged on the heat-conducting surface 104. When one of the lamp panels 2 fails, only the lamp panel 2 needs to be replaced, and the other lamp panels 2 can continue to work normally, so that the maintenance is convenient, and the maintenance cost is saved.

[0047] Specifically, the lamp panel 2 can be detachably arranged on the heat-conducting surface 104 of the liquid cooling device through a fastening screw 9. The light source is integrated on a circuit board to form the lamp panel 2. The lamp panel 2 can be mounted on the heat-conducting surface. The heat generated by the light source is transmitted to the heat-conducting surface through the circuit board, and is taken away by the flowing cooling liquid in the liquid cooling cavity.

[0048] The light source can be an LED lamp bead, an LED chip, a laser light source, etc. When the light source is an LED chip, the LED chip can be directly integrated on a circuit board by using a chip on board (COB) packaging technology. The lamp panel 2 can also be a COB board. When the light source is lit and emits light, the light source generates heat, and the heat is transferred to the circuit board.

[0049] The LED chips are uniformly arranged on the circuit board, and the arrangement shape of the LED chips corresponds to the shape of the light-emitting surface of the lamp panel 2. The arrangement shape of the LED chips can be rectangular, circular, etc.

[0050] Please refer to Figure 3 and Figure 4 The liquid cooling box 10 includes a plurality of sub-liquid cooling cavities, and the plurality of sub-liquid cooling cavities are in communication with each other. Each sub-liquid cooling cavity can correspond to a heat conduction surface 104 to dissipate heat from the lamp panel 2 arranged on the heat conduction surface 104. The plurality of sub-liquid cooling cavities can be in series communication with each other or in parallel communication with each other. As long as the circulation of the cooling liquid in each sub-liquid cooling cavity can be achieved.

[0051] The liquid cooling box 10 can be a one-piece structure. Each side surface of the liquid cooling box 10 is a heat conduction surface 104, and the lamp panel 2 is directly mounted on the plurality of side surfaces of the liquid cooling box 10.

[0052] Specifically, the liquid cooling box 10 is in the shape of a cube. The adjacent two heat conduction surfaces 104 are arranged perpendicular to each other, and the included angle between the adjacent two heat conduction surfaces 104 is a right angle. When the liquid cooling box 10 is in other shapes, such as a frustum or a multi-surface sphere, the included angle between the heat conduction surfaces 104 can also be an acute angle or an obtuse angle.

[0053] The liquid cooling box 10 has six side surfaces. Five of the side surfaces can be used as heat conduction surfaces 104, and the other side surface can be provided with an inlet 102 and an outlet 103, and the liquid inlet pipe 143, the liquid outlet pipe 144, and the cable 145, etc. are led out; or the side surface can also be used for assembly to fix the liquid cooling box 10 on an external support. Alternatively, the side surface can also be provided with a clamping structure to enable the liquid cooling boxes 10 to be spliced with each other. Alternatively, in the case that the liquid inlet pipe 143, the liquid outlet pipe 144, and the cable 145, etc. do not interfere with the operation of other lamp panels 2, the side surface can also be used as a heat conduction surface 104 to mount the lamp panel 2 and increase the number of lamp panels 2 arranged on the liquid cooling box 10.

[0054] The liquid cooling boxes 10 can be spliced together to form a pyramid or a column, and the plurality of liquid cooling boxes 10 can be stacked to meet the light source requirements of the photographic lamp. When one of the liquid cooling boxes 10 is damaged, only the damaged liquid cooling box 10 needs to be replaced, and the other liquid cooling boxes 10 can continue to work, so that the liquid cooling device is easy to maintain and the maintenance cost is reduced. The liquid cooling box 10 can form a liquid cooling cavity 101, or the liquid cooling box 10 can be divided into a plurality of sub-liquid cooling cavities by a partition, a pipeline, or the like. The division of the liquid cooling cavity in the liquid cooling box 10 is not limited, as long as each heat conduction surface 104 of the liquid cooling box 10 corresponds to a liquid cooling cavity, and the heat on the heat conduction surface 104 can be removed by the cooling liquid. The low-temperature cooling liquid is introduced into the liquid cooling box 10 through the liquid inlet, so that each heat conduction surface 104 in contact with the liquid cooling cavity is cooled. The low-temperature cooling liquid absorbs the heat generated by the light source on the lamp panel 2 through the heat conduction surface 104 and becomes high-temperature cooling liquid, which is discharged from the liquid outlet.

[0055] In this embodiment, please refer to Figure 3 and Figure 4 For convenience of description, the heat conduction surface 104 of the liquid cooling box 10 includes a first heat conduction surface 105, a second heat conduction surface 106, a third heat conduction surface 107, and a fourth heat conduction surface 108 arranged around and connected at the head and tail, and a fifth heat conduction surface 109 located at the top. The liquid inlet 102 and the liquid outlet 103 are arranged at the bottom of the liquid cooling box 10.

[0056] The liquid cooling cavity 101 of the liquid cooling box 10 can be divided into a low-temperature cooling cavity and a high-temperature return cavity. The low-temperature cooling cavity is in communication with the liquid inlet 102, and the high-temperature return cavity is in communication with the liquid outlet 103. The low-temperature cooling cavity includes a first cooling cavity 114 distributed around the liquid cooling cavity 101, and a second cooling cavity 115 arranged at the top. The first cooling cavity 114 and the second cooling cavity 115 are in communication through a cooling channel 116. The first cooling cavity 114 is distributed around the first heat conduction surface 105, the second heat conduction surface 106, the third heat conduction surface 107, and the fourth heat conduction surface 108. The second cooling cavity 115 is located at the top of the liquid cooling box 10 and corresponds to the fifth heat conduction surface 109. The cooling channel 116 is located at the center of the liquid cooling box 10 and extends from bottom to top to realize the communication between the first cooling cavity 114 and the second cooling cavity 115. The first cooling cavity 114 and the second cooling cavity 115 are both provided with fins 117.

[0057] When the low-temperature cooling liquid enters from the bottom liquid inlet 102, it is distributed to the first cooling cavity 114 and the second cooling cavity 115 through the cooling channel 116. The cooling liquid in the first cooling cavity 114 flows upwards along the fins 117, and then the heat generated by the first heat-conducting surface 105, the second heat-conducting surface 106, the third heat-conducting surface 107, and the fourth heat-conducting surface 108 is taken away, and the cooling liquid flows out from the top of the first cooling cavity 114 and becomes the first high-temperature return liquid. The cooling liquid in the second cooling cavity 115 flows upwards to the fins, and then the heat generated by the fifth heat-conducting surface 109 is taken away, and the cooling liquid flows out from the side of the second cooling cavity 115 and becomes the second high-temperature return liquid.

[0058] The high-temperature return cavity 118 is located between the first cooling cavity 114 and the second cooling cavity 115 and extends in the vertical direction. The high-temperature return cavity 118 is in communication with the first cooling cavity 114 and the second cooling cavity 115. The liquid cooling box 10 is provided with a baffle 119 between the top of the first cooling cavity 114 and the side of the second cooling cavity 115. The baffle 119 can prevent the first high-temperature return liquid and the second high-temperature return liquid from being disturbed, which affects the smooth return of the first high-temperature return liquid and the second high-temperature return liquid to the high-temperature return cavity 118, and finally the first high-temperature return liquid and the second high-temperature return liquid flow out through the liquid outlet 103. The arrangement of the low-temperature cooling cavity and the high-temperature return cavity 118 can facilitate the unidirectional flow of the cooling liquid in the liquid cooling cavity and the circulation of the cooling liquid.

[0059] The shape of the liquid cooling box 10 can also be a spherical body, a polyhedral body, an irregular shape, etc.

[0060] Please refer to Figure 5 and Figure 6 In other embodiments, the liquid cooling box 10 can also include a plurality of sub-liquid cooling boxes 12. The sub-liquid cooling box 12 is provided with a sub-liquid cooling cavity. The plurality of sub-liquid cooling boxes 12 are inclinedly spliced with each other and can be spliced into a pyramid shape, a spherical shape, a polyhedral shape, etc.

[0061] The sub-liquid cooling box 12 can be flat. The sub-liquid cooling box 12 includes a first mounting plate 121 and a second mounting plate 122 arranged oppositely. The outer side of the first mounting plate 121 is a heat-conducting surface 104. The lamp plate 2 can be mounted on the outer side of the first mounting plate 121. The lamp plate 2 can be detachably arranged on the heat-conducting surface 104. When one of the lamp plates 2 fails, only the lamp plate 2 needs to be replaced, and the other lamp plates 2 can continue to work normally, which facilitates maintenance and saves maintenance cost. Specifically, the lamp plate 2 can be detachably arranged on the heat-conducting surface 104 of the liquid cooling device through a fastening screw 9.

[0062] The first mounting plate 121 can also be provided with a temperature sensor 120 for sensing the temperature of the first mounting plate 121.

[0063] The first mounting plate 121 and / or the second mounting plate 122 can be provided with a water containing groove in the thickness direction, and the first mounting plate 121 and the second mounting plate 122 cover the water containing groove to form a sub-liquid cooling cavity.

[0064] The second mounting plate 122 is provided with a first communication pipe 123 and a second communication pipe 124 which are in communication with the sub-liquid cooling cavity. The first communication pipe 123 can be used for accessing the cooling liquid, and the second communication pipe 124 can be used for discharging the cooling liquid. It can be understood that the first communication pipe 123 can also be used for discharging the cooling liquid, and the second communication pipe 124 can also be used for accessing the cooling liquid.

[0065] The plurality of sub-liquid cooling boxes 12 include a plurality of sub-liquid cooling cavities, and the plurality of sub-liquid cooling cavities can be in communication with each other through the first communication pipe 123 and the second communication pipe 124. In addition, the plurality of sub-liquid cooling cavities can be in series or in parallel.

[0066] The liquid cooling device further includes a converging box 13, and the liquid inlet 102 and the liquid outlet 103 are arranged on the converging box 13. The converging box 13 is provided with a converging cavity which is in communication with the liquid cooling cavity. Specifically, the plurality of sub-liquid cooling cavities and the converging cavity are in communication with each other, and the plurality of sub-liquid cooling cavities are in parallel communication through the converging cavity.

[0067] Specifically, five sub-liquid cooling boxes 12 and one converging box 13 are spliced with each other to form a hexahedral liquid cooling device. The five sub-liquid cooling boxes 12 are respectively arranged on five sides of the hexahedron, and the converging box 13 is arranged on the bottom surface of the hexahedron. The first mounting plate 121 of the five sub-liquid cooling boxes 12 is used for mounting the lamp panel 2. The adjacent two sub-liquid cooling boxes 22 are arranged perpendicular to each other, and the included angle between the adjacent two heat conduction surfaces 201 is a right angle. When the liquid cooling box 21 is in other shapes, such as a frustum or a multi-surface sphere, the included angle between the adjacent two sub-liquid cooling boxes 22 can also be an acute angle or an obtuse angle.

[0068] The converging box 13 is arranged at the bottom of the hexahedral liquid cooling device. The upper surface of the converging box 13 is provided with a first connector 131 for connecting the first communication pipe 123 and a second connector 132 for connecting the second communication pipe 124. The first connector 131 and the second connector 132 are a plurality of, and correspond to the first communication pipe 123 and the second communication pipe 124 of the five sub-liquid cooling boxes 12 respectively.

[0069] In addition, the first communication pipe 123 and the second communication pipe 124 of the sub-liquid cooling box 12 arranged on different sides all extend towards the upper surface of the converging box 13. Therefore, the first communication pipe 123 and the second communication pipe 124 of each sub-liquid cooling box 12 can be connected to the first connector 131 and the second connector 132 of the converging box 13.

[0070] And, the plurality of first joints 131 and the plurality of second joints 132 are respectively aligned with the docking positions of the first communication pipes 123 and the second communication pipes 124 of each sub-liquid cooling box 12, so that the five sub-liquid cooling boxes 12 can be docked to form a cube shape.

[0071] The first communication pipes 123 and the second communication pipes 124 are hard pipes. And, the sub-liquid cooling boxes 12 are supported on the confluence box 13 by the first communication pipes 123 and the second communication pipes 124.

[0072] And, the first communication pipes 123 are detachably connected with the first joints 131. The second communication pipes 124 are detachably connected with the second joints 132. When one of the sub-liquid cooling boxes 12 is damaged, only the damaged sub-liquid cooling box 12 needs to be removed and replaced with a new one, so that the maintenance is convenient.

[0073] Please refer to Figure 7 In other embodiments, the liquid cooling device further comprises a mounting rack 15. The mounting rack 15 can be a cuboid structure with one open end. The open end of the mounting rack 15 is used to lead out the water flow pipeline and the circuit line. The mounting rack 15 can be a metal frame.

[0074] The mounting rack 15 is provided with a plurality of mounting surfaces 150 which are arranged at an inclination to each other. The sub-liquid cooling boxes 12 are mounted on the mounting surfaces 150 of the mounting rack 15. The mounting rack 15 can better support the plurality of sub-liquid cooling boxes 12, so that the sub-liquid cooling boxes 12 can be stably spliced together and maintain a three-dimensional shape.

[0075] Specifically, the mounting rack 15 is in the shape of a cube. The mounting rack 15 can have five mounting surfaces 150 and one open end. The five sub-liquid cooling boxes 12 are correspondingly mounted on the five mounting surfaces 150. The second mounting plate 122 of the sub-liquid cooling box 12 is provided with the first communication pipe 123, the second communication pipe 124 and the circuit pipeline 125. The circuit pipeline 125 is used to pass through the cable of the lamp panel 2. The mounting surface 150 is provided with a first through hole 151, a second through hole 152 and a third through hole 153. The first through hole 151 is used to pass through the first communication pipe 123, the second through hole 152 is used to pass through the second communication pipe 124, and the third through hole 153 is used to pass through the circuit pipeline 125. Then, the first communication pipes 123, the second communication pipes 124 and the circuit pipelines 125 of the plurality of sub-liquid cooling boxes 12 are gathered in the interior of the mounting rack 15 and led out from the open end.

[0076] It can be understood that the plurality of first communication pipes 123 can be converged into one pipeline, and the plurality of second communication pipes 124 can also be converged into one pipeline, so as to be communicated with the liquid inlet pipe 143 and the liquid outlet pipe 144.

[0077] The liquid cooling device can further comprise an external liquid cooling tank. The external liquid cooling tank is independent of the liquid cooling device. The external liquid cooling tank is in communication with the liquid cooling device through the liquid inlet pipe 143 and the liquid outlet pipe 144. The external liquid cooling tank provides low-temperature cooling liquid for the liquid cooling device. The cooling liquid can be low-temperature water, low-temperature fluorinated liquid, low-temperature silicon oil, etc. The external liquid cooling tank is independent of the liquid cooling device, does not occupy the space of the liquid cooling device, and does not increase the weight of the liquid cooling device, so that the light emitting diode light source 10 can be conveniently arranged. In addition, the distance between the external liquid cooling tank and the liquid cooling device can be adjusted according to the use requirement, and the external liquid cooling tank can be applied to various occasions.

[0078] The external liquid cooling tank is used for providing circulating cooling liquid for the liquid cooling device. The external liquid cooling tank is provided with a pressure pump (not shown in the figure), a liquid inlet pipe 143 and a liquid outlet pipe 144. The liquid inlet pipe 143 is in communication with the liquid inlet 102, and the liquid outlet pipe 144 is in communication with the liquid outlet 103. The pressure pump, the liquid inlet pipe, the liquid cooling cavity and the liquid outlet pipe form a closed circulation loop of the cooling liquid. The pressure pump is connected to the circulation loop and is used for pressurizing the cooling liquid, so that the cooling liquid maintains a high flow rate and can quickly take away heat.

[0079] The liquid cooling tank is connected to the liquid cooling box 10 through the extended liquid inlet pipe 143 and the liquid outlet pipe 144, so that the liquid cooling box 10 and the liquid cooling tank are designed in a split manner. The weight of the liquid cooling tank does not affect the weight of the liquid cooling box 10, so that the weight of the liquid cooling box 10 is relatively light. When the photographic lamp is installed, only the relatively light liquid cooling box 10 needs to be fixed and installed, so that the liquid cooling box 10 can be arranged at a corresponding installation position according to the use requirement. The area of the liquid cooling box is reduced.

[0080] The liquid cooling tank can be powered by an internal battery or an external power supply. The power supply mode of the liquid cooling tank is not limited. The liquid cooling tank is connected to the power supply, so that the pressure pump can be powered and work.

[0081] The above content is only a preferred embodiment of the present application, and is not used to limit the implementation scheme of the present application. Those skilled in the art can easily make corresponding changes or modifications according to the main concept and spirit of the present application. Therefore, the protection scope of the present application should be subject to the protection scope required by the claims.

Claims

1. A liquid cooling device, characterized by, The application relates to a liquid cooling box. The liquid cooling box is internally provided with a plurality of sub-liquid cooling cavities which are interconnected.

2. The liquid cooling device according to claim 1, characterized in that The liquid cooling box comprises a plurality of sub-liquid cooling boxes, each of which is provided with a sub-liquid cooling cavity, and the sub-liquid cooling boxes are interconnected in an inclined mode.

3. The liquid cooling device of claim 2, wherein, The liquid cooling box is provided with a plurality of heat-conducting surfaces for mounting light sources, the heat-conducting surfaces are arranged at an angle, at least two of the heat-conducting surfaces are provided with the light sources, and the cooling liquid enters the liquid cooling cavity through the liquid inlet and is discharged from the liquid outlet.

4. The liquid cooling device of claim 3, wherein, The liquid cooling box is internally provided with a plurality of sub-liquid cooling cavities which are interconnected.

5. The liquid cooling device of claim 4, wherein, The liquid cooling box comprises a plurality of sub-liquid cooling boxes, each of which is provided with a sub-liquid cooling cavity, and the sub-liquid cooling boxes are interconnected in an inclined mode.

6. The liquid cooling device of claim 5, wherein, The liquid cooling box is provided with a plurality of heat-conducting surfaces for mounting light sources, the heat-conducting surfaces are arranged at an angle, at least two of the heat-conducting surfaces are provided with the light sources, and the cooling liquid enters the liquid cooling cavity through the liquid inlet and is discharged from the liquid outlet.

7. The liquid cooling device of claim 3, wherein, The liquid cooling box is internally provided with a plurality of sub-liquid cooling cavities which are interconnected.

8. The liquid cooling device of claim 7, wherein, The liquid cooling box comprises a plurality of sub-liquid cooling boxes, each of which is provided with a sub-liquid cooling cavity, and the sub-liquid cooling boxes are interconnected in an inclined mode.

9. The liquid cooling device of claim 1, wherein, The liquid cooling box is provided with a plurality of heat-conducting surfaces for mounting light sources, the heat-conducting surfaces are arranged at an angle, at least two of the heat-conducting surfaces are provided with the light sources, and the cooling liquid enters the liquid cooling cavity through the liquid inlet and is discharged from the liquid outlet.

10. The liquid cooling device of claim 1, wherein, The liquid cooling box is internally provided with a plurality of sub-liquid cooling cavities which are interconnected.

11. The liquid cooling device of claim 1, wherein, The liquid cooling box comprises a plurality of sub-liquid cooling boxes, each of which is provided with a sub-liquid cooling cavity, and the sub-liquid cooling boxes are interconnected in an inclined mode.

12. The liquid cooling device of any of claims 1-11, wherein, The liquid cooling box is provided with a plurality of heat-conducting surfaces for mounting light sources, the heat-conducting surfaces are arranged at an angle, at least two of the heat-conducting surfaces are provided with the light sources, and the cooling liquid enters the liquid cooling cavity through the liquid inlet and is discharged from the liquid outlet. The liquid cooling box is internally provided with a plurality of sub-liquid cooling cavities which are interconnected. The liquid cooling box comprises a plurality of sub-liquid cooling boxes, each of which is provided with a sub-liquid cooling cavity, and the sub-liquid cooling boxes are interconnected in an inclined mode. The liquid cooling box is provided with a plurality of heat-conducting surfaces for mounting light sources, the heat-conducting surfaces are arranged at an angle, at least two of the heat-conducting surfaces are provided with the light sources, and the cooling liquid enters the liquid cooling cavity through the liquid inlet and is discharged from the liquid outlet. The liquid cooling box is internally provided with a plurality of sub-liquid cooling cavities which are interconnected. The liquid cooling box comprises a plurality of sub-liquid cooling boxes, each of which is provided with a sub-liquid cooling cavity, and the sub-liquid cooling boxes are interconnected in an inclined mode. The liquid cooling box is provided with a plurality of heat-conducting surfaces for mounting light sources, the heat-conducting surfaces are arranged at an angle, at least two of the heat-conducting surfaces are provided with the light sources, and the cooling liquid enters the liquid cooling cavity through the liquid inlet and is discharged from the liquid outlet. The liquid cooling box is internally provided with a plurality of sub-liquid cooling cavities which are interconnected. The liquid cooling box comprises a plurality of sub-liquid cooling boxes, each of which is provided with a sub-liquid cooling cavity, and the sub-liquid cooling boxes are interconnected in an inclined mode. The liquid cooling box is provided with a plurality of heat-conducting surfaces for mounting light sources, the heat-conducting surfaces are arranged at an angle, at least two of the heat-conducting surfaces are provided with the light sources, and the cooling liquid enters the liquid cooling cavity through the liquid inlet and is discharged from the liquid outlet. The liquid cooling box is internally provided with a plurality of sub-liquid cooling cavities which are interconnected. The liquid cooling box comprises a plurality of sub-liquid cooling boxes, each of which is provided with a sub-liquid cooling cavity, and the sub-liquid cooling boxes are interconnected in an inclined mode. The liquid cooling box is provided with a plurality of heat-conducting surfaces for mounting light sources, the heat-conducting surfaces are arranged at an angle, at least two of the heat-conducting surfaces are provided with the light sources, and the cooling liquid enters the liquid cooling cavity through the liquid inlet and is discharged from the liquid outlet. The liquid cooling box is internally provided with a plurality of sub-liquid cooling cavities which are interconnected. The liquid cooling box comprises a plurality of sub-liquid cooling boxes, each of which is provided with a sub-liquid cooling cavity, and the sub-liquid cooling boxes are interconnected in an inclined mode. The liquid cooling box is provided with a plurality of heat-conducting surfaces for mounting light sources, the heat-conducting surfaces are arranged at an angle, at least two of the heat-conducting surfaces are provided with the light sources, and the cooling liquid enters the liquid cooling cavity through the liquid inlet and is discharged from the liquid outlet. The liquid cooling box is internally provided with a plurality of sub-liquid cooling cavities which are interconnected. The liquid cooling box comprises a plurality of sub-liquid cooling boxes, each of which is provided with a sub-liquid cooling cavity, and the sub-liquid cooling boxes are interconnected in an inclined mode. The liquid cooling box is provided with a plurality of heat-conducting surfaces for mounting light sources, the heat-conducting surfaces are arranged at an angle, at least two of the heat-conducting surfaces are provided with the light sources, and the cooling liquid enters the liquid cooling cavity through the liquid inlet and is discharged from the liquid outlet. The liquid cooling box is internally provided with a plurality of sub-liquid cooling cavities which are interconnected. The liquid cooling box comprises a plurality of sub-liquid cooling boxes, each of which is provided with a sub-liquid cooling cavity, and the sub-liquid cooling boxes are interconnected in an inclined mode. The liquid cooling box is provided with a plurality of heat-conducting surfaces for mounting light sources, the heat-conducting surfaces are arranged at an angle, at least two of the heat-conducting surfaces are provided with the light sources, and the cooling liquid enters the liquid cooling cavity through the liquid inlet and is discharged from the liquid outlet. The liquid cooling box is internally provided with a plurality of sub-liquid cooling cavities which are interconnected. The liquid cooling box comprises a plurality of sub-liquid cooling boxes, each of which is provided with a sub-liquid cooling cavity, and the sub-liquid cooling boxes are interconnected in an inclined mode. The liquid cooling box is provided with a plurality of heat-conducting surfaces for mounting light sources, the heat-conducting surfaces are arranged at an angle, at least two of the heat-conducting surfaces are provided with the light sources, and the cooling liquid enters the liquid cooling cavity through the liquid inlet and is discharged from the liquid outlet. The liquid cooling box is internally provided with a plurality of sub-liquid cooling cavities which are interconnected. The liquid cooling box comprises a plurality of sub-liquid cooling boxes, each of which is provided with a sub-liquid cooling cavity, and the sub-liquid cooling boxes are interconnected in an inclined mode. The liquid cooling box is provided with a plurality of heat-conducting surfaces for mounting light sources, the heat-conducting surfaces are arranged at an angle, at least two of the heat-conducting surfaces are provided with the light sources, and the cooling liquid enters the liquid cooling cavity through the liquid inlet and is discharged from the liquid outlet. The liquid cooling box is internally provided with a plurality of sub-liquid cooling cavities which are interconnected. The liquid cooling box comprises a plurality of sub-liquid cooling boxes, each of which is provided with a sub-liquid cooling cavity, and the sub-liquid cooling boxes are interconnected in an inclined mode. The liquid cooling box is provided with a plurality of heat-conducting surfaces for mounting light sources, the heat-conducting surfaces are arranged at an angle, at least two of the heat-conducting surfaces are provided with the light sources, and the cooling liquid enters the liquid cooling cavity through the liquid inlet and is discharged from the liquid outlet. The liquid cooling box is internally provided with a plurality of sub-liquid cooling cavities which are interconnected. The liquid cooling box comprises a plurality of sub-liquid cooling boxes, each of which is provided with a sub-liquid cooling cavity, and the sub-liquid cooling boxes are interconnected in an inclined mode. The liquid cooling box is provided with a plurality of heat-conducting surfaces for mounting light sources, the heat-conducting surfaces are arranged at an angle, at least two of the heat-conducting surfaces are provided with the light sources, and the cooling liquid enters the liquid cooling cavity through the liquid inlet and is discharged from the liquid outlet. The liquid cooling box is internally provided with a plurality of sub-liquid cooling cavities which are interconnected. The liquid cooling box comprises a plurality of sub-liquid cooling boxes, each of which is provided with a sub-liquid cooling cavity, and the sub-liquid cooling boxes are interconnected in an