Supporting device of circuit board

Abstract

The utility model relates to a supporting device of a circuit board, which comprises a frame body and a supporting assembly used for supporting the circuit board, the circuit board is arranged above the frame body, and the height of the top surface of the supporting assembly is the same as that of the top surface of the frame body; the supporting assemblies and the frame body form a plurality of supporting areas. The circuit board is provided with a plurality of test areas, each test area is provided with a plurality of electronic parts, and each support area corresponds to one or more test areas; when the circuit board is arranged on the frame body, the supporting assembly abuts against the circuit board so as to support the one or more testing areas respectively. According to the utility model, the supporting assembly is arranged in the frame body, and the height of the top surface of the supporting assembly is consistent with that of the top surface of the frame body, so that the supporting assembly and the frame body can support the circuit board together and provide supporting force for the whole circuit board; the supporting assembly and the frame body can form a plurality of supporting areas, and the supporting areas correspond to the testing areas on the circuit board respectively. When the circuit board is placed on the frame body, the supporting assembly abuts against the abutting circuit board and supports the test area.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic device test technical field, more specifically, relate to a kind of support device of circuit board. BACKGROUND

[0002] At present, the batch testing of chip is generally carried out on a circuit board integrated with multiple same test systems, and the electronic components of each test system are arranged in the corresponding area, and a chip mounting seat is arranged on each area for placing the chip. Since the area of such circuit board is large and many electronic components are placed thereon, the circuit board needs to be erected during testing. In this case, the circuit board is easily deformed due to gravity, which may cause faults. SUMMARY

[0003] The utility model provides a kind of support device of circuit board to solve the technical problems that circuit board is easily deformed due to gravity when being erected for testing, which may cause faults.

[0004] The utility model adopts the technical scheme that:

[0005] A support device of circuit board is constructed to support the circuit board, which includes a frame body and a support assembly for supporting the circuit board. The circuit board is located above the frame body, and the support assembly is arranged in the frame body. The top surface of the support assembly has the same height as the top surface of the frame body. The support assembly and the frame body form multiple support areas. The circuit board is provided with multiple test areas, each of which is provided with a plurality of electronic components. Each support area corresponds to one or more test areas. When the circuit board is placed on the frame body, the support assembly abuts against the circuit board to support one or more test areas respectively.

[0006] Further, the support assembly includes a first support bar and a second support bar, which are arranged in the frame body in a cross shape to form multiple support areas, and each support area corresponds to one test area.

[0007] Further, the circuit board is provided with a groove corresponding to the support assembly, and the groove is clamped with the support assembly. Alternatively, the circuit board is provided with one or more openings, and the support assembly is provided with a protrusion corresponding to the opening, which is clamped in the opening.

[0008] Further, the frame body comprises a first side frame and a second side frame, the first side frame and the second side frame are connected, the first side frame is longitudinally arranged and located on both sides of the first supporting strip, and the second side frame is transversely arranged and located on both sides of the second supporting strip.

[0009] Further, the supporting assembly comprises a plurality of first supporting strips, the frame body comprises a first side frame and a second side frame which is connected perpendicularly to the first side frame, one of the first side frame and the second side frame is connected perpendicularly to the plurality of first supporting strips, and the first side frame or the second side frame connected to the first supporting strip is provided with a plurality of heat dissipation holes.

[0010] Further, the supporting assembly comprises a sub-supporting structure which is arranged perpendicularly to the first supporting strip and is connected slidingly to the first supporting strip.

[0011] Further, the sub-supporting structure comprises an upper part and a lower part, the upper part is movably connected to the lower part, the upper part is provided with a seat body and a first through hole, the lower part is provided with a placing groove, a fixing column and a second through hole, the seat body is located in the placing groove, the first through hole and the second through hole are arranged correspondingly, and the fixing column penetrates through the second through hole and the first through hole.

[0012] Further, the bottom of the first supporting strip is provided with a sliding groove, the lower part is provided with a column body which corresponds to the sliding groove and is slidingly arranged in the sliding groove.

[0013] Further, the upper part is provided with a supporting plate for supporting the circuit board, and the supporting plate is horizontally arranged and in contact with the circuit board.

[0014] Further, the first supporting strip is provided with a plurality of first insertion grooves, the second supporting strip is provided with a plurality of second insertion grooves which correspond to the first insertion grooves, and the first insertion grooves are respectively clamped with the second insertion grooves.

[0015] The utility model discloses the beneficial effect lies in:

[0016] By arranging the supporting assembly in the frame body, the height of the top surface of the supporting assembly is consistent with the height of the top surface of the frame body, the frame body and the supporting assembly can support the circuit board together, and the supporting force is provided for the whole circuit board; the supporting assembly and the frame body can form a plurality of supporting areas and correspond to the test areas on the circuit board respectively, when the circuit board is placed on the frame body, the supporting assembly abuts against the circuit board, and the supporting areas can support the test areas. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the present application will be further described below with reference to the drawings and embodiments. The drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the premise of not deviating from the concept of the present application:

[0018] Figure 1 is the overall structure diagram of a circuit board support device in an embodiment of the present application;

[0019] Figure 2 is a three-dimensional schematic diagram of a circuit board in an embodiment of the present application;

[0020] Figure 3 is a three-dimensional schematic diagram of a frame body and a first support strip in an embodiment of the present application;

[0021] Figure 4 is a three-dimensional schematic diagram of a frame body and a second support strip in an embodiment of the present application;

[0022] Figure 5 is a three-dimensional schematic diagram of a circuit board support device in another embodiment of the present application;

[0023] Figure 6 is a three-dimensional schematic diagram of a circuit board support device in another embodiment of the present application; Figure 5

[0024] Figure 7 is a three-dimensional schematic diagram of a lower part in an embodiment of the present application;

[0025] Figure 8 is a three-dimensional schematic diagram of an upper part in an embodiment of the present application.

[0026] Label explanation: circuit board 1, frame body 2, support assembly 3, first support strip 301, second support strip 302, support area 303, test area 101, groove 102, opening 103, protrusion 304, first side frame 201, second side frame 202, heat dissipation hole 203, sub support structure 305, upper part 306, lower part 307, seat body 308, first through hole 309, placing groove 310, fixed column 311, second through hole 312, sliding groove 313, column body 314, support plate 315, first insertion slot 316, second insertion slot 317. DETAILED DESCRIPTION

[0027] ​In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the following will make a clear and complete description of the technical scheme in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all. Based on the embodiments of the utility model, all other embodiments obtained by the ordinary skilled in the art without creative labor belong to the protection scope of the utility model.

[0028] The terms "first", "second", "third", "fourth" and the like in the description, claims, and drawings of the application (if any) are used to distinguish between similar objects, not necessarily in an ordinal sense or in a particular sequence. It should be understood that the use of such terms is interchangeable under appropriate circumstances to enable the embodiments described herein to be embodied in other than the order illustrated or described herein. Moreover, the terms "comprise" and "have", and any variations thereof, are intended to cover a non-exclusive inclusion, for example, a process, method, system, product, or apparatus that comprises a list of steps or units is not necessarily limited to those clearly listed, but can include other steps or units not clearly listed or inherent to such processes, methods, products, or apparatus.

[0029] The application is described in detail in conjunction with the schematic diagram, and in the detailed description of the embodiments of the application, the cross-sectional view of the device structure is partially enlarged without the general proportion for the convenience of description, and the schematic diagram is only an example, which should not limit the scope of the application. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in actual manufacturing.

[0030] Please refer to Figure 1 An embodiment of the application provides a circuit board supporting device for supporting a circuit board 1, comprising a frame 2, a supporting assembly 3 for supporting the circuit board 1, the circuit board 1 is located above the frame 2, the supporting assembly 3 is arranged in the frame 2, and the top surface of the supporting assembly 3 is at the same height as the top surface of the frame 2; the supporting assembly 3 and the frame 2 form a plurality of supporting areas 303; the circuit board 1 is provided with a plurality of test areas 101, each test area 101 is provided with a plurality of electronic components, and each supporting area 303 corresponds to one or more test areas 101; when the circuit board 1 is placed on the frame 2, the supporting assembly 3 abuts against the circuit board 1 to support one or more test areas 101 respectively.

[0031] In order to make the above-mentioned purposes, features and advantages of the application more obvious and easy to understand, the specific embodiments of the application will be described in detail below in conjunction with the drawings.

[0032] As Figure 1As shown, in an embodiment, the frame 2, a support assembly 3 for supporting the circuit board 1, the circuit board 1 is located above the frame 2, the support assembly 3 is arranged in the frame 2, and the top surface of the support assembly 3 is at the same height as the top surface of the frame 2; the support assembly 3 and the frame 2 form a plurality of support areas 303; the circuit board 1 is provided with a plurality of test areas 101, each test area 101 is provided with a plurality of electronic components, and each support area 303 corresponds to one or more test areas 101; when the circuit board 1 is placed on the frame 2, the support assembly 3 abuts the circuit board 1 to support one or more test areas 101 respectively.

[0033] Specifically, the support assembly 3 is arranged in the frame 2, and the top surface is at the same height as the top surface of the frame 2, which can support the circuit board 1 together with the frame 2. Between the support assembly 3 and the frame 2, a plurality of support areas 303 are formed, and the circuit board 1 is provided with a plurality of test areas 101, each test area 101 is provided with electronic components, and the support area 303 corresponds to the test area 101, and when the circuit board 1 is placed on the frame 2, the support area 303 will provide support to the test area 101. By arranging the support assembly 3 in the frame 2, and the height of the top surface of the support assembly 3 is consistent with the height of the top surface of the frame 2, the circuit board 1 can be supported together with the frame 2, and the support force is provided to the entire circuit board 1, avoiding deformation of the circuit board 1 due to gravity, and avoiding failure.

[0034] In an embodiment, the support assembly 3 includes a first support bar 301 and a second support bar 302, the first support bar 301 and the second support bar 302 are arranged in the frame 2 to form a plurality of support areas 303, and each support area 303 corresponds to one test area 101.

[0035] Specifically, as shown, Figure 1 The support assembly 3 includes a first support bar 301 and a second support bar 302, the first support bar 301 and the second support bar 302 are integrally formed or detachably connected. The first support bar 301 and the second support bar 302 are respectively arranged in the frame 2, and the height is the same as the frame 2, which can support the entire circuit board 1 together with the frame 2; avoid deformation of the circuit board 1 under the influence of long-term high temperature and gravity.

[0036] More specifically, the first support bar 301 and the second support bar 302 are arranged in the frame 2 and form a plurality of support areas 303, and the support areas 303 correspond to the test areas 101 respectively to support the test areas 101.

[0037] In addition, the support assembly 3 can be provided with only the first support strip 301 or only the second support strip 302. When the support assembly 3 is provided with only the first support strip 301, the first support strip 301 is arranged horizontally in the frame 2, and a support area 303 is formed between the first support strip 301 and the frame 2, which can correspond to the plurality of test areas 101. When only the second support strip 302 is provided, the second support strip 302 is arranged vertically, and similarly, a plurality of support areas 303 are formed between the second support strip 302 and the frame 2, and the test areas 101 are supported.

[0038] In an embodiment, the circuit board 1 is provided with a groove 102 corresponding to the support assembly 3, and the groove 102 is clamped with the support assembly 3; or the circuit board 1 is provided with one or more openings 103, and the support assembly 3 is provided with a protrusion 304 corresponding to the opening 103, which is clamped in the opening 103.

[0039] Specifically, as shown in Figure 2 It is difficult to position the circuit board 1 on the support assembly 3. When the circuit board 1 is provided with a groove 102 corresponding to the support assembly 3, the groove 102 can be clamped with the support assembly 3 after the circuit board 1 is placed above the support assembly 3. In a specific embodiment, the support assembly 3 is the first support strip 301 and the second support strip 302, and the groove 102 corresponds to the first support strip 301 and the second support strip 302, that is, the circuit board 1 is provided with a groove 102 in a crisscross manner, and after the circuit board 1 is placed, the top of the first support strip 301 and the second support strip 302 can be located in the groove 102 and clamped therewith, thereby avoiding sliding of the circuit board 1.

[0040] Further, as shown in Figure 1 and Figure 2 When the circuit board 1 is provided with one or more openings 103, the support assembly 3 is provided with a protrusion 304 corresponding to the opening 103, which is clamped in the opening 103. In a specific embodiment, the opening 103 is a circular hole, and the circuit board 1 is provided with two circular holes, and the second support strip 302 is provided with a circular protrusion corresponding to the circular hole. When the circuit board 1 is placed, the circular hole is aligned with the protrusion 304 and then loaded, so that the circuit board 1 is limited above the support assembly 3, thereby avoiding sliding and affecting testing. In another specific embodiment, the circuit board 1 is provided with a square hole, and the support assembly 3 is provided with a square protrusion corresponding to the square hole, and the square hole is loaded into the protrusion 304 to fix the circuit board 1.

[0041] In an embodiment, the frame 2 includes a first side frame 201 and a second side frame 202, and the first side frame 201 and the second side frame 202 are connected. The first side frame 201 is arranged longitudinally and located on both sides of the first support strip 301, and the second side frame 202 is arranged horizontally and located on both sides of the second support strip 302.

[0042] Specifically, as shown in Figure 3 , the first side frame 201 and the second side frame 202 are connected, and can be integrally formed or detachably connected; when the first side frame 201 and the second side frame 202 are integrally formed, the first side frame 201 and the second side frame 202 are connected. When the first side frame 201 and the second side frame 202 are detachably connected, vertical notches can be provided on both sides of the second side frame 202, the thickness of the notches is the same as the thickness of the first side frame 201, the second side frame 202 is symmetrically placed, then the first side frame 201 is respectively inserted into the notches provided in the second side frame 202, and can be fixed, and can be disassembled by applying force to pull out.

[0043] In an embodiment, the support assembly 3 includes a plurality of first support bars 301, the frame 2 includes a first side frame 201 and a second side frame 202 connected perpendicularly to the first side frame 201, and the plurality of first support bars 301 are connected perpendicularly to one of the first side frame 201 and the second side frame 202, and the first side frame 201 or the second side frame 202 connected to the first support bar 301 is provided with a plurality of heat dissipation holes 203.

[0044] Specifically, as shown in Figure 3 , the first side frame 201 and the second side frame 202 are arranged perpendicularly, the first support bar 301 is arranged horizontally in the frame 2, and the first side frame 201 is arranged vertically. When only the first support bar 301 is provided in the frame 2, the heat dissipation holes 203 are provided in the first side frame 201, so that air can enter the frame 2 from the heat dissipation holes 203 of the first side frame 201, and heat can be dissipated from the first side frame 201 on the other side.

[0045] In an embodiment, when the support assembly 3 is the second support bar 302, the second side frame 202 is provided with the heat dissipation holes 203, and the heat dissipation holes 203 are arranged correspondingly to the second support bar 302.

[0046] As shown in Figure 4 , specifically, the second support bar 302 is arranged vertically in the frame 2, and the heat dissipation holes 203 are provided in the second side frame 202, i.e. the heat dissipation holes 203 are provided on both sides of the second support bar 302, so that after the circuit board 1 is placed above the second support bar 302, heat can flow out through the heat dissipation holes 203 provided in the second side frame 202.

[0047] In an embodiment, the support assembly 3 includes a sub-support structure 305, the sub-support structure 305 is arranged perpendicularly to the first support bar 301 and is slidably connected to the first support bar 301.

[0048] As shown in Figure 5Specifically, when only the horizontal first support bars 301 are retained, the support force on the circuit board 1 will decrease. In this case, a sub-support structure 305 is provided in a direction perpendicular to the first support bars 301, and the height of the sub-support structure 305 is the same as that of the first support bars 301, which can increase the support force on the circuit board 1. The sub-support structure 305 is slidably connected to the first support bars 301, and the position of the sub-support structure 305 can be adjusted to flexibly avoid solder balls or electronic components on the bottom of the circuit board 1.

[0049] When only the second support bar 302 is retained, a sub-support structure 305 is set in the vertical direction of the second support bar 302 to increase the supporting force on the circuit board 1, and support the circuit board 1 together with the second support bar 302. Similarly, its position can be adjusted by sliding the sub-support structure 305.

[0050] In one embodiment, the sub-support structure 305 includes an upper component 306 and a lower component 307, and the upper component 306 is movably connected to the lower component 307; the upper component 306 is provided with a base body 308 and a first through hole 309, and the lower component 307 is provided with a placement groove 310, a fixing column 311 and a second through hole 312, the base body 308 is located in the placement groove 310, the first through hole 309 and the second through hole 312 are arranged correspondingly, and the fixing column 311 passes through the second through hole 312 and the first through hole 309.

[0051] like Figure 6 Specifically, the upper component 306 and the lower component 307 are pivotally connected and slidably connected to the first support bar 301 or the second support bar 302, allowing for flexible adjustment based on the solder balls or electronic components on the bottom of the circuit board 1. When placing the circuit board 1, the upper component 306 is pressed down, causing it to rotate along the lower component 307. The lower component 307 is then moved to adjust the position based on the electronic components on the bottom of the circuit board 1, allowing the circuit board 1 to be smoothly placed on the support assembly 3. When the upper component 306 is needed for support, the upper component 306 is moved so that it contacts the bottom of the circuit board 1, thereby supporting the circuit board 1.

[0052] In one embodiment, a sliding groove 313 is provided at the bottom of the first support bar 301 , and a column 314 corresponding to the sliding groove 313 is provided on the lower component 307 . The column 314 is slidably disposed in the sliding groove 313 .

[0053] like Figure 5 and Figure 7Specifically, when only the first support bar 301 is provided in the frame 2, and the bottom of the first support bar 301 is provided with a slide groove 313, the columns 314 provided on the lower component 307 are respectively installed in the slide groove 313, so that the lower component 307 can move along the slide groove 313 and thus adjust its position. When only the second support bar 302 is provided in the frame 2, and the bottom of the second support bar 302 is provided with a slide groove 313, the lower component 307 can slide in the slide groove 313 and, by applying force to the upper component 306, can flexibly avoid the solder balls or electronic components on the bottom of the circuit board 1.

[0054] In one embodiment, the upper component 306 is provided with a support plate 315 for supporting the circuit board 1 . The support plate 315 is arranged horizontally and contacts the circuit board 1 .

[0055] like Figure 8 As shown, specifically, the support plate 315 can be a cylindrical or square column, which can contact and support the bottom of the circuit board 1. Providing the support plate 315 below the circuit board 1 can increase the contact area with the circuit board 1 and thus increase the support force of the circuit board 1.

[0056] In one embodiment, the first support bar 301 is provided with a plurality of first slots 316 , and the second support bar 302 is provided with second slots 317 corresponding to the first slots 316 . The first slots 316 are respectively engaged with the second slots 317 .

[0057] like Figure 3 and Figure 4 As shown, specifically, the first slot 316 of the first support bar 301 is placed upward, and the second slot 317 of the second support bar 302 is set downward. After the first support bar 301 is installed in the frame 2, the second slot 317 of the second support bar 302 is respectively engaged with the first slot 316, so that the second support bar 302 can be fixed in the frame 2, and together with the first support bar 301, form multiple support areas 303.

[0058] More specifically, Figure 3 As shown, the first support bar 301 is provided with five first slots 316, and the notches of the first slots 316 are arranged upwards, as shown in FIG. Figure 4 As shown, the second slots 317 provided on the second support bar 302 are arranged downward, and the number of the first slots 316 and the second slots 317 corresponds to each other. The second slots 317 provided on the second support bar 302 are respectively inserted into the first slots 316, so that the first support bar 301 and the second support bar 302 can form the following Figure 1The cross distribution shown, the first support strip 301 and the second support strip 302 are staggered with each other, and the height is the same as the frame 2, a plurality of support areas 303 can be formed, and the circuit board 1 is supported. The first support strip 301 is provided with a first slot 316, and the second support strip 302 is provided with a second slot 317, so that the first support strip 301 and the second support strip 302 can be detachably connected, and in actual use, the circuit board 1 can be installed and used according to the electronic components at the bottom of the circuit board 1.

[0059] Each of the embodiments in the specification is described in a progressive manner, and the same and similar parts between the embodiments can be referred to each other. Each embodiment focuses on the difference from other embodiments. In particular, for the method embodiments, since they are basically similar to the structural embodiments, the description is relatively simple, and the relevant parts can be referred to the part of the structural embodiments.

[0060] The above is a specific implementation of the present application. It should be understood that the above-described embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand; it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A support device for a circuit board for supporting a circuit board, characterized by, The support device comprises a frame, a support assembly for supporting the circuit board, the circuit board is located above the frame, the support assembly is arranged in the frame, and the top surface of the support assembly is at the same height as the top surface of the frame; The support assembly and the frame form a plurality of support areas; The circuit board is provided with a plurality of test areas, each of which is provided with a plurality of electronic components, and each of the support areas corresponds to one or more test areas; When the circuit board is placed on the frame, the support assembly abuts against the circuit board to support one or more test areas respectively.

2. The support device for the circuit board according to claim 1, wherein The support assembly comprises a first support bar and a second support bar, the first support bar and the second support bar are arranged in the frame in a cross manner to form a plurality of support areas, and each of the support areas corresponds to a test area respectively.

3. The support apparatus for a circuit board according to claim 1, wherein The bottom of the circuit board is provided with a groove corresponding to the support assembly, and the groove is clamped with the support assembly; Or The circuit board is provided with one or more openings, and the support assembly is provided with a protrusion corresponding to the opening, and the protrusion is clamped in the opening.

4. The circuit board support apparatus according to claim 2, wherein The frame comprises a first side frame and a second side frame, and the first side frame and the second side frame are connected; The first side frame is arranged in a longitudinal direction and located on both sides of the first support bar; The second side frame is arranged in a transverse direction and located on both sides of the second support bar.

5. The support apparatus for a circuit board according to claim 1, wherein The support assembly comprises a plurality of first support bars, the frame comprises a first side frame and a second side frame connected perpendicularly to the first side frame, a plurality of the first support bars are connected perpendicularly to one of the first side frame and the second side frame, and the first side frame or the second side frame connected to the first support bar is provided with a plurality of heat dissipation holes.

6. The support device for a circuit board according to claim 5, wherein The support assembly comprises a sub-support structure, the sub-support structure is arranged perpendicularly to the first support bar and is connected slidingly with the first support bar.

7. The support apparatus for a circuit board according to claim 6, wherein The sub-support structure comprises an upper part and a lower part, and the upper part is movably connected with the lower part; The upper part is provided with a seat body and a first through hole, the lower part is provided with a placing groove, a fixing column and a second through hole, the seat body is located in the placing groove, the first through hole is arranged correspondingly with the second through hole, and the fixing column penetrates through the second through hole and the first through hole.

8. The support device for a circuit board according to claim 7, wherein The bottom of the first support bar is provided with a sliding groove, and the lower part is provided with a column body corresponding to the sliding groove, and the column body is slidingly arranged in the sliding groove.

9. The support apparatus for a circuit board according to claim 7, wherein The upper part is provided with a support plate for supporting the circuit board, and the support plate is arranged horizontally and in contact with the circuit board.

10. The support device for a circuit board according to claim 2, wherein The first support bar is provided with a plurality of first insertion slots, the second support bar is provided with a plurality of second insertion slots corresponding to the first insertion slots, and the first insertion slots are clamped with the second insertion slots respectively.

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