Radiator with tin overflow prevention structure

Abstract

The utility model discloses a radiator with a tin overflow prevention structure, which comprises a radiating fin, a heat conduction pipe is connected onto the radiating fin, the end part, far away from the radiating fin, of the heat conduction pipe is connected with a first heat transfer bottom plate, and the surface, facing a heat source, of the first heat transfer bottom plate is connected with an overflow prevention heat transfer bottom plate; the area of an upper butt joint face of the anti-overflow heat transfer bottom plate is smaller than that of a lower butt joint face of the anti-overflow heat transfer bottom plate, the connecting side edges of the upper butt joint face and the lower butt joint face are all slope faces, and the upper butt joint face is connected to the first heat transfer bottom plate. The spill-proof heat transfer bottom plate is simple in structure, has a good tin spill-proof function, can be integrally formed in a stamping mode when being machined, and solves the problem that a tin spill-proof groove cannot be machined when a heat transfer plate is thin.

Description

TECHNICAL FIELD

[0001] The utility model belongs to radiator technical field, especially relate to a radiator with anti -overflow tin structure. BACKGROUND

[0002] The electronic components inside the notebook computer usually generate heat when working, which makes the temperature of the components rise and affects the normal work of the components. Therefore, a heat dissipation device must be installed to ensure that the components work normally at an appropriate temperature.

[0003] At present, the heat dissipation device used in most of the notebook computers is a fan, a heat sink and a heat pipe welded on the heat sink as a heat dissipation component, which dissipates heat through heat conduction. However, various components are usually arranged in the notebook computer, in order to better contact the surface of the heat generating components and improve the heat conduction efficiency, the prior art usually welds a heat transfer plate at one end of the heat pipe. Usually, a closed groove is machined on the heat transfer plate to prevent tin overflow during welding. However, when the thickness of the heat transfer plate is very thin, it is not convenient to machine a groove on the heat transfer plate to prevent tin overflow during welding. SUMMARY

[0004] To solve the above technical problems, the utility model provides a radiator with anti -overflow tin structure, which solves the problem that when the heat transfer plate is thin, the groove cannot be machined on the surface to prevent tin overflow.

[0005] The technical scheme of the utility model is:

[0006] A radiator with anti -overflow tin structure, characterized in that it comprises a heat sink, a heat pipe connected to the heat sink, a first heat transfer plate connected to the end of the heat pipe away from the heat sink, and an anti -overflow heat transfer plate connected to the surface of the first heat transfer plate facing the heat source.

[0007] The area of the upper flat surface of the anti -overflow heat transfer plate is smaller than that of the lower flat surface, and the side edges of the upper flat surface and the lower flat surface are both inclined surfaces. The upper flat surface is connected to the first heat transfer plate.

[0008] Further, each inclined surface is formed by chamfering, and the size of the chamfer is (C 0.5mm-C 1.0mm) x 45°.

[0009] Further, the four corners where the upper flat surface and the lower flat surface meet are chamfered.

[0010] Further, the length and width dimensions of the anti -overflow heat transfer plate are smaller than those of the first heat transfer plate.

[0011] Further, the first heat transfer bottom plate is provided with a connecting piece, and the connecting piece is provided with a plurality of mounting holes.

[0012] Further, two heat dissipation fins are arranged at intervals, two heat conduction pipes are connected to the two heat dissipation fins, the two heat conduction pipes are arranged in the same direction, one end of one of the heat conduction pipes is connected to the two heat dissipation fins, and one end of the other heat conduction pipe is connected to the heat dissipation fin on the side close to the heating element.

[0013] The anti-overflow heat transfer bottom plate has the advantages of simple structure, good anti-overflow tin effect, and the structure can be integrally punched during processing, thereby overcoming the problem that the anti-overflow tin groove cannot be processed when the heat transfer plate is too thin. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 is the overall schematic view of the utility model;

[0015] Figure 2 is another angle schematic view of the utility model;

[0016] Figure 3 is a schematic view of the tin paste placed in the accommodating gap of the utility model:

[0017] Figure 4 is Figure 3 A-A cross-sectional view;

[0018] Figure 5 is Figure 4 schematic view after removing the tin paste:

[0019] Figure 6 The utility model anti-overflow heat transfer bottom plate schematic view.

[0020] Among them: 100-heat dissipation fin, 200-heat conduction pipe, 300-first heat transfer bottom plate, 301-connecting piece, 302-mounting hole, 400-anti-overflow heat transfer bottom plate, 401-upper flat surface, 402-lower flat surface, 403-inclined surface, 404-round corner, 500-accommodating gap, 501-tin paste. DETAILED DESCRIPTION

[0021] In order to more clearly understand the technical means of the utility model, and can be implemented according to the content of the specification, the specific embodiments of the utility model are further described in detail below, the following examples are used to illustrate the utility model, but not to limit the scope of the utility model.

[0022] As Figures 1-6 Indicated, the utility model provides a kind of heat sink with anti-overflow tin structure, mainly used for the heat dissipation in the notebook computer.It includes heat dissipation fin 100, heat conduction pipe 200, first heat transfer bottom plate 300 and anti-overflow heat transfer bottom plate 400.

[0023] The fin 100 is a fin. The fin 100 is welded with a heat pipe 200. The length direction of the heat pipe 200 is set to be away from the fin 100. The heat pipe 200 is a good heat transfer element, which fully utilizes the heat conduction principle and the rapid heat transfer property of phase change medium, and rapidly transfers the heat of the heat generating element to the heat source outside.

[0024] The number of the fin 100 and the heat pipe 200 and the shape of the heat pipe 200 of the radiator can be selected according to actual use requirements. In order to improve the heat dissipation efficiency, two fins 100 and two heat pipes 200 are arranged at intervals, the two heat pipes 200 are arranged in the same direction, one end of one of the heat pipes 200 is welded on the two fins 100, and the other heat pipe 200 is welded on the fin 100 close to the heat generating element.

[0025] The ends of the two heat pipes 200 away from the fin 100 are welded together with the first heat transfer bottom plate 300. The first heat transfer bottom plate 300 of the utility model is an aluminum plate with a flat structure, both sides of which are connected with a connecting piece 301, and each connecting piece 301 is provided with a mounting hole 302. The fastener (not shown) connects the first heat transfer bottom plate 300 with the notebook computer through the mounting hole 302, so as to avoid displacement of the anti-overflow heat transfer bottom plate 400 welded on the first heat transfer bottom plate 300 when the anti-overflow heat transfer bottom plate 400 is in close contact with the heat generating element.

[0026] The first heat transfer bottom plate 300 is an aluminum plate with good heat transfer performance, which can directly contact the heat generating element and transfer the heat of the heat generating element to the heat pipe 200 for heat dissipation. However, in actual application, there are many other working elements around the heat generating element in the internal space of the notebook computer, and the surface of the heat generating element and the surface of the other working elements are not in the same plane, which makes the first heat transfer bottom plate 300 unable to closely contact the surface of the heat generating element, thereby reducing the heat transfer effect and ultimately leading to poor heat dissipation effect.

[0027] Therefore, the anti-overflow heat transfer bottom plate 400 is welded on one surface of the first heat transfer bottom plate 300 facing the heating element. The length and width of the anti-overflow heat transfer bottom plate 400 are smaller than the length and width of the first heat transfer bottom plate 300, and the size and specific shape can be selected according to actual application needs. The anti-overflow heat transfer bottom plate 400 of the utility model is a rectangular copper plate. In order to prevent overflow of tin when the anti-overflow heat transfer bottom plate 400 is tin-welded with the first heat transfer bottom plate 300, the anti-overflow heat transfer bottom plate 400 is provided with an upper flat joint surface 401 and a lower flat joint surface 402. The upper flat joint surface 401 and the lower flat joint surface 402 are two opposite surfaces, and the four sides where the upper flat joint surface 401 and the lower flat joint surface 402 meet are chamfered to form four inclined surfaces 403, and the area of the upper flat joint surface 401 is smaller than the area of the lower flat joint surface 402. The chamfer type of the utility model is C chamfer, and the chamfer size is 0.5mm*45°. When tin-welding, tin paste is coated on the upper flat joint surface 401 to be welded with the first heat transfer bottom plate 300. When the upper flat joint surface 401 meets the first heat transfer bottom plate 300, the lower flat joint surface 402 and the first heat transfer bottom plate 300 have a containing gap 500. After the tin paste on the upper flat joint surface 401 is melted by the tin-welding gun, the excess tin paste 501 will form a ring at the containing gap 500 due to the adsorption force between the lower flat joint surface 402 of the first heat transfer bottom plate 300, and will not flow to other positions, causing tin overflow defects.

[0028] Further, the four corners where the upper flat joint surface 401 and the lower flat joint surface 402 meet are chamfered.

[0029] After the anti-overflow heat transfer bottom plate 400 is welded with the first heat transfer bottom plate 300, the anti-overflow heat transfer bottom plate 400 is used to directly meet the surface of the heating element, and the heat of the heating element is sequentially transmitted to the first heat transfer bottom plate 300, the heat pipe 200, and then the heat pipe 200 transmits the heat to the heat dissipation fins 100 for heat dissipation, so as to realize heat dissipation and cooling of the heating element.

[0030] The above is only the preferred embodiment of the utility model, and is not used to limit the utility model. It should be pointed out that, for ordinary skilled persons in the technical field, without departing from the technical principles of the utility model, a number of improvements and modifications can be made, and these improvements and modifications should be regarded as the protection range of the utility model.

Claims

1. A heat sink having a spill-proof tin structure, characterized by, The heat dissipation fin (100) is connected with a heat conduction pipe (200), the end of the heat conduction pipe (200) away from the heat dissipation fin (100) is connected with a first heat transfer bottom plate (300), and the surface of the first heat transfer bottom plate (300) facing the heat source is connected with a anti-overflow heat transfer bottom plate (400); The area of the upper horizontal joint surface (401) of the anti-overflow heat transfer bottom plate (400) is smaller than that of the lower horizontal joint surface (402), the side edges of the upper horizontal joint surface (401) and the lower horizontal joint surface (402) are both inclined surfaces (403), and the upper horizontal joint surface (401) is connected to the first heat transfer bottom plate (300).

2. The heat spreader with anti-overflow tin structure of claim 1, wherein, Each inclined surface (403) is formed by a chamfer, and the size of the chamfer is (C 0.5mm-C 1.0mm)×45°.

3. The heat spreader with anti-overflow tin structure of claim 1, wherein, The four corners where the upper horizontal joint surface (401) and the lower horizontal joint surface (402) meet are all chamfered (404).

4. The heat spreader with anti-overflow tin structure of claim 1, wherein, The length and width of the anti-overflow heat transfer bottom plate (400) are both smaller than those of the first heat transfer bottom plate (300).

5. The heat spreader with anti-overflow tin structure of claim 1, wherein, The first heat transfer bottom plate (300) is provided with a connecting piece (301), and the connecting piece (301) is provided with a plurality of mounting holes (302).

6. The heat spreader with anti-overflow tin structure of claim 1, wherein, Two heat dissipation fins (100) are arranged at intervals, two heat conduction pipes (200) are connected to the two heat dissipation fins (100), the two heat conduction pipes (200) are arranged in the same direction, one end of one of the heat conduction pipes (200) is connected to the two heat dissipation fins (100), and one end of the other heat conduction pipe (200) is connected to the heat dissipation fin (100) on the side close to the heat generating element.

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