Chip capacitor

Abstract

The utility model relates to a chip capacitor, which comprises a main body part and external electrodes arranged at two ends of the main body part, the main body part is divided into a working part and a non-working part from top to bottom; the working part is formed by overlapping ceramic dielectric diaphragms printed with internal electrodes in a staggered manner; the non-working part is formed by overlapping ceramic dielectric diaphragms which do not comprise internal electrodes; a welding part is formed at the lower end of the external electrode; and the number of the internal electrodes in the area of the main body part corresponding to the height of the welding part is not more than one. According to the chip capacitor, the non-working part is arranged at the lower part of the chip capacitor, so that when the chip capacitor is subjected to internal cracks due to relatively large stress or relatively high temperature, the internal cracks appear in the non-working part, short circuit is not formed, an open circuit is formed, the problems of electric leakage, even circuit board burning and the like are not caused, and the safety of the circuit board is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to tooling field especially relates to a patch capacitor. BACKGROUND

[0002] As one of the most widely used capacitors at present, patch capacitors are widely used in various circuit boards and electronic devices due to their large capacity range, small size, low equivalent series resistance, high rated voltage, and no polarity.

[0003] However, patch capacitors are prone to short circuit under impact and high stress, causing leakage and even circuit board burning.

[0004] The structure of the conventional ceramic patch capacitor is shown in the figure, the two ends of the patch capacitor are external electrodes 130, the core part is composed of ceramic dielectric film 112 with internal electrodes 110 printed in a staggered manner, the external electrodes 130 are used for welding, the internal electrodes 110 are used for storing electric charge, and the ceramic dielectric film 112 serves as a dielectric. Figure 1 When the patch capacitor is welded on the circuit board 200, the external electrodes 130 are fixedly connected with the circuit board 200 after welding through the solder 210, and when the stress becomes large, cracks 101 shown by the dashed line in the figure will be generated, which penetrates through multiple internal electrodes 110, thereby causing a short circuit. Figure 1 UTILITY MODEL CONTENT

[0005] In order to solve the above problems of the prior art, the utility model provides a patch capacitor.

[0006] In order to achieve the above purpose, the utility model adopts the following main technical scheme:

[0007] A patch capacitor, comprising a main body part and external electrodes arranged at both ends of the main body part; the main body part is divided into a working part and a non-working part from top to bottom; the working part is composed of ceramic dielectric film with internal electrodes printed in a staggered manner; the non-working part is composed of ceramic dielectric film without internal electrodes; the lower end of the external electrode forms a welding part; the number of internal electrodes in the main body part region corresponding to the height of the welding part is not more than one.

[0008] Further, the external electrode is the two end electrodes of the patch capacitor.

[0009] Further, one end of the internal electrode is connected with the external electrode.

[0010] Further, the height of the non-working part is greater than the height of the welding part.

[0011] Further, the height of the non-working part is equal to the height of the welding part.​

[0012] Further, the height of the non-working part is less than the height of the welding part; the number of internal electrodes in the region of the main part corresponding to the height of the welding part is one.

[0013] The utility model discloses beneficial effect is: through setting up non - working part in the lower part of patch capacitor, when the internal crack of patch capacitor is caused by bearing stress greatly or temperature is higher, internal crack appears in non - working part, does not form short circuit, but forms open circuit, does not cause the problem such as electric leakage and even circuit board burning, guarantees the safety of circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the following will be to the embodiment needed to use the drawing of the utility model make a brief introduction, should understand, the following drawing only shows some embodiments of the utility model, therefore should not be seen as the limitation to the range, for the ordinary skill in the art person, under the premise of not paying the creative labor, can also obtain other related drawings according to these drawings.

[0015] Figure 1 It is the structure schematic diagram of patch capacitor in prior art;

[0016] Figure 2 It is the structure schematic diagram of the utility model;

[0017] Figure 3 It is another embodiment schematic diagram of the structure of the utility model;

[0018] Mark explanation:

[0019] 100, main part; 101, crack; 110, working part; 111, internal electrode; 112, ceramic dielectric diaphragm; 120, non - working part; 130, external electrode; 131, welding part; 200, circuit board; 210, solder. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in conjunction with the drawings of the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0021] In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0022] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "provided with", "connection" and the like should be broadly understood, for example, "connection" can be fixed connection, can also be detachable connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the communication between two elements inside. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0023] Embodiment:

[0024] The inventor found that the current patch capacitor is prone to short circuit under the condition of collision and bearing stress, causing leakage and even circuit board burning and other problems;

[0025] The so-called patch capacitor, full name: Multilayer Ceramic Capacitor (MLCC), also known as ceramic patch capacitor. It is composed of ceramic dielectric film 112 (i.e. dielectric plate) with printed electrodes (i.e. internal electrodes 110) stacked in a staggered manner, and then sintered at high temperature to form a ceramic chip. Then, a metal layer (i.e. external electrode 130) is sealed on both ends of the chip to form a structure similar to a monolithic stone, hence the name monolithic capacitor.

[0026] Generally, the composite perovskite compound dielectric ceramic powder with barium titanate [BaTiO3] as the main raw material is mixed with adhesive, solvent and related additives to form a slurry. The green ceramic film is formed by film rolling, extrusion or casting method, and then dried, printed with internal electrodes 120, laminated, cut, sintered, coated with end electrodes and sintered. The sintering temperature is 880-1300℃. There are two types: one with lead resin encapsulation and the other without lead encapsulation. Patch capacitors are widely used in printed circuits, thick-film hybrid integrated circuits as external components. Currently, they are widely used in airborne, shipborne, vehicle-mounted, radar, communication, ship, medical equipment, power supply, precision instruments and other fields.

[0027] The structure of the conventional ceramic patch capacitor is shown in Figure 1 The two ends of the patch capacitor are external electrodes 130, and the core part is composed of ceramic dielectric film 112 with printed internal electrodes 110 stacked in a staggered manner. The external electrodes 130 are used for soldering, the internal electrodes 110 are used for storing electric charge, and the ceramic dielectric film 112 serves as a dielectric. When the patch capacitor is soldered on the circuit board 200, the external electrodes 130 are soldered by solder 210 and fixedly connected with the circuit board 200. When the stress becomes large, since the patch capacitor is fixed at the soldering position, cracks 101 as shown by the dashed line in Figure 1 may occur inside the fixed area. The cracks 101 in the figure are only for illustration, and the actual cracks are not completely straight lines, but internal cracks formed at an approximate inclination angle. The cracks 101 penetrate through multiple internal electrodes 110, causing a short circuit. Figure 1

[0028] To solve the above problems, the inventors creatively propose the patch capacitor of the present utility model, as shown in Figure 2 ​As shown, a patch capacitor includes a main body 100 and external electrodes 130 arranged at both ends of the main body 100, the external electrodes 130 being two end electrodes of the patch capacitor; the main body 100 is divided into a working part 110 and a non-working part 120 from top to bottom; the working part 110 is composed of ceramic dielectric films 112 with internal electrodes 111 printed thereon in a staggered manner, one end of the internal electrode 111 being connected to the external electrode 130, which can be understood as the core part of the traditional patch capacitor, and the internal electrode 111 is connected to the external electrode 130 in a staggered manner; the non-working part 120 is composed of ceramic dielectric films 112 without internal electrodes 111, which can be understood as a single structure of the ceramic dielectric or the ceramic dielectric film 112 stack; the lower end of the external electrode 130 is formed with a welding part 131; the number of internal electrodes 111 in the region of the main body 100 corresponding to the height of the welding part 131 is not more than one; by arranging the non-working part 120, the cracks 101 generated when the patch capacitor is subjected to external force are mainly limited in the non-working part 120, so that the situation of continuous cracks 101 penetrating through multiple internal electrodes 111 does not occur, that is, short circuit is avoided;

[0029] The number of internal electrodes 111 in the region of the main body 100 corresponding to the height of the welding part 131 is not more than one, which includes three cases. In an embodiment, the height of the non-working part 120 is greater than the height of the welding part 131. In this case, even if cracks 101 are generated, they are all located in the non-working area, and the generation of cracks 101 will not cause short circuit and will not affect the normal use of the patch capacitor, but the non-working area of this structure will occupy a certain size. In order to ensure sufficient capacity of the capacitor, the size of the patch capacitor of this structure will be larger than that of the normal size capacitor. In an embodiment, the spacing of the internal electrodes 111 in the working part 110 can be compressed to reduce the volume. In an embodiment, the height of the non-working part 120 is equal to the height of the welding part 131. In this case, when cracks 101 are generated, the cracks 101 are most likely to be in the non-working part 120, but there is a certain probability that the cracks 101 will extend to the internal electrodes 111, thereby forming an open circuit, but the same will not form a short circuit. In an embodiment, the height of the non-working part 120 is less than the height of the welding part 131, and the number of internal electrodes 111 in the region of the main body 100 corresponding to the height of the welding part 131 is one. By arranging in this way, the volume of the patch capacitor can be minimized, the cracks 101 occur at the junction of the working part 110 and the non-working part, and the cracks 101 extend into the working part 110, but since the cracks 101 are limited to not penetrating through multiple internal electrodes 111, short circuit can still be avoided. In an embodiment, the length of the internal electrode 111 can also be shortened to reduce the height occupied by the non-working part 120, such as Figure 3 As shown, compared withFigure 2 The structure in Figure 3 The length of the middle internal electrode 111 is shorter, but correspondingly, the height of the working portion 110 can be further increased, and the height of the non-working portion 120 can be further reduced.

[0030] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent transformations made using the contents of the description and drawings of the present invention, or directly or indirectly applied in the relevant technical field, are also included in the patent protection scope of the present invention.

Claims

1. A chip capacitor, characterized by: The patch capacitor comprises a main body (100) and external electrodes (130) arranged at both ends of the main body (100); the main body (100) is divided into a working part (110) and a non-working part (120) from top to bottom; the working part (110) is formed by laminating ceramic dielectric films (112) with internal electrodes (111) in a staggered manner; the non-working part (120) is formed by laminating ceramic dielectric films (112) without internal electrodes (111); the lower end of the external electrode (130) is formed with a welding part (131); the number of internal electrodes (111) in the region of the main body (100) corresponding to the height of the welding part (131) is not more than one.

2. The chip capacitor as claimed in claim 1, wherein: The external electrode (130) is the two end electrodes of the patch capacitor.

3. The chip capacitor of claim 1, wherein: One end of the internal electrode (111) is connected with the external electrode (130).

4. The chip capacitor of claim 1, wherein: The height of the non-working part (120) is greater than the height of the welding part (131).

5. The chip capacitor of claim 1, wherein: The height of the non-working part (120) is equal to the height of the welding part (131).

6. The chip capacitor of claim 1, wherein: The height of the non-working part (120) is less than the height of the welding part (131); the number of internal electrodes (111) in the region of the main body (100) corresponding to the height of the welding part (131) is one.

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